M395916 五、新型説明： 【新型所屬之技術領域】 本創作係有關一種散熱結構，尤指一種可直接快速將熱 源散逸’以確保發光體工作壽命之發光體之散熱結構。 【先前技術】 按，發光二極體具有體積小、重量輕、低耗電、壽命長 專诸多優‘點’因此廣泛使用於電腦周邊、通訊產品以及其他 >電子裝置中。 而在高功率發光二極體元件中，尤其是可提供照明使用 之發光二極體元件，為提供更大之出光量，往往必須提高發 光二極體之工作電流，或者使增大每一個發光二極體元件之 發光晶粒尺寸；然而隨著工作電流的提升，將會使的發光晶 粒產生更多的熱量，因而導致發光晶粒的工作溫度隨之上 升，而發光晶粒之工作溫度越高，則發光效率越低，甚至對 發光晶粒造成永久性的傷害，又電路板上的發光元件需以空 >氣為熱傳導介質。然而以空氣傳導方式散熱，無法將發光元 件所累積的熱迅速有效的散失，而使得發光元件的效能降 低’甚至減少元件的壽命，因此如何將發光二極體元件之工 作熱源適時向外界排出，以使發光二極體元件保持適當之工 作溫度’進而增進發光放率以節省能源，正是高功率發光二 極體元件在研究發展上的一項重要課題。 M395916 【新型内容】 有鑑於此，本創作之主要目的係提供一發光體之散熱結 構其係包含有一電路板、絕緣層、至少一貫孔、一散熱基板、 至少一發光二極體及至少一組導線；其中絕緣層上端面設一 電路板，而絕緣層另端面設一散熱基板，且該電路板及絕緣 層設有至少一貫穿之貫孔，而發光二極體崁設該貫孔内並抵 接該散熱基板，並由一組導線分別銜接該發光二極體及電路 板間形成電性連接，其藉由該散熱基板為其熱擴散介質迅速 傳導熱源’更直接而快速將發光二極體作動時之熱源散去，鲁 以確保發光二極體之工作效能及功率。 【實施方式】 為能使責審查委員清楚本創作之結，構組成’以及整體 運作方式’茲配合圖式說明如下： 本創作「發光體之散熱結構」，如第一圖所示，其係包含 有電路板10、絕緣層2〇、複數貫孔30及散熱基板40 ;其整 體結構係為層疊組設所構成，該電路板10下端面設有絕緣層 _ 2〇而散熱基板4〇係設於該絕緣層20下端面，係相對於電 路板10之另端面，另該電路板10及絕緣層20設有複數貫孔 30，且該貫孔3〇同時貫穿該電路板1〇及絕緣層20。 一當然，本創作其散熱結構進一步可結合發光體，又如第 「圖所示，其係包含有電路板10、絕緣層20、至少一貫孔 〇、散熱基板40、至少一發光二極體50及至少一組導線6〇 ; ^整體結構係為層疊組設所構成，該該電路板10下端面彀有 、色緣層20，而散熱基板4〇係設於該絕緣層20且相對於電路 M395916 板10之另端面，另該電路板1〇及絕緣層2〇設有至少一貫孔 30’且該貫孔30同時貫穿該電路板1〇及絕緣層20。 據以，實際實施如第三圖所示，該發光二極體50係崁設 於該貫孔30内，並抵接該散熱基板40 ’其藉由該散熱基板 40為其熱擴散介質迅速傳導熱源，更直接而快速將發光二極 體50作動時之熱源傳導並可快速散熱，以確保發光二極體 • 50之工作效能及功率。又該發光二極體5〇與電路板1〇間銜 -設一組導線60使兩電極分別得以電性連接。 鲁 再者’該電路板10與該絕緣層20間，及該絕緣層20與 該散熱基板40係可各設置一接著層，而該接著層係可為焊接 層或是導熱膠黏合層。. 而且’該發光二極體50設置於貫孔30内係與該電路板 10等高’其可使光源具有較佳之出光角度，或是如第四圖所 示該發光二極體50設置於貫孔30.内係高於該電路板1〇，其 可使光源具有較大之出光角度。 又’該散熱基板40可為石墨層、鋁金屬基板、非導電性 籲鑽石層41 (如五圖及所示）之其中一者，亦可為均溫散熱板 -42’以配合不同之散熱效果。而該均溫散熱板如第六圖及第 七圖所示，係由一基座421蓋合一蓋板422所組設，且該基 座421與蓋板422之間設有複數支撐柱體423，以及一具有 複數槽孔424之毛細元件425，而該基座421内進一步填充 有散熱液體。而散熱基板40上所抵接之發光體工作所發出之 熱源，可藉由該散熱基板40之作用將熱源佈滿整個散熱基板 40板體，並利用散熱基板40將熱源加以散去，以確保發光 體之工作壽命。 M395916 如上所述，本創作提供另一較佳可行之發光體之散熱結 構，爰依法提呈新型專利之申請；惟，以上之實施說明及圖 式所示，係本創作較佳實施例者，並非以此侷限本創作，是 以，舉凡與本創作之構造、裝置、特徵等近似、雷同者，均 應屬本創作之創設目的及申請專利範圍之内。 【圖式簡單說明】 第一圖係為本創作發光體之散熱結構之結構示意圖。 第二圖係為本創作發光體之散熱結構之另一結構分解 圖。 第三圖係為本創作發光體之散熱結構之另一結構示意 圖。 第四圖係為本創作發光體之散熱結構之局部結構分解 圖。 . 第五圖係為本創作發光體之散熱結構之又一結構分解 圖。 第六圖係為本創作發光體之散熱結構之均溫散熱板結構 分解圖。 第七圖係為本創作發光體之散熱結構之均溫散熱板結構 剖視圖。 M395916 •【主要元件符號說明】 電路板10 絕緣層20 貫孔30 散熱基板40 非導電性鑽石層41 均溫散熱板42 基座421 蓋板422 支撐柱體423 槽孔424 毛細元件425 發光二極體50 導線60M395916 V. New Description: [New Technology Field] This creation is about a heat dissipation structure, especially a heat dissipation structure that can directly dissipate the heat source to ensure the working life of the illuminator. [Prior Art] According to the light-emitting diode, it has a small size, light weight, low power consumption, and long life. It is widely used in computer peripherals, communication products, and other electronic devices. In the high-power light-emitting diode element, especially the light-emitting diode element which can provide illumination, in order to provide a larger amount of light, it is necessary to increase the operating current of the light-emitting diode, or to increase each light-emitting. The illuminating grain size of the diode element; however, as the operating current increases, the illuminating crystal grains will generate more heat, thereby causing the operating temperature of the illuminating crystal grains to rise, and the operating temperature of the illuminating crystal grains. The higher the luminous efficiency, the more permanent damage to the luminescent crystal grains, and the light-emitting elements on the circuit board need to be empty. However, heat dissipation by air conduction can not quickly and effectively dissipate the heat accumulated by the light-emitting elements, so that the performance of the light-emitting elements is reduced, and even the life of the components is reduced. Therefore, how to discharge the working heat source of the light-emitting diode elements to the outside world at a proper time, In order to maintain the proper operating temperature of the light-emitting diode component, thereby increasing the light-emitting rate to save energy, it is an important subject in the research and development of high-power light-emitting diode components. M395916 [New content] In view of this, the main purpose of the present invention is to provide a heat dissipation structure of a light-emitting body, which comprises a circuit board, an insulating layer, at least a consistent hole, a heat-dissipating substrate, at least one light-emitting diode and at least one set a wire; wherein the upper end surface of the insulating layer is provided with a circuit board, and the other end of the insulating layer is provided with a heat dissipation substrate, and the circuit board and the insulating layer are provided with at least one through hole, and the light emitting diode is disposed in the through hole Abutting the heat dissipating substrate, and electrically connecting a pair of wires respectively connecting the light emitting diode and the circuit board, wherein the heat dissipating substrate rapidly conducts a heat source for the heat diffusion medium, and the light emitting diode is more directly and quickly When the body is moving, the heat source is dissipated, so as to ensure the working efficiency and power of the light-emitting diode. [Embodiment] In order to make the review committee aware of the conclusion of the creation, the composition and the overall operation mode are described as follows: The creation of the "heat dissipation structure of the illuminator", as shown in the first figure, is The circuit board 10 includes a circuit board 10, an insulating layer 2, a plurality of through holes 30, and a heat dissipation substrate 40. The overall structure is a stacking structure, and the lower end surface of the circuit board 10 is provided with an insulating layer _ 2 〇 and the heat dissipation substrate 4 The lower end surface of the insulating layer 20 is opposite to the other end surface of the circuit board 10. The circuit board 10 and the insulating layer 20 are provided with a plurality of through holes 30, and the through holes 3 are simultaneously penetrated through the circuit board and insulated. Layer 20. Of course, the heat dissipation structure of the present invention can further be combined with the illuminant, and as shown in the first figure, the circuit board 10 includes an electric circuit board 10, an insulating layer 20, at least a uniform aperture, a heat dissipation substrate 40, and at least one light-emitting diode 50. And at least one set of wires 6〇; ^the overall structure is formed by a stacking assembly, the lower end surface of the circuit board 10 has a color edge layer 20, and the heat dissipation substrate 4 is disposed on the insulating layer 20 and is opposite to the circuit The other end face of the M395916 board 10, and the circuit board 1 and the insulating layer 2 are provided with at least a uniform hole 30' and the through hole 30 penetrates through the circuit board 1 and the insulating layer 20. At the same time, the actual implementation is as follows. As shown in the figure, the light-emitting diode 50 is disposed in the through-hole 30 and abuts the heat-dissipating substrate 40'. The heat-dissipating substrate 40 rapidly conducts a heat source for its thermal diffusion medium, and directly and quickly emits light. When the diode 50 is activated, the heat source is conducted and can be quickly dissipated to ensure the working efficiency and power of the light-emitting diode 50. The light-emitting diode 5 is connected to the circuit board 1 - a set of wires 60 is provided. The two electrodes are electrically connected respectively. Lu Zai's the board 10 and The insulating layer 20 and the insulating layer 20 and the heat dissipating substrate 40 may each be provided with an adhesive layer, and the adhesive layer may be a solder layer or a thermal adhesive bonding layer. Moreover, the light emitting diode 50 is disposed. In the through hole 30 is equal to the circuit board 10 'which can make the light source have a better light exit angle, or as shown in the fourth figure, the light emitting diode 50 is disposed in the through hole 30. The internal system is higher than the circuit The plate 1 〇 can make the light source have a larger light exit angle. The heat dissipation substrate 40 can be one of a graphite layer, an aluminum metal substrate, and a non-conductive diamond layer 41 (such as five figures and shown). The uniform temperature heat dissipation plate-42' can also be used to match different heat dissipation effects. The temperature uniform heat dissipation plate is assembled by a base 421 and a cover plate 422 as shown in the sixth and seventh figures. A plurality of support pillars 423 are disposed between the base 421 and the cover plate 422, and a capillary element 425 having a plurality of slots 424 is further filled with the heat dissipation liquid. The heat dissipation substrate 40 is offset. The heat source emitted by the operation of the illuminator can be used to heat the heat source by the action of the heat dissipation substrate 40. The heat dissipation substrate 40 is plated, and the heat source is used to dissipate the heat source to ensure the working life of the illuminator. M395916 As described above, the present invention provides another heat dissipation structure of the illuminant which is preferably feasible, and is presented in accordance with the law. The application of the new patent; however, the above description of the implementation and the drawings show that the preferred embodiment of the present invention is not limited to this creation, so that it is similar to the structure, device, and features of the creation. All of them should be within the creation purpose of the creation and the scope of patent application. [Simplified illustration] The first picture is the structure diagram of the heat dissipation structure of the illuminator. The second picture is the heat dissipation of the illuminator. Another structural exploded view of the structure. The third figure is another structural schematic diagram of the heat dissipation structure of the illuminator. The fourth figure is an exploded view of the partial structure of the heat dissipation structure of the illuminator. The fifth figure is another structural exploded view of the heat dissipation structure of the present illuminator. The sixth figure is an exploded view of the structure of the uniform temperature heat dissipation plate of the heat dissipation structure of the creation illuminator. The seventh figure is a cross-sectional view of the structure of the uniform temperature heat dissipation plate of the heat dissipation structure of the illuminator. M395916 • [Main component symbol description] Circuit board 10 Insulation layer 20 Through hole 30 Heat sink substrate 40 Non-conductive diamond layer 41 Uniform temperature heat sink 42 Base 421 Cover plate 422 Support column 423 Slot hole 424 Capillary element 425 Light-emitting diode Body 50 wire 60