TWI714217B - Die bonding device and manufacturing method of semiconductor device - Google Patents

Die bonding device and manufacturing method of semiconductor device Download PDF

Info

Publication number
TWI714217B
TWI714217B TW108129074A TW108129074A TWI714217B TW I714217 B TWI714217 B TW I714217B TW 108129074 A TW108129074 A TW 108129074A TW 108129074 A TW108129074 A TW 108129074A TW I714217 B TWI714217 B TW I714217B
Authority
TW
Taiwan
Prior art keywords
jig
die
aforementioned
ejection
dome
Prior art date
Application number
TW108129074A
Other languages
Chinese (zh)
Other versions
TW202015170A (en
Inventor
名久井勇輝
岡本樹
五十嵐維月
Original Assignee
日商捷進科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商捷進科技有限公司 filed Critical 日商捷進科技有限公司
Publication of TW202015170A publication Critical patent/TW202015170A/en
Application granted granted Critical
Publication of TWI714217B publication Critical patent/TWI714217B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

[課題] 提供一種自動地進行拾取性的確認或筒夾偏斜的確認之晶粒接合裝置。 [解決手段] 晶粒接合裝置，係具備有：頂出單元，從下方頂出晶粒且使其從切割帶剝離；及晶粒接合部，吸附經剝離之前述晶粒且接合於基板上。前述頂出單元，係具備有：頂出治具；及殼體，安裝有前述頂出治具。可將測定治具安裝於述殼體及從前述殼體卸除以代替前述頂出治具。前述頂出治具，係具有：塊體，將前述切割帶頂出至圓頂中。前述測定治具，係在圓頂中收納有測定機器。[Question] To provide a die bonding device that automatically confirms pick-up properties or collet deflection. [Solution] The die bonding device is provided with: an ejection unit that ejects the die from below and peels it from the dicing tape; and the die bonding part absorbs the peeled die and bonds it to the substrate. The aforementioned ejection unit is equipped with: an ejection jig; and a housing, on which the aforementioned ejection jig is installed. The measuring jig can be installed and removed from the housing to replace the ejection jig. The aforementioned ejection jig is provided with a block to eject the aforementioned cutting tape into the dome. The aforementioned measuring jig contains a measuring device in a dome.

Description

晶粒接合裝置及半導體裝置之製造方法Die bonding device and manufacturing method of semiconductor device

本揭示，係關於晶粒接合裝置，例如能應用於頂出治具可更換的晶粒接合器。The present disclosure relates to die bonding devices, which can be applied to die bonders with replaceable ejector jigs, for example.

在半導體裝置之製造工程的一部分，有將半導體晶片(以下，僅稱為晶粒。)搭載於配線基板或引線框架等(以下，僅稱為基板。)而組合封裝的工程，在組合封裝之工程的一部分，有從半導體晶圓(以下，僅稱為晶圓。)分割晶粒的工程(切割工程)與將經分割之晶粒搭載於基板上的接合工程。接合工程所使用的半導體製造裝置為晶粒接合器等的晶粒接合裝置。As part of the manufacturing process of a semiconductor device, there is a process of mounting a semiconductor chip (hereinafter, only referred to as a die) on a wiring board or lead frame (hereinafter, only referred to as a substrate), and then combining and packaging. As part of the process, there are a process of dividing a die from a semiconductor wafer (hereinafter, simply referred to as a wafer) (a dicing process) and a bonding process of mounting the divided die on a substrate. The semiconductor manufacturing equipment used in the bonding process is a die bonding device such as a die bonder.

在接合工程中，係有將從晶圓所分割之晶粒剝離的剝離工程。在剝離工程中，係將該些晶粒從被保持於晶圓保持器的切割帶1個1個剝離，並使用被稱為筒夾的吸附治具來拾取經剝離的晶粒而搬送至基板上。In the bonding process, there is a peeling process for peeling the dies divided from the wafer. In the peeling process, these dies are peeled off one by one from the dicing tape held in the wafer holder, and the peeled dies are picked up using a suction jig called a collet and transported to the substrate on.

晶粒接合器，係在切割帶之下方(背面)設置有頂出單元，且為該頂出單元上升而將切割帶的晶粒上推，從切割帶剝離晶粒者。在將晶粒上推之頂出單元的前端，係安裝有頂出治具。在該頂出治具，係安裝有四根剝離起點形成銷等，該四根剝離起點形成銷，係被設置於將晶粒之中央頂出的內側塊體或該內側塊體的四角。 [先前技術文獻] [專利文獻]The die bonder is a device that is provided with an ejection unit under (back) of the dicing tape, and the die of the dicing tape is pushed up by the ejection unit to lift the die from the dicing tape. At the front end of the ejection unit that pushes the die up, an ejection jig is installed. The ejection jig is equipped with four peeling start point forming pins, etc., and the four peeling start point forming pins are provided on the inner block or the four corners of the inner block that ejects the center of the crystal grain. [Prior Technical Literature] [Patent Literature]

[專利文獻1] 日本特開2013-172122號公報[Patent Document 1] JP 2013-172122 A

[本發明所欲解決之課題][Problem to be solved by the present invention]

在剝離工程中，雖係必需進行晶粒之拾取性的確認・調整或筒夾裝設狀態(筒夾裝設位置、高度、偏斜(傾斜)或筒夾吸附面之磨損等)的確認・調整，但該些是以人力等來進行。 本揭示之課題，係提供一種可輕易地進行拾取性的確認或筒夾狀態的確認之晶粒接合裝置。 其他課題及新穎之特徵，係可由本說明書之記述及附加圖面明確得知。 [用以解決課題之手段]In the peeling process, although it is necessary to confirm and adjust the pick-up of the crystal grains or confirm the collet installation status (collet installation position, height, deflection (tilt) or wear of the collet suction surface, etc.) Adjustments, but these should be done with manpower. The subject of the present disclosure is to provide a die bonding device that can easily confirm the pick-up or collet status. Other topics and novel features can be clearly understood from the description of this manual and the attached drawings. [Means to solve the problem]

如下述，簡單地說明本揭示中代表性者之概要。 亦即，晶粒接合裝置，係具備有：頂出單元，從下方頂出晶粒且使其從切割帶剝離；及晶粒接合部，吸附經剝離之前述晶粒且接合於基板上。前述頂出單元，係具備有：頂出治具；及殼體，安裝有前述頂出治具。可將測定治具安裝於述殼體及從前述殼體卸除以代替前述頂出治具。前述頂出治具，係具有：塊體，將前述切割帶頂出至圓頂中。前述測定治具，係在圓頂中收納有測定機器。 [發明之效果]As follows, the outline of the representative ones in this disclosure is briefly explained. That is, the die bonding device is provided with: an ejection unit for ejecting the die from below and peeling it from the dicing tape; and a die bonding part for adsorbing the peeled die and bonding it on the substrate. The aforementioned ejection unit is equipped with: an ejection jig; and a housing, on which the aforementioned ejection jig is installed. The measuring jig can be installed and removed from the housing to replace the ejection jig. The aforementioned ejection jig is provided with a block to eject the aforementioned cutting tape into the dome. The aforementioned measuring jig contains a measuring device in a dome. [Effects of Invention]

根據上述晶粒接合裝置，可輕易地進行拾取性的確認或筒夾裝設狀態的確認。According to the above-mentioned die bonding device, it is possible to easily confirm the pick-up performance or the collet mounting state.

晶粒之拾取性的確認，雖係藉由下述任一者來進行，但存在有如下述般的問題。 (1)安裝內建有荷重元之頂出治具狀的測定器，進行測定晶圓剝離荷重。在測定後，更換成一般的頂出治具。由於此是利用人力來進行，因此，調整需耗費較長的作業時間。 (2)對載置於裝置之前的晶圓，事先以度盤規等來測定剝離力。無法保証設定結果為最佳化。 (3)藉由利用作業員的經驗之試誤法，決定拾取條件這樣的參數。在拾取性因晶圓的特性變化而產生變化之際，難以繼續生產。The pick-up properties of the crystal grains are confirmed by any one of the following, but there are problems as follows. (1) Install a tester in the shape of an ejection jig with a built-in load cell to measure the wafer peeling load. After the measurement, replace it with a general ejector jig. Since this is done by manpower, the adjustment takes a long time. (2) For the wafer before being placed in the device, the peel force is measured in advance with a dial gauge or the like. There is no guarantee that the setting result will be optimized. (3) Determine parameters such as picking conditions by using the trial and error method of the operator's experience. When the pick-up property changes due to changes in the characteristics of the wafer, it is difficult to continue production.

又，筒夾裝設狀態確認、調整，雖係如下述般地進行，但存在有如下述般的問題。 停止生產，在圓頂上放置感壓紙，將專用治具安裝於筒夾部，並從上方按壓至感壓紙而進行裝設狀態的確認、調整。在調整後，係更換成一般的筒夾。無法確認裝置運轉中的狀態。由於利用人力進行調整作業，因此，調整結果會因作業員而產生偏差。In addition, although the collet mounting state confirmation and adjustment are performed as follows, there are problems as follows. Stop production, place pressure sensitive paper on the dome, install a special jig on the collet part, and press the pressure sensitive paper from above to confirm and adjust the installation state. After adjustment, the system is replaced with a normal collet. Unable to confirm the operating status of the device. Since the adjustment work is performed by manpower, the adjustment result may vary depending on the operator.

以下，使用圖面，說明關於實施形態及實施例。但是，在以下的說明中，對同一構成要素附上同一符號，省略重複之說明。另外，圖面，係為了使說明更明確，與實際之形態相比，有針對各部之寬度、厚度、形狀等示意地顯示的情形，但始終為一例，並非限定本發明之解釋。Hereinafter, embodiments and examples will be described using the drawings. However, in the following description, the same reference numerals are attached to the same constituent elements, and repeated descriptions are omitted. In addition, the drawings are shown schematically for the width, thickness, shape, etc. of each part compared with the actual form in order to make the description clearer, but they are always an example and do not limit the interpretation of the present invention.

在實施形態之半導體製造裝置中，係將測定機器組入與一般的頂出治具相同形狀之圓頂內而構成測定治具，並自動地更換一般的頂出治具與測定治具。使用圖1～圖5，說明關於實施形態之半導體製造裝置。In the semiconductor manufacturing apparatus of the embodiment, the measuring device is assembled into a dome of the same shape as the general ejector jig to form a measurement jig, and the general ejection jig and the measurement jig are automatically replaced. 1 to 5, the semiconductor manufacturing apparatus of the embodiment will be described.

圖1，係說明關於更換實施形態之頂出治具及測定治具的概念圖。圖2，係說明關於更換圖1之頂出治具及測定治具的概念上視圖。 頂出治具80，係被安裝於頂出單元13之前端的殼體131，其是被使用於頂出單元13上升而將切割帶上之晶粒上推，從切割帶剝離晶粒的一般頂出治具。在頂出治具80之內部，係設置有將晶粒之中央頂出的塊體等。Figure 1 is a conceptual diagram illustrating the replacement of the ejector jig and the measuring jig of the embodiment. Fig. 2 is a conceptual top view explaining the replacement of the ejector jig and the measuring jig of Fig. 1; The ejector fixture 80 is installed on the housing 131 at the front end of the ejector unit 13, which is used to lift the ejector unit 13 to push up the die on the dicing tape, and peel the die from the dicing tape. Out of the fixture. Inside the ejection jig 80, a block for ejecting the center of the crystal grain, etc. is provided.

測定治具80A，係被安裝於頂出單元13之前端的殼體131，且被使用於確認拾取性。在測定治具80A之內部，係設置有荷重元等。The measuring jig 80A is attached to the housing 131 at the front end of the ejection unit 13, and is used to confirm the pick-up. Inside the measuring jig 80A, a load cell is installed.

測定治具80B，係被安裝於頂出單元13之前端的殼體131，且使用於確認拾取性及筒夾的裝設狀態。在測定治具80B之內部，係設置有攝影機等的攝像裝置。The measuring jig 80B is installed in the housing 131 at the front end of the ejection unit 13 and used to confirm the pick-up property and the installation state of the collet. Inside the measuring jig 80B, an imaging device such as a camera is installed.

測定治具80C，係被安裝於頂出單元13之前端的殼體131，且使用於確認筒夾的偏斜。在測定治具80C之內部，係設置有變位計等。The measuring jig 80C is installed on the housing 131 at the front end of the ejection unit 13 and used to confirm the deflection of the collet. Inside the measuring jig 80C, a displacement gauge is installed.

如圖2所示般，頂出治具80及測定治具80A～80C，係被保持於治具存放器95，且治具存放器95會旋轉，未圖示之更換臂將頂出治具80或測定治具80A～80C抓住，在治具存放器95與頂出單元13之間移動而自動地更換。As shown in Figure 2, the ejector jig 80 and the measuring jig 80A to 80C are held in the jig storage 95, and the jig storage 95 will rotate, and the replacement arm not shown will eject the jig 80 or measuring jigs 80A to 80C are grasped and moved between the jig storage 95 and the ejection unit 13 to be automatically replaced.

其次，使用圖3～圖5，說明關於測定治具的構造及動作。圖3，係說明圖1之測定治具80A的圖；圖3(A)，係測定治具80A之圓頂部的剖面圖；圖3(B)，係測定時的剖面圖。圖4，係說明圖1之測定治具80B的圖；圖4(A)，係測定治具80B之圓頂部的剖面圖；圖4(B)，係以頂出治具進行頂出時的剖面圖；圖4(C)，係藉由測定治具80B進行測定時的剖面圖；圖4(D)，係拍攝筒夾之吸附面時的剖面圖。圖5，係說明圖1之測定治具80C的圖；圖5(A)，係測定治具80C之圓頂部的剖面圖；圖5(B)，係藉由測定治具80C進行測定時的剖面圖。Next, the structure and operation of the measuring jig will be explained using FIGS. 3 to 5. Fig. 3 is a diagram illustrating the measuring jig 80A of Fig. 1; Fig. 3(A) is a cross-sectional view of the dome of the measuring jig 80A; Fig. 3(B) is a cross-sectional view of the measuring jig 80A. Fig. 4 is a diagram illustrating the measuring jig 80B of Fig. 1; Fig. 4(A) is a cross-sectional view of the dome of the measuring jig 80B; Fig. 4(B) is a diagram of the ejection jig for ejection Cross-sectional view; Figure 4(C) is a cross-sectional view when measuring with the measuring jig 80B; Figure 4(D) is a cross-sectional view when the suction surface of the collet is photographed. Fig. 5 is a diagram illustrating the measuring jig 80C of Fig. 1; Fig. 5(A) is a cross-sectional view of the dome of the measuring jig 80C; Fig. 5(B) is the measurement when the measuring jig 80C is used for measurement Sectional view.

測定治具80A之圓頂81A的外形及大小，係與頂出治具80的圓頂相同，或為可藉由更換臂進行處理並裝設的大小。測定治具80B之圓頂81B的大小，係與頂出治具80的圓頂相同，或為可藉由更換臂進行處理並裝設的大小，圓頂81B的外形，係除了上面以外，其餘與頂出治具80的圓頂相同，或為可藉由更換臂進行處理並裝設者。測定治具80C之圓頂81C的大小，係與頂出治具80的圓頂相同，或為可藉由更換臂進行處理並裝設的大小，圓頂81C的外形，係與頂出治具80的圓頂相同，或為可藉由更換臂進行處理者。The shape and size of the dome 81A of the measuring jig 80A are the same as the dome of the ejection jig 80, or a size that can be handled and installed by replacing the arm. Measure the size of the dome 81B of the jig 80B, which is the same as the dome of the ejection jig 80, or a size that can be handled and installed by replacing the arm. The shape of the dome 81B is except for the top. It is the same as the dome of the ejector fixture 80, or can be handled and installed by replacing the arm. The size of the dome 81C of the measuring jig 80C is the same as the dome of the ejection jig 80, or a size that can be handled and installed by replacing the arm. The shape of the dome 81C is the same as the ejection jig The dome of 80 is the same, or it can be handled by replacing the arm.

如圖3(A)所示般，在圓頂81A之中心部，係組入有將切割帶16頂出至上方的1個塊體84A。塊體84A，係經由荷重元85A被連結於基塊86A，且與頂出軸桿88A連動地進行上下動作，該頂出軸桿88A，係藉由未圖示的驅動機構來進行上下動作。另外，在基塊86A與基底部89A之間設置有壓縮線圈彈簧87A。荷重元85A所需之配線，係沿著基塊86A及軸桿88A或在其內部予以配置，並藉由後述之配接器內的發送機進行無線傳輸或以有線連接與被設置於頂出單元13之本體的接收機或配線連接。As shown in FIG. 3(A), at the center of the dome 81A, a block 84A that pushes the cutting tape 16 upward is incorporated. The block 84A is connected to the base block 86A via the load cell 85A, and moves up and down in conjunction with the ejection shaft 88A. The ejection shaft 88A is moved up and down by a driving mechanism not shown. In addition, a compression coil spring 87A is provided between the base block 86A and the base portion 89A. The wiring required for the load cell 85A is arranged along the base block 86A and the shaft 88A or inside it, and is wirelessly transmitted by the transmitter in the adapter described later, or is connected to the ejector by wired connection The receiver or wiring connection of the main body of the unit 13.

如圖3(B)所示般，使測定治具80A上升且使其上面與切割帶16之背面接觸，在停止測定治具80A的上升後，驅動頂出軸桿88A往上而將塊體84A頂出，並將從切割帶16剝離晶粒D的力測定為荷重元85A的壓縮力。As shown in Fig. 3(B), the measuring jig 80A is raised and its upper surface is in contact with the back of the cutting tape 16. After stopping the raising of the measuring jig 80A, the ejector shaft 88A is driven upward to push the block 84A was ejected, and the force of peeling the die D from the dicing tape 16 was measured as the compressive force of the load cell 85A.

如圖4(A)所示般，在圓頂81B之中心部，係組入了具有透鏡及圖像感測器的攝影機(攝像裝置)85B，圓頂81B之上面，係形成與攝影機85B之寬度相等的開口。攝影機85B所需之配線，係延伸至後述的配接器，並藉由配接器內的發送機進行無線傳輸或以有線連接與被設置於頂出單元13之本體的接收機或配線連接。As shown in Figure 4(A), at the center of the dome 81B, a camera (imaging device) 85B with a lens and an image sensor is incorporated. The top of the dome 81B is formed with the camera 85B. Openings of equal width. The wiring required for the camera 85B is extended to the adapter described later, and is connected to a receiver or wiring installed in the main body of the ejector unit 13 through a transmitter in the adapter for wireless transmission or wired connection.

如圖4(B)所示般，使頂出治具80上升且使其上面與切割帶16之背面接觸，在停止測定治具80的上升後，驅動頂出軸桿88往上而將塊體84頂出。在降低塊體84後，將頂出治具80更換成測定治具80B。在測定治具80B，係安裝有攝影機85B，如圖4(C)所示般，穿透切割帶16從下面拍攝以頂出治具80所剝離的晶粒剝離狀態。As shown in Fig. 4(B), the ejector jig 80 is raised and its upper surface is in contact with the back surface of the cutting tape 16, and after the rise of the measuring jig 80 is stopped, the ejector shaft 88 is driven to move upward to move the block The body 84 is ejected. After lowering the block 84, the ejection jig 80 is replaced with a measuring jig 80B. The measuring jig 80B is equipped with a camera 85B. As shown in FIG. 4(C), the dicing tape 16 penetrates the dicing tape 16 and photographs the peeling state of the crystal grains peeled from the jig 80 from below.

又，如圖4(D)所示般，測定治具80B，係從下方直接拍攝筒夾22的晶粒吸附面。藉此，可確認更換後之筒夾的裝設狀態確認或使用中之筒夾的磨損或異物附著。Furthermore, as shown in FIG. 4(D), the measuring jig 80B is to directly photograph the crystal grain adsorption surface of the collet 22 from below. With this, it is possible to confirm the installation state of the replaced collet or the wear or foreign matter adhesion of the collet in use.

如圖5(A)所示般，測定治具80C，係被配置為複數個探針84C從圓頂表面突出，圓頂81B之上面，係在探針84C的位置具有開口。另外，探針84C本身，係具有回彈機構。在探針84C之根部，係存在有變位計85C，探針84C之壓入量，係可測定。變位計85C所需之配線，係延伸至後述的配接器，並藉由配接器內的發送機進行無線傳輸或以有線連接與被設置於頂出單元13之本體的接收機或配線連接。As shown in FIG. 5(A), the measuring jig 80C is arranged such that a plurality of probes 84C protrude from the surface of the dome, and the upper surface of the dome 81B has an opening at the position of the probe 84C. In addition, the probe 84C itself has a rebound mechanism. At the root of the probe 84C, there is a displacement gauge 85C, and the pressure of the probe 84C can be measured. The wiring required for the displacement gauge 85C is extended to the adapter described later, and is wirelessly transmitted by the transmitter in the adapter or connected by wire to the receiver or wiring installed in the main body of the ejector unit 13 connection.

如圖5(B)所示般，將筒夾22從上方按壓至測定治具80C，藉此，從探針84C之壓入量的不同，測定筒夾22對圓頂81C的偏斜狀態。As shown in FIG. 5(B), the collet 22 is pressed from above to the measuring jig 80C, thereby measuring the deflection state of the collet 22 with respect to the dome 81C from the difference in the pressing amount of the probe 84C.

根據實施形態，在裝置內設置組入有測定器的測定治具，藉此，無需長時間停止生產而可自動地進行計測。又，可容易進行生產開始前之偏斜調節或拾取條件的設定，並使其短時間化。又，在生產中，於線內測定生產中之晶圓特性的變化或筒夾偏斜的偏差，並進行再校正，藉此，可減少對生產的影響。又，若頂出治具、筒夾、晶圓之條件改變，雖會造成拾取失誤或裂縫等的問題，但由於可事先(自動地)進行檢查，因此，可防範問題於未然。 [實施例]According to the embodiment, a measurement jig incorporating a measuring device is installed in the device, thereby enabling automatic measurement without stopping production for a long time. In addition, the skew adjustment or picking condition setting before the start of production can be easily performed, and the time can be shortened. In addition, during production, the variation of wafer characteristics or the deviation of collet skew during production is measured in-line and recalibrated, thereby reducing the impact on production. In addition, if the conditions of ejecting jigs, collets, and wafers are changed, problems such as picking errors or cracks may be caused, but since inspections can be performed (automatically) in advance, problems can be prevented before they occur. [Example]

圖6，係表示實施例之晶粒接合器之概略的上視圖。圖7，係說明在圖6中從箭頭A方向觀看時，拾取頭、接合頭之動作的圖。Fig. 6 is a schematic top view showing the die bonder of the embodiment. Fig. 7 is a diagram illustrating the actions of the pickup head and the bonding head when viewed from the direction of arrow A in Fig. 6.

晶粒接合器10，係一般具有：晶粒供給部1，其供給安裝至基板S的晶粒D，該基板S，係印刷了1個或複數個成為最終1封裝的製品區域(以下，稱為封裝區域P。)；拾取部2、中間平台部3；接合部4；搬送部5、基板供給部6K；基板搬出部6H；及控制部7，監視各部之動作並進行控制。Y軸方向為晶粒接合器10的前後方向，X軸方向為左右方向。晶粒供給部1被配置於晶粒接合器10的前側，接合部4被配置於後側。The die bonder 10 generally has: a die supply unit 1 which supplies die D mounted on a substrate S, and the substrate S is printed with one or more product areas (hereinafter referred to as the final package) It is the packaging area P.); the pickup part 2, the intermediate platform part 3; the joining part 4; the conveying part 5, the substrate supply part 6K; the substrate unloading part 6H; and the control part 7, which monitors and controls the actions of each part. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply part 1 is arranged on the front side of the die bonder 10, and the bonding part 4 is arranged on the rear side.

首先，晶粒供給部1，係供給安裝至基板S之封裝區域P的晶粒D。晶粒供給部1，係具有：保持晶圓11的晶圓台12；及將晶粒D從晶圓11頂出之以點線所示的頂出單元13。晶粒供給部1，係藉由未圖示之驅動裝置，沿XY方向移動，並使拾取之晶粒D移動至頂出單元13的位置。First, the die supply unit 1 supplies the die D mounted on the package area P of the substrate S. The die supply unit 1 has: a wafer stage 12 that holds the wafer 11; and an ejection unit 13 that ejects the die D from the wafer 11 as shown by dotted lines. The die supply unit 1 is moved in the XY direction by a driving device not shown, and the picked die D is moved to the position of the ejection unit 13.

拾取部2，係具有：拾取頭21，拾取晶粒D；拾取頭之Y驅動部23，使拾取頭21沿Y方向移動；及未圖示之各驅動部，使筒夾22升降、旋轉及沿X方向移動。拾取頭21，係具有筒夾22(圖7亦參閱)，並從晶粒供給部1拾取晶粒D且載置於中間平台31，該筒夾22，係將所頂出的晶粒D吸附保持於前端。拾取頭21，係具有：未圖示之各驅動部，使筒夾22升降、旋轉及沿X方向移動。The pickup part 2 has: a pickup head 21 to pick up the die D; a Y drive part 23 of the pickup head to move the pickup head 21 in the Y direction; and various drive parts not shown in the figure to move the collet 22 up and down, rotate and Move in the X direction. The pickup head 21 has a collet 22 (see also FIG. 7), and picks up the die D from the die supply part 1 and places it on the intermediate platform 31. The collet 22 adsorbs the ejected die D Keep it at the front end. The pick-up head 21 is provided with various driving parts not shown in the figure, which lifts, rotates, and moves the collet 22 in the X direction.

中間平台部3，係具有：中間平台31，暫時地載置晶粒D；及平台辨識攝影機32，用以識別中間平台31上的晶粒D。The intermediate platform portion 3 has: an intermediate platform 31 for temporarily placing the die D; and a platform identification camera 32 for identifying the die D on the intermediate platform 31.

接合部4，係從中間平台31拾取晶粒D，接合於被搬送至接合平台BS上之基板S的封裝區域P上，或以層積於已被接合於基板S的封裝區域P上之晶粒上的形式進行接合。接合部4，係具有：接合頭41，具備有與拾取頭21相同地將晶粒D吸附保持於前端的筒夾42(圖7亦參閱)；Y驅動部43，使接合頭41沿Y方向移動；及基板辨識攝影機44，拍攝基板S之封裝區域P的位置辨識標記(未圖示)，並識別接合位置。 藉由像這樣的構成，接合頭41，係根據平台辨識攝影機32之攝像資料，修正拾取位置・姿勢，並從中間平台31拾取晶粒D，根據基板辨識攝影機44之攝像資料，將晶粒D接合於基板S。The bonding part 4 picks up the die D from the intermediate platform 31 and bonds it on the package area P of the substrate S that is transported to the bonding platform BS, or is laminated on the package area P of the substrate S that has been bonded Join in the form of particles. The bonding part 4 has: a bonding head 41 equipped with a collet 42 (see also FIG. 7) for sucking and holding the die D at the front end in the same manner as the picking head 21; and a Y driving part 43 that makes the bonding head 41 move in the Y direction Move; and the substrate recognition camera 44, photographs the position recognition mark (not shown) of the package area P of the substrate S, and recognizes the bonding position. With such a configuration, the bonding head 41 is based on the platform to recognize the imaging data of the camera 32, correct the pickup position and posture, and pick up the die D from the intermediate platform 31. According to the substrate recognition camera 44, the die D Bonded to the substrate S.

搬送部5，係具有：抓住基板S而搬送的基板搬送爪51；及基板S進行移動的搬送道52。基板S，係藉由「以沿著搬送道52所設置之未圖示的滾珠螺桿來驅動被設置於搬送道52之基板搬送爪51之未圖示的螺帽」之方式，沿X方向移動。 藉由像這樣的構成，基板S，係從基板供給部6K沿著搬送道52移動至接合位置，接合後，移動至基板搬出部6H，將基板S收授至基板搬出部6H。The conveying unit 5 has: a substrate conveying claw 51 that grips and conveys the substrate S; and a conveyance path 52 that moves the substrate S. The substrate S is moved in the X direction by "a ball screw (not shown) provided along the transport path 52 drives the nut (not shown) of the substrate transport claw 51 provided on the transport path 52") . With such a configuration, the substrate S is moved from the substrate supply part 6K to the bonding position along the conveyance path 52, and after bonding, it moves to the substrate carrying-out part 6H, and the substrate S is transferred to the substrate carrying-out part 6H.

控制部7，係具備有：記憶體，儲存有程式(軟體)，該程式，係監視晶粒接合器10之各部的動作並進行控制；及中央處理裝置(CPU)，執行被儲存於記憶體的程式。The control part 7 is provided with: a memory, which stores a program (software), which monitors and controls the actions of each part of the die bonder 10; and a central processing unit (CPU), whose execution is stored in the memory Program.

晶粒接合器10，係具有：晶圓辨識攝影機24，辨識晶圓11上之晶粒D的姿勢；平台辨識攝影機32，辨識被載置於中間平台31之晶粒D的姿勢；及基板辨識攝影機44，辨識接合平台BS上的安裝位置。必須修正辨識攝影機間的姿勢偏移，係參與接合頭41之拾取的平台辨識攝影機32及參與接合頭41之朝安裝位置之接合的基板辨識攝影機44。The die bonder 10 has: a wafer recognition camera 24 to recognize the posture of the die D on the wafer 11; a platform recognition camera 32 to recognize the posture of the die D placed on the intermediate platform 31; and substrate recognition The camera 44 recognizes the installation position on the bonding platform BS. The posture deviation between the recognition cameras must be corrected. The platform recognition camera 32 that participates in the pickup of the bonding head 41 and the substrate recognition camera 44 that participates in the bonding of the bonding head 41 toward the mounting position must be corrected.

其次，使用圖8、9，說明晶圓台12的構成。圖8，係表示圖6之晶圓台之外觀立體圖的圖。圖9，係表示圖8之晶圓台之主要部分的概略剖面圖。Next, the structure of the wafer stage 12 will be described using FIGS. 8 and 9. FIG. 8 is a diagram showing a perspective view of the appearance of the wafer stage of FIG. 6. FIG. 9 is a schematic cross-sectional view showing the main part of the wafer stage of FIG. 8.

在圖8、9中，晶圓台12，係具有：擴展環15，保持晶圓環14；支撐環17(圖8所示)，被保持於晶圓環14，將接著有複數個晶粒D的切割帶16水平定位；及頂出單元13(圖9所示)，被配置於支撐環17之內側，用以將晶粒D頂出至上方。In Figures 8 and 9, the wafer stage 12 has: an expansion ring 15 to hold the wafer ring 14; a support ring 17 (shown in Figure 8), which is held on the wafer ring 14, and there will be a plurality of die The cutting belt 16 of D is positioned horizontally; and the ejection unit 13 (shown in FIG. 9) is arranged on the inner side of the support ring 17 to eject the die D to the top.

詳細內容係如後述，頂出單元13，係由頂出單元本體(未圖示)、殼體131及頂出治具所構成，可藉由未圖示的驅動機構，沿上下方向移動，晶圓台12可沿水平方向移動。The details are described later. The ejector unit 13 is composed of an ejector unit body (not shown), a housing 131, and an ejector jig. It can be moved in the vertical direction by a drive mechanism not shown in the figure. The round table 12 can move in the horizontal direction.

晶圓台12，係被搭載於X基座19上，藉由該X基座19，晶圓台12可沿X軸方向移動。在X基座19之下方，係安裝有Y基座20，藉由該Y基座20，使晶圓台12與X基座19一起沿Y軸方向移動。The wafer stage 12 is mounted on an X base 19, and the X base 19 allows the wafer stage 12 to move in the X-axis direction. Below the X base 19, a Y base 20 is installed, and the Y base 20 moves the wafer stage 12 together with the X base 19 in the Y-axis direction.

晶圓台12，係在晶粒D的頂出時，使保持晶圓環14的擴展環15下降。其結果，保持於晶圓環14之切割帶16會被拉伸，晶粒D的間隔變寛，藉由頂出單元13，從晶粒D之下方頂出晶粒D，使晶粒D的拾取性提升。The wafer stage 12 lowers the expansion ring 15 holding the wafer ring 14 when the die D is ejected. As a result, the dicing tape 16 held in the wafer ring 14 will be stretched, and the spacing of the die D will become wider. The ejection unit 13 ejects the die D from below the die D, making the die D Pickup improved.

另外，將被稱為晶粒貼覆膜18之薄膜狀的接著材料貼附於晶圓11與切割帶16之間。在具有晶粒貼覆膜18的晶圓中，切割，係對晶圓11與晶粒貼覆膜18進行。因此，在剝離工程中，係將晶圓11與晶粒貼覆膜18從切割帶16剝離。In addition, a film-like adhesive material called die attach film 18 is attached between wafer 11 and dicing tape 16. In the wafer having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

圖10，係表示從圖8之晶圓台拆卸了晶圓保持器之狀態的上視圖。 在圖10中，在Y基座20，係安裝有頂出單元13。在該頂出單元13附近，在X基座19，係安裝有更換臂94。該更換臂94，係抓住頂出治具80等者。在Y基座20，係安裝有治具存放器95，在治具存放器95，係設置有頂出治具80及實施形態的測定治具80A，80B，80C。在圖10中，係表示更換臂94抓住了被設置於治具存放器95之頂出治具80的狀態。Fig. 10 is a top view showing a state in which the wafer holder is removed from the wafer stage of Fig. 8; In FIG. 10, the ejector unit 13 is installed on the Y base 20. In the vicinity of the ejection unit 13, a replacement arm 94 is attached to the X base 19. The replacement arm 94 is used to grasp the ejector fixture 80 and the like. The Y base 20 is equipped with a jig storage 95, and the jig storage 95 is provided with an ejection jig 80 and measurement jigs 80A, 80B, and 80C of the embodiment. In FIG. 10, it shows the state where the exchange arm 94 grasped the ejection jig 80 provided in the jig storage 95. As shown in FIG.

根據本實施例，治具存放器95可旋轉，使所需之頂出治具80等移動至更換臂94易抓住的位置。更換臂94，係藉由X基座19，使目的之頂出治具80等移動至頂出單元13之正上方。According to this embodiment, the jig storage 95 is rotatable, so that the required ejection jig 80 can be moved to a position where the replacement arm 94 can be easily grasped. The replacement arm 94 is used by the X base 19 to move the intended ejection jig 80 and the like to just above the ejection unit 13.

殼體131相對於「頂出治具80等已被卸下且在變成了僅為殼體131之頂出單元13的正上方停止」的頂出治具80等上升而合為一體。另外，殼體131之詳細內容，係如後述。The casing 131 rises and integrates with the ejection jig 80 etc. that "the ejection jig 80 and the like have been removed and stop just above the ejection unit 13 of the casing 131". In addition, the details of the housing 131 are as described later.

圖11，係圖9之頂出治具的立體圖；圖11(A)，係表示頂出治具之圓頂的部分，圖11(B)，表示配接器的部分。圖11(C)，係圖11(A)之圓頂與圖11(B)之配接器合為一體之狀態的立體圖。圖12，係圖11(C)的剖面圖。在圖12中，雖然在圓頂上面，係形成有開口及吸引口等，在開口，係配置有頂出塊等，但將其省略。又，在圖12中，在圓頂內，雖係設置有頂出塊等，但將其省略。Fig. 11 is a perspective view of the ejector jig of Fig. 9; Fig. 11(A) shows the part of the dome of the ejector jig, and Fig. 11(B) shows the part of the adapter. Fig. 11(C) is a perspective view of the state where the dome of Fig. 11(A) and the adapter of Fig. 11(B) are integrated. Fig. 12 is a cross-sectional view of Fig. 11(C). In FIG. 12, although an opening, a suction port, etc. are formed on the upper surface of the dome, and an ejector block, etc. are arranged in the opening, these are omitted. In addition, in FIG. 12, although ejector blocks and the like are provided in the dome, they are omitted.

在圖11(A)中，在圓頂81之內部，係收納有頂出塊等。螺帽93，係在連結配接器91與圓頂81之際使用。In Fig. 11(A), inside the dome 81, ejector blocks and the like are housed. The nut 93 is used when connecting the adapter 91 and the dome 81.

在圖11(B)中，在配接器91，係安裝有3根對準銷92。該對準銷92，係在搬送頂出治具80之際使用者。由於對準銷92，係如圖8所示般，相對於整齊排列之晶粒D的朝向而決定頂出塊之朝向，因此，其為用以在更換臂94抓住了頂出治具80之際，使頂出治具80之朝向不產生偏差者。在配接器91之上部，係頂出軸桿88露出。In Fig. 11(B), the adapter 91 is equipped with three alignment pins 92. The alignment pin 92 is used by the user when transporting the ejection jig 80. Since the alignment pin 92 determines the orientation of the ejector block relative to the orientation of the die D arranged neatly as shown in FIG. 8, it is used to hold the ejector jig 80 in the replacement arm 94 At this time, the direction of the ejector jig 80 is not deviated. On the upper part of the adapter 91, the ejector shaft 88 is exposed.

在圖11(C)、12中，在圓頂81之下方，係連結有配接器91，並成為與後述之殼體連結的部分。該配接器91與圓頂81，係藉由螺帽93來連結。該配接器91與圓頂81被連結的狀態會成為頂出治具80。像這樣的頂出治具80等被設置於圖10所示的治具存放器95。In FIGS. 11(C) and 12, below the dome 81, an adapter 91 is connected, and it becomes a part connected with the housing mentioned later. The adapter 91 and the dome 81 are connected by a nut 93. The state where the adapter 91 and the dome 81 are connected becomes the ejection jig 80. Such an ejection jig 80 and the like are installed in the jig storage 95 shown in FIG. 10.

圖13，係圖9之殼體的立體圖。圖14，係表示圖11之配接器與圖13之殼體合為一體之狀態的剖面圖。圖15，係表示圖11之頂出治具與圖13之殼體合為一體之狀態的立體圖。在圖14中，省略配接器91內的構成。Figure 13 is a perspective view of the housing of Figure 9. Fig. 14 is a cross-sectional view showing a state where the adapter of Fig. 11 and the housing of Fig. 13 are integrated. Fig. 15 is a perspective view showing a state where the ejector jig of Fig. 11 and the housing of Fig. 13 are integrated. In FIG. 14, the configuration in the adapter 91 is omitted.

在圖13中，頂出單元13之殼體131，係被安裝於頂出單元本體(未圖示)，且為了***圖11中所說明的配接器91，而成為碗狀的容器。如圖13、14所示般，在該殼體131之外周，係更設置有環形件131a，該環形件131a，係在內側設置有用以將配接器91卡止的球狀突起131c。球狀突起131c，係貫通被設置於殼體131的貫通孔131b，並可進入複數個被設置於配接器91之外周的凹部91a。環形件131a，係被彈簧131d所支撐，直至球狀突起131c進入殼體131的貫通孔131b與配接器91的凹部91a為止，位置可靈活地變動。In FIG. 13, the housing 131 of the ejector unit 13 is installed in the ejector unit body (not shown), and is formed into a bowl-shaped container for inserting the adapter 91 described in FIG. 11. As shown in FIGS. 13 and 14, a ring 131 a is further provided on the outer periphery of the housing 131, and the ring 131 a is provided with a spherical protrusion 131 c for locking the adapter 91 on the inner side. The spherical protrusion 131c penetrates through the through hole 131b provided in the housing 131 and can enter a plurality of recesses 91a provided on the outer periphery of the adapter 91. The ring 131a is supported by the spring 131d until the spherical protrusion 131c enters the through hole 131b of the housing 131 and the recess 91a of the adapter 91, and the position can be flexibly changed.

亦即，根據本實施例，如圖14所示般，當配接器91被***至殼體131之內部時，則配接器91之側壁會壓開環形件131a的球狀突起131c。而且，當壓入配接器91時，則球狀突起131c會進入配接器91的凹部91a而被鎖固。That is, according to this embodiment, as shown in FIG. 14, when the adapter 91 is inserted into the housing 131, the side wall of the adapter 91 will press the spherical protrusion 131c of the ring 131a. Moreover, when the adapter 91 is pressed in, the spherical protrusion 131c enters the recess 91a of the adapter 91 and is locked.

說明配接器91與殼體131之對接動作，由於圓頂81內的真空埠(未圖示)被堵塞，因此，真空壓力會上升，配接器91被吸入至殼體131內而進行對接。另一方面，配接器91之拆卸，係當真空埠被堵塞時，殼體131內會被加壓，藉此，配接器91從殼體131內彈出。Explain the docking operation between the adapter 91 and the housing 131. Since the vacuum port (not shown) in the dome 81 is blocked, the vacuum pressure will rise, and the adapter 91 will be sucked into the housing 131 for docking. . On the other hand, the disassembly of the adapter 91 is that when the vacuum port is blocked, the inside of the housing 131 will be pressurized, whereby the adapter 91 is ejected from the housing 131.

如此一來，根據本實施例，配接器91與殼體131，係可確實被鎖固而維持密接性者。其結果，如圖15所示般，經由配接器91，頂出治具80之圓頂81與殼體131合為一體。In this way, according to this embodiment, the adapter 91 and the housing 131 can be securely locked to maintain tightness. As a result, as shown in FIG. 15, the dome 81 of the ejection jig 80 and the housing 131 are integrated via the adapter 91.

圖16，係表示圖10之更換臂的立體圖。 在圖16中，在更換臂94，係缺口部94a被設置於與對準銷92相對向的位置，該對準銷92，係被安裝於頂出治具80。對準銷92，係被設置為定位用，以便在更換臂94為了從横方向抓住而移動時，使頂出治具80之朝向不產生變化。Fig. 16 is a perspective view showing the replacement arm of Fig. 10; In FIG. 16, in the replacement arm 94, the notch portion 94 a is provided at a position opposite to the alignment pin 92, and the alignment pin 92 is attached to the ejector jig 80. The alignment pin 92 is provided for positioning, so that when the replacement arm 94 is moved in order to be grasped from the horizontal direction, the direction of the ejection jig 80 does not change.

另外，以使對準銷92確實地進入缺口部94a內的方式，藉由彈簧(未圖示)支撐對準銷92，且即便倒下，亦只要在缺口部94a內返回到原始位置即可。In addition, the alignment pin 92 is supported by a spring (not shown) so that the alignment pin 92 can surely enter the notch 94a, and even if it falls, it only needs to return to the original position in the notch 94a. .

另外，由於可更換為測定治具80A，80B，80C以代替頂出治具，因此，至少「測定治具80A，80B，80C之配接器與殼體131連結的部分及與更換臂94連結的部分」之形狀、構造、大小，係與配接器91相同。測定治具80A，80B，80C之配接器整體的形狀、構造、大小，係亦可與配接器91相同。測定治具80A，80B，80C之圓頂81A，81B，81C與測定治具80A，80B，80C之配接器連結的部分之形狀、構造、大小，係與頂出治具80相同為較佳。In addition, since the measuring jigs 80A, 80B, 80C can be replaced with the ejector jigs, at least the part where the adapter of the measuring jigs 80A, 80B, 80C is connected to the housing 131 and the replacement arm 94 The shape, structure and size of the "part" are the same as those of the adapter 91. The overall shape, structure, and size of the adapters of the measuring fixtures 80A, 80B, and 80C can also be the same as the adapter 91. The shape, structure and size of the dome 81A, 81B, 81C of the measuring jig 80A, 80B, 80C and the adapter of the measuring jig 80A, 80B, 80C are the same as the ejection jig 80. .

其次，使用圖17，說明關於頂出治具的構造。圖17，係表示圖10之頂出治具之圓頂部的剖面圖。Next, the structure of the ejector jig will be explained using FIG. 17. Fig. 17 is a cross-sectional view showing the dome of the ejector fixture of Fig. 10;

在頂出治具80之圓頂81之上面的周邊部，係設置有複數個吸引口82及被形成為同心圓狀的複數個溝83。吸引口82及溝83之各自的內部，係在使頂出治具80上升且使其上面與切割帶16的背面接觸之際，藉由未圖示的吸引機構而減壓，讓切割帶16之背面密接於圓頂81的上面。A plurality of suction ports 82 and a plurality of grooves 83 formed in a concentric circle shape are provided on the peripheral portion of the upper surface of the dome 81 of the ejection jig 80. When the inside of the suction port 82 and the groove 83 are lifted up and the upper surface of the ejector jig 80 is brought into contact with the back of the cutting tape 16, the pressure is reduced by a suction mechanism not shown, so that the cutting tape 16 The back is closely attached to the top of the dome 81.

在圓頂81之中心部，係組入有將切割帶16頂出至上方的3個塊體84～86。3個塊體84～86，係在尺寸最大之外側塊體84的內側配置有尺寸比其更小的中間塊體85，而且，在其內側配置有尺寸最小之內側塊體86。In the center of the dome 81, three blocks 84 to 86 are assembled to push the cutting tape 16 upwards. The three blocks 84 to 86 are arranged on the inner side of the largest outer block 84 An intermediate block 85 having a smaller size than this, and an inner block 86 with the smallest size is arranged on the inside thereof.

在圓頂81之上面的周邊部與外側的塊體84之間及3個塊體84～86，係設置有間隙。該些間隙之內部，係藉由未圖示的吸引機構而減壓，當切割帶16之背面接觸於圓頂81的上面時，則切割帶16被吸引至下方，並密接於塊體84～86的上面。A gap is provided between the peripheral portion of the upper surface of the dome 81 and the outer block 84 and the three blocks 84 to 86. The inside of these gaps is decompressed by a suction mechanism not shown. When the back surface of the cutting tape 16 contacts the upper surface of the dome 81, the cutting tape 16 is attracted to the bottom, and is closely attached to the blocks 84~ 86 above.

3個塊體84～86，係介設於第1壓縮線圈彈簧87a、中間塊體85與內側塊體86之間，並被連結於彈簧常數比第1壓縮線圈彈簧87a大的第2壓縮線圈彈簧87b及內側塊體86，且與頂出軸桿88連動地進行上下動作，該第1壓縮線圈彈簧87a，係介設於外側塊體84與中間塊體85之間，該頂出軸桿88，係藉由未圖示的驅動機構來進行上下動作。The three blocks 84 to 86 are interposed between the first compression coil spring 87a, the intermediate block 85 and the inner block 86, and are connected to the second compression coil having a spring constant greater than the first compression coil spring 87a The spring 87b and the inner block 86 move up and down in conjunction with the ejection shaft 88. The first compression coil spring 87a is interposed between the outer block 84 and the intermediate block 85. The ejection shaft 88. The up and down movement is performed by a drive mechanism not shown.

在將發送機收納於測定治具80A，80B，80C之配接器內的情況下，係例如使用電池驅動的無線微電腦模組(商品名：TWELITE(Mono Wireless股份有限公司))等。又，在連接測定治具80A，80B，80C之配線與殼體131之配線的情況下，係例如經由頂出軸桿88來進行。When the transmitter is housed in the adapter of the measuring jigs 80A, 80B, and 80C, for example, a battery-driven wireless microcomputer module (trade name: TWELITE (Mono Wireless Co., Ltd.)) is used. In addition, when connecting the wiring of the measuring jigs 80A, 80B, and 80C and the wiring of the housing 131, it is performed, for example, via the ejector shaft 88.

其次，使用圖18，說明關於使用了實施例的晶粒接合器之半導體裝置之製造方法。圖18，係表示使用了圖6的晶粒接合器之半導體裝置之製造方法的流程圖。Next, referring to FIG. 18, a method of manufacturing a semiconductor device using the die bonder of the embodiment will be described. FIG. 18 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 6.

首先，在生產開始前，藉由測定治具80A來測定從切割帶剝離晶粒的力，或藉由測定治具80B來測定晶粒的剝離狀態，以設定拾取條件。又，藉由測定治具80C來測定筒夾的偏斜並進行調整。First, before the start of production, the force to peel the die from the dicing tape is measured by measuring the jig 80A, or the peeling state of the die is measured by the measuring jig 80B to set the picking conditions. In addition, the deflection of the collet was measured and adjusted by measuring jig 80C.

步驟S11：將保持了切割帶16之晶圓環14儲存於晶圓匣盒(未圖示)，並搬入至晶粒接合器10，該切割帶16，係貼附有從晶圓11所分割的晶粒D。控制部7，係將晶圓環14從填充了晶圓環14之晶圓匣盒供給至晶粒供給部1。又，準備基板S，並搬入至晶粒接合器10。控制部7，係以基板供給部6K，將基板S載置於搬送道52。Step S11: The wafer ring 14 holding the dicing tape 16 is stored in a cassette (not shown) and carried into the die bonder 10. The dicing tape 16 is attached to the wafer 11的晶粒 D. The control unit 7 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. In addition, the substrate S is prepared and carried into the die bonder 10. The control unit 7 is a substrate supply unit 6K, and the substrate S is placed on the conveyance path 52.

步驟S12：控制部7，係從被保持於晶圓環14的切割帶16拾取晶粒D。Step S12: The control unit 7 picks up the die D from the dicing tape 16 held on the wafer ring 14.

步驟S13：控制部7，係將拾取到之晶粒D搭載於基板S的封裝區域P上或層積於已接合的晶粒上。更具體而言，控制部7，係將從切割帶16拾取到之晶粒D載置於中間平台31，以接合頭41從中間平台31再次拾取晶粒D，並接合於所搬送來之基板S的封裝區域P。Step S13: The control unit 7 mounts the picked-up die D on the packaging area P of the substrate S or laminates it on the bonded die. More specifically, the control unit 7 places the die D picked up from the dicing tape 16 on the intermediate platform 31, and the die D is picked up again from the intermediate platform 31 by the bonding head 41 and bonded to the transferred substrate Package area P of S.

步驟S14：控制部7，係以基板搬送爪51將基板S移動至基板搬出部6H，且將基板S交付給基板搬出部6H，並從晶粒接合器10搬出基板S(基板卸載)。Step S14: The control section 7 moves the substrate S to the substrate unloading section 6H by the substrate transfer claw 51, delivers the substrate S to the substrate unloading section 6H, and unloads the substrate S from the die bonder 10 (substrate unloading).

在重複了上述步驟預定次數後或檢測到異常的情況下，藉由測定治具80A來測定從切割帶剝離晶粒的力，或藉由測定治具80B來測定晶粒的剝離狀態，以設定拾取條件。又，藉由測定治具80C來測定筒夾的裝設狀態並進行調整。After repeating the above steps a predetermined number of times or when an abnormality is detected, measure the force to peel the die from the dicing tape by measuring jig 80A, or measure the peeling state of the die by measuring jig 80B to set Pick up conditions. In addition, the installation state of the collet is measured and adjusted by the measuring jig 80C.

以上，雖根據實施形態及實施例，具體地說明了本發明者所研發的發明，但本發明並不限定於上述實施形態及實施例，當然可實施各種變更。As mentioned above, although the invention developed by the present inventors has been specifically explained based on the embodiments and examples, the present invention is not limited to the above-mentioned embodiments and examples, and various modifications can of course be implemented.

例如，在實施例中，雖係說明了關於治具存放器可收納4個治具的例子，但並不限於此，例如亦可為2個以上3個以下，或亦可為4個以上。又，雖說明了關於在治具存放器收納有1個頂出治具的例子，但並不限於此，例如亦可收納2個以上的頂出治具。在該情況下，頂出治具，係對應於不同品種者。For example, in the embodiment, although an example in which four jigs can be accommodated in the jig storage is described, it is not limited to this. For example, there may be two or more and three or less, or four or more. In addition, although the example in which one ejection jig is stored in the jig storage is described, it is not limited to this, and for example, two or more ejection jigs may be stored. In this case, the ejector fixtures correspond to different types.

又，在實施形態中，雖係使用具有透鏡及圖像感測器的攝影機(攝像裝置)或變位計作為測定治具，但例如亦可使用光學方式指紋感測器或靜電電容式指紋感測器等的指紋感測器，檢測接觸到之部分的細微凹凸，並高精度地檢測筒夾裝設狀態或筒夾的形狀(磨損、異物附著)。又，亦可在自動地更換了筒夾之際，將指紋感測器使用於筒夾的品種登錄或確認。又，亦可內建真空感測器，測定筒夾的晶粒吸附壓。In addition, in the embodiment, although a camera (imaging device) or a displacement meter having a lens and an image sensor is used as the measurement jig, for example, an optical fingerprint sensor or an electrostatic capacitive fingerprint sensor may be used. Fingerprint sensors, such as sensors, detect the subtle unevenness of the touched part, and accurately detect the collet installation state or the shape of the collet (wear, foreign matter adhesion). Also, when the collet is automatically replaced, the fingerprint sensor can be used to register or confirm the type of collet. In addition, a built-in vacuum sensor can be used to measure the adsorption pressure of the die of the collet.

又，在實施形態中，雖係說明了關於筒夾裝設狀態等的確認，但亦可根據測定結果，自動地調整筒夾的位置或高度、角度。In addition, in the embodiment, although the confirmation of the mounting state of the collet is explained, the position, height, and angle of the collet may be automatically adjusted based on the measurement result.

又，關於測定治具或感測器之電源供給，亦可使用無限供電方式。In addition, the unlimited power supply method can also be used for the power supply of the measuring jig or sensor.

又，亦可為具備有複數組包含拾取部、對準部與接合部的安裝部及搬送道的晶粒接合器，或亦可為具備有複數組包含拾取部、對準部與接合部的安裝部，搬送道則具備1組。Also, it may be a die bonder equipped with a complex array of mounting parts including a picking part, an alignment part, and a joining part, and a conveying path, or a die bonder having multiple arrays including a picking part, an alignment part, and a joining part. The installation part and the conveying path have 1 set.

又，在實施例中，雖係說明了使用晶粒貼覆膜的例子，但亦可設置將接著劑塗佈於基板的預形成部而不使用晶粒貼覆膜。In addition, in the embodiment, although an example of using a die attach film is described, it is also possible to provide an adhesive applied to a preformed portion of the substrate without using a die attach film.

又，在實施例中，雖係說明了「以拾取頭來從晶粒供給部拾取晶粒且載置於中間平台，並以接合頭來將被載置於中間平台之晶粒接合於基板」的晶粒接合器，但並不限於此，另可應用於從晶粒供給部拾取晶粒的半導體製造裝置。 例如，亦可應用於「無中間平台與拾取頭而以接合頭來將晶粒供給部之晶粒接合於基板」的晶粒接合器。 又，可應用於「無中間平台，從晶粒供給部拾取晶粒，將晶粒拾取頭旋轉至上面而將晶粒收授至接合頭，以接合頭來接合於基板」的倒裝晶片接合器。 又，可應用於「無中間平台與接合頭，從晶粒供給部將由拾取頭拾取到之晶粒載置於托盤等」的晶粒分選機。In addition, in the embodiment, it is explained that "the pick-up head picks up the die from the die supply part and places it on the intermediate platform, and the bonding head is used to bond the die placed on the intermediate platform to the substrate" The die bonder is not limited to this, and can be applied to a semiconductor manufacturing device that picks up die from a die supply part. For example, it can also be applied to a die bonder that uses a bonding head to bond the die of the die supply portion to the substrate without an intermediate platform and a pick-up head. In addition, it can be applied to flip chip bonding with "no intermediate platform, picking up the die from the die supply part, rotating the die picking head to the top to transfer the die to the bonding head, and using the bonding head to bond to the substrate". Device. In addition, it can be applied to a die sorting machine that "does not have an intermediate platform and a bonding head, and places the die picked up by the pickup head on a tray from the die supply part".

10:晶粒接合器 1:晶粒供給部 12:晶圓台 13:頂出單元 131:殼體 14:晶圓環 15:擴展環 16:切割帶 17:支撐環 18:晶粒貼覆膜 19:X基座 20:Y基座 2:拾取部 21:拾取頭 22:筒夾 3:中間平台部 31:中間平台 4:接合部 41:接合頭 42:筒夾 5:搬送部 51:基板搬送爪 7:控制部 80:頂出治具 80A、80B、80C:測定治具 81:圓頂 88:頂出軸桿 91:配接器 92:對準銷 94:更換臂 95:治具存放器 D:晶粒 S:基板 P:封裝區域10: Die Bonder 1: Die supply part 12: Wafer table 13: ejection unit 131: Shell 14: Wafer ring 15: expansion ring 16: cutting tape 17: Support ring 18: Die paste film 19: X base 20: Y base 2: Pickup 21: Pickup head 22: collet 3: Middle platform 31: Intermediate platform 4: Joint 41: Joint head 42: Collet 5: Transport Department 51: substrate transfer claw 7: Control Department 80: ejector fixture 80A, 80B, 80C: measuring fixture 81: dome 88: ejector shaft 91: Adapter 92: alignment pin 94: Replace arm 95: Fixture storage D: grain S: substrate P: Package area

[圖1] 說明關於更換實施形態之頂出治具及測定治具的概念圖。 [圖2] 說明關於更換圖1之頂出治具及測定治具的概念上視圖。 [圖3] 說明圖1之測定治具80A的圖。 [圖4] 說明圖1之測定治具80B的圖。 [圖5] 說明圖1之測定治具80C的圖。 [圖6] 表示實施例之晶粒接合器之概略的上視圖。 [圖7] 說明在圖6中從箭頭A方向觀看時，拾取頭、接合頭之動作的圖。 [圖8] 表示圖6之晶圓台之外觀立體圖的圖。 [圖9] 表示圖6之晶圓台之主要部分的概略剖面圖。 [圖10] 表示從圖8之晶圓台拆卸了晶圓保持器之狀態的上視圖。 [圖11] 圖9之頂出治具的立體圖。 [圖12] 圖11(C)的剖面圖。 [圖13] 圖9之殼體的立體圖。 [圖14] 表示圖11之配接器與圖13之殼體合為一體之狀態的剖面圖。 [圖15] 表示圖11之頂出治具與圖13之殼體合為一體之狀態的立體圖。 [圖16] 表示圖10之更換臂的立體圖。 [圖17] 表示圖10之頂出治具之圓頂部的立體圖。 [圖18] 表示使用了圖6的晶粒接合器之半導體裝置之製造方法的流程圖。[Figure 1] A conceptual diagram explaining the replacement of the ejector jig and the measuring jig of the embodiment. [Figure 2] Illustrates the conceptual top view of replacing the ejector jig and measuring jig in Figure 1. [Fig. 3] A diagram illustrating the measurement jig 80A of Fig. 1. [Fig. 4] A diagram illustrating the measurement jig 80B of Fig. 1. [Fig. 5] A diagram illustrating the measurement jig 80C of Fig. 1. [Fig. 6] A schematic top view showing the die bonder of the embodiment. [Fig. 7] A diagram explaining the actions of the pickup head and the bonding head when viewed from the direction of arrow A in Fig. 6. [Fig. 8] A diagram showing the appearance perspective view of the wafer stage in Fig. 6. [FIG. 9] A schematic cross-sectional view showing the main part of the wafer stage in FIG. 6. [FIG. 10] A top view showing a state where the wafer holder is removed from the wafer stage of FIG. 8. [Figure 11] Figure 9 is a perspective view of the ejector jig. [Fig. 12] A sectional view of Fig. 11(C). [Fig. 13] A perspective view of the housing of Fig. 9. [Fig. 14] A cross-sectional view showing the state where the adapter of Fig. 11 and the housing of Fig. 13 are integrated. [Fig. 15] A perspective view showing the state where the ejector jig of Fig. 11 and the housing of Fig. 13 are integrated. [Fig. 16] A perspective view showing the replacement arm of Fig. 10. [Figure 17] A perspective view showing the dome of the ejector jig shown in Figure 10. [FIG. 18] A flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 6.

13:頂出單元 13: ejection unit

80:頂出治具 80: ejector fixture

80A:測定治具 80A: Measuring fixture

80B:測定治具 80B: Measuring fixture

80C:測定治具 80C: Measuring fixture

131:殼體 131: Shell

Claims (15)

一種晶粒接合裝置，其特徵係，具備有：頂出單元，從下方頂出晶粒且使其從切割帶剝離；及晶粒接合部，吸附經剝離之前述晶粒且接合於基板上，前述頂出單元，係具備有：頂出治具；及殼體，安裝有前述頂出治具，可將測定治具安裝於前述殼體及從前述殼體卸除以代替前述頂出治具，前述頂出治具，係具有：塊體，將前述切割帶頂出至圓頂中，前述測定治具，係在圓頂中收納有測定機器，前述測定機器，係荷重元或攝像裝置或變位計。 A die bonding device, characterized in that it is provided with: an ejector unit for ejecting the die from below and peeling it from the dicing tape; and a die bonding part for adsorbing the peeled die and bonding it on a substrate, The aforementioned ejection unit is provided with: ejection jig; and a housing, where the ejection jig is installed, and the measurement jig can be installed and removed from the housing to replace the ejection jig , The aforementioned ejection jig has: a block to eject the aforementioned cutting tape into the dome, the aforementioned measurement jig is secured in the dome to house a measuring machine, and the aforementioned measuring machine is a load cell or a camera device or Displacement gauge. 如申請專利範圍第1項之晶粒接合裝置，其中，前述測定機器，係檢測筒夾的裝設狀態或筒夾的形狀。 For example, the die bonding device of the first item in the scope of patent application, wherein the aforementioned measuring machine detects the installed state of the collet or the shape of the collet. 如申請專利範圍第1項之晶粒接合裝置，其中，收納有前述荷重元之前述測定治具，係更具有將前述切割帶頂出的塊體，頂出前述塊體，將從前述切割帶剝離前述晶粒的力測定為前述荷重元的壓縮力。 For example, the die bonding device of the first item in the scope of patent application, wherein the measuring jig containing the load element further has a block for pushing out the dicing tape, and the block is pushed out from the dicing tape The force to peel the crystal grains was measured as the compressive force of the load cell. 如申請專利範圍第1項之晶粒接合裝置，其中，收納有前述攝像裝置之前述測定治具，係穿透前述切割帶，拍攝藉由前述頂出治具所剝離之前述晶粒的剝離狀態。 For example, the die bonding device of the first item in the scope of patent application, wherein the measurement jig containing the imaging device penetrates the dicing tape to photograph the peeling state of the die peeled by the ejection jig . 如申請專利範圍第1項之晶粒接合裝置，其中，收納有前述變位計之前述測定治具，係更具有複數個探針，前述變位計，係測定吸附治具推壓前述探針所致之壓入量，該吸附治具，係吸附前述晶粒。 For example, the die bonding device of the first item in the scope of patent application, in which the aforementioned measuring jig containing the aforementioned displacement gauge is further provided with a plurality of probes, and the aforementioned displacement gauge is a measuring and adsorbing fixture that pushes the aforementioned probe The amount of indentation caused by the adsorption fixture is to adsorb the aforementioned crystal grains. 如申請專利範圍第1項之晶粒接合裝置，其中，前述測定治具，係更具有發送機，可無線傳輸由前述測定機器測定到的資料。 For example, the die bonding device of the first item in the scope of the patent application, wherein the aforementioned measuring jig further has a transmitter, which can wirelessly transmit the data measured by the aforementioned measuring machine. 如申請專利範圍第1項之晶粒接合裝置，其中，前述頂出治具，係更具備有：配接器，與前述圓頂連結，並具有使前述塊體上下動作的頂出軸桿，前述頂出治具，係藉由前述配接器被連結於前述殼體。 For example, the die bonding device of the first item in the scope of patent application, wherein the ejection jig is further equipped with an adapter, which is connected to the dome, and has an ejection shaft that allows the block to move up and down, The ejection jig is connected to the housing through the adapter. 一種晶粒接合裝置，其特徵係，具備有：頂出單元，從下方頂出晶粒且使其從切割帶剝離；及晶粒接合部，吸附經剝離之前述晶粒且接合於基板 上，前述頂出單元，係具備有：頂出治具；及殼體，安裝有前述頂出治具，可將測定治具安裝於前述殼體及從前述殼體卸除以代替前述頂出治具，前述頂出治具，係具有：塊體，將前述切割帶頂出至圓頂中，前述測定治具，係在圓頂中收納有測定機器，並且具備有與前述圓頂連結的配接器，前述測定治具，係藉由前述配接器被連結於前述殼體。 A die bonding device, characterized by being provided with: an ejector unit for ejecting the die from below and peeling it from the dicing tape; and a die bonding part for adsorbing the peeled die and bonding it to a substrate Above, the aforementioned ejection unit is equipped with: ejection fixture; and a housing, where the aforementioned ejection fixture is installed, and the measurement fixture can be installed in and removed from the aforementioned housing instead of the aforementioned ejection fixture. The jig, the ejection jig, has: a block, the cutting tape is ejected into the dome, the measurement jig is attached to the dome and the measurement machine is housed, and it is provided with a connection to the dome The adapter, the measuring jig, is connected to the housing through the adapter. 一種晶粒接合裝置，其特徵係，具備有：頂出單元，從下方頂出晶粒且使其從切割帶剝離；及晶粒接合部，吸附經剝離之前述晶粒且接合於基板上，前述頂出單元，係具備有：頂出治具；及殼體，安裝有前述頂出治具，可將測定治具安裝於前述殼體及從前述殼體卸除以代替前述頂出治具，前述頂出治具，係具有：塊體，將前述切割帶頂出至圓頂中， 前述測定治具，係在圓頂中收納有測定機器，而且具備有：治具存放器，收納前述頂出治具及前述測定治具；及更換臂，從前述治具存放器，將前述頂出治具及前述測定治具抓住，前述更換臂，係使前述頂出治具及前述測定治具移動至前述頂出單元之前述殼體的上部而進行更換。 A die bonding device, characterized in that it is provided with: an ejector unit for ejecting the die from below and peeling it from the dicing tape; and a die bonding part for adsorbing the peeled die and bonding it on a substrate, The aforementioned ejection unit is provided with: ejection jig; and a housing, where the ejection jig is installed, and the measurement jig can be installed and removed from the housing to replace the ejection jig , The aforementioned ejection jig has: a block body to eject the aforementioned cutting tape into the dome, The aforementioned measuring jig contains a measuring machine in a dome, and is equipped with: a jig storage for storing the ejection jig and the aforementioned measuring jig; The ejection jig and the measurement jig are grasped, and the replacement arm is replaced by moving the ejection jig and the measurement jig to the upper part of the housing of the ejection unit. 如申請專利範圍第9項之晶粒接合裝置，其中，更具備有：晶圓台，使所搭載的晶圓環沿X方向與Y方向移動，前述更換臂，係藉由前述晶圓台，使前述頂出治具及前述測定治具移動至前述頂出單元的上部。 For example, the die bonding device of item 9 of the scope of patent application is further equipped with: a wafer table, which moves the mounted wafer ring in the X direction and Y direction, and the aforementioned replacement arm is provided by the aforementioned wafer table, Move the ejection jig and the measurement jig to the upper part of the ejection unit. 如申請專利範圍第9項之晶粒接合裝置，其中，前述治具存放器會旋轉。 For example, the die bonding device of item 9 in the scope of patent application, in which the aforementioned jig holder rotates. 如申請專利範圍第1項之晶粒接合裝置，其中，更具備有：拾取頭，拾取被貼附於前述切割帶之晶粒；中間平台，載置有由前述拾取頭拾取到之晶粒；及接合頭，將從前述中間平台拾取到之晶粒接合於基板或已接合的晶粒上。 For example, the die bonding device of the first item of the scope of patent application, which is further equipped with: a pickup head, which picks up the die attached to the aforementioned dicing tape; an intermediate platform, which holds the die picked up by the aforementioned pickup head; And the bonding head, bonding the die picked up from the aforementioned intermediate platform to the substrate or the bonded die. 一種半導體裝置之製造方法，其特徵係，具備有：(a)準備如申請專利範圍第1~11項中任一項之晶粒接合裝置的工程；(b)搬入保持前述切割帶之晶圓環的工程；(c)準備搬入基板的工程；(d)拾取晶粒的工程；及(e)將前述拾取到之晶粒接合於前述基板或已接合的晶粒上之工程。 A method of manufacturing a semiconductor device, which is characterized by: (a) preparing a die bonding device as in any one of the scope of the patent application item 1 to 11; (b) loading the wafer holding the aforementioned dicing tape The process of ring; (c) the process of preparing the substrate to be transferred; (d) the process of picking up the die; and (e) the process of bonding the picked-up die to the substrate or the bonded die. 如申請專利範圍第13項之半導體裝置之製造方法，其中，前述(d)工程，係以接合頭來拾取被貼附於前述切割帶的晶粒，前述(e)工程，係將由前述接合頭拾取到之晶粒接合於前述基板或已接合的晶粒上。 For example, the method of manufacturing a semiconductor device in the scope of the patent application, wherein the step (d) is to pick up the die attached to the dicing tape with a bonding head, and the step (e) is to use the bonding head The picked-up die is bonded to the aforementioned substrate or the bonded die. 如申請專利範圍第13項之半導體裝置之製造方法，其中，前述(d)工程，係具有：(d1)以拾取頭來拾取被貼附於前述切割帶之晶粒的工程；及(d2)將由前述拾取頭拾取到之晶粒載置於中間平台的工程，前述(e)工程，係具有： (e1)以接合頭來拾取被載置於前述中間平台之晶粒的工程；及(e2)將由前述接合頭拾取到之晶粒載置於前述基板的工程。 For example, the method for manufacturing a semiconductor device according to the scope of the patent application, wherein the aforementioned (d) process has: (d1) a process of picking up the die attached to the aforementioned dicing tape with a pick-up head; and (d2) The process of placing the crystal grains picked up by the aforementioned pickup head on the intermediate platform, the aforementioned process (e) has: (e1) The process of picking up the die placed on the intermediate platform with the bonding head; and (e2) the process of placing the die picked up by the bonding head on the substrate.
TW108129074A 2018-09-19 2019-08-15 Die bonding device and manufacturing method of semiconductor device TWI714217B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-174832 2018-09-19
JP2018174832A JP7102305B2 (en) 2018-09-19 2018-09-19 Manufacturing method of die bonding equipment and semiconductor equipment

Publications (2)

Publication Number Publication Date
TW202015170A TW202015170A (en) 2020-04-16
TWI714217B true TWI714217B (en) 2020-12-21

Family

ID=69848730

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108129074A TWI714217B (en) 2018-09-19 2019-08-15 Die bonding device and manufacturing method of semiconductor device

Country Status (4)

Country Link
JP (1) JP7102305B2 (en)
KR (1) KR102297846B1 (en)
CN (1) CN110931367B (en)
TW (1) TWI714217B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102405424B1 (en) * 2020-06-25 2022-06-07 한화정밀기계 주식회사 Wafer stage device
JP2022071993A (en) * 2020-10-29 2022-05-17 アスリートＦａ株式会社 Electronic component bonding apparatus
KR102488826B1 (en) * 2021-04-09 2023-01-17 양해춘 Pick and place systems with hybrid ejector
JP2023147018A (en) * 2022-03-29 2023-10-12 東レエンジニアリング株式会社 Projection head and projection device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013172122A (en) * 2012-02-23 2013-09-02 Hitachi High-Tech Instruments Co Ltd Die bonder
TW201533823A (en) * 2014-02-26 2015-09-01 Shinkawa Kk Pickup apparatus and pickup method for semiconductor dies
US20160099225A1 (en) * 2014-04-30 2016-04-07 Fasford Technology Co., Ltd. Die Bonder and Bonding Method

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140497A (en) * 1992-10-27 1994-05-20 Hitachi Ltd Pickup device
JPH098101A (en) * 1995-06-19 1997-01-10 Matsushita Electric Ind Co Ltd Die ejector device
JP3933118B2 (en) * 2003-10-02 2007-06-20 ソニー株式会社 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
JP4864816B2 (en) * 2007-06-19 2012-02-01 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
KR20090113510A (en) * 2008-04-28 2009-11-02 세크론 주식회사 Level correcting apparatus for bonding area of die bonder, and level correcting method using the same
JP2012069733A (en) * 2010-09-24 2012-04-05 Hitachi High-Tech Instruments Co Ltd Tooling management method of die bonder, and die bonder
JP5936847B2 (en) * 2011-11-18 2016-06-22 富士機械製造株式会社 Wafer-related data management method and wafer-related data creation apparatus
KR20130066234A (en) * 2011-12-12 2013-06-20 삼성전자주식회사 Fabricating method of semiconductor device and appratus for pick-up of semiconductor device used thereof
CN102637623B (en) * 2012-04-18 2014-07-30 莆田学院 LED (light-emitting diode) chip carrier positioning and absorbing device
JP5996983B2 (en) * 2012-09-19 2016-09-21 ヤマハ発動機株式会社 Electronic component mounting device
KR102247033B1 (en) * 2014-04-16 2021-05-03 삼성전자주식회사 Die bonding apparatus
JP6538358B2 (en) 2015-01-26 2019-07-03 ファスフォードテクノロジ株式会社 Bonding apparatus and collet inclination inspection method for bonding apparatus
JP5888455B1 (en) * 2015-04-01 2016-03-22 富士ゼロックス株式会社 Semiconductor manufacturing apparatus and semiconductor chip manufacturing method
JP5888463B1 (en) 2015-11-30 2016-03-22 富士ゼロックス株式会社 Semiconductor manufacturing apparatus and semiconductor chip manufacturing method
WO2017168498A1 (en) * 2016-03-28 2017-10-05 富士機械製造株式会社 Component supply apparatus, mounting apparatus, and component supply method
JP6797569B2 (en) * 2016-06-13 2020-12-09 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and manufacturing method of semiconductor equipment
JP6637397B2 (en) * 2016-09-12 2020-01-29 ファスフォードテクノロジ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
JP6138332B1 (en) * 2016-12-22 2017-05-31 ハイソル株式会社 Vacuum transfer method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013172122A (en) * 2012-02-23 2013-09-02 Hitachi High-Tech Instruments Co Ltd Die bonder
TW201533823A (en) * 2014-02-26 2015-09-01 Shinkawa Kk Pickup apparatus and pickup method for semiconductor dies
US20160099225A1 (en) * 2014-04-30 2016-04-07 Fasford Technology Co., Ltd. Die Bonder and Bonding Method

Also Published As

Publication number Publication date
KR102297846B1 (en) 2021-09-06
TW202015170A (en) 2020-04-16
KR20200033177A (en) 2020-03-27
CN110931367B (en) 2023-03-31
CN110931367A (en) 2020-03-27
JP2020047759A (en) 2020-03-26
JP7102305B2 (en) 2022-07-19

Similar Documents

Publication Publication Date Title
TWI714217B (en) Die bonding device and manufacturing method of semiconductor device
KR102329117B1 (en) Manufacturing apparatus of semiconductor and manufacturing method of semiconductor device
JP5996983B2 (en) Electronic component mounting device
TWI673806B (en) Apparatus of thermocompression bonding
CN106981444B (en) Hot-pressing bonding device
CN108364880B (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
US7598729B2 (en) Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
TW201732961A (en) Die bonding device and semiconductor device manufacturing method comprising a wafer cassette, a case for storing the substrate, a wafer platform, a bonding platform, and a multi-joint mechanical arm having multiple DOF for transferring wafers, substrates and dies
WO2007083360A1 (en) Semiconductor fabrication device and fabrication method
TWI613452B (en) Electronic component conveying device and electronic component inspection device
JP6818608B2 (en) Manufacturing method of die bonding equipment and semiconductor equipment
TWI668172B (en) Device handler
KR102649912B1 (en) Bonding module and die bonding apparatus having the same
KR102000079B1 (en) Die bonding apparatus
JP7284328B2 (en) Die bonding apparatus and semiconductor device manufacturing method
JPH05208390A (en) Suction nozzle
WO2022054393A1 (en) Collet detection device, collet adjustment device, bonding device, collet detection method, and collet adjustment method
KR100315514B1 (en) Two-head type CSP bonder apparatus
KR102000081B1 (en) Die stage unit for testing die and die binding apparatus having the same
WO2019150439A1 (en) Component mounting device
CN115148631A (en) Continuous mounting and pressing equipment for heat dissipation cover and substrate
TW202416393A (en) Die bonding apparatus
KR20230046252A (en) Handling device of electronic component, mounting device of electronic component and mounting method of electronic component