TWI811763B - 黏接片以及加工物之製造方法 - Google Patents

黏接片以及加工物之製造方法 Download PDF

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Publication number: TWI811763B
Authority: TW; Taiwan
Prior art keywords: mentioned; base material; adhesive sheet; adhesive; shaped component
Prior art date: 2014-12-02

Application number

TW110129890A

Other languages

English (en)

Chinese (zh)

Other versions

TW202144516A (zh

Inventor

山下茂之

中村優智

Original Assignee

日商琳得科股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-12-02

Filing date

2015-12-01

Publication date

2023-08-11

2015-12-01 Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司

2021-12-01 Publication of TW202144516A publication Critical patent/TW202144516A/zh

2023-08-11 Application granted granted Critical

2023-08-11 Publication of TWI811763B publication Critical patent/TWI811763B/zh

Links

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VMWUNHCDOIDVAA-UHFFFAOYSA-N isocyanatooxyethane Chemical compound CCON=C=O VMWUNHCDOIDVAA-UHFFFAOYSA-N 0.000 description 1
239000000314 lubricant Substances 0.000 description 1
JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
229910052753 mercury Inorganic materials 0.000 description 1
229910001507 metal halide Inorganic materials 0.000 description 1
150000005309 metal halides Chemical class 0.000 description 1
RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
YYOVITCBQDQNHB-UHFFFAOYSA-N methyl prop-2-eneperoxoate Chemical compound C(C=C)(=O)OOC.C(C=C)(=O)OOC YYOVITCBQDQNHB-UHFFFAOYSA-N 0.000 description 1
LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
239000003921 oil Substances 0.000 description 1
239000011368 organic material Substances 0.000 description 1
AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
239000002245 particle Substances 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
229910000073 phosphorus hydride Inorganic materials 0.000 description 1
239000003504 photosensitizing agent Substances 0.000 description 1
239000000049 pigment Substances 0.000 description 1
239000004014 plasticizer Substances 0.000 description 1
229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
229920002857 polybutadiene Polymers 0.000 description 1
229920001083 polybutene Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
229920000570 polyether Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
239000011112 polyethylene naphthalate Substances 0.000 description 1
229920000139 polyethylene terephthalate Polymers 0.000 description 1
239000005020 polyethylene terephthalate Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920000306 polymethylpentene Polymers 0.000 description 1
239000011116 polymethylpentene Substances 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
229920001289 polyvinyl ether Polymers 0.000 description 1
238000003672 processing method Methods 0.000 description 1
JTBKFHQUYVNHSR-UHFFFAOYSA-N propan-2-yloxyalumane Chemical compound CC(C)O[AlH2] JTBKFHQUYVNHSR-UHFFFAOYSA-N 0.000 description 1
239000001294 propane Substances 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
238000005086 pumping Methods 0.000 description 1
150000004053 quinones Chemical class 0.000 description 1
239000000376 reactant Substances 0.000 description 1
230000009467 reduction Effects 0.000 description 1
238000011160 research Methods 0.000 description 1
239000011342 resin composition Substances 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
239000002356 single layer Substances 0.000 description 1
239000002904 solvent Substances 0.000 description 1
125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
239000010959 steel Substances 0.000 description 1
229920005992 thermoplastic resin Polymers 0.000 description 1
YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
229910052718 tin Inorganic materials 0.000 description 1
239000011135 tin Substances 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
239000004408 titanium dioxide Substances 0.000 description 1
239000002023 wood Substances 0.000 description 1
239000008096 xylene Substances 0.000 description 1
229910052725 zinc Inorganic materials 0.000 description 1
239000011701 zinc Substances 0.000 description 1
229910052726 zirconium Inorganic materials 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Adhesive Tapes (AREA)
Dicing (AREA)
Adhesives Or Adhesive Processes (AREA)
Laser Beam Processing (AREA)
Laminated Bodies (AREA)

TW110129890A 2014-12-02 2015-12-01 黏接片以及加工物之製造方法 TWI811763B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2014-244009		2014-12-02
JP2014244009		2014-12-02

Publications (2)

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TW202144516A TW202144516A (zh)	2021-12-01
TWI811763B true TWI811763B (zh)	2023-08-11

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TW104140062A TWI738633B (zh)	2014-12-02	2015-12-01	加工物之製造方法
TW110129890A TWI811763B (zh)	2014-12-02	2015-12-01	黏接片以及加工物之製造方法
TW108148058A TW202014490A (zh)	2014-12-02	2015-12-01	黏接片以及加工物之製造方法

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Country Status (6)

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JP (1)	JP6731852B2 (ja)
KR (1)	KR102447759B1 (ja)
CN (1)	CN106795396B (ja)
SG (1)	SG11201704347YA (ja)
TW (3)	TWI738633B (ja)
WO (1)	WO2016088677A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR102430472B1 (ko) *	2014-12-25	2022-08-05	덴카 주식회사	레이저 다이싱용 점착 시트 및 반도체 장치의 제조 방법
JP6980684B2 (ja) *	2016-11-02	2021-12-15	リンテック株式会社	ダイシングシート
CN110753993B (zh) *	2017-07-03	2023-12-01	琳得科株式会社	隐形切割用粘着片及半导体装置的制造方法
JP7109918B2 (ja) *	2017-12-28	2022-08-01	日東電工株式会社	ダイシングテープ一体型半導体背面密着フィルム
JP7296944B2 (ja) *	2018-03-29	2023-06-23	リンテック株式会社	ワーク加工用シート
CN111989764A (zh) *	2018-04-18	2020-11-24	琳得科株式会社	工件加工用片
JPWO2020195744A1 (ja) *	2019-03-27	2020-10-01
KR102426261B1 (ko) *	2019-09-26	2022-07-29	주식회사 엘지화학	다이싱 테이프용 점착조성물 및 이를 포함하는 다이싱 테이프
CN111693368A (zh) *	2020-06-15	2020-09-22	苏州高泰电子技术股份有限公司	用于晶圆切割胶带微观表征性能的测试方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2010073897A (ja) *	2008-09-18	2010-04-02	Lintec Corp	レーザーダイシングシートおよび半導体チップの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5124778B2 (ja)	1971-12-22	1976-07-27
JP2005229040A (ja)	2004-02-16	2005-08-25	Denki Kagaku Kogyo Kk	半導体基盤固定用粘着シート
JP4712468B2 (ja) *	2004-11-30	2011-06-29	古河電気工業株式会社	ダイシングダイボンドテープ
JP4762671B2 (ja) *	2005-10-26	2011-08-31	古河電気工業株式会社	ダイシングテープ、および半導体ウェハダイシング方法
JP5019619B2 (ja) *	2008-03-27	2012-09-05	古河電気工業株式会社	ウェハ表面保護テープ
JP2011040449A (ja) *	2009-08-07	2011-02-24	Du Pont Mitsui Polychem Co Ltd	ダイシングテープ用基材、ダイシングテープ、半導体装置の製造方法
JP5603757B2 (ja) *	2009-12-04	2014-10-08	リンテック株式会社	レーザーダイシング用粘着シート及び半導体装置の製造方法
JP2012079936A (ja) *	2010-10-01	2012-04-19	Nitto Denko Corp	ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
CN103238205B (zh) *	2010-12-06	2016-05-18	木本股份有限公司	激光切割用辅助片
JP6071712B2 (ja) *	2013-04-05	2017-02-01	日東電工株式会社	粘着テープ

2015
- 2015-11-27 JP JP2016562422A patent/JP6731852B2/ja active Active
- 2015-11-27 WO PCT/JP2015/083414 patent/WO2016088677A1/ja active Application Filing
- 2015-11-27 SG SG11201704347YA patent/SG11201704347YA/en unknown
- 2015-11-27 KR KR1020177005685A patent/KR102447759B1/ko active IP Right Grant
- 2015-11-27 CN CN201580047960.6A patent/CN106795396B/zh active Active
- 2015-12-01 TW TW104140062A patent/TWI738633B/zh active
- 2015-12-01 TW TW110129890A patent/TWI811763B/zh active
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2010073897A (ja) *	2008-09-18	2010-04-02	Lintec Corp	レーザーダイシングシートおよび半導体チップの製造方法

Also Published As

Publication number	Publication date
JP6731852B2 (ja)	2020-07-29
KR102447759B1 (ko)	2022-09-27
KR20170091578A (ko)	2017-08-09
WO2016088677A1 (ja)	2016-06-09
TWI738633B (zh)	2021-09-11
CN106795396A (zh)	2017-05-31
CN106795396B (zh)	2020-12-18
JPWO2016088677A1 (ja)	2017-09-07
TW202144516A (zh)	2021-12-01
SG11201704347YA (en)	2017-06-29
TW202014490A (zh)	2020-04-16
TW201629171A (zh)	2016-08-16

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US20070036930A1 (en)	2007-02-15	Pressure-sensitive adhesive sheet, production method thereof and method of processing articles
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US20110008597A1 (en)	2011-01-13	Surface protective sheet
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