M421217 五、新型說明： 【新型所屬之技術領域】 本創作是關於一種在加工晶圓的自動化設備中，用來拿取晶 圓之取放手臂機構，特別是指一種用來拿取變形翹曲之晶圓，並 能在拿取過程中避免晶圓破片之取放手臂機構。 【先前技術】 # 纽有的加工晶圓自動化設備中，最常用機械手臂作為取放 晶圓的機構，此種機械手臂通常被製成薄型平板狀的手臂，並在 手臂表面設有供空氣流通的氣槽，當手臂接_晶圓時，利用外 在的真空源將手臂氣槽巾的空氣絲，以形成真錄態來達到吸 取晶圓的目的。 但上述技術’對於平整度高無㈣之厚片日日日圓或薄化之軟性 晶圓(如石夕晶圓)而言，因手臂與晶圓有良好的貼合度，所以可得到 #良好的晶圓取放能力，然而，當硬脆之晶圓薄化後會產生變形及 _現象’當變形量超過-定程度時，會在晶圓與手臂之間出現 過大的間隙，贿無法形成真空，亦可能造成真空吸取期間，手 臂壓迫晶圓而造成晶圓破片的情形。 【新型内容】 因此’本創作的目的是設計一種晶圓取放手臂觸，此取放 手臂上設置-軟質彈性體’藉此轉雜體來承载晶圓，以解決 3 M421217 真空吸附過封，晶圓與手制產生壓迫，而造成晶圓破片的情 ' 形。 '本創作所提供之晶圓取放手臂機構，主要是在一手臂本體上 设置至少一軟質彈性體，該手臂本體内部設有連接真空源之第一 氣道，該軟質彈性體内部設有與該第一排氣道相通之第二氣道， 軟質彈性體具有-接觸端肋承載H當對該第—氣道及該 第二氣道抽真空，該接觸端可隨晶圓表面幅度產生變形，而服貼 φ 於該晶圓表面；藉由軟質彈性體的變形能力以及做為手臂本體與 晶圓間的介質，可避免在抽真空過程中，晶圓與手臂本體產生擠 壓而導致晶圓破片。 與傳統僅以手臂對晶圓抽真空，吸附晶圓的技術相較，本創 作在手臂本體上增設軟質彈性體來承載晶圓，並非直接讓翹曲變 形的晶圓接觸手臂本體，因此，在抽真空欲吸附晶圓過程中，軟 質彈性體能隨著晶圓表面產生變形進而服貼於晶圓表面，與晶圓 • 表面之間沒有空隙，形成良好的吸附效果。 【實施方式】 以下配合圖式及元件符號對本創作之實施方式做更詳細的說 明，俾使熟習該項技藝者在研讀本說明書後能據以實施。 請參閱第一圖為本創作晶圓取放手臂機構較佳實施例組合 圖。主要包括一手臂本體1與至少一軟質彈性體2。該軟質彈性體 2設置於該手臂本體1上，用以承載一經薄化後產生翹曲的晶圓， 4 猎由軟質彈性體2本身可以變形的特性來適應科坦的晶圓表 面並做為晶圓與手臂本體間的介質，避免取放手臂機構在被抽 真工過私中’因晶圓過於接近手臂本體，而對晶圓產生壓迫，造 成晶圓破片的問題。 π參閱第及第三圖’分別為本創作晶圓取放手臂機構較 k貝化例分觸及組合剖面圖。在本實關巾，所述手臂本體） 可以金屬製成U形體’手臂本體丨並具有—接續端u，用以連接 一真空源（圖未示）’手臂本體丨内部開設有第-氣道12，此第一 氣道12沿著手臂本體丨的輪廓設置，而通過手臂本體丨兩端以及 雜續i% 1卜手臂本體1兩端分別設有__凹陷面13，用以設置所 述軟質彈性體2’第-氣道12向上延伸通過此凹陷面13。在本實 施例中軟質彈性體2有兩個，分別固設於該兩凹陷面13上，軟質 彈性體2的結構包括形成—體之—接觸端2卜—頸部22及一基部 23，該基部23固設於該凹陷面13，該頸部22.位於基部23上方， 該接觸端21位於頸部22上方，頸部22的徑向尺寸小於基部23 及接觸端21之徑向尺寸，軟質彈性體2内部開設有第二氣道％， 此第二氣道24從基部23通至接觸端21，因此，當軟質彈性體2 固設於凹陷面13時，第一氣道12是與第二氣道24相連通。其令， 接觸端21呈盤狀。軟質彈性體2具有當所述頸部22愈具彈性， 接觸端21能偏擺的角度愈大之特性，使接觸端21能適應並服貼 於各種不同表面幅度之晶圓。 請配合第三圖，並請參閱第四圖及第五圖，分別為手臂本體 M421217M421217 V. New Description: [New Technology Field] This creation is about a pick-and-place arm mechanism for taking wafers in automated equipment for processing wafers, especially for taking deformation warping. Wafers, and can avoid the wafer fragmentation of the arm mechanism during the take-up process. [Prior Art] # In the processing of wafer automation equipment, the most commonly used mechanical arm is used as a mechanism for picking and placing wafers. This type of robot arm is usually made into a thin flat arm and is provided with air circulation on the arm surface. The air trough, when the arm is connected to the wafer, uses an external vacuum source to force the air filament of the arm airbag to form a true recording state to achieve the purpose of sucking the wafer. However, the above technology is good for the thick wafers with high flatness (4) and the thin wafers of thin days (such as Shi Xi Wa Wa), because the arm and the wafer have a good fit. The wafer pick-and-place capability, however, will cause deformation and _ phenomenon when the hard and brittle wafer is thinned. When the amount of deformation exceeds a certain degree, there will be an excessive gap between the wafer and the arm, and the bribe cannot form. The vacuum may also cause the wafer to be crushed by the arm during vacuum suction, causing wafer fragmentation. [New content] Therefore, the purpose of this creation is to design a wafer pick-and-place arm contact, which is provided with a soft elastomer to transfer the wafer to carry the wafer to solve the 3 M421217 vacuum adsorption over-sealing. Wafer and hand-made oppression, resulting in wafer fragmentation. The wafer pick-and-place arm mechanism provided by the present invention is mainly provided with at least one soft elastic body on an arm body, and the first air passage connecting the vacuum source is disposed inside the arm body, and the soft elastic body is internally provided a second air passage communicating with the first exhaust passage, the soft elastomer having a contact end rib carrying H. When the first air passage and the second air passage are evacuated, the contact end may be deformed according to the surface amplitude of the wafer, and the service is applied. φ is on the surface of the wafer; by the deformability of the soft elastomer and as the medium between the arm body and the wafer, it is possible to prevent the wafer from being crushed during the vacuuming process and causing wafer fragmentation. Compared with the traditional technique of vacuuming the wafer and sucking the wafer, this creation adds a soft elastomer to the arm body to carry the wafer. It does not directly expose the warped wafer to the arm body. Therefore, During the vacuum pumping process, the soft elastomer can be applied to the surface of the wafer as the wafer surface is deformed, and there is no gap between the wafer and the surface to form a good adsorption effect. [Embodiment] The embodiments of the present invention will be described in more detail below with reference to the drawings and the component symbols, so that those skilled in the art can implement the present invention after studying the present specification. Please refer to the first figure for a combination of preferred embodiments of the wafer pick-and-place arm mechanism. It mainly comprises an arm body 1 and at least one soft elastic body 2. The soft elastic body 2 is disposed on the arm body 1 for carrying a wafer which is warped after being thinned. 4 The hunting is characterized by the deformability of the soft elastic body 2 to adapt to the surface of the substrate of the Kotan and as The medium between the wafer and the arm body avoids the problem of the wafer fragmentation caused by the wafer being too close to the arm body due to the fact that the wafer is too close to the arm body. π Refer to the third and third figures' respectively for the creation of the wafer pick-and-place arm mechanism. In the actual closing towel, the arm body can be made of metal into a U-shaped body arm body and has a connecting end u for connecting a vacuum source (not shown). The arm body is internally provided with a first air passage 12 The first air passage 12 is disposed along the contour of the arm body ,, and the __ recessed surface 13 is respectively disposed at both ends of the arm body 以及 and the ends of the arm body 1 for setting the soft elasticity. The body 2' first air passage 12 extends upward through the recessed surface 13. In the present embodiment, two soft elastic bodies 2 are respectively fixed on the two concave surfaces 13 , and the structure of the soft elastic body 2 includes a forming body-contacting end 2 - a neck portion 22 and a base portion 23, which The base portion 23 is fixed to the recessed surface 13 . The neck portion 22 is located above the base portion 23 . The contact end 21 is located above the neck portion 22 . The radial dimension of the neck portion 22 is smaller than the radial dimension of the base portion 23 and the contact end 21 , and the soft portion is soft. The second air passage 24 is opened from the base portion 23 to the contact end 21. Therefore, when the soft elastic body 2 is fixed to the recessed surface 13, the first air passage 12 and the second air passage 24 are Connected. Therefore, the contact end 21 has a disk shape. The soft elastomer 2 has the property that the neck portion 22 becomes more elastic and the angle at which the contact end 21 can yaw is greater, so that the contact end 21 can be adapted to conform to the wafer of various surface widths. Please cooperate with the third figure, and please refer to the fourth and fifth figures, respectively, the arm body M421217
圓之_及其局部視圖。本___機構是利 (、空來牛_吸附(承载)晶圓’特別是針馳曲變形的晶圓， 吸附後再將晶圓移至下-工作站進行加卫。因此在手臂本體吸附 晶圓的過程中，必須避免晶圓破片。取放手臂機構吸取晶圓的過 程為，當晶圓3被置放於軟質彈性體2的接觸端2ι後，真空源(圖 未不)對第-乳道12及第二氣道24抽真空，晶圓3表面與接觸端 21之間形成-股緊密接觸的力量，此時，接觸端21因具彈性變形 能力，會隨著所接觸的晶圓3表面幅度變形，並服貼於晶圓3表 面，由第五圖可見’若晶圓3表面馳曲形態是漸漸朝晶圓中央 向下弧彎凹陷，與其接觸的接觸端21表面便形成—侧向下饋縮的 狀態’以達到使軟質彈性體2服貼於晶圓3表面的目的。如前述， 工員郤22的彈性會影響接觸端21所能偏擺的幅度；若頸部22過硬， 接觸端21又需承載下彎幅度較大的晶圓時，抽真空過程中，接觸 端21會對晶圓3產生壓迫，很容易造成晶圓破片，故，頸部22 及接觸端21需有適當的彈性。晶圓的翹曲狀亦可能為表面向上弧 彎翹曲(圖未示）’亦適用本創作之軟質彈性體。 與傳統僅以手臂對晶圓抽真空吸附晶圓的技術相較，本創作 在手臂本體1上增設軟質彈性體2來承載晶圓3,並非直接讓翹曲 變形的晶圓3接觸手臂本體1，因此，在抽真空欲吸附晶圓過程 中’軟質彈性體2能隨著晶圓3表面產生變形進而服貼於晶圓3 表面’與晶圓3表面丈間沒有空隙，不會造成晶圓破片的情形。 以上所述者僅為用以解釋本創作之較佳實施例’並非企圖據 M4.21217 以對本創作做任何形式上之限制，是以，凡有在相同之創作精神 下所作有關本創作之任何修飾或變更，皆仍應包括在本創作意圖 保護之範缚。The circle _ and its partial view. The ___ agency is a profitable (and empty ox-adsorbing (bearing) wafer', especially the wafer that is deformed by the needle. After the adsorption, the wafer is moved to the lower-workstation for reinforcement. Therefore, the body is adsorbed. In the process of wafer, wafer fragmentation must be avoided. The process of picking up the arm by the arm mechanism is that when the wafer 3 is placed on the contact end 2 of the soft elastomer 2, the vacuum source (not shown) - The milk passage 12 and the second air passage 24 are evacuated, and a force of close contact between the surface of the wafer 3 and the contact end 21 is formed. At this time, the contact end 21 is elastically deformed and will follow the wafer to be contacted. 3 The surface amplitude is deformed and applied to the surface of the wafer 3. As can be seen from the fifth figure, if the surface of the wafer 3 is smoothly curved toward the center of the wafer, the surface of the contact end 21 is formed. The state of the side-down-feeding is to achieve the purpose of adhering the soft elastic body 2 to the surface of the wafer 3. As described above, the elasticity of the worker 22 affects the amplitude of the yaw of the contact end 21; if the neck 22 is too hard When the contact end 21 needs to carry a wafer with a large downward bend, during the vacuuming process, the contact 21 will compress the wafer 3, which is easy to cause wafer fragmentation. Therefore, the neck 22 and the contact end 21 need to have appropriate elasticity. The warpage of the wafer may also warp the surface upward arc (not shown) ) 'The soft elastomer of this creation is also applicable. Compared with the traditional technique of vacuum-adsorbing wafers by arm-to-wafer, this creation adds a soft elastomer 2 to the arm body 1 to carry the wafer 3, which is not directly The warped deformed wafer 3 contacts the arm body 1. Therefore, during the evacuation of the wafer to be adsorbed, the 'soft elastomer 2 can be deformed along the surface of the wafer 3 and then applied to the surface of the wafer 3' and the wafer 3 There is no gap between the surface and no wafer fragmentation. The above description is only for explaining the preferred embodiment of the creation' is not intended to impose any form restrictions on the creation according to M4.21217. Any modification or alteration of this creation made in the same creative spirit should still be included in the protection of this creative intent.
M421217 【圖式簡單說明】 第-圖為本創作晶圓取放手臂機構較佳實施例組合圖。 第二圖為本創作晶®取放手f機構較佳實_分解圖。 第二圖為本創作晶圓取放手臂機構較佳實施例組合剖面圖 第四圖為手臂本體承載晶圓之前視圖。 第五圖為第四圖之局部視圖。 【主要元件符號說明】 1. 手臂本體 u.接續端 12_第一氣道 13.凹陷面 2. 軟質彈性體 21. 接觸端 22. 頸部 23. 基部 24·第二氣道 3.晶圓M421217 [Simple Description of the Drawings] The first figure is a combination of preferred embodiments of the wafer pick-and-place arm mechanism. The second picture is a better actual _ exploded view of the creation of the crystal plate. The second figure is a combined cross-sectional view of a preferred embodiment of the wafer pick-and-place arm mechanism. The fourth figure is a front view of the arm body carrying the wafer. The fifth figure is a partial view of the fourth figure. [Main component symbol description] 1. Arm body u. Connection end 12_First air passage 13. Concave surface 2. Soft elastomer 21. Contact end 22. Neck 23. Base 24·Second air passage 3. Wafer