TWI786649B - Laser processing head and laser processing apparatus - Google Patents

Laser processing head and laser processing apparatus Download PDF

Info

Publication number
TWI786649B
TWI786649B TW110118976A TW110118976A TWI786649B TW I786649 B TWI786649 B TW I786649B TW 110118976 A TW110118976 A TW 110118976A TW 110118976 A TW110118976 A TW 110118976A TW I786649 B TWI786649 B TW I786649B
Authority
TW
Taiwan
Prior art keywords
laser light
shutter
processing
light
laser
Prior art date
Application number
TW110118976A
Other languages
Chinese (zh)
Other versions
TW202206212A (en
Inventor
松本明久
太田崇浩
永利圭太
Original Assignee
日商松下知識產權經營股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW202206212A publication Critical patent/TW202206212A/en
Application granted granted Critical
Publication of TWI786649B publication Critical patent/TWI786649B/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

雷射加工頭（12）具備：光學構件（22），其使雷射光（Lx）分支為雷射光（Lx1）及雷射光（Lx2）；掃描部，其掃描雷射光（Lx1）；光接收部（25），其檢測雷射光（Lx2）的強度；第二光閘（32），其於阻斷雷射光（Lx1）的關閉位置與使雷射光（Lx1）透射的開啟位置之間位移；以及焦點距離調整部（23），其調整雷射光（Lx1）的焦點距離。第二光閘（32）配置於光學構件（22）與焦點距離調整部（23）之間。The laser processing head (12) has: an optical member (22), which branches the laser light (Lx) into laser light (Lx1) and laser light (Lx2); a scanning part, which scans the laser light (Lx1); a light receiving part (25) which detects the intensity of the laser light (Lx2); a second shutter (32) which is displaced between a closed position for blocking the laser light (Lx1) and an open position for transmitting the laser light (Lx1); and A focus distance adjustment unit (23), which adjusts the focus distance of the laser light (Lx1). The second optical shutter (32) is arranged between the optical member (22) and the focal distance adjustment part (23).

Description

雷射加工頭以及雷射加工裝置Laser processing head and laser processing device

本發明是關於雷射加工頭以及雷射加工裝置。 The present invention relates to a laser processing head and a laser processing device.

專利文獻1記載了一種雷射加工裝置，具備：雷射光源，其射出不可見光之雷射光；可見光源，其射出可見光之引導光；混合鏡(mixing mirror)，其將雷射光分支為第一分支光及第二分支光，且將引導光之光軸與第一分支光之光軸設為同軸；電流計鏡(galvanometer mirror)，其改變第一分支光及引導光之方向；光接收元件，其檢測第二分支光之強度；第一光閘，其配置於雷射光源與混合鏡之間；以及第二光閘，其配置於混合鏡與電流計鏡之間。 Patent Document 1 describes a laser processing device comprising: a laser light source that emits invisible laser light; a visible light source that emits visible light as a guiding light; a mixing mirror that splits the laser light into first The branched light and the second branched light, and the optical axis of the guided light is coaxial with the optical axis of the first branched light; a galvanometer mirror (galvanometer mirror), which changes the direction of the first branched light and the guided light; a light receiving element , which detects the intensity of the second branch light; the first shutter, which is arranged between the laser light source and the mixing mirror; and the second shutter, which is arranged between the mixing mirror and the galvanometer mirror.

雷射加工裝置依據僅加工用之第一分支光照射於工件的狀態、僅確認用之引導光照射於工件的狀態以及測量用之第二分支光照射於光接收元件的狀態，開啟及關閉第一光閘及第二光閘。 The laser processing device turns on and off the second branch light according to the state where only the first branch light for processing is irradiated on the workpiece, the state where only the guiding light for confirmation is irradiated on the workpiece, and the second branch light for measurement is irradiated on the light receiving element. A shutter and a second shutter.

專利文獻1：日本專利特開2007-61843號公報 Patent Document 1: Japanese Patent Laid-Open No. 2007-61843

上述雷射加工裝置較佳具備調整雷射光之焦點距離的功能，從而能夠根據工件的表面形狀、高度而改變雷射光相對於工件的照射位置。本發明的目的在於提供一種雷射加工頭及雷射加工裝置，其能夠抑制大型化，同時調整雷射光的焦點距離。 The above-mentioned laser processing device preferably has a function of adjusting the focal length of the laser light, so that the irradiation position of the laser light relative to the workpiece can be changed according to the surface shape and height of the workpiece. An object of the present invention is to provide a laser processing head and a laser processing device capable of adjusting the focal length of laser light while suppressing enlargement.

以下記載用於解決上述課題的手段及其作用效果。 Means for solving the above-mentioned problems and their operational effects are described below.

解決上述課題之雷射加工頭是使用不可見光之加工用雷射光對工件進行加工，其具備：光學構件，其使自加工用雷射光源射出的該加工用雷射光分支為第一分支光及第二分支光，且使自顯示用雷射光源射出的可見光之顯示用雷射光的光軸與該第一分支光的光軸對準；掃描部，其對該工件掃描該第一分支光及該顯示用雷射光；光接收部，其檢測該第二分支光的強度；第一光閘，其配置為比該光學構件更靠近該加工用雷射光源側，且於阻斷該加工用雷射光的關閉位置與使該加工用雷射光透射的開啟位置之間位移；第二光閘，其配置為比該光學構件更靠近該工件側，且於阻斷該第一分支光及該顯示用雷射光的關閉位置與使該第一分支光及該顯示用雷射光透射的開啟位置之間位移；以及焦點距離調整部，其調整該第一分支光及該顯示用雷射光的焦點距離，該第二光閘配置於該光學構件與該焦點距離調整部之間。 A laser processing head that solves the above-mentioned problems processes a workpiece using a processing laser light of invisible light, and includes an optical member that branches the processing laser light emitted from a processing laser light source into a first branch light and the second branch light, and align the optical axis of the display laser light emitted from the visible light source for display with the optical axis of the first branch light; the scanning part scans the first branch light and the first branch light to the workpiece; The display laser light; a light receiving unit that detects the intensity of the second branch light; a first shutter that is arranged closer to the processing laser light source side than the optical member, and is configured to block the processing laser light. Displacement between the closed position for emitting light and the open position for transmitting the laser light for processing; the second shutter is configured to be closer to the workpiece side than the optical member, and is used to block the first branch light and the display Displacement between the off position of the laser light and the on position for transmitting the first branch light and the display laser light; and a focus distance adjustment unit, which adjusts the focus distance of the first branch light and the display laser light, the The second shutter is arranged between the optical member and the focal length adjusting part.

若考慮將光閘配置於較焦點距離調整部更靠近第一分支光的行進方向之比較例，則焦點距離調整部必須在第一分支光之光軸的延伸方向上，一面考慮光閘所佔據的區域，一面調整焦點距離。於此情形，焦點距離調整部的尺寸容易變大。從此點來看，上述構成之雷射加工裝置由於第二光閘配置於光學構件與焦點聚調整部之間，因此不易發生上述情況。由此，雷射加工裝置能夠抑制裝置之大型化。 If considering the comparative example in which the optical gate is arranged closer to the traveling direction of the first branch light than the focal length adjustment part, the focal length adjustment part must be in the extending direction of the optical axis of the first branch light, while considering the position occupied by the optical gate. area while adjusting the focus distance. In this case, the size of the focal length adjustment unit tends to become large. From this point of view, in the laser processing apparatus having the above configuration, since the second shutter is arranged between the optical member and the focus adjustment unit, the above-mentioned situation is less likely to occur. Thereby, the laser processing apparatus can suppress the enlargement of an apparatus.

解決上述課題之雷射加工裝置是使用不可見光之加工用雷射光對工件進行加工，其具備：加工用雷射光源，其射出該加工用雷射光；顯示用雷射光源，其射出可見光之顯示用雷射光；光學構件，其使該加工用雷射光分支為第一分支光及第二分支光，且使該顯示用雷射光的光軸與該第一分支光的光軸對準；掃描部，其對該工件掃描該第一分支光及該顯示用雷射光；光接收部，其檢測該第二分支光的強度；第一光閘，其配置為比該光學構件更靠近該加工用雷射光源側，且於阻斷該加工用雷射光的關閉位置與使該加工用雷射光透射的開啟位置之間位移；第二光閘，其配置為比該光學構件更靠近該工件側，且於阻斷該第一分支光及該顯示用雷射光的關閉位置與使該第一分支光及該顯示用雷射光透射的開啟位置之間位移；以及焦點距離調整部，其調整該第一分支光及該顯示用雷射光的焦點距離，該第二光閘配置於該光學構件與該焦點距離調整部之間。 A laser processing device that solves the above-mentioned problems processes workpieces using laser light for processing invisible light, and includes: a laser light source for processing that emits the laser light for processing; a laser light source for display that emits visible light for display Using laser light; an optical component that splits the processing laser light into a first branch light and a second branch light, and aligns the optical axis of the display laser light with the optical axis of the first branch light; a scanning unit , which scans the first branch light and the display laser light on the workpiece; a light receiving part, which detects the intensity of the second branch light; a first shutter, which is arranged closer to the processing laser than the optical member the light source side, and is displaced between a closed position for blocking the processing laser light and an open position for transmitting the processing laser light; a second shutter disposed closer to the workpiece side than the optical member, and Displacing between an off position for blocking the first branch light and the display laser light and an open position for transmitting the first branch light and the display laser light; and a focus distance adjustment unit that adjusts the first branch The focal length of the light and the laser light for displaying, the second shutter is arranged between the optical member and the focal distance adjusting part.

上述構成之雷射加工裝置可獲得與上述雷射加工頭相同的作用效果。 The laser processing device with the above-mentioned structure can obtain the same effect as the above-mentioned laser processing head.

雷射加工頭以及雷射加工裝置能夠一面抑制大型化，一面調整焦點距離。 The laser processing head and the laser processing device can adjust the focus distance while suppressing enlargement.

10:雷射加工裝置 10:Laser processing device

11:加工用雷射光源 11: Laser light source for processing

12:雷射加工頭 12: Laser processing head

14:控制裝置 14: Control device

21:顯示用雷射光源 21: Laser light source for display

22:光學構件 22: Optical components

23:焦點距離調整部 23: Focus distance adjustment unit

24:掃描部 24: Scanning department

25:光接收部 25: Light receiving part

26:通知部 26: Notification Department

31:第一光閘 31: The first shutter

32:第二光閘 32: Second shutter

41:第一關閉感測器(第一開閉感測器之一例) 41: First closing sensor (an example of the first opening and closing sensor)

42:第一開啟感測器(第一開閉感測器之一例) 42: The first opening sensor (an example of the first opening and closing sensor)

43:第二關閉感測器(第二開閉感測器之一例) 43: Second closing sensor (an example of the second opening and closing sensor)

44:第二開啟感測器(第二開閉感測器之一例) 44: The second opening sensor (an example of the second opening and closing sensor)

W:工件 W: Workpiece

Lx:雷射光(加工用雷射光之一例) Lx: Laser light (an example of laser light for processing)

Lx1:雷射光(第一分支光之一例) Lx1: laser light (an example of the first branch light)

Lx2:雷射光(第一分支光之一例) Lx2: Laser light (an example of the first branch light)

Ly:雷射光(顯示用雷射光之一例) Ly: laser light (an example of laser light for display)

Sc1:第一關閉訊號 Sc1: first close signal

So1:第一開啟訊號 So1: first open signal

Sc2:第二關閉訊號 Sc2: Second close signal

So2:第二開啟訊號 So2: Second open signal

Tc1:第一關閉動作時間(第一動作時間之一例) Tc1: First closing action time (an example of the first action time)

Tc2:第二關閉動作時間(第二動作時間之一例) Tc2: Second closing operation time (an example of the second operation time)

To1:第一開啟動作時間(第一動作時間之一例) To1: First opening action time (an example of the first action time)

To2:第二開啟動作時間(第二動作時間之一例) To2: The second opening action time (an example of the second action time)

Tth:時間判定值 Tth: time judgment value

△Tc、△To:差值 △Tc, △To: difference

△Tth:差值判定值 △Tth: difference judgment value

圖1為一實施方式之雷射加工裝置的示意圖。 FIG. 1 is a schematic diagram of a laser processing device according to an embodiment.

圖2為上述雷射加工裝置之焦點距離調整部的示意圖。 FIG. 2 is a schematic diagram of the focus distance adjustment part of the above-mentioned laser processing device.

圖3為說明於加工模式、顯示模式或測量模式中，上述雷射加工裝置之控制裝置所執行的處理之流程的流程圖。 FIG. 3 is a flow chart illustrating the flow of processing executed by the control device of the laser processing device in a processing mode, a display mode, or a measurement mode.

圖4為說明上述雷射加工裝置之控制裝置於任意時間點所執行的處理之流程的流程圖。 FIG. 4 is a flow chart illustrating the flow of processing executed by the control device of the above-mentioned laser processing device at an arbitrary point of time.

圖5為將上述雷射加工裝置與比較例的雷射加工裝置之焦點距離調整部進行比較的示意圖。 FIG. 5 is a schematic diagram comparing the focus distance adjustment section of the laser processing device described above and the laser processing device of the comparative example.

以下針對雷射加工裝置以及雷射加工頭的一實施方式進行說明。本實施方式的雷射加工裝置是藉由將雷射光照射於工件表面而在工件表面形成文字、記號或圖形等即所謂的雷射雕刻機(laser marker)裝置。 One embodiment of a laser processing device and a laser processing head will be described below. The laser processing device of this embodiment is a so-called laser marker device that forms characters, marks, or graphics on the surface of the workpiece by irradiating laser light on the surface of the workpiece.

如圖1所示，雷射加工裝置10具有加工用雷射光源11、雷射加工頭12、光纜13以及控制裝置14。 As shown in FIG. 1 , the laser processing device 10 has a laser light source 11 for processing, a laser processing head 12 , an optical cable 13 , and a control device 14 .

本實施方式中，於雷射加工裝置10中，加工用雷射光源11、雷射加工頭12與控制裝置14為分別地構成。另一實施方式中，加工用雷射光源11、雷射加工頭12及控制裝置14可為一體地構成。 In this embodiment, in the laser processing apparatus 10, the laser light source 11 for processing, the laser processing head 12, and the control apparatus 14 are comprised separately. In another embodiment, the laser light source 11 for processing, the laser processing head 12 and the control device 14 may be integrally formed.

加工用雷射光源11射出對工件W進行加工的不可見光之雷射光Lx。加工用雷射光源11例如是YAG雷射、二氧化碳氣體雷射以及光纖雷射等雷射光源。從加工用雷射光源11射出的雷射光Lx相當於「加工用雷射光」。 The processing laser light source 11 emits laser light Lx of invisible light for processing the workpiece W. As shown in FIG. The laser light source 11 for processing is, for example, a laser light source such as a YAG laser, a carbon dioxide gas laser, or a fiber laser. The laser light Lx emitted from the processing laser light source 11 corresponds to "processing laser light".

雷射加工頭12將從加工用雷射光源11射出的雷射光Lx朝向工件W照射。雷射加工頭12經由光纜13連接於加工用雷射光源11。 The laser processing head 12 irradiates the workpiece W with laser light Lx emitted from the processing laser light source 11 . The laser processing head 12 is connected to a processing laser light source 11 via an optical cable 13 .

雷射加工頭12具有顯示用雷射光源21、光學構件22、焦點距離調整部23、掃描部24、光接收部25、通知部26、第一光閘31與第二光閘32、第 一驅動部33與第二驅動部34。又，雷射加工頭12具有第一關閉感測器41與第一開啟感測器42、第二關閉感測器43與第二開啟感測器44、以及殼體51。 The laser processing head 12 has a laser light source 21 for display, an optical member 22, a focal length adjustment unit 23, a scanning unit 24, a light receiving unit 25, a notification unit 26, a first shutter 31 and a second shutter 32, a first A driving part 33 and a second driving part 34 . Moreover, the laser processing head 12 has a first close sensor 41 and a first open sensor 42 , a second close sensor 43 and a second open sensor 44 , and a casing 51 .

顯示用雷射光源21射出顯示用雷射光Ly。顯示用雷射光源21例如為雷射二極管或LED等。雷射光Ly是具有可見光區域之波長的可見光。從顯示用雷射光源21射出的雷射光Ly相當於「顯示用雷射光」。 The display laser light source 21 emits display laser light Ly. The display laser light source 21 is, for example, a laser diode or an LED. Laser light Ly is visible light having a wavelength in the visible light region. The laser light Ly emitted from the display laser light source 21 corresponds to "display laser light".

光學構件22具有如下功能：作為以已定的分割比使入射之雷射光Lx分支為雷射光Lx1及雷射光Lx2之分束器的功能、以及作為將入射的雷射光Ly進行反射之鏡的功能。從這點來看，光學構件22也可由作為分束器之第一光學構件以及作為鏡之第二光學構件兩個構件構成。光學構件22較佳雷射光Lx之透射率為90%以上，且較佳雷射光Ly之反射率為90%以上。雷射光Lx1相當於「第一分支光」，雷射光Lx2相當於「第二分支光」。 The optical member 22 has the following functions: a function as a beam splitter that splits the incident laser light Lx into laser light Lx1 and laser light Lx2 at a predetermined split ratio, and a function as a mirror that reflects the incident laser light Ly . From this point of view, the optical member 22 may also be composed of two members, the first optical member as a beam splitter and the second optical member as a mirror. The optical member 22 preferably has a transmittance of laser light Lx of 90% or more, and preferably has a reflectance of laser light Ly of 90% or more. Laser light Lx1 corresponds to "first branch light", and laser light Lx2 corresponds to "second branch light".

光學構件22配置於從加工用雷射光源11射出的雷射光Lx與從顯示用雷射光源21射出的雷射光Ly所交叉的位置。光學構件22的光學薄膜相對於從加工用雷射光源11射出的雷射光Lx之光軸傾斜45度，相對於從顯示用雷射光源21射出的雷射光Ly之光軸傾斜45度。光學構件22中，來自加工用雷射光源11的雷射光Lx所入射之面是與來自顯示用雷射光源21的雷射光Ly所入射之面相反側的面。如此，本實施方式中，藉由光學構件22，雷射光Lx1的光軸與雷射光Ly的光軸大致上一致，雷射光Lx1的光軸與雷射光Lx2的光軸大致上正交。 The optical member 22 is arranged at a position where the laser light Lx emitted from the processing laser light source 11 intersects the laser light Ly emitted from the display laser light source 21 . The optical film of the optical member 22 is inclined at 45 degrees with respect to the optical axis of the laser light Lx emitted from the processing laser light source 11 and at 45 degrees with respect to the optical axis of the laser light Ly emitted from the display laser light source 21 . In the optical member 22 , the surface on which the laser light Lx from the processing laser light source 11 is incident is the surface opposite to the surface on which the laser light Ly from the display laser light source 21 is incident. Thus, in the present embodiment, the optical axis of the laser light Lx1 and the optical axis of the laser light Ly substantially coincide with each other by the optical member 22 , and the optical axis of the laser light Lx1 and the optical axis of the laser light Lx2 are substantially perpendicular to each other.

接著，參照圖1及圖2，針對焦點距離調整部23的構成之一例進行說明。圖2中，為了易於理解說明，省略了掃描部24等雷射加工裝置10的一部分構成之圖示。 Next, an example of the configuration of the focal length adjustment unit 23 will be described with reference to FIGS. 1 and 2 . In FIG. 2 , illustration of a part of the configuration of the laser processing apparatus 10 such as the scanning unit 24 is omitted for easy understanding of the description.

如圖1所示，焦點距離調整部23在雷射光Lx1、Ly之光軸延伸的方向上被配置於光學構件22與掃描部24之間。如圖2所示，焦點距離調整部23具有第一透鏡231、第二透鏡232及第三透鏡233與透鏡驅動部234。 As shown in FIG. 1 , the focal length adjustment unit 23 is arranged between the optical member 22 and the scanning unit 24 in the direction in which the optical axes of the laser beams Lx1 and Ly extend. As shown in FIG. 2 , the focal length adjustment unit 23 has a first lens 231 , a second lens 232 , a third lens 233 and a lens driving unit 234 .

第一透鏡231為凹透鏡，第二透鏡232與第三透鏡233為凸透鏡。第二透鏡232及第三透鏡233配置於第一透鏡231的光軸上。透鏡驅動部234是包括例如馬達與將馬達之輸出軸的旋轉運動轉換為第一透鏡231的前進/後退運動之傳動機構而構成。透鏡驅動部234使第一透鏡231沿著雷射光Lx1、Ly之光軸移動，藉此使第一透鏡23與第二透鏡232之間的距離改變。 The first lens 231 is a concave lens, and the second lens 232 and the third lens 233 are convex lenses. The second lens 232 and the third lens 233 are disposed on the optical axis of the first lens 231 . The lens driving unit 234 includes, for example, a motor and a transmission mechanism that converts the rotational motion of the output shaft of the motor into the forward/backward motion of the first lens 231 . The lens driving part 234 moves the first lens 231 along the optical axis of the laser light Lx1 , Ly, thereby changing the distance between the first lens 23 and the second lens 232 .

於第一透鏡231及第二透鏡232之間的距離為基準距離Ls之情形時，第二透鏡232將光束直徑藉由第一透鏡231而被放大之雷射光Lx1、Ly作為平行光而輸出。此情形時，第三透鏡233使雷射光Lx1、Ly會聚至基準焦點位置LPs。 When the distance between the first lens 231 and the second lens 232 is the reference distance Ls, the second lens 232 outputs the laser beams Lx1 and Ly whose beam diameters are magnified by the first lens 231 as parallel light. In this case, the third lens 233 converges the laser light Lx1 and Ly to the reference focus position LPs.

於第一透鏡231與第二透鏡232之間的距離小於基準距離Ls之情形時，第二透鏡232使光束直徑藉由第一透鏡231放大的雷射光Lx1、Ly之光束直徑進一步放大。此情形時，第三透鏡233使雷射光Lx1、Ly會聚至比基準焦點位置LPs更遠的位置。 When the distance between the first lens 231 and the second lens 232 is smaller than the reference distance Ls, the second lens 232 further enlarges the beam diameters of the laser beams Lx1 and Ly whose beam diameters are enlarged by the first lens 231 . In this case, the third lens 233 converges the laser light Lx1 and Ly to a position farther than the reference focus position LPs.

於第一透鏡231與第二透鏡232之間的距離大於基準距離Ls之情形時，第二透鏡232使光束直徑藉由第一透鏡231放大的雷射光Lx1、Ly之光束直徑收斂。此情形時，第三透鏡233使雷射光Lx1、Ly會聚至比基準焦點位置LPs更近的位置。 When the distance between the first lens 231 and the second lens 232 is greater than the reference distance Ls, the second lens 232 converges the beam diameters of the laser beams Lx1 and Ly enlarged by the first lens 231 . In this case, the third lens 233 converges the laser beams Lx1 and Ly to a position closer to the reference focus position LPs.

由以上可知，焦點距離調整部23藉由縮短第一透鏡231與第二透鏡232之間的距離來增加焦點距離。另一方面，焦點距離調整部23藉由增加第 一透鏡231與第二透鏡232之間的距離來縮短焦點距離。如此，雷射加工裝置10藉由調整雷射光Lx1的焦點位置，能夠對加工面在高度方向變化的工件W精度良好地進行雷射加工。關於此點，與雷射光Lx1照射於工件W的情況相比，於雷射光Ly照射於工件W之情形時，焦點距離調整部23可不需嚴密地調整焦點距離。 From the above, it can be seen that the focal length adjustment unit 23 increases the focal distance by shortening the distance between the first lens 231 and the second lens 232 . On the other hand, the focus distance adjustment unit 23 increases the The distance between the first lens 231 and the second lens 232 is used to shorten the focal length. In this way, the laser processing apparatus 10 can accurately perform laser processing on the workpiece W whose processing surface changes in the height direction by adjusting the focus position of the laser light Lx1. In this regard, when the workpiece W is irradiated with the laser light Ly, the focus distance adjustment unit 23 does not need to strictly adjust the focus distance when the workpiece W is irradiated with the laser light Lx1 .

如圖1所示，掃描部24包括一對電流計鏡241、242與驅動一對電流計鏡241、242的掃描驅動部243。一對電流計鏡241、242例如為全反射鏡。一對電流計鏡241、242可旋動地於已定方向被支承。一個電流計鏡241相對於工件W沿第一方向可旋動地被支承，而另一個電流計鏡242相對於工件W沿與第一方向正交的第二方向可旋動地被支承。掃描部24藉由掃描驅動部243使一對電流計鏡241、242旋動，藉此相對於工件W在兩個已定方向上二維掃描雷射光Lx1、Ly。然後，被掃描部24的一對電流計鏡241、242反射的雷射光Lx1、Ly被照射於工件W。 As shown in FIG. 1 , the scanning unit 24 includes a pair of galvanometer mirrors 241 and 242 and a scanning driving unit 243 that drives the pair of galvanometer mirrors 241 and 242 . The pair of galvanometer mirrors 241 and 242 are, for example, total reflection mirrors. A pair of galvanometer mirrors 241 and 242 are rotatably supported in a predetermined direction. One galvanometer mirror 241 is rotatably supported relative to the workpiece W in a first direction, and the other galvanometer mirror 242 is rotatably supported relative to the workpiece W in a second direction perpendicular to the first direction. The scanning unit 24 rotates the pair of galvano mirrors 241 and 242 by the scanning driving unit 243 , thereby two-dimensionally scanning the laser beams Lx1 and Ly relative to the workpiece W in two predetermined directions. Then, the workpiece W is irradiated with the laser beams Lx1 and Ly reflected by the pair of galvano mirrors 241 and 242 of the scanner unit 24 .

光接收部25接收從加工用雷射光源11射出的雷射光Lx中被光學構件22反射的雷射光Lx2。光接收部25將對應於所接收的雷射光Lx2的強度之訊號輸出至控制裝置14。也就是說，光接收部25是檢測雷射光Lx2的強度之光接收元件。雷射光Lx的強度越強，雷射光Lx2的強度變得越強。也就是說，雷射光Lx2的強度與雷射光Lx的強度相關。 The light receiving unit 25 receives the laser light Lx2 reflected by the optical member 22 among the laser light Lx emitted from the processing laser light source 11 . The light receiving unit 25 outputs a signal corresponding to the intensity of the received laser light Lx2 to the control device 14 . That is, the light receiving unit 25 is a light receiving element that detects the intensity of the laser light Lx2. The stronger the intensity of the laser light Lx is, the stronger the intensity of the laser light Lx2 becomes. That is, the intensity of the laser light Lx2 correlates with the intensity of the laser light Lx.

通知部26基於來自控制裝置14的控制訊號，向使用者通知包括警告在內的各種訊息。通知部26可以由例如能夠顯示文字及圖像中的至少一者之顯示器構成、也可由點滅的燈構成、還可由輸出聲音的揚聲器構成。又，通知部26可以配置於與雷射加工頭12不同的部位。 The notification unit 26 notifies the user of various messages including warnings based on the control signal from the control device 14 . The notification unit 26 may be constituted by, for example, a display capable of displaying at least one of characters and images, may be constituted by a light that is turned off, or may be constituted by a speaker that outputs sound. In addition, the notification unit 26 may be arranged at a different location from the laser processing head 12 .

第一光閘31及第二光閘32是由雷射光Lx、Ly不會透射之材質構成。第一光閘31及第二光閘32為形狀及大小等共通的同一規格。第一光閘31配置於在雷射光Lx的行進方向上比光學構件22更靠近加工用雷射光源11側。一例中，第一光閘31於雷射光Lx、Lx1之從加工用雷射光源11至工件W的行進路徑上配置於加工用雷射光源11與光學構件22之間。第一光閘31藉由第一驅動部33在阻斷雷射光Lx的關閉位置與使雷射光Lx透射的開啟位置之間動作。同樣地，第二光閘32配置於雷射光Lx1的行進方向上比光學構件22更靠近工件W側，詳細而言，配置於光學構件22與焦點距離調整部23之間。一例中，第二光閘32於雷射光Lx、Lx1之從加工用雷射光源11至工件W的行進路徑上配置於光學構件22與工件W之間，詳細而言，配置於光學構件22與焦點距離調整部23之間。第二光閘32藉由第二驅動部34在阻斷雷射光Lx1、Ly的關閉位置與使雷射光Lx1、Ly透射的開啟位置之間動作。 The first shutter 31 and the second shutter 32 are made of materials that do not transmit the laser light Lx and Ly. The first shutter 31 and the second shutter 32 have the same specifications in common, such as shape and size. The first shutter 31 is arranged on the side closer to the processing laser light source 11 than the optical member 22 in the traveling direction of the laser light Lx. In one example, the first shutter 31 is arranged between the laser light source 11 for processing and the optical member 22 on the traveling path of the laser beams Lx, Lx1 from the laser light source 11 for processing to the workpiece W. The first shutter 31 is operated between a closed position for blocking the laser light Lx and an open position for transmitting the laser light Lx by the first driving unit 33 . Similarly, the second shutter 32 is disposed closer to the workpiece W than the optical member 22 in the traveling direction of the laser beam Lx1 , and specifically, is disposed between the optical member 22 and the focal length adjustment unit 23 . In one example, the second shutter 32 is arranged between the optical member 22 and the workpiece W on the path of the laser beams Lx, Lx1 from the processing laser light source 11 to the workpiece W, specifically, between the optical member 22 and the workpiece W. Between the focal length adjustment part 23. The second shutter 32 is operated by the second driving unit 34 between a closed position for blocking the laser light Lx1 and Ly and an open position for transmitting the laser light Lx1 and Ly.

第一光閘31及第二光閘32可構成為在關閉位置與開啟位置之間旋動，也可構成為在關閉位置與開啟位置之間直線移動。圖1中，以兩點鏈線示出配置於關閉位置的第一光閘3及第二光閘32，以實線示出配置於開啟位置的第一光閘31及第二光閘32。以下之說明中，有將第一光閘31及第二光閘32兩者稱為「光閘」之情形。 The first shutter 31 and the second shutter 32 may be configured to rotate between a closed position and an open position, or may be configured to move linearly between a closed position and an open position. In FIG. 1 , the first shutter 3 and the second shutter 32 arranged at the closed position are shown by chain lines, and the first shutter 31 and the second shutter 32 arranged at the open position are shown by solid lines. In the following description, both the first shutter 31 and the second shutter 32 may be referred to as “shutters”.

第一驅動部33包括例如馬達與將馬達的輸出軸之旋轉運動轉換為第一光閘31的開閉運動之轉換機構。第一驅動部33例如也可由螺線管等致動器構成。第二驅動部34與第一驅動部33為同一規格。第二驅動部34除了驅動對象為第二光閘32此點之外，與第一驅動部33相同。 The first drive unit 33 includes, for example, a motor and a conversion mechanism that converts the rotational motion of the output shaft of the motor into the opening and closing motion of the first shutter 31 . The first driving unit 33 may be constituted by an actuator such as a solenoid, for example. The second drive unit 34 is of the same specification as the first drive unit 33 . The second driving unit 34 is the same as the first driving unit 33 except that the driving object is the second shutter 32 .

第一關閉感測器41檢測到第一光閘31配置於關閉位置，第一開啟感測器42檢測到第一光閘31配置於開啟位置。第二關閉感測器43檢測到第二光閘32配置於關閉位置，第二開啟感測器44檢測到第二光閘32配置於開啟 位置。詳細而言，第一關閉感測器41、第一開啟感測器42、第二關閉感測器43以及第二開啟感測器44根據第一光閘31及第二光閘32的位置向控制裝置14輸出導通/斷開訊號。由此點來看，第一關閉感測器41及第一開啟感測器42相當於檢測第一光閘31的開閉狀態之「第一開閉感測器」之一例，第二關閉感測器43及第二開啟感測器44相當於檢測第二光閘32的開閉狀態之「第二開閉感測器」之一例。 The first close sensor 41 detects that the first shutter 31 is configured at a closed position, and the first open sensor 42 detects that the first shutter 31 is configured at an open position. The second closed sensor 43 detects that the second shutter 32 is configured in the closed position, and the second open sensor 44 detects that the second shutter 32 is configured in the open position. Location. Specifically, the first close sensor 41, the first open sensor 42, the second close sensor 43, and the second open sensor 44 move toward the sensor according to the positions of the first shutter 31 and the second shutter 32 The control device 14 outputs on/off signals. From this point of view, the first closing sensor 41 and the first opening sensor 42 are equivalent to an example of the "first opening and closing sensor" that detects the opening and closing state of the first shutter 31, and the second closing sensor 43 and the second opening sensor 44 correspond to an example of a "second opening and closing sensor" that detects the opening and closing state of the second shutter 32 .

又，該等感測器可為光之透射態樣或反射態樣會根據光閘的位置而改變的光電感測器，或者可為藉由與光閘的物理性接觸切換所輸出之訊號的限位開關。進而，該等感測器可為磁性地檢測光閘位置的磁性感測器。 Also, the sensors may be photoelectric sensors whose transmission or reflection of light changes according to the position of the shutter, or may be sensors that switch the output signal by physical contact with the shutter. limit switch. Further, the sensors may be magnetic sensors that magnetically detect the position of the shutter.

第一關閉感測器41輸出「第一關閉訊號Sc1」，該第一關閉訊號Sc1在第一光閘31配置於關閉位置時導通，在第一光閘31未配置於關閉位置時斷開。第一開啟感測器42輸出「第一開啟訊號So1」，該第一開啟訊號So1在第一光閘31配置於開啟位置時導通，在第一光閘31未配置於開啟位置時斷開。第二關閉感測器43輸出「第二關閉訊號Sc2」，該第二關閉訊號Sc2在第二光閘32配置於關閉位置時導通，在第二光閘32未配置於關閉位置時斷開。第二開啟感測器44輸出「第二開啟訊號So2」，該第二開啟訊號So2在第二光閘32配置於開啟位置時導通，在第二光閘32未配置於開啟位置時斷開。 The first closing sensor 41 outputs a "first closing signal Sc1". The first closing signal Sc1 is turned on when the first shutter 31 is disposed at the closed position, and is turned off when the first shutter 31 is not disposed at the closed position. The first open sensor 42 outputs a "first open signal So1". The first open signal So1 is turned on when the first shutter 31 is configured at the open position, and is turned off when the first shutter 31 is not configured at the open position. The second closing sensor 43 outputs a "second closing signal Sc2". The second closing signal Sc2 is turned on when the second shutter 32 is disposed at the closed position, and is turned off when the second shutter 32 is not disposed at the closed position. The second open sensor 44 outputs a "second open signal So2". The second open signal So2 is turned on when the second shutter 32 is disposed at the open position, and is turned off when the second shutter 32 is not disposed at the open position.

由以上可知，於第一光閘31配置於關閉位置之情形時，第一關閉訊號Sc1導通而第一開啟訊號So1斷開。又，於第一光閘31配置於開啟位置之情形時，第一關閉訊號Sc1斷開，而第一開啟訊號So1導通。然後，於第一光閘31配置於關閉位置與開啟位置之間的中間位置之情形時，換言之，於第一光閘31未被配置於關閉位置亦未被配置於開啟位置之情形時，第一關閉訊號Sc1及第一開啟訊號So1皆斷開。關於第二關閉訊號Sc2及第二開啟訊號So2與第二光閘32的位置之關係亦同。再者，另一實施方式中，第一關閉訊號Sc1也可為 在第一光閘31配置於關閉位置時斷開，在第一光閘31未被配置於關閉位置時導通的訊號。關於其他的訊號亦同。 It can be seen from the above that when the first shutter 31 is disposed at the closed position, the first closing signal Sc1 is turned on and the first opening signal So1 is turned off. Moreover, when the first shutter 31 is disposed at the open position, the first closing signal Sc1 is turned off, and the first opening signal So1 is turned on. Then, when the first shutter 31 is disposed at an intermediate position between the closed position and the open position, in other words, when the first shutter 31 is neither disposed at the closed position nor disposed at the open position, the second Both a closing signal Sc1 and a first opening signal So1 are turned off. The same is true for the relationship between the second closing signal Sc2 and the second opening signal So2 and the position of the second shutter 32 . Moreover, in another implementation manner, the first closing signal Sc1 can also be The signal is turned off when the first shutter 31 is arranged in the closed position, and is turned on when the first shutter 31 is not arranged in the closed position. The same applies to other signals.

殼體51呈箱形狀。殼體51容納雷射加工頭12的組成構件。於殼體51設有光纜13所連接之連接器。又，殼體51中，在雷射光Lx1、Ly射出的部分，設置了會透射光之窗口部。 The casing 51 has a box shape. The housing 51 houses the constituent components of the laser machining head 12 . The housing 51 is provided with a connector to which the optical cable 13 is connected. In addition, in the case 51, a window portion through which the laser light Lx1, Ly is emitted is provided to transmit the light.

接著，針對控制裝置14進行說明。 Next, the control device 14 will be described.

控制裝置14依據使用者所輸入的已定之加工條件，控制加工用雷射光源11與雷射加工頭12之構成要素。詳細而言，控制裝置14使雷射光Lx、Ly從加工用雷射光源11及顯示用雷射光源21射出，或調整雷射光Lx、Ly之強度。又，控制裝置14驅動焦點距離調整部23的透鏡驅動部234而調整雷射光Lx1、Ly之焦點距離，或驅動掃描部24的掃描驅動部243而改變雷射光Lx1、Ly相對於工件W之照射位置。進而，控制裝置14驅動第一驅動部33而使第一光閘31進行開閉動作，或驅動第二驅動部34而使第二光閘32進行開閉動作。 The control device 14 controls the components of the laser light source 11 for processing and the laser processing head 12 according to the predetermined processing conditions input by the user. Specifically, the control device 14 emits the laser beams Lx and Ly from the processing laser light source 11 and the display laser light source 21 , or adjusts the intensity of the laser beams Lx and Ly. In addition, the control device 14 drives the lens driving unit 234 of the focal length adjusting unit 23 to adjust the focal length of the laser beams Lx1 and Ly, or drives the scanning driving unit 243 of the scanning unit 24 to change the irradiation of the laser beams Lx1 and Ly on the workpiece W. Location. Furthermore, the control device 14 drives the first drive unit 33 to open and close the first shutter 31 , or drives the second drive unit 34 to open and close the second shutter 32 .

然後，控制裝置14藉由控制加工用雷射光源11與雷射加工頭12之構成要素來執行加工模式、顯示模式、測量模式及待機模式。加工模式是將加工用之雷射光Lx照射於工件W而對工件W進行加工的模式。顯示模式是將顯示用之雷射光Ly照射於工件W而使工件W進行加工的部分可視化的模式。測量模式是測量加工用雷射光Lx之強度的模式。待機模式是等待執行加工模式、顯示模式或測量模式的模式。 Then, the control device 14 executes a processing mode, a display mode, a measurement mode, and a standby mode by controlling the components of the processing laser light source 11 and the laser processing head 12 . The processing mode is a mode for processing the workpiece W by irradiating the workpiece W with laser light Lx for processing. The display mode is a mode in which the workpiece W is irradiated with display laser light Ly to visualize the processed portion of the workpiece W. The measurement mode is a mode for measuring the intensity of the processing laser light Lx. The standby mode is a mode waiting for the processing mode, display mode, or measurement mode to be executed.

依據加工條件執行加工模式之情形時，控制裝置14將第一光閘31及第二光閘32皆配置於開啟位置。此時，控制裝置14使雷射光Lx從加工用雷射光源11射出。然後，從加工用雷射光源11射出的雷射光Lx中，透射光學構件22的雷射光Lx1於透射焦點距離調整部23後入射至掃描部24。然後，控制裝置14依據加工條件，一面藉由焦點距離調整部23調整雷射光Lx1的焦點 位置，一面藉由掃描部24掃描雷射光Lx1。如此，雷射加工裝置10依據加工條件對工件W進行加工。 When the processing mode is executed according to the processing conditions, the control device 14 configures both the first shutter 31 and the second shutter 32 at open positions. At this time, the control device 14 emits the laser light Lx from the processing laser light source 11 . Then, among the laser light Lx emitted from the processing laser light source 11 , the laser light Lx1 transmitted through the optical member 22 is transmitted through the focal length adjustment unit 23 and enters the scanning unit 24 . Then, the control device 14 adjusts the focus of the laser light Lx1 through the focus distance adjustment unit 23 according to the processing conditions. position, while scanning the laser light Lx1 by the scanning unit 24 . In this way, the laser processing device 10 processes the workpiece W according to the processing conditions.

依據加工條件執行顯示模式之情形時，控制裝置14將第一光閘31配置於關閉位置，將第二光閘32配置於開啟位置。此時，控制裝置14使雷射光Ly從顯示用雷射光源21射出。如此，從顯示用雷射光源21射出的雷射光Ly被光學構件22反射。接著，雷射光Ly透射焦點距離調整部23後入射至掃描部24。然後，控制裝置14依據加工條件，一面藉由焦點距離調整部23調整雷射光Ly的焦點位置，一面藉由掃描部24掃描雷射光Ly。如此，操作者可目視確認加工於工件W表面的文字、記號或圖形等。又，顯示模式中，從第一光閘31被配置於關閉位置此點來看，即使誤從加工用雷射光源11射出雷射光Lx，雷射光Lx1也不會照射於工件W。 When the display mode is executed according to processing conditions, the control device 14 arranges the first shutter 31 at the closed position, and arranges the second shutter 32 at the open position. At this time, the control device 14 emits the laser light Ly from the display laser light source 21 . In this way, the laser light Ly emitted from the display laser light source 21 is reflected by the optical member 22 . Next, the laser light Ly is transmitted through the focal length adjustment unit 23 and enters the scanning unit 24 . Then, the control device 14 adjusts the focus position of the laser light Ly by the focal length adjustment unit 23 and scans the laser light Ly by the scanning unit 24 according to the processing conditions. In this way, the operator can visually confirm the characters, symbols, graphics, etc. processed on the surface of the workpiece W. As shown in FIG. Also, in the display mode, since the first shutter 31 is disposed at the closed position, the workpiece W is not irradiated with the laser light Lx1 even if the laser light Lx is erroneously emitted from the processing laser light source 11 .

於執行測量模式之情形時，控制裝置14將第一光閘31配置於開啟位置，將第二光閘32配置於關閉位置。此時，控制裝置14使雷射光Lx從加工用雷射光源11射出。如此，從加工用雷射光源11射出的雷射光Lx中，被光學構件22反射的雷射光Lx2入射至光接收部25。控制裝置14基於與從光接收部25輸出之雷射光Lx2的強度相對應之訊號，獲取雷射光Lx的強度。然後，控制裝置14為了使照射於工件W的雷射光Lx1之強度恆定，或是為了將照射於工件W的雷射光Lx1之強度設為目標值，而控制加工用雷射光源11之振盪。測量模式例如在雷射加工裝置10的電源接通之後或是在執行基於加工條件的加工模式之前執行。又，測量模式中，從第二光閘32被配置於關閉位置此點來看，雷射光Lx1不會照射於工件W。 When the measurement mode is executed, the control device 14 arranges the first shutter 31 at the open position, and arranges the second shutter 32 at the closed position. At this time, the control device 14 emits the laser light Lx from the processing laser light source 11 . In this way, among the laser light Lx emitted from the processing laser light source 11 , the laser light Lx2 reflected by the optical member 22 enters the light receiving unit 25 . The control device 14 acquires the intensity of the laser light Lx based on a signal corresponding to the intensity of the laser light Lx2 output from the light receiving unit 25 . Then, the control device 14 controls the oscillation of the processing laser light source 11 to make the intensity of the laser light Lx1 irradiated on the workpiece W constant or to set the intensity of the laser light Lx1 irradiated on the workpiece W to a target value. The measurement mode is executed, for example, after the power of the laser processing apparatus 10 is turned on or before execution of the processing mode based on processing conditions. Also, in the measurement mode, the workpiece W is not irradiated with the laser light Lx1 from the point that the second shutter 32 is disposed at the closed position.

於執行待機模式之情形時，控制裝置14將第一光閘31及第二光閘32皆配置於關閉位置。此時，雷射光Lx及Ly不會從加工用雷射光源11及顯示用雷射光源21射出。 When executing the standby mode, the control device 14 configures both the first shutter 31 and the second shutter 32 at the closed position. At this time, the laser beams Lx and Ly are not emitted from the processing laser light source 11 and the display laser light source 21 .

接著，針對加工模式、顯示模式以及測量模式的執行中，控制裝置14所執行的控制進行說明。 Next, the control performed by the control device 14 during execution of the machining mode, the display mode, and the measurement mode will be described.

加工模式執行期間，維持第一光閘31及第二光閘32皆配置於開啟位置的情況。換言之，在加工模式執行期間，第一光閘31及第二光閘32皆不會從開啟位置移動。此處，在執行加工模式的情況下，控制裝置14以如下方式判定光閘的狀態。於第一開啟感測器42及第二開啟感測器44的檢測結果顯示第一光閘31及第二光閘32皆配置於開啟位置之情形時，控制裝置14判定光閘的狀態為正常。進而，於第一關閉感測器41及第二關閉感測器43的檢測結果顯示第一光閘31及第二光閘32皆未配置於關閉位置之情形時，控制裝置14判定光閘的狀態為正常。 During the execution of the processing mode, the condition that both the first shutter 31 and the second shutter 32 are configured at the open position is maintained. In other words, during the processing mode, neither the first shutter 31 nor the second shutter 32 will move from the open position. Here, when the processing mode is executed, the control device 14 determines the state of the shutter as follows. When the detection results of the first open sensor 42 and the second open sensor 44 show that the first shutter 31 and the second shutter 32 are both configured in the open position, the control device 14 determines that the state of the shutter is normal . Furthermore, when the detection results of the first closing sensor 41 and the second closing sensor 43 show that the first shutter 31 and the second shutter 32 are not disposed at the closed position, the control device 14 determines whether the shutter is closed. Status is OK.

詳細而言，於第一開啟訊號So1及第二開啟訊號So2皆為導通之情形且第一關閉訊號Sc1及第二關閉訊號Sc2皆為斷開之情形時，控制裝置14判定光閘的狀態為正常。換言之，於第一開啟訊號So1及第二開啟訊號So2之至少一者為斷開之情形，或第一關閉訊號Sc1及第二關閉訊號Sc2之至少一者為導通之情形時，控制裝置14判定光閘的狀態並非正常。 Specifically, when the first opening signal So1 and the second opening signal So2 are both on and the first closing signal Sc1 and the second closing signal Sc2 are both off, the control device 14 determines that the state of the shutter is normal. In other words, when at least one of the first open signal So1 and the second open signal So2 is off, or at least one of the first close signal Sc1 and the second close signal Sc2 is on, the control device 14 determines The status of the shutter is not normal.

然後，於判定光閘的狀態為正常之情形時，控制裝置14繼續執行加工模式。另一方面，於判定光閘的狀態並非正常之情形時，控制裝置14使通知部26通知第一警告，且停止雷射光Lx自加工用雷射光源11射出。 Then, when it is determined that the state of the shutter is normal, the control device 14 continues to execute the processing mode. On the other hand, when it is determined that the state of the shutter is not normal, the control device 14 causes the notification unit 26 to notify the first warning, and stops the emission of the laser light Lx from the processing laser light source 11 .

此處，所謂第一警告，是指於第一光閘31及第二光閘32未配置於與模式對應的位置之情形時所輸出的警告，為緊急性較高之警告。於輸出第一警告之情形時，控制裝置14較佳督促維修保養的執行，且較佳限制加工模式、顯示模式及測量模式的執行。 Here, the first warning refers to a warning that is output when the first shutter 31 and the second shutter 32 are not disposed at a position corresponding to the mode, and is a warning of high urgency. When the first warning is output, the control device 14 preferably urges the execution of maintenance, and preferably restricts the execution of the machining mode, the display mode and the measurement mode.

顯示模式執行期間，維持第一光閘31配置於關閉位置的情況，且維持第二光閘32配置於開啟位置的情況。換言之，顯示模式執行期間，第一光 閘31不會從關閉位置移動，且第二光閘32不會從開啟位置移動。此處，在執行顯示模式的情況下，控制裝置14以如下方式判定光閘的狀態。於第一關閉感測器41及第二開啟感測器44的檢測結果顯示第一光閘31配置於關閉位置，並且第二光閘32配置於開啟位置之情形時，控制裝置14判定光閘的狀態為正常。進而，於第一開啟感測器42及第二關閉感測器43的檢測結果顯示第一光閘31未配置於開啟位置，並且第二光閘32未配置於關閉位置之情形時，控制裝置14判定光閘的狀態為正常。 During the execution of the display mode, the first shutter 31 is maintained at the closed position, and the second shutter 32 is maintained at the open position. In other words, during display mode execution, the first light The shutter 31 does not move from the closed position, and the second shutter 32 does not move from the open position. Here, when the display mode is executed, the control device 14 determines the state of the shutter as follows. When the detection results of the first closing sensor 41 and the second opening sensor 44 show that the first shutter 31 is disposed at the closed position and the second shutter 32 is disposed at the open position, the control device 14 determines that the shutter status is normal. Furthermore, when the detection results of the first open sensor 42 and the second close sensor 43 show that the first shutter 31 is not configured in the open position, and the second shutter 32 is not configured in the closed position, the control device 14. It is determined that the state of the shutter is normal.

詳細而言，於第一關閉訊號Sc1及第二開啟訊號So2皆為導通且第一開啟訊號So1及第二關閉訊號Sc2皆為斷開之情形時，控制裝置14判定光閘的狀態為正常。換言之，於第一關閉訊號Sc1及第二開啟訊號So2之至少一者為斷開之情形，或第一開啟訊號So1及第二關閉訊號Sc2之至少一者為導通之情形時，控制裝置14判定光閘的狀態並非正常。 Specifically, when the first closing signal Sc1 and the second opening signal So2 are both on and both the first opening signal So1 and the second closing signal Sc2 are off, the control device 14 determines that the state of the shutter is normal. In other words, when at least one of the first closing signal Sc1 and the second opening signal So2 is off, or at least one of the first opening signal So1 and the second closing signal Sc2 is on, the control device 14 determines The status of the shutter is not normal.

然後，於判定光閘的狀態為正常之情形時，控制裝置14繼續執行顯示模式。另一方面，於判定光閘的狀態並非正常之情形時，控制裝置14使通知部26通知第一警告，且停止雷射光Ly自顯示用雷射光源21射出。 Then, when it is determined that the state of the shutter is normal, the control device 14 continues to execute the display mode. On the other hand, when it is determined that the state of the shutter is not normal, the control device 14 causes the notification unit 26 to notify the first warning, and stops the emission of the laser light Ly from the display laser light source 21 .

執行測量模式期間，維持第一光閘31配置於開啟位置的情況，且維持第二光閘32配置於關閉位置的情況。換言之，測量模式執行期間，第一光閘31不從會開啟位置移動，且第二光閘32不會從關閉位置移動。此處，在執行測量模式的情況下，控制裝置14以如下方式判定光閘的狀態。於第一開啟感測器42及第二關閉感測器43的檢測結果顯示第一光閘31配置於開啟位置，並且第二光閘32配置於關閉位置之情形時，控制裝置14判定光閘的狀態為正常。進而，於第一關閉感測器41及第二開啟感測器44的檢測結果顯示第一光閘31未配置於關閉位置，並且第二光閘32未配置於開啟位置之情形時，控制裝置14判定光閘的狀態為正常。 During the measurement mode, the first shutter 31 is maintained at the open position, and the second shutter 32 is maintained at the closed position. In other words, during execution of the measurement mode, the first shutter 31 does not move from the open position, and the second shutter 32 does not move from the closed position. Here, when the measurement mode is executed, the control device 14 determines the state of the shutter as follows. When the detection results of the first open sensor 42 and the second close sensor 43 show that the first shutter 31 is disposed at the open position and the second shutter 32 is disposed at the closed position, the control device 14 determines that the shutter status is normal. Furthermore, when the detection results of the first closing sensor 41 and the second opening sensor 44 show that the first shutter 31 is not disposed at the closed position, and the second shutter 32 is not disposed at the open position, the control device 14. It is determined that the state of the shutter is normal.

詳細而言，於第一開啟訊號So1及第二關閉訊號Sc2皆為導通之情形，且第一關閉訊號Sc1及第二開啟訊號So2皆為斷開之情形時，控制裝置14判定光閘的狀態為正常。換言之，於第一開啟訊號So1及第二關閉訊號Sc2之至少一者為斷開之情形，或第一關閉訊號Sc1及第二開啟訊號So2之至少一者為導通之情形時，控制裝置14判定光閘的狀態並非正常。 Specifically, when the first opening signal So1 and the second closing signal Sc2 are both on, and the first closing signal Sc1 and the second opening signal So2 are both off, the control device 14 determines the state of the shutter. as normal. In other words, when at least one of the first turn-on signal So1 and the second turn-off signal Sc2 is off, or at least one of the first turn-off signal Sc1 and the second turn-on signal So2 is on, the control device 14 determines The status of the shutter is not normal.

然後，於判定光閘的狀態為正常之情形時，控制裝置14繼續執行測量模式。另一方面，於判定光閘的狀態並非正常之情形時，控制裝置14使通知部26通知第一警告，且停止雷射光Lx自加工用雷射光源11射出。 Then, when it is determined that the state of the shutter is normal, the control device 14 continues to execute the measurement mode. On the other hand, when it is determined that the state of the shutter is not normal, the control device 14 causes the notification unit 26 to notify the first warning, and stops the emission of the laser light Lx from the processing laser light source 11 .

接著，針對在加工模式、顯示模式、測量模式及待機模式之切換時控制裝置14所執行的控制進行說明。 Next, control performed by the control device 14 at the time of switching between the processing mode, the display mode, the measurement mode, and the standby mode will be described.

雷射加工裝置10中，若從某一模式切換至另一模式，則第一光閘31及第二光閘32從關閉位置向開啟位置進行開啟動作，或從開啟位置向關閉位置進行關閉動作。此處，如果第一光閘31與第二光閘32以及第一驅動部33與第二驅動部34等隨時間發生變化，則第一光閘31及第二光閘32之開閉動作所需的時間會變化。具體而言，第一光閘31及第二光閘32之開閉動作所需的時間增加。 In the laser processing device 10, when switching from a certain mode to another mode, the first shutter 31 and the second shutter 32 perform an opening operation from the closed position to the open position, or perform a closing operation from the open position to the closed position. . Here, if the first shutter 31 and the second shutter 32 and the first driving unit 33 and the second driving unit 34 change over time, the opening and closing operations of the first shutter 31 and the second shutter 32 need time will vary. Specifically, the time required for the opening and closing operations of the first shutter 31 and the second shutter 32 increases.

此處，控制裝置14獲取第一光閘31從開啟位置至關閉位置進行關閉動作所需的時間，換言之，從第一開啟訊號So1斷開至第一關閉訊號Sc1導通為止的時間作為「第一關閉動作時間Tc1」。又，控制裝置14獲取第一光閘31從關閉位置至開啟位置進行開啟動作所需的時間，換言之，從第一關閉訊號Sc1斷開至第一開啟訊號So1導通為止的時間作為「第一開啟動作時間To1」。此處，第一關閉動作時間Tc1及第一開啟動作時間To1相當於「第一動作時間」之一例。 Here, the control device 14 acquires the time required for the first shutter 31 to perform the closing action from the open position to the closed position, in other words, the time from when the first opening signal So1 is turned off to when the first closing signal Sc1 is turned on, as the "first Closing action time Tc1". Moreover, the control device 14 acquires the time required for the first shutter 31 to perform the opening operation from the closed position to the open position, in other words, the time from the first closing signal Sc1 being turned off to the first opening signal So1 being turned on as the "first opening Action time To1". Here, the first closing operation time Tc1 and the first opening operation time To1 correspond to an example of "first operating time".

同樣地，控制裝置14獲取第二光閘32從開啟位置至關閉位置進行關閉動作所需的時間，換言之，從第二開啟訊號So2斷開至第二關閉訊號Sc2 導通為止的時間作為「第二關閉動作時間Tc2」。又，控制裝置14獲取第二光閘32從關閉位置至開啟位置進行開啟動作所需的時間，換言之，從第二關閉訊號Sc2斷開至第二開啟訊號So2導通為止的時間作為「第二開啟動作時間To2」。此處，第二關閉動作時間Tc2及第二開啟動作時間To2相當於「第二動作時間」之一例。 Similarly, the control device 14 acquires the time required for the closing action of the second shutter 32 from the open position to the closed position, in other words, from the second opening signal So2 to the second closing signal Sc2 The time until turning on is referred to as "second closing operation time Tc2". Moreover, the control device 14 obtains the time required for the second shutter 32 to open from the closed position to the open position, in other words, the time from when the second close signal Sc2 is turned off to when the second open signal So2 is turned on is taken as the "second open position". Action time To2". Here, the second closing operation time Tc2 and the second opening operation time To2 correspond to an example of "second operating time".

然後，控制裝置14基於第一關閉動作時間Tc1及第一開啟動作時間To1之至少一者判定第一光閘31的狀態是否正常。同樣地，控制裝置14基於第二關閉動作時間Tc2及第二開啟動作時間To2之至少一者判定第二光閘32的狀態是否正常。於第一關閉動作時間Tc1、第一開啟動作時間To1、第二關閉動作時間Tc2及第二開啟動作時間To2之至少一者為預先設定的時間判定值Tth以上之情形時，控制裝置14使通知部26輸出第二警告。 Then, the control device 14 determines whether the state of the first shutter 31 is normal based on at least one of the first closing operation time Tc1 and the first opening operation time To1. Similarly, the control device 14 determines whether the state of the second shutter 32 is normal based on at least one of the second closing operation time Tc2 and the second opening operation time To2. When at least one of the first closing operation time Tc1, the first opening operation time To1, the second closing operation time Tc2, and the second opening operation time To2 is greater than or equal to the preset time judgment value Tth, the control device 14 notifies Section 26 outputs a second warning.

又，控制裝置14基於第一關閉動作時間Tc1及第二關閉動作時間Tc2之間的差值△Tc，判定第一光閘31的狀態是否正常。同樣地，控制裝置14基於第一開啟動作時間To1及第二開啟動作時間To2之間的差值△To，判定第二光閘32的狀態是否正常。於差值△Tc或差值△To為預先設定的差值判定值△Tth以上之情形時，控制裝置14使通知部26輸出第二警告。 Furthermore, the control device 14 determines whether the state of the first shutter 31 is normal based on the difference ΔTc between the first closing operation time Tc1 and the second closing operation time Tc2. Similarly, the control device 14 determines whether the state of the second shutter 32 is normal based on the difference ΔTo between the first opening time To1 and the second opening time To2 . When the difference ΔTc or the difference ΔTo is equal to or greater than the predetermined difference judgment value ΔTth, the control device 14 causes the notification unit 26 to output the second warning.

此處，第二警告是於第一光閘31及第二光閘32的動作時間延遲之情形時所輸出的警告，從此點來看，其為緊急性低於第一警告之警告。於輸出第二警告之情形時，控制裝置14較佳督促維修保養的執行，但不限制加工模式、顯示模式及測量模式的執行。 Here, the second warning is a warning output when the operating time of the first shutter 31 and the second shutter 32 is delayed, and from this point of view, it is a warning lower in urgency than the first warning. When the second warning is output, the control device 14 preferably supervises the execution of the maintenance, but does not limit the execution of the processing mode, the display mode and the measurement mode.

時間判定值Tth較佳基於雷射加工裝置10出廠時光閘的動作時間來決定。時間判定值Tth於光閘之關閉動作時的判定值及光閘之開啟動作時的判定值可設為不同之值。關於差值判定值△Tth亦同。 The time determination value Tth is preferably determined based on the operating time of the shutter when the laser processing device 10 is shipped. The time judgment value Tth may be set to a different value when the shutter is closed and when the shutter is opened. The same applies to the difference judgment value ΔTth.

此外，本實施方式中，控制裝置14將第一關閉動作時間Tc1、第一開啟動作時間To1、第二關閉動作時間Tc2及第二開啟動作時間To2儲存於內設之儲存部中。例如，假設伴隨模式的改變，第一光閘31從開啟位置至關閉位置進行關閉動作之情形。此情形時，控制裝置14伴隨第一光閘31的關閉動作獲取第一關閉動作時間Tc1。接著，控制裝置14將儲存於儲存部的第一關閉動作時間Tc1與新獲取的第一關閉動作時間Tc1進行比較。於新獲取的第一關閉動作時間Tc1比儲存於儲存部的第一關閉動作時間Tc1長之情形時，控制裝置14使儲存部儲存新獲取的第一關閉動作時間Tc1。如此，控制裝置14使最長的第一關閉動作時間Tc1儲存於儲存部。關於第一開啟動作時間To1、第二關閉動作時間Tc2及第二開啟動作時間To2亦同。 In addition, in this embodiment, the control device 14 stores the first closing time Tc1 , the first opening time To1 , the second closing time Tc2 and the second opening time To2 in a built-in storage unit. For example, assume a case where the first shutter 31 performs a closing operation from the open position to the closed position as the mode is changed. In this case, the control device 14 acquires the first closing operation time Tc1 accompanying the closing operation of the first shutter 31 . Next, the control device 14 compares the first closing operation time Tc1 stored in the storage unit with the newly acquired first closing operation time Tc1. When the newly obtained first closing operation time Tc1 is longer than the first closing operation time Tc1 stored in the storage unit, the control device 14 causes the storage unit to store the newly obtained first closing operation time Tc1. In this way, the control device 14 stores the longest first closing operation time Tc1 in the storage unit. The same applies to the first opening operation time To1, the second closing operation time Tc2, and the second opening operation time To2.

以上說明中，於通知第一警告或第二警告之情形時，可謂第一光閘31及第二光閘32之至少一者並非正常。因此，當通知第一警告或第二警告之情形時，控制裝置14較佳通知光閘並非正常。 In the above description, when the first warning or the second warning is notified, it can be said that at least one of the first shutter 31 and the second shutter 32 is abnormal. Therefore, when notifying the situation of the first warning or the second warning, the control device 14 preferably notifies that the shutter is not normal.

參照圖3所示的流程圖，針對並未執行待機模式之情形時，控制裝置14所執行的處理流程進行說明。控制裝置14每隔已定的控制週期反覆執行本處理。 Referring to the flow chart shown in FIG. 3 , the flow of processing executed by the control device 14 when the standby mode is not executed will be described. The control device 14 repeatedly executes this process every predetermined control period.

如圖3所示，控制裝置14獲取第一關閉感測器41、第一開啟感測器42、第二關閉感測器43及第二開啟感測器44所輸出的訊號(S11)。接著，控制裝置14判定是否為執行加工模式期間(S12)。為加工模式執行期間之情形時(S12：是)，控制裝置14判定是否第一開啟訊號So1及第二開啟訊號So2兩者皆為導通且第一關閉訊號Sc1及第二關閉訊號Sc2兩者皆為斷開(S13)。若於步驟S13判定為肯定之情形時(S13：是)，則控制裝置14暫時結束本處理。此情形時，控制裝置14繼續執行加工模式。另一方面，若步驟S13判定為否定 之情形時(S13：否)，則控制裝置14使通知部26通知第一警告(S14)。此情形時，控制裝置14中斷加工模式的執行。之後，控制裝置14結束本處理。 As shown in FIG. 3 , the control device 14 obtains signals output by the first close sensor 41 , the first open sensor 42 , the second close sensor 43 and the second open sensor 44 ( S11 ). Next, the control device 14 determines whether or not it is a machining mode execution period (S12). When it is the case during the execution of the processing mode (S12: Yes), the control device 14 determines whether both the first opening signal So1 and the second opening signal So2 are both on and whether the first closing signal Sc1 and the second closing signal Sc2 are both on. is disconnected (S13). If it is determined in the affirmative in step S13 (S13: Yes), the control device 14 temporarily ends this process. In this case, the control device 14 continues to execute the machining mode. On the other hand, if step S13 judges negative In this case (S13: NO), the control device 14 makes the notification unit 26 notify the first warning (S14). In this case, the control device 14 interrupts the execution of the machining mode. After that, the control device 14 ends this process.

步驟S12中，在並非執行加工模式期間之情形時(S12：否)，控制裝置14判定是否為顯示模式執行期間(S15)。為顯示模式執行期間之情形時(S15：是)，控制裝置14判定是否第一關閉訊號Sc1及第二開啟訊號So2兩者皆為導通且第一開啟訊號So1及第二關閉訊號Sc2兩者皆為斷開(S16)。若於步驟S16判定為肯定之情形時(S16：是)，則控制裝置14暫時結束本處理。此情形時，控制裝置14繼續執行顯示模式。另一方面，若步驟S16判定為否定之情形時(S16：否)，則控制裝置14執行步驟S14之處理。此情形時，控制裝置14中斷顯示模式的執行。 In step S12, when it is not a machining mode execution period (S12: No), the control apparatus 14 judges whether it is a display mode execution period (S15). When the situation during the execution of the display mode (S15: Yes), the control device 14 determines whether both the first closing signal Sc1 and the second opening signal So2 are both on and both the first opening signal So1 and the second closing signal Sc2 are turned on. is disconnected (S16). If it is determined in the affirmative at step S16 (S16: Yes), the control device 14 temporarily ends this process. In this case, the control device 14 continues to execute the display mode. On the other hand, if the determination in step S16 is negative (S16: NO), the control device 14 executes the processing in step S14. In this case, the control device 14 interrupts the execution of the display mode.

步驟S15中，於並非顯示模式執行期間之情形時(S15：否)，控制裝置14判定是否第一開啟訊號So1及第二關閉訊號Sc2兩者皆為導通，且第一關閉訊號Sc1及第二開啟訊號Sc1兩者皆為斷開(S17)。此處，步驟S15判定為否定之情形是指執行測量模式期間之情形。若步驟S17判定為肯定之情形時(S17：是)，則控制裝置14暫時結束本處理。此情形時，控制裝置14繼續執行測量模式。另一方面，於步驟S17判定為否定之情形時(S17：否)，控制裝置14執行步驟S14之處理。此情形時，控制裝置14中斷測量模式的執行。 In step S15, when the situation is not during the execution of the display mode (S15: No), the control device 14 determines whether both the first opening signal So1 and the second closing signal Sc2 are turned on, and the first closing signal Sc1 and the second closing signal Sc1 are turned on. Both of the enable signals Sc1 are turned off (S17). Here, the case where the determination in step S15 is negative refers to the case during which the measurement mode is being executed. If the determination in step S17 is affirmative (S17: Yes), the control device 14 temporarily ends this process. In this case, the control device 14 continues to execute the measurement mode. On the other hand, when step S17 determines that it is negative (S17: No), the control device 14 executes the process of step S14. In this case, the control device 14 interrupts the execution of the measurement mode.

參照圖4所示的流程圖，說明控制裝置14為了判定光閘的狀態所執行的處理之流程。例如，自執行前一次本處理起，控制裝置14於第一光閘31及第二光閘32的開閉動作之次數超過已定次數時，執行本處理。 Referring to the flowchart shown in FIG. 4, the flow of processing executed by the control device 14 to determine the state of the shutter will be described. For example, the control device 14 executes this process when the number of opening and closing operations of the first shutter 31 and the second shutter 32 exceeds a predetermined number since the previous execution of this processing.

如圖4所示，控制裝置14獲取最近的第一關閉動作時間Tc1、第一開啟動作時間To1、第二關閉動作時間Tc2及第二開啟動作時間To2(S21)。接著，控制裝置14計算第一開啟動作時間To1及第二開啟動作時間To2之差值 △To，且計算第一關閉動作時間Tc1及第二關閉動作時間Tc2之差值△Tc(S22)。此處，將差值△Tc、△To設為取絕對值之值。 As shown in FIG. 4 , the control device 14 acquires the latest first closing action time Tc1 , first opening action time To1 , second closing action time Tc2 and second opening action time To2 ( S21 ). Next, the control device 14 calculates the difference between the first opening action time To1 and the second opening action time To2 ΔTo, and calculate the difference ΔTc between the first closing action time Tc1 and the second closing action time Tc2 (S22). Here, the differences ΔTc and ΔTo are assumed to be absolute values.

然後，控制裝置14判定第一關閉動作時間Tc1及第一開啟動作時間To1之至少一者是否為時間判定值Tth以上(S23)。於第一關閉動作時間Tc1及第一開啟動作時間To1之至少一者為時間判定值Tth以上之情形(S23：是)，換言之，於第一光閘31之開閉動作所需的時間變長之情形時，控制裝置14通知第二警告(S24)。之後，控制裝置14結束本處理。 Then, the control device 14 determines whether at least one of the first closing operation time Tc1 and the first opening operation time To1 is equal to or greater than the time determination value Tth ( S23 ). When at least one of the first closing operation time Tc1 and the first opening operation time To1 is greater than or equal to the time determination value Tth (S23: Yes), in other words, when the time required for the opening and closing operation of the first shutter 31 becomes longer In this case, the control device 14 notifies the second warning (S24). After that, the control device 14 ends this process.

另一方面，於第一關閉動作時間Tc1及第一開啟動作時間To1兩者皆未達時間判定值Tth之情形時(S23：否)，控制裝置14判定是否第二關閉動作時間Tc2及第二開啟動作時間To2之至少一者為時間判定值Tth以上(S25)。於第二關閉動作時間Tc2及第二開啟動作時間To2之至少一者為時間判定值Tth以上之情形(S25：是)，換言之，於第二光閘32之開閉動作所需的時間變長之情形時，控制裝置14執行步驟S24之處理。 On the other hand, when both the first closing operation time Tc1 and the first opening operation time To1 are less than the time judgment value Tth (S23: No), the control device 14 determines whether the second closing operation time Tc2 and the second At least one of the opening operation times To2 is equal to or greater than the time determination value Tth (S25). When at least one of the second closing operation time Tc2 and the second opening operation time To2 is greater than or equal to the time judgment value Tth (S25: Yes), in other words, when the time required for the opening and closing operation of the second shutter 32 becomes longer In this case, the control device 14 executes the processing of step S24.

另一方面，於第二關閉動作時間Tc2及第二開啟動作時間To2兩者皆未達時間判定值Tth之情形時(S25：否)，控制裝置14判定差值△Tc及△To之至少一者是否為差值判定值△Tth以上(S26)。於差值△Tc及△To之至少一者為差值判定值△Tth以上之情形時(S26：是)，換言之，於第一光閘31及第二光閘32之開閉動作所需的時間產生差異之情形時，控制裝置14執行步驟S24的處理。另一方面，於兩者的差值△Tc、△To未達差值判定值△Tth之情形時(S26：否)，控制裝置14結束本處理。 On the other hand, when both the second closing operation time Tc2 and the second opening operation time To2 are less than the time judging value Tth (S25: No), the control device 14 judges at least one of the difference ΔTc and ΔTo Whether or not it is greater than or equal to the difference judgment value ΔTth (S26). When at least one of the difference ΔTc and ΔTo is greater than the difference judgment value ΔTth (S26: Yes), in other words, the time required for the opening and closing of the first shutter 31 and the second shutter 32 When a discrepancy occurs, the control device 14 executes the process of step S24. On the other hand, when the difference values ΔTc and ΔTo between the two are less than the difference judgment value ΔTth (S26: NO), the control device 14 ends this process.

針對本實施方式之作用進行說明。 The operation of this embodiment will be described.

如圖1所示，於執行加工模式期間，第一光閘31配置於以實線表示的開啟位置，第二光閘32配置於以實線表示的開啟位置。又，於執行顯示模式期間，第一光閘31配置於以兩點鏈線表示的關閉位置，第二光閘32配置於以實線表 示的開啟位置。又，於執行測量模式期間，第一光閘31配置於以實線表示的開啟位置，第二光閘32配置於以兩點鏈線表示的關閉位置。 As shown in FIG. 1 , during the execution of the processing mode, the first shutter 31 is configured at an open position indicated by a solid line, and the second shutter 32 is configured at an open position indicated by a solid line. Also, during the execution of the display mode, the first shutter 31 is disposed at the closed position indicated by a two-dot chain line, and the second shutter 32 is disposed at the closed position indicated by a solid line. open position shown. Also, during the execution of the measurement mode, the first shutter 31 is disposed at an open position indicated by a solid line, and the second shutter 32 is disposed at a closed position indicated by a two-dot chain line.

然後，雷射加工裝置10於執行加工模式、顯示模式及測量模式期間，基於第一關閉感測器41、第一開啟感測器42、第二關閉感測器43及第二開啟感測器44的檢測結果，監控第一光閘31及第二光閘32的位置。然後，於第一光閘31及第二光閘32的位置與執行中的模式不對應之情形時，雷射加工裝置10輸出第一警告，並且停止雷射光Lx、Ly自對應於執行中的模式之雷射光源射出。 Then, during the processing mode, display mode and measurement mode of the laser processing device 10, based on the first closing sensor 41, the first opening sensor 42, the second closing sensor 43 and the second opening sensor 44 , monitor the positions of the first shutter 31 and the second shutter 32 . Then, when the positions of the first shutter 31 and the second shutter 32 do not correspond to the mode being executed, the laser processing device 10 outputs the first warning, and stops the laser light Lx, Ly from corresponding to the mode being executed. The laser light source of the mode shoots out.

針對本實施方式之效果進行說明。 Effects of this embodiment will be described.

(1)雷射加工裝置10藉由第一關閉感測器41、第一開啟感測器42、第二關閉感測器43、第二開啟感測器44之四個感測器，判定第一光閘31及第二光閘32之位置。因此，雷射加工裝置10能夠正確地判定光閘的位置。由此，雷射加工裝置10能夠於加工模式、顯示模式及測量模式中，精度良好地判定光閘是否正常地動作。 (1) The laser processing device 10 uses four sensors of the first close sensor 41 , the first open sensor 42 , the second close sensor 43 , and the second open sensor 44 to determine the The positions of the first shutter 31 and the second shutter 32. Therefore, the laser processing apparatus 10 can accurately determine the position of the shutter. Accordingly, the laser processing apparatus 10 can accurately determine whether or not the shutter is operating normally in the processing mode, the display mode, and the measurement mode.

(2)詳細而言，雷射加工裝置10於加工模式、顯示模式及測量模式之各者中，基於四個感測器所輸出之訊號，判定光閘的狀態是否正常。因此，雷射加工裝置10於加工模式、顯示模式及測量模式中，能夠進一步精度良好地判定光閘是否正常地動作。 (2) Specifically, in each of the processing mode, the display mode and the measurement mode, the laser processing device 10 determines whether the state of the shutter is normal or not based on the signals output by the four sensors. Therefore, in the processing mode, the display mode, and the measurement mode, the laser processing device 10 can more accurately determine whether or not the shutter is operating normally.

(3)雷射加工裝置10於加工模式、顯示模式及測量模式中，於光閘的位置不在預期位置之情形時，通知緊急性高的第一警告。進而，雷射加工裝置10進行第一警告的通知，並且停止雷射光Lx、Ly自加工用雷射光源11或顯示用雷射光源21射出。因此，雷射加工裝置10可提高安全性。 (3) The laser processing device 10 notifies the first warning with high urgency when the position of the shutter is not at the expected position in the processing mode, the display mode, and the measurement mode. Furthermore, the laser processing apparatus 10 notifies the first warning, and stops emission of the laser beams Lx and Ly from the processing laser light source 11 or the display laser light source 21 . Therefore, the laser processing device 10 can improve safety.

(4)雷射加工裝置10基於第一關閉動作時間Tc1及第二關閉動作時間Tc2，判定光閘的狀態是否正常。詳細而言，雷射加工裝置10藉由第一 關閉動作時間Tc1及第二關閉動作時間Tc2與時間判定值Tth之比較，判定光閘的狀態是否正常。然後，於判定光閘的狀態並非正常之情形時，雷射加工裝置10能夠通知緊急性低的第二警告。 (4) The laser processing device 10 determines whether the state of the shutter is normal based on the first closing operation time Tc1 and the second closing operation time Tc2 . Specifically, the laser processing device 10 uses the first Comparing the closing operation time Tc1 and the second closing operation time Tc2 with the time judging value Tth determines whether the state of the shutter is normal. Then, when it is determined that the state of the shutter is not normal, the laser processing device 10 can notify the second warning with low urgency.

(5)雷射加工裝置10基於第一開啟動作時間To1及第二開啟動作時間To2判定光閘的狀態是否正常。詳細而言，雷射加工裝置10藉由第一開啟動作時間To1及第二開啟動作時間To2與時間判定值Tth之比較，判定光閘的狀態是否正常。然後，於雷射加工裝置10判定光閘的狀態並非正常之情形時，能夠通知緊急性低的第二警告。 (5) The laser processing device 10 determines whether the state of the shutter is normal based on the first opening operation time To1 and the second opening operation time To2. In detail, the laser processing device 10 determines whether the state of the shutter is normal or not by comparing the first opening time To1 and the second opening time To2 with the time determination value Tth. Then, when the laser processing apparatus 10 determines that the state of the shutter is not normal, it can notify the second warning with low urgency.

(6)雷射加工裝置10基於第一關閉動作時間Tc1與第二關閉動作時間Tc2的差值△Tc以及第一開啟動作時間To1與第二開啟動作時間To2的差值△To，判定光閘的狀態是否正常。詳細而言，雷射加工裝置10藉由差值△Tc、△To與差值判定值△Tth之比較，判定光閘的狀態是否正常。然後，於雷射加工裝置10判定光閘的狀態並非正常之情形時，能夠通知緊急性低的第二警告。 (6) The laser processing device 10 judges whether the shutter is closed based on the difference ΔTc between the first closing time Tc1 and the second closing time Tc2 and the difference ΔTo between the first opening time To1 and the second opening time To2. status is normal. In detail, the laser processing device 10 judges whether the state of the optical shutter is normal or not by comparing the difference values ΔTc, ΔTo with the difference judgment value ΔTth. Then, when the laser processing apparatus 10 determines that the state of the shutter is not normal, it can notify the second warning with low urgency.

(7)如圖5所示，考慮將第二光閘32配置於比焦點距離調整部23X更靠近雷射光Lx1的行進方向之比較例的雷射加工裝置10X。比較例的雷射加工裝置10X中，焦點距離調整部23X於雷射光Lx1的光軸之延伸方向上，必須一面考慮第二光閘32所佔據的區域，一面調整雷射光Lx1的焦點距離。因此，於雷射光Lx1的行進方向以及與該行進方向正交的方向上之焦點距離調整部23X的主體尺寸容易變大。從此點來看，本實施方式的雷射加工裝置10由於第二光閘32是配置於光學構件22與焦點距離調整部23之間，因此不容易造成上述情況。由此，雷射加工裝置10能夠抑制裝置之大型化。 (7) As shown in FIG. 5 , consider a laser processing apparatus 10X of a comparative example in which the second shutter 32 is arranged closer to the traveling direction of the laser beam Lx1 than the focal length adjustment unit 23X. In the laser processing device 10X of the comparative example, the focus distance adjustment unit 23X must adjust the focus distance of the laser light Lx1 while considering the area occupied by the second shutter 32 in the extending direction of the optical axis of the laser light Lx1. Therefore, the main body size of the focal length adjustment part 23X in the advancing direction of the laser light Lx1 and the direction orthogonal to this advancing direction becomes large easily. From this point of view, in the laser processing apparatus 10 of the present embodiment, since the second shutter 32 is disposed between the optical member 22 and the focal length adjustment unit 23 , the above-mentioned situation is unlikely to occur. Thereby, the laser processing apparatus 10 can suppress the enlargement of an apparatus.

(8)如圖5所示，比較例的雷射加工裝置10X中，若欲以不改變本實施方式之雷射光Lx1、Ly的焦點位置及焦點位置之光斑尺寸(spot size)的方式配置第二光閘32，則會產生以下問題。詳細而言，如圖5所示，第一透鏡 231X、第二透鏡232X及第三透鏡233X之間隔變長，或者第一透鏡231X、第二透鏡232X及第三透鏡233X變大。從此點來看，本實施方式的雷射加工裝置10由於第二光閘32是配置於光學構件22與焦點距離調整部23之間，因此更加能夠抑制裝置之大型化。又，本實施方式的雷射加工裝置10能夠抑制伴隨透鏡之大型化而提高成本。 (8) As shown in FIG. 5 , in the laser processing apparatus 10X of the comparative example, if the focal positions of the laser beams Lx1 and Ly of the present embodiment and the spot size of the focal positions are not changed, the first Two shutters 32, the following problems will arise. In detail, as shown in Figure 5, the first lens 231X, the second lens 232X, and the third lens 233X become longer, or the first lens 231X, the second lens 232X, and the third lens 233X become larger. From this point of view, since the second shutter 32 is arranged between the optical member 22 and the focal length adjustment unit 23 in the laser processing apparatus 10 of the present embodiment, it is possible to further suppress the enlargement of the apparatus. Moreover, the laser processing apparatus 10 of this embodiment can suppress cost increase accompanying the enlargement of a lens.

(9)於焦點距離調整部23配置於較掃描部24更靠近雷射光Lx1的行進方向之情形時，必須將焦點距離調整部23的第一透鏡231之能夠接收以掃描部24掃描的雷射光Lx1之尺寸增大。從此點來看，雷射加工裝置10中，由於焦點距離調整部23配置於第二光閘32與掃描部24之間，因此第一透鏡231的大型化，詳細而言，焦點距離調整部23的大型化能夠被抑制。 (9) When the focus distance adjusting part 23 is disposed closer to the traveling direction of the laser light Lx1 than the scanning part 24, the first lens 231 of the focus distance adjusting part 23 must be able to receive the laser light scanned by the scanning part 24 The size of Lx1 is increased. From this point of view, in the laser processing apparatus 10, since the focus distance adjustment unit 23 is arranged between the second shutter 32 and the scanning unit 24, the size of the first lens 231 is increased. Specifically, the focus distance adjustment unit 23 upsizing can be suppressed.

(10)比較例的雷射加工裝置10X中，第二光閘32阻斷藉由焦點距離調整部23使光束直徑收斂後之雷射光Lx1，換言之，能量密度高的雷射光。因此，第二光閘32必須由熱性耐久度高的材質構成。從此點來看，本實施方式的雷射加工裝置10中，第二光閘32阻斷藉由焦點距離調整部23使光束直徑收斂前之雷射光Lx1，換言之，能量密度低的雷射光。由此，雷射加工裝置10中，第二光閘32不是由耐久度高的材質構成亦可。 (10) In the laser processing apparatus 10X of the comparative example, the second shutter 32 blocks the laser light Lx1 whose beam diameter is converged by the focal length adjustment unit 23 , in other words, the laser light with high energy density. Therefore, the second shutter 32 must be made of a material with high thermal durability. From this point of view, in the laser processing apparatus 10 of the present embodiment, the second shutter 32 blocks the laser light Lx1 before the beam diameter is converged by the focal length adjustment unit 23 , in other words, the laser light with low energy density. Therefore, in the laser processing apparatus 10, the second shutter 32 does not have to be made of a highly durable material.

本實施方式能夠以如下方式進行修改而實施。本實施方式及以下的變更例可在技術上不矛盾之範圍內相互組合而實施。 This embodiment mode can be modified and implemented as follows. This embodiment and the following modified examples can be implemented in combination with each other within a technically non-contradictory range.

於雷射加工頭12，加工用雷射光源11與控制裝置14之至少一者可一體地形成。於一體地形成之情形時，例如可以考慮使加工用雷射光源11收納於殼體51，或者使加工用雷射光源11與控制裝置14收納於殼體51。於加工用雷射光源11被收納於外殼51之情形時，雷射加工裝置10可取決於雷射光源的種類而不具備光纜13。又，雷射加工裝置10也可為具備使來自加工用雷射光源11的雷射Lx成為平行光之視準(collimate)光學系統之構成。 In the laser processing head 12, at least one of the processing laser light source 11 and the control device 14 may be integrally formed. In the case of integral formation, for example, housing the processing laser light source 11 in the housing 51 or housing the processing laser light source 11 and the control device 14 in the housing 51 may be considered. When the laser light source 11 for processing is housed in the housing 51 , the laser processing device 10 may not include the optical cable 13 depending on the type of the laser light source. In addition, the laser processing apparatus 10 may be configured to include a collimate optical system for making the laser beam Lx from the laser light source 11 for processing parallel light.

雷射加工頭12可構成為透射光學構件22的雷射光Lx1朝向光接收部25，並且被光學構件22反射的雷射光Lx2朝向工件W。 The laser machining head 12 may be configured such that the laser light Lx1 transmitted through the optical member 22 is directed toward the light receiving portion 25 , and the laser light Lx2 reflected by the optical member 22 is directed toward the workpiece W. As shown in FIG.

焦點距離調整部23可不具有第三透鏡233。此情形時，可在殼體51之使雷射光Lx1、Ly透射的部位設置相當於第三透鏡233的聚光透鏡。於設置聚光透鏡之情形時，為如下構成：使藉由掃描部24改變方向之雷射光Lx1及Ly經由該聚光透鏡而朝向工件W會聚。另一方面，於僅不具有第三透鏡的構成之情形時，來自焦點距離調整部23的雷射光朝向掃描部24、工件W會聚。再者，焦點距離調整部23可由四個以上的透鏡構成。 The focal length adjustment unit 23 may not have the third lens 233 . In this case, a condensing lens corresponding to the third lens 233 may be provided at a portion of the casing 51 where the laser light Lx1 and Ly are transmitted. When a condensing lens is provided, the laser beams Lx1 and Ly whose directions are changed by the scanning unit 24 are condensed toward the workpiece W through the condensing lens. On the other hand, in the case of only the configuration without the third lens, the laser light from the focal length adjustment unit 23 converges toward the scanning unit 24 and the workpiece W. FIG. Furthermore, the focal length adjustment unit 23 may be composed of four or more lenses.

焦點距離調整部23中，透鏡驅動部234可使第二透鏡232相對於第一透鏡231移動，藉此調整第一透鏡231及第二透鏡232之間的距離。 In the focus distance adjusting part 23 , the lens driving part 234 can move the second lens 232 relative to the first lens 231 , thereby adjusting the distance between the first lens 231 and the second lens 232 .

第一光閘31及第二光閘32並非相同規格亦可。此情形時，第一光閘31的第一關閉動作時間Tc1及第一開啟動作時間To1與第二光閘32的第二關閉動作時間Tc2及第二開啟動作時間To2有差異。因此，於比較該等時間之情形時，較佳乘上已定之係數後進行比較。 The first shutter 31 and the second shutter 32 may not have the same specifications. In this case, the first closing time Tc1 and the first opening time To1 of the first shutter 31 are different from the second closing time Tc2 and second opening time To2 of the second shutter 32 . Therefore, when comparing the conditions of these times, it is better to multiply the predetermined coefficients for comparison.

第一關閉感測器41、第一開啟感測器42、第二關閉感測器43及第二開啟感測器44可為類比感測器。 The first close sensor 41 , the first open sensor 42 , the second close sensor 43 and the second open sensor 44 may be analog sensors.

控制裝置14可在圖4的步驟S23、S25、S26中執行至少一個判定處理。又，步驟S23中，控制裝置14可僅進行使用了第一關閉動作時間Tc1及第一開啟動作時間To1之一者的判定處理。又，步驟S25中，控制裝置14可僅進行使用了第二關閉動作時間Tc2及第二開啟動作時間To2之一者的判定處理。進而，步驟S26中，控制裝置14可僅進行使用了差值△Tc、△To之一者的判定處理。 The control device 14 may execute at least one determination process in steps S23, S25, and S26 of FIG. 4 . Moreover, in step S23, the control apparatus 14 may perform the determination process using only one of the 1st closing operation time Tc1 and the 1st opening operation time To1. Moreover, in step S25, the control apparatus 14 may perform the determination process using only one of the 2nd closing operation time Tc2 and the 2nd opening operation time To2. Furthermore, in step S26, the control device 14 may perform the determination process using only one of the difference values ΔTc and ΔTo.

控制裝置14可基於第一關閉動作時間Tc1及第一開啟動作時間To1之差值，判定是否輸出第二警告。同樣地，控制裝置14可以基於第二關閉動作時間Tc2及第二開啟動作時間To2之差值，判定是否輸出第二警告。 The control device 14 may determine whether to output the second warning based on the difference between the first closing action time Tc1 and the first opening action time To1. Likewise, the control device 14 may determine whether to output the second warning based on the difference between the second closing action time Tc2 and the second opening action time To2.

控制裝置14於使第一光閘31從開啟位置向關閉位置進行關閉動作時，獲取第一關閉動作時間Tc1，並且將所獲取的第一關閉動作時間Tc1與時間判定值Tth進行比較，藉此判定是否輸出第二警告。據此，控制裝置14不需儲存第一關閉動作時間Tc1。關於第一開啟動作時間To1、第二關閉動作時間Tc2及第二開啟動作時間To2亦同。 The control device 14 obtains the first closing operation time Tc1 when closing the first shutter 31 from the open position to the closed position, and compares the obtained first closing operation time Tc1 with the time determination value Tth, whereby It is determined whether to output the second warning. Accordingly, the control device 14 does not need to store the first closing action time Tc1. The same applies to the first opening operation time To1, the second closing operation time Tc2, and the second opening operation time To2.

控制裝置14可儲存第一光閘31及第二光閘32之開閉次數。然後，控制裝置14可根據第一光閘31及第二光閘32的開閉次數，使通知部26輸出第二警告。 The control device 14 can store the opening and closing times of the first shutter 31 and the second shutter 32 . Then, the control device 14 may cause the notification unit 26 to output the second warning according to the number of opening and closing times of the first shutter 31 and the second shutter 32 .

控制裝置14可為如下構成：包括一個以上之依據電腦程式進行動作的處理器、執行各種處理中至少一部分的處理之專用的硬體等一個以上之專用的硬體電路或是該等的組合。處理器包括CPU以及RAM、ROM等記憶體，記憶體存有構成為使CPU執行處理之程式碼或指令。記憶體，也就是儲存介質，包括能夠由通用或專用之電腦進行訪問的任何可利用之介質。 The control device 14 may be configured by including one or more dedicated hardware circuits such as one or more processors operating according to computer programs, dedicated hardware for executing at least a part of various processes, or a combination thereof. The processor includes a CPU and memories such as RAM and ROM, and the memories store codes or instructions configured to cause the CPU to execute processing. Memory, that is, storage media, includes any available media that can be accessed by a general-purpose or special-purpose computer.

10:雷射加工裝置10:Laser processing device

11:加工用雷射光源11: Laser light source for processing

12:雷射加工頭12: Laser processing head

13:光纜13: Optical cable

14:控制裝置14: Control device

21:顯示用雷射光源21: Laser light source for display

22:光學構件22: Optical components

23:焦點距離調整部23: Focus distance adjustment unit

24:掃描部24: Scanning department

25:光接收部25: Light receiving part

26:通知部26: Notification Department

31:第一光閘31: The first shutter

32:第二光閘32: Second shutter

33:第一驅動部33: The first driving department

34:第二驅動部34: The second drive unit

41:第一關閉感測器41: First off sensor

42:第一開啟感測器42: First open sensor

43:第二關閉感測器43:Second off sensor

44:第二開啟感測器44:Second opening sensor

51:殼體51: Shell

241、242:電流計鏡241, 242: Galvanometer mirror

243:掃描驅動部243: Scan driver

Lx、Lx1、Lx2、Ly:雷射光Lx, Lx1, Lx2, Ly: laser light

W:工件W: Workpiece

Claims (6)

一種雷射加工頭，其使用不可見光之加工用雷射光對工件進行加工，該雷射加工頭之特徵在於，具備：光學構件，其使自加工用雷射光源射出的該加工用雷射光分支為第一分支光及第二分支光，且使自顯示用雷射光源射出的可見光之顯示用雷射光的光軸與該第一分支光的光軸對準；掃描部，其對該工件掃描該第一分支光及該顯示用雷射光；光接收部，其檢測該第二分支光的強度；第一光閘，其配置為比該光學構件更靠近該加工用雷射光源側，且於阻斷該加工用雷射光的關閉位置與使該加工用雷射光透射的開啟位置之間位移；第二光閘，其配置為比該光學構件更靠近該工件側，且於阻斷該第一分支光及該顯示用雷射光的關閉位置與使該第一分支光及該顯示用雷射光透射的開啟位置之間位移；焦點距離調整部，其調整該第一分支光及該顯示用雷射光的焦點距離；第一開閉感測器，其檢測該第一光閘的開閉狀態；以及第二開閉感測器，其檢測該第二光閘的開閉狀態，該第二光閘配置於該光學構件與該焦點距離調整部之間，該第一開閉感測器具有：第一關閉感測器，其檢測該第一光閘配置於關閉位置；以及第一開啟感測器，其檢測該第一光閘配置於開啟位置；該第二開閉感測器具有：第二關閉感測器，其檢測該第二光閘配置於關閉位置；以及第二開啟感測器，其檢測該第二光閘配置於開啟位置。 A laser processing head for processing a workpiece using laser light for processing invisible light, the laser processing head is characterized by comprising: an optical member for branching the laser light for processing emitted from a laser light source for processing It is the first branch light and the second branch light, and the optical axis of the display laser light emitted from the visible light emitted from the display laser light source is aligned with the optical axis of the first branch light; the scanning part scans the workpiece The first branch light and the display laser light; a light receiving unit that detects the intensity of the second branch light; a first shutter that is arranged closer to the processing laser light source side than the optical member, and a displacement between an off position for blocking the processing laser light and an open position for transmitting the processing laser light; Displacement between the off position of the branched light and the display laser light and the open position for transmitting the first branch light and the display laser light; a focus distance adjustment unit that adjusts the first branch light and the display laser light the focal distance; the first opening and closing sensor, which detects the opening and closing state of the first optical shutter; and the second opening and closing sensor, which detects the opening and closing state of the second optical shutter, which is configured on the optical Between the member and the focus distance adjustment part, the first opening and closing sensor has: a first closing sensor, which detects that the first shutter is disposed at a closed position; and a first opening sensor, which detects that the first A shutter is configured in an open position; the second open/close sensor has: a second close sensor that detects that the second shutter is configured in a closed position; and a second open sensor that detects the second light The gate is configured in an open position. 如請求項1記載的雷射加工頭，其中，該焦點距離調整部具有第一透鏡及配置於該第一透鏡的光軸上之第二透鏡，藉由調整該第一透鏡及該第二透鏡之間的距離，調整透射該第一透鏡及該第二透鏡之該第一分支光的焦點距離。 The laser processing head as described in Claim 1, wherein the focal length adjustment unit has a first lens and a second lens arranged on the optical axis of the first lens, and by adjusting the first lens and the second lens The distance between them is used to adjust the focal distance of the first branch light transmitted through the first lens and the second lens. 如請求項2記載的雷射加工頭，其中，該焦點距離調整部配置於該光學構件與該掃描部之間。 The laser processing head as described in claim 2, wherein the focal length adjustment unit is disposed between the optical component and the scanning unit. 一種雷射加工裝置，其使用不可見光之加工用雷射光對工件進行加工，該雷射加工裝置之特徵在於，具備：加工用雷射光源，其射出該加工用雷射光；顯示用雷射光源，其射出可見光之顯示用雷射光；光學構件，其使該加工用雷射光分支為第一分支光及第二分支光，且使該顯示用雷射光的光軸與該第一分支光的光軸對準；掃描部，其對該工件掃描該第一分支光及該顯示用雷射光；光接收部，其檢測該第二分支光的強度；第一光閘，其配置為比該光學構件更靠近該加工用雷射光源側，且於阻斷該加工用雷射光的關閉位置與使該加工用雷射光透射的開啟位置之間位移；第二光閘，其配置為比該光學構件更靠近該工件側，且於阻斷該第一分支光及該顯示用雷射光的關閉位置與使該第一分支光及該顯示用雷射光透射的開啟位置之間位移；焦點距離調整部，其調整該第一分支光及該顯示用雷射光的焦點距離；第一開閉感測器，其檢測該第一光閘的開閉狀態；以及第二開閉感測器，其檢測該第二光閘的開閉狀態， 該第二光閘配置於該光學構件與該焦點距離調整部之間，該第一開閉感測器具有：第一關閉感測器，其檢測該第一光閘配置於關閉位置；以及第一開啟感測器，其檢測該第一光閘配置於開啟位置；該第二開閉感測器具有：第二關閉感測器，其檢測該第二光閘配置於關閉位置；以及第二開啟感測器，其檢測該第二光閘配置於開啟位置。 A laser processing device that processes a workpiece using laser light for processing invisible light, the laser processing device is characterized in that it includes: a laser light source for processing that emits the laser light for processing; a laser light source for display , which emits visible laser light for display; an optical member, which splits the processing laser light into a first branch light and a second branch light, and makes the optical axis of the display laser light coincide with the light of the first branch light Axis alignment; scanning part, which scans the first branched light and the display laser light to the workpiece; light receiving part, which detects the intensity of the second branched light; first shutter, which is configured to be larger than the optical member It is closer to the side of the laser light source for processing, and is displaced between a closed position for blocking the laser light for processing and an open position for transmitting the laser light for processing; a second shutter configured to be closer than the optical member It is close to the workpiece side, and is displaced between an off position for blocking the first branch light and the display laser light and an open position for transmitting the first branch light and the display laser light; the focus distance adjustment part, adjusting the focus distance of the first branch light and the display laser light; a first opening and closing sensor, which detects the opening and closing state of the first shutter; and a second opening and closing sensor, which detects the opening and closing state of the second shutter open and close state, The second shutter is disposed between the optical member and the focal distance adjustment part, and the first opening and closing sensor has: a first closing sensor, which detects that the first shutter is disposed at a closed position; and a first an open sensor, which detects that the first shutter is configured in an open position; the second open/close sensor has: a second close sensor, which detects that the second shutter is configured in a closed position; and a second open sensor A detector for detecting that the second shutter is configured in an open position. 如請求項4記載的雷射加工裝置，其中，該焦點距離調整部具有第一透鏡及配置於該第一透鏡的光軸上之第二透鏡，藉由調整該第一透鏡及該第二透鏡之間的距離，調整透射該第一透鏡及該第二透鏡之該第一分支光的焦點距離。 The laser processing device as described in claim 4, wherein the focal length adjustment unit has a first lens and a second lens arranged on the optical axis of the first lens, and by adjusting the first lens and the second lens The distance between them is used to adjust the focal distance of the first branch light transmitted through the first lens and the second lens. 如請求項5記載的雷射加工裝置，其中，該焦點距離調整部配置於該光學構件與該掃描部之間。 The laser processing device according to Claim 5, wherein the focal length adjustment unit is disposed between the optical component and the scanning unit.
TW110118976A 2020-08-06 2021-05-26 Laser processing head and laser processing apparatus TWI786649B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020133971A JP2022030175A (en) 2020-08-06 2020-08-06 Laser processing head and laser processing device
JP2020-133971 2020-08-06

Publications (2)

Publication Number Publication Date
TW202206212A TW202206212A (en) 2022-02-16
TWI786649B true TWI786649B (en) 2022-12-11

Family

ID=80117888

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110118976A TWI786649B (en) 2020-08-06 2021-05-26 Laser processing head and laser processing apparatus

Country Status (6)

Country Link
US (1) US20230311246A1 (en)
EP (1) EP4194138A4 (en)
JP (1) JP2022030175A (en)
KR (1) KR20230031355A (en)
TW (1) TWI786649B (en)
WO (1) WO2022030076A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11285871A (en) * 1998-04-03 1999-10-19 Miyachi Technos Corp Mechanism of detecting opened and closed state of laser optical path
JP2007061843A (en) * 2005-08-30 2007-03-15 Sunx Ltd Laser beam machining apparatus
JP2011056523A (en) * 2009-09-07 2011-03-24 Keyence Corp Laser beam machining device
JP2012002604A (en) * 2010-06-15 2012-01-05 Disco Abrasive Syst Ltd Height position measuring device for workpiece supported on chuck table and laser processing machine
JP2018069272A (en) * 2016-10-27 2018-05-10 株式会社アマダホールディングス Imaging method of laser processing position, and laser processing device
TWI651144B (en) * 2014-08-20 2019-02-21 城戶淳二 Laser annealing device and laser annealing method
CN109648191A (en) * 2019-01-15 2019-04-19 北京大学 It is a kind of can real-time monitoring energy micron order high-resolution ultrafast laser machining system
CN110193666A (en) * 2019-07-06 2019-09-03 深圳市普达镭射科技有限公司 Laser-beam welding machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0768396A (en) * 1993-09-02 1995-03-14 Hitachi Constr Mach Co Ltd Laser beam machine
JP4818717B2 (en) * 2005-12-28 2011-11-16 パナソニック電工Ｓｕｎｘ株式会社 Laser processing equipment
JP2012076105A (en) * 2010-09-30 2012-04-19 Panasonic Electric Works Sunx Co Ltd Laser beam machining apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11285871A (en) * 1998-04-03 1999-10-19 Miyachi Technos Corp Mechanism of detecting opened and closed state of laser optical path
JP2007061843A (en) * 2005-08-30 2007-03-15 Sunx Ltd Laser beam machining apparatus
JP2011056523A (en) * 2009-09-07 2011-03-24 Keyence Corp Laser beam machining device
JP2012002604A (en) * 2010-06-15 2012-01-05 Disco Abrasive Syst Ltd Height position measuring device for workpiece supported on chuck table and laser processing machine
TWI651144B (en) * 2014-08-20 2019-02-21 城戶淳二 Laser annealing device and laser annealing method
JP2018069272A (en) * 2016-10-27 2018-05-10 株式会社アマダホールディングス Imaging method of laser processing position, and laser processing device
CN109648191A (en) * 2019-01-15 2019-04-19 北京大学 It is a kind of can real-time monitoring energy micron order high-resolution ultrafast laser machining system
CN110193666A (en) * 2019-07-06 2019-09-03 深圳市普达镭射科技有限公司 Laser-beam welding machine

Also Published As

Publication number Publication date
WO2022030076A1 (en) 2022-02-10
JP2022030175A (en) 2022-02-18
EP4194138A4 (en) 2024-03-06
US20230311246A1 (en) 2023-10-05
EP4194138A1 (en) 2023-06-14
KR20230031355A (en) 2023-03-07
TW202206212A (en) 2022-02-16

Similar Documents

Publication Publication Date Title
JP5861532B2 (en) Laser radar equipment
US8772688B2 (en) Autofocus device including line image forming unit and rotation unit that rotates line image
TWI786649B (en) Laser processing head and laser processing apparatus
TWI786648B (en) Laser processing apparatus and laser processing head
JP4632248B2 (en) Laser processing equipment
WO2019216040A1 (en) Laser beam processing machine and method for detecting state of optical component
US20220176488A1 (en) Laser device
US20210146481A1 (en) Laser machining device
EP3098910B1 (en) Laser processing machine and focusing angle setting method of laser processing machine
US11878367B2 (en) Optical device and article manufacturing method
JP2001246489A (en) Laser material processing device
KR20200006999A (en) Lidar device and method using simplified detection
JP2021097073A (en) Laser oscillator
US10067294B2 (en) Beam distributor
KR101941580B1 (en) Apparatus for measuring surface profile
WO2021220762A1 (en) Laser processing head and laser processing device
WO2021220763A1 (en) Laser processing head and laser processing device
WO2023084716A1 (en) Optical processing device
JP2005062519A (en) Mechanism for laser beam machining position adjustment, and laser beam machining device provided with the same
JP5737312B2 (en) Laser output detector
JP5109763B2 (en) Optical scanning apparatus and optical scanning method
JP2010032221A (en) Beam irradiation apparatus