TWM451489U - Light source device - Google Patents

Description

光源裝置Light source device

一種光源裝置，應用於作為照明或警示用燈的發光源，本創作尤指一種以陶瓷基板為載體，在陶瓷基板上成型有複數個導熱柱，且在其平面上組設有複數個獨立發光二極體模組的光源裝置。A light source device is applied to a light source as a light for illumination or warning. In particular, the present invention relates to a ceramic substrate as a carrier, a plurality of heat conducting columns are formed on the ceramic substrate, and a plurality of independent light beams are arranged on the plane. Light source device for the diode module.

發光二極體低用電、高亮度的特性，使其符合現代講究能源節約的使用需求，近幾年有關發光二極體的技術發展已臻於相當成熟的情況，是以，從早期低亮度，僅能作為替代性光源之使用需求演變至今，發光二極體已能符合高亮度、使用壽命長的需求，惟，伴隨而來的問題，則是發光二極體在達到高功率電性使用需求的同時，其所產生的熱能亦隨之大幅升高；依此，若在整體應用上，無法即時將發光二極體所產生的熱能盡速排除，則高溫的情況即會造成發光二極體之使用壽命減短，例如造成晶片快速失效，進而形成光衰減情況提前發生、又例如造成覆蓋於晶片上方的混光層膠體(EXPOXY環氧樹脂)加速黃化、質變等情況，是以，如何將發光二極體所產生的熱能快速發散，乃為目前實體應用上極待解決的問題。The low-power and high-brightness characteristics of the light-emitting diode make it meet the modern energy-saving use requirements. In recent years, the development of the technology of the light-emitting diode has been quite mature, so that it is low-intensity from the early stage. The demand for use as an alternative light source has evolved to date, and the light-emitting diode has been able to meet the requirements of high brightness and long service life. However, the accompanying problem is that the light-emitting diode is in high-power electrical use. At the same time of demand, the heat energy generated by it is also greatly increased; accordingly, if the heat energy generated by the light-emitting diode cannot be eliminated as soon as possible in the overall application, the high-temperature condition will cause the light-emitting diode The service life of the body is shortened, for example, causing rapid failure of the wafer, thereby forming a light attenuation condition to occur in advance, and for example, causing accelerated mixing of the colloidal layer colloid (EXPOXY epoxy resin) over the wafer to accelerate yellowing, qualitative change, etc. How to quickly dissipate the heat generated by the light-emitting diode is an extremely problem to be solved in the current physical application.

請參閱「第1圖」，圖中所示係為一種習知的燈泡型燈具之立體外觀圖，如圖所示的燈泡型燈具1，其主要是應用一發光二極體裝置11作為發光源，現行實體產品中，所應用的發光二極體裝置11其主要係將一印刷有電路線的電路基板112，作為一發光二極體 模組113的載體，製作時，係利用表面粘著技術，使數個發光二極體模組113直接粘著於電路基板112之平面，且各發光二極體模組113係分別與電路線完成電性連接，又，各發光二極體模組113的表面被覆有一混光層膠體(EXPOXY環氧樹脂)114，用以保護各發光二極體模組113的晶片(或同時具有混色的功效)；承上，再將發光二極體裝置11組設於一燈座12的組設部121，再將一半球型的燈殼組設後，即製成燈泡型燈具1；此種類型所製成的燈具，主要係使發光二極體裝置11的電路基板112可平貼於燈座12的組設部121，而所述的燈座12通常是以金屬製成，例如鋁或鋁合金，其主要是利用燈座12之材料本身具有較佳的散熱效果，藉以使電路基板112所聚集的熱可經由燈座12進行發散；惟，所述的散熱過程在進行時，電路基板112本身同時也處在高溫的情況中，是以，如在電路基板112上方佈設過多的發光二極體模組113，則常有因溫度過高而導致電路基板112變形的情況，如果電路基板112本身進一步以金屬製成，則其電性連接的部份，又常有短路的情況發生，是以，產品的良率常因此而大受影響。Please refer to "Fig. 1", which is a perspective view of a conventional bulb-type lamp, as shown in the bulb type lamp 1, which mainly uses a light-emitting diode device 11 as a light source. In the current physical product, the applied light-emitting diode device 11 mainly uses a circuit substrate 112 printed with a circuit line as a light-emitting diode. The carrier of the module 113 is fabricated by using a surface adhesion technique to directly adhere a plurality of LED modules 113 to the plane of the circuit substrate 112, and each of the LED modules 113 is respectively connected to the circuit line. After the electrical connection is completed, the surface of each of the LED modules 113 is coated with a light-mixing layer colloid (EXPOXY epoxy resin) 114 for protecting the wafers of the LED modules 113 (or at the same time having a color mixture). (Effect)); then, the light-emitting diode device 11 is set in the assembly portion 121 of a lamp holder 12, and then the half-ball type lamp housing is assembled, thereby forming a bulb-type lamp 1; The lamp is mainly made such that the circuit substrate 112 of the LED device 11 can be flatly attached to the assembly portion 121 of the lamp holder 12, and the lamp holder 12 is usually made of metal, such as aluminum or aluminum. The alloy mainly uses the material of the lamp holder 12 to have a better heat dissipation effect, so that the heat accumulated by the circuit substrate 112 can be diverged through the lamp holder 12; however, when the heat dissipation process is in progress, the circuit substrate 112 is in progress. It is also in the case of high temperature at the same time, such as on the circuit substrate 112. If too many LED modules 113 are disposed, the circuit substrate 112 may be deformed due to excessive temperature. If the circuit substrate 112 itself is further made of metal, the electrically connected portions are often A short circuit occurs because the yield of the product is often greatly affected.

有鑒於上述的問題，創作者乃係依據多年來從事相關產品設計的經驗，針對發光二極體之發光特性、熱源產生及分佈、導熱及散熱需求等，進行相關性的研究及分析，期能設計出可解決上述問題之實體產品；依此，本創作之主要的目的在於提供一種強度佳、導熱及散熱效果良好的光源裝置；並進一步使其可符合照明或警示光源之需求。In view of the above problems, the creators are based on years of experience in related product design, research and analysis of the luminescence characteristics, heat source generation and distribution, heat conduction and heat dissipation requirements of the light-emitting diodes. The physical product designed to solve the above problems is designed; accordingly, the main purpose of the creation is to provide a light source device with good strength, good heat conduction and heat dissipation effect; and further make it meet the requirements of illumination or warning light source.

為達上述目的，本創作主要係以散熱效果良好的陶瓷材料作為基板，並於其上平表面印刷有電路，再者，在陶瓷基板之實體貫穿有複數個透孔，且於各透孔中填充有導熱效果良好的材料，以使陶瓷基板本身即具有數個導熱柱，具各導熱柱延伸至陶瓷基板的下平面，並於一導熱層形成連結，又，本創作所稱的陶瓷基板，其電路主要係供複數個已完成封裝的發光二極體模組直接進行電性組設，在製程中可大幅降低其生產難度，再者，各發光二極體模組完成組設於陶瓷基板後，其在發光時所產生的熱能，可直接經由各導熱柱，快速的傳導至導熱層；另，本創作可直接貼附於一燈具之組設部，藉由導熱層與燈具之組設部的接觸，使熱可快速被導至燈具本身，以進行大面積的熱發散效果，進而達到快速散熱的功效。In order to achieve the above objectives, the present invention mainly uses a ceramic material having a good heat dissipation effect as a substrate, and a circuit is printed on the upper flat surface thereof. Further, a plurality of through holes are formed in the solid body of the ceramic substrate, and in each through hole. Filled with a material with good thermal conductivity, so that the ceramic substrate itself has a plurality of thermally conductive columns, each of which has a heat conducting column extending to the lower plane of the ceramic substrate and forming a joint in a thermally conductive layer, and the ceramic substrate referred to in the present invention, The circuit is mainly for the electrical assembly of a plurality of completed LED modules, which can greatly reduce the production difficulty in the process. Furthermore, the LED modules are assembled on the ceramic substrate. After that, the heat energy generated during the light emission can be quickly transmitted to the heat conductive layer directly through the heat conducting columns; in addition, the creation can be directly attached to the assembly part of a lamp, and the heat conduction layer and the lamp are assembled. The contact of the part allows the heat to be quickly guided to the lamp itself for a large-area heat dissipation effect, thereby achieving rapid heat dissipation.

為使 貴審查委員得以清楚了解本創作的結構、組成及其實施後之功效，茲以下列說明搭配圖示，請參閱。In order for your review board to have a clear understanding of the structure, composition and effectiveness of the creation, please refer to the following description.

請參閱「第2圖」，圖中所示係為本創作的立體外觀圖，如圖所示的光源裝置2，其主要係由一陶瓷基板21、複數個發光二極體模組22所組構而成，其中，各發光二極體模組22係為經封裝完成的獨立元件(單元)，其分別組設於陶瓷基板21的上表面，又，經過電性線路佈設的設計，於陶瓷基板21的邊緣，係具有一組電性接點211(正、負極接點)，以供與一外部電性線路作連接。Please refer to "Fig. 2", which is a three-dimensional appearance of the creation. The light source device 2 shown in the figure is mainly composed of a ceramic substrate 21 and a plurality of LED modules 22. Each of the LED modules 22 is a packaged independent component (unit), which is respectively disposed on the upper surface of the ceramic substrate 21, and is designed by electrical wiring, in ceramics. The edge of the substrate 21 has a set of electrical contacts 211 (positive and negative contacts) for connection to an external electrical circuit.

請接續參閱「第3圖」，圖中所示係為本創作的構件組合示意圖，如圖所示，陶瓷基板21之上表面212，係佈設有一電性線路 213，其係可例如以印刷方法完成，又，陶瓷基板21的實體上，係經貫穿，成形有複數個透孔214，且於此透孔214之中填充有熱傳導性良好的高導熱性材料，以形成一導熱柱215；又，本創作中所述的發光二極體模組22乃係指已經過封裝完成後之獨立元件(單元)，其係組設於陶瓷基21的上表面212，且與所述的電性線路213完成電性連接，組設完成後，即如「第2圖」中所示；承上，請接續參閱「第4圖」，圖中所示係為本創作的剖面示意圖，如圖可知，所述的導熱柱215係藉由透孔214，成型於陶瓷基板21的上表面212與下表面216之間，且導熱柱215下方的末端，係與與成型於下表面216的一導熱層217形成連結，又，所述的導熱層217係以一高熱傳導係數的材料，塗佈於下表面216的平面上，完成後，與導熱柱215形成一個有效的熱傳導途徑；請搭配參閱「第5圖」，圖中所示即為本創作之下表面的示意圖。Please refer to "3", which is a schematic diagram of the assembly of the original assembly. As shown in the figure, the upper surface 212 of the ceramic substrate 21 is provided with an electrical circuit. 213, which can be completed, for example, by a printing method. Further, the ceramic substrate 21 is integrally formed with a plurality of through holes 214 formed therein, and the through holes 214 are filled with a highly thermally conductive material having good thermal conductivity. The light-emitting diode module 22 described in the present application refers to a separate component (unit) that has been packaged and assembled on the upper surface 212 of the ceramic substrate 21. And electrically connected to the electrical circuit 213, after the completion of the assembly, as shown in "Figure 2"; please refer to "Figure 4", which is shown in the figure. As shown in the figure, the heat conducting column 215 is formed by the through hole 214 between the upper surface 212 and the lower surface 216 of the ceramic substrate 21, and the end of the heat conducting column 215 is formed and molded. A heat conducting layer 217 is formed on the lower surface 216 to form a joint. Further, the heat conducting layer 217 is coated on the plane of the lower surface 216 by a material having a high thermal conductivity. After completion, it forms an effective relationship with the heat conducting column 215. Heat conduction path; please refer to "Figure 5", as shown in the figure A schematic representation of the surface under this creation.

請參閱「第6圖」，圖中所示係為本創作的實施示意圖(一)，如圖中所示，本創作所稱的光源裝置2，係可供組設於一燈具3，所述的燈具3係具有一燈座31，其主要係由散熱性良好的金屬材料製成，燈座31的上方係成型有一組設部311，本創作所稱的光源裝置2，即藉陶瓷基板21之下平面216，平貼組設於組設部311的平面，兩者之間可藉由鎖固、或黏貼以完成相互固定，且兩者之間亦可進一步塗佈有導熱效果較佳的接著劑(例如銀膠)；承上，組設完成後，進一步使光源裝置2的電性接點211(正、負極接點)，與一電性連接線32完成電性連結，且在燈座31上方再組設一可透光的蓋體33，即可完成燈具3之組設。Please refer to "Fig. 6", which is a schematic diagram of the implementation of the creation (1). As shown in the figure, the light source device 2 referred to in the present invention can be assembled in a lamp 3, The lamp 3 has a lamp holder 31, which is mainly made of a metal material with good heat dissipation. The lamp holder 31 is formed with a set of portions 311. The light source device 2, which is referred to in the present invention, is a ceramic substrate 21. The lower surface 216 is disposed on the plane of the assembly portion 311, and can be fixed to each other by locking or pasting, and the two can be further coated with a heat conduction effect. a subsequent agent (for example, silver glue); after the assembly is completed, the electrical contact 211 (positive and negative contact) of the light source device 2 is further electrically connected to an electrical connection line 32, and the lamp is A light-permeable cover 33 is further disposed above the seat 31 to complete the assembly of the lamp 3.

請接續參閱「第7圖」，圖中所示係為本創作的實施示意圖 (二)，如圖所示，當光源裝置2經電流導通後係可產生發光，此時，其所產生的熱能，即如圖中所示，可快速的藉由各導熱柱215向下傳導至陶瓷基板21的下表面216，並由導熱層217快速的將熱能導向燈座31，由於燈座31本身為金屬材料製成(或在其表面塗覆有高散熱效果的材料)，是以，所述的熱能，即可被快速的發散，進而達到絕佳散熱的效果。Please refer to "Figure 7", which is a schematic diagram of the implementation of this creation. (2) As shown in the figure, when the light source device 2 is turned on by the current, light can be generated. At this time, the heat energy generated by the light source device 2 can be quickly transmitted downward through the heat conducting columns 215 as shown in the figure. To the lower surface 216 of the ceramic substrate 21, and the thermal energy is quickly guided by the heat conductive layer 217 to the lamp holder 31, since the lamp holder 31 itself is made of a metal material (or a material having a high heat dissipation effect on its surface) The heat energy can be quickly dissipated to achieve excellent heat dissipation.

綜上所述可知，本創作所稱之光源裝置，其主要係以陶瓷基板作為發光二極體模組的載板，藉此高散熱的特性，可以增加發光二極體佈設的數量，藉以提高其發光時的總亮度，再者，其平面上直接佈設有電性線路，以使各發光二極體模組可直接組設於陶瓷基板的平面上，再者，於陶瓷基板本身成型有數個導熱柱，且在其下表面成型有一導熱層，藉由各導熱柱與導熱層的結合，以形成一個快速導熱的途徑，藉此，當各發光二極體在發光時所產生的熱能，即可藉上述的導熱途徑，將熱能快速的導引至一散熱裝置，例如具有金屬製的燈座、具有散熱鰭片的燈座、或散熱器等，以降低熱能對發光二極體模組造成的破壞，相對而言，即可提高其使用壽命；據上所陳可知，本創作其據以實施後，確實可以達到提供一種強度佳、導熱及散熱效果良好的光源裝置之目的。In summary, the light source device referred to in the present invention mainly uses a ceramic substrate as a carrier plate of the light-emitting diode module, thereby increasing the number of light-emitting diodes and thereby increasing the number of light-emitting diodes. The total brightness of the light when it is illuminated, and the electrical line is directly disposed on the plane, so that the light emitting diode modules can be directly assembled on the plane of the ceramic substrate, and further, several ceramics are formed on the ceramic substrate itself. The heat conducting column has a heat conducting layer formed on the lower surface thereof, and the heat conducting layer is combined with the heat conducting layer to form a fast heat conduction path, whereby the heat energy generated when each light emitting diode emits light, that is, The thermal conduction can be quickly guided to a heat dissipating device, such as a metal lamp holder, a lamp holder with heat sink fins, or a heat sink to reduce heat energy to the LED module. The damage can be relatively improved, and it can be improved according to the above. According to the above, after the implementation of this creation, it can indeed provide a light source device with good strength, good heat conduction and heat dissipation. of.

唯，以上所述者，僅為本創作之較佳實施例而已，並非用以限定本創作實施之範圍，任何熟習此技藝者，在不脫離本創作之精神與範圍下所作之均等變化與修飾，皆應涵蓋於本創作之專利範圍內。The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any change and modification made by those skilled in the art without departing from the spirit and scope of the present invention. , should be covered by the scope of this creation patent.

綜上所述，本創作之功效，係符合申請專利要件之「實用性」、「新穎性」與「進步性」；申請人爰依專利法之規定，向 鈞局提 起新型專利之申請。In summary, the effectiveness of this creation is in line with the "practicality", "novelty" and "progressiveness" of the application for patents; the applicant has filed with the Office in accordance with the provisions of the Patent Law. Application for new patents.

1‧‧‧燈泡型燈具1‧‧‧Light bulb type lamps

11‧‧‧發光二極體裝置11‧‧‧Lighting diode device

12‧‧‧燈座12‧‧‧ lamp holder

112‧‧‧電路基板112‧‧‧ circuit board

121‧‧‧組設部121‧‧‧Team Department

113‧‧‧發光二極體模組113‧‧‧Lighting diode module

114‧‧‧混光層膠體114‧‧‧mixed layer colloid

2‧‧‧光源裝置2‧‧‧Light source device

21‧‧‧陶瓷基板21‧‧‧Ceramic substrate

22‧‧‧發光二極體模組22‧‧‧Lighting diode module

211‧‧‧電性接點211‧‧‧Electrical contacts

212‧‧‧上表面212‧‧‧ upper surface

213‧‧‧電性線路213‧‧‧Electrical lines

214‧‧‧透孔214‧‧‧through hole

215‧‧‧導熱柱215‧‧‧thermal column

216‧‧‧下表面216‧‧‧ lower surface

217‧‧‧導熱層217‧‧‧thermal layer

3‧‧‧燈具3‧‧‧Lighting

31‧‧‧燈座31‧‧‧ lamp holder

32‧‧‧電性連接線32‧‧‧Electrical cable

311‧‧‧組設部311‧‧‧ Department

33‧‧‧蓋體33‧‧‧ cover

第1圖，為一種習知的燈泡型燈具之立體外觀圖。Fig. 1 is a perspective view of a conventional bulb type lamp.

第2圖，為本創作的立體外觀圖。Figure 2 is a three-dimensional appearance of the creation.

第3圖，為本創作的構件組合示意圖。Figure 3 is a schematic diagram of the component combination of the creation.

第4圖，為本創作的剖面示意圖。Figure 4 is a schematic cross-sectional view of the creation.

第5圖，為本創作之下表面的示意圖。Figure 5 is a schematic diagram of the surface under the creation.

第6圖，為本創作的實施示意圖(一)。Figure 6 is a schematic diagram of the implementation of the creation (1).

第7圖，為本創作的實施示意圖(二)。Figure 7 is a schematic diagram of the implementation of the creation (2).

2‧‧‧光源裝置2‧‧‧Light source device

21‧‧‧陶瓷基板21‧‧‧Ceramic substrate

22‧‧‧發光二極體模組22‧‧‧Lighting diode module

211‧‧‧電性接點211‧‧‧Electrical contacts

Claims (3)

一種光源裝置，供作為照明用燈之發光源，其包括：一陶瓷基板，該陶瓷基板的上表面成型有一電性線路，並電性連結至成型於該陶瓷基板邊緣的一電性接點，該陶瓷基板之上表面至下表面之間，並成型有一貫穿的透孔，該透孔中成型有一導熱柱，該導熱柱末端，與成型於該陶瓷基板之一下表面的一導熱層形成連結，進而形成一熱傳導途徑；以及一發光二極體模組，組設於該陶瓷基板的上表面，並與該電性線路完成電性連接。A light source device for use as a light source for an illumination lamp, comprising: a ceramic substrate having an electrical circuit formed on an upper surface thereof and electrically connected to an electrical contact formed on an edge of the ceramic substrate; Between the upper surface and the lower surface of the ceramic substrate, a through hole is formed, and a heat conducting column is formed in the through hole, and the end of the heat conducting column is coupled with a heat conducting layer formed on a lower surface of the ceramic substrate. Further, a heat conduction path is formed; and a light emitting diode module is disposed on the upper surface of the ceramic substrate and electrically connected to the electrical circuit. 如申請專利範圍第1項所述的光源裝置，其中，該導熱柱有複數個。The light source device of claim 1, wherein the plurality of thermally conductive columns are plural. 如申請專利範圍第1項所述的光源裝置，其中，該發光二極體模組有複數個。The light source device of claim 1, wherein the light emitting diode module has a plurality of light emitting diode modules.