TWI674048B - Displacement amount acquisition apparatus, inspection apparatus, displacement amount acquisition method, and inspection method - Google Patents
Displacement amount acquisition apparatus, inspection apparatus, displacement amount acquisition method, and inspection method Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
- G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract
在位置偏移量取得裝置(41)之圖像分割部(411)中，分割2個圖像中之一圖像來取得分割區域群。適性區域特定部(412)求出各分割區域相對於取得2個圖像間之位置偏移量之偏移量取得處理之適性度，藉此自分割區域群特定出適於偏移量取得處理之複數個適性區域。位置偏移量取得部(413)於各適性區域中，進行2個圖像間之偏移量取得處理，藉此取得該適性區域之位置偏移量。位置偏移量算出部(414)對於分割區域群中不包含於複數個適性區域之不適性區域，根據複數個適性區域之位置偏移量、及該不適性區域與複數個適性區域之位置關係，來求出位置偏移量。藉此，可精度良好地求出2個圖像中各分割區域之位置偏移量。 An image division unit (411) of the position shift amount acquiring device (41) divides one of the two images to obtain a divided region group. The adaptive region specifying unit (412) obtains the suitability of the offset amount acquisition processing for each divided region with respect to the positional offset amount between the two images, thereby identifying the appropriate offset acquisition process from the divided region group. A plurality of regions of fitness. A position shift amount acquisition unit (413) performs a shift amount acquisition process between two images in each adaptive region, thereby obtaining a position shift amount of the adaptive region. The position offset calculation unit (414), based on the position offsets of the plurality of adaptive regions and the positional relationship between the plurality of adaptive regions, for the unsuitable regions in the divided region group that are not included in the plurality of adaptive regions. To find the position offset. Thereby, the positional shift amount of each divided area in the two images can be accurately obtained.
Description
本發明係關於位置偏移量取得裝置、檢查裝置、位置偏移量取得方法及檢查方法。 The present invention relates to a position shift amount acquisition device, an inspection device, a position shift amount acquisition method, and an inspection method.
習知，印刷基板之外觀檢查會將CAM(Computer Aided Manufacturing；電腦輔助製造)資料等之設計資料作為基準而進行檢查。例如，將設計資料所示之設計圖案的圖像與顯示印刷基板之配線圖案的圖像進行比較，而將有一定程度以上差異的地方作為缺陷而擷取出來。在如此之比較檢查中，會進行2個圖像之對位。在該對位中，求出2個圖像之位置偏移量。 It is known that the visual inspection of printed substrates will use design information such as CAM (Computer Aided Manufacturing) data as a benchmark for inspection. For example, the image of the design pattern shown in the design data is compared with the image of the wiring pattern on the printed circuit board, and the difference that is more than a certain degree is extracted as a defect. In such a comparison check, alignment of two images is performed. In this alignment, the amount of positional shift between the two images is obtained.
再者，在日本專利特開平6-300703號公報中，揭示有一種檢查裝置，其將每個將被檢查圖像及參考圖像分割為既定尺寸之區域而成之評價區隔相互地比較，來進行缺陷之檢測。在該檢查裝置中，求出各評價區隔之兩個圖像之位置偏移量，來得到相對於位置偏移量之頻率分布。作為圖像整體之位置偏移量而取得該頻率分布之分布重心之位置且作為被檢查圖像所示之圖案中內部應變之最大值而取得距重心最遠之點與重心之間之距離。 Furthermore, Japanese Patent Laid-Open No. 6-300703 discloses an inspection device that compares each evaluation segment formed by dividing an inspected image and a reference image into regions of a predetermined size, For defect detection. In this inspection device, the position shift amount of the two images in each evaluation segment is obtained to obtain the frequency distribution with respect to the position shift amount. The position of the center of gravity of the frequency distribution is obtained as the positional offset of the entire image, and the distance between the point farthest from the center of gravity and the center of gravity is obtained as the maximum value of the internal strain in the pattern shown in the inspected image.
然而，於對每個既定尺寸之分割區域進行2個圖像之對位之情形時，存在有一分割區域之圖案例如僅由朝一方向延伸之直線狀之圖案要素所構成之情形。於該情形時，雖可精度良好地求出垂直於該一方向之方向的位置偏移量，但難以精度良好地求出該一方向之位置偏移量。 However, in a case where two images are aligned for each divided area of a predetermined size, there is a case where a pattern of one divided area is composed of, for example, a linear pattern element extending in one direction only. In this case, although the position shift amount in the direction perpendicular to the one direction can be obtained with good accuracy, it is difficult to obtain the position shift amount in the one direction with high accuracy.
本發明係用於位置偏移量取得裝置，其目的在於精度良好地求出2個圖像中各分割區域之位置偏移量。 The present invention is used for a position shift amount acquiring device, and the object thereof is to accurately calculate the position shift amount of each divided region in two images.
本發明之位置偏移量取得裝置具備有：圖像分割部，其分割2個圖像中之一圖像來取得分割區域群；適性區域特定部，其求出各分割區域相對於取得上述2個圖像間之位置偏移量之偏移量取得處理之適性度，藉此自上述分割區域群特定出適於上述偏移量取得處理之複數個適性區域；位置偏移量取得部，其於各適性區域中，進行上述2個圖像間之上述偏移量取得處理，藉此取得上述各適性區域之位置偏移量；以及位置偏移量算出部，其對於上述分割區域群中不包含於上述複數個適性區域之不適性區域，根據上述複數個適性區域之位置偏移量、及上述不適性區域與上述複數個適性區域之位置關係，來求出位置偏移量。 The position shift amount obtaining device according to the present invention includes an image division unit that divides one of two images to obtain a divided region group, and an adaptive region specifying unit that obtains each divided region with respect to obtaining the above-mentioned 2 The positional amount of the positional offset amount between the images is obtained as the suitability of the process, thereby identifying a plurality of adaptive regions suitable for the above-mentioned offset amount acquisition process from the segmented area group; Performing the above-mentioned offset amount acquisition processing between the two images in each of the adaptive regions, thereby obtaining the positional offset amount of the respective adaptive regions; and a positional offset amount calculating unit, which The discomfort regions included in the plurality of adaptive regions are obtained based on the positional shift amounts of the plurality of adaptive regions and the positional relationship between the discomfort regions and the plurality of adaptive regions.
根據本發明，可精度良好地求出2個圖像中各分割區域之位置偏移量。 According to the present invention, the position shift amount of each divided region in the two images can be accurately obtained.
於本發明一較佳形態中，上述適性區域特定部藉由檢測包含於上述各分割區域所示之圖案之特徵點，來求出上述適性度。 In a preferred aspect of the present invention, the adaptability region specifying unit determines the adaptability by detecting feature points included in the pattern shown in each of the divided regions.
於本發明另一較佳形態中，上述一圖像係自顯示設計圖案之設計資料所導出之圖像，且上述2個圖像中之另一圖像係藉 由拍攝形成有基於上述設計資料之實際圖案之對象物所取得之圖像。 In another preferred form of the present invention, the above-mentioned one image is an image derived from design data showing a design pattern, and the other of the two images is formed by shooting based on the above-mentioned design data. The image obtained by the object of the actual pattern.
在本發明一態樣中，於上述偏移量取得處理中，一邊將上述一圖像之上述各適性區域朝上下左右移動，一邊求出上述各適性區域與上述2個圖像中之另一圖像的差，藉此取得上述各適性區域之上述位置偏移量。 In one aspect of the present invention, in the offset obtaining process, while moving the adaptive regions of the one image up, down, left, and right, and obtaining the other of the adaptive regions and the two images The difference in the image is used to obtain the above-mentioned position shift amount of each of the adaptive regions.
在本發明另一態樣中，將上述各分割區域之位置作為參數之位置偏移量之算式被預先設定，上述位置偏移量算出部根據上述複數個適性區域之位置偏移量、及上述複數個適性區域之位置，來求出上述算式之係數。 In another aspect of the present invention, a calculation formula is set in advance that uses the position of each of the divided regions as a parameter, and the position shift amount calculation unit is based on the position shift amounts of the plurality of adaptive regions and the above. The position of the plurality of adaptive regions is used to find the coefficient of the above formula.
本發明亦用於檢查裝置。本發明之檢查裝置具備有：前述之位置偏移量取得裝置；及檢查部，其使用藉由上述位置偏移量取得裝置所取得之上述各分割區域之位置偏移量，一邊進行上述2個圖像之對位，一邊取得對包含於上述2個圖像之被檢查圖像之檢查結果。 The invention is also used in inspection devices. The inspection device of the present invention includes the aforementioned position shift amount acquisition device and an inspection unit that performs the above two while using the position shift amount of each of the divided regions obtained by the position shift amount acquisition device. The alignment of the images, while obtaining the inspection results of the inspected images included in the two images.
本發明亦用於位置偏移量取得方法、及檢查方法。 The present invention is also applied to a method for obtaining a position offset amount and a method for inspection.
前述之目的及其他目的、特徵、態樣及優點係可參照隨附之圖式並藉由以下所進行本發明之詳細說明而明確化。 The foregoing objects and other objects, features, aspects, and advantages can be made clear by referring to the accompanying drawings and performing the detailed description of the present invention below.
1‧‧‧圖案檢查裝置 1‧‧‧ pattern inspection device
2‧‧‧裝置本體 2‧‧‧device body
3‧‧‧電腦 3‧‧‧ computer
6‧‧‧參考圖像 6‧‧‧Reference image
8‧‧‧記錄媒體 8‧‧‧ recording media
9‧‧‧基板 9‧‧‧ substrate
21‧‧‧攝影裝置 21‧‧‧Photographic installation
22‧‧‧平台 22‧‧‧ Platform
23‧‧‧平台驅動部 23‧‧‧Platform driver
31‧‧‧CPU 31‧‧‧CPU
32‧‧‧ROM 32‧‧‧ROM
33‧‧‧RAM 33‧‧‧RAM
34‧‧‧固定磁碟 34‧‧‧ fixed disk
35‧‧‧顯示器 35‧‧‧ Display
36a‧‧‧鍵盤 36a‧‧‧Keyboard
36b‧‧‧滑鼠 36b‧‧‧mouse
37‧‧‧讀取裝置 37‧‧‧Reading device
38‧‧‧通訊部 38‧‧‧ Ministry of Communications
41‧‧‧位置偏移量取得裝置 41‧‧‧Position shift obtaining device
42‧‧‧檢查部 42‧‧‧ Inspection Department
48‧‧‧設計資料 48‧‧‧Design Information
49‧‧‧儲存部 49‧‧‧Storage Department
50‧‧‧被檢查分割區域 50‧‧‧ Checked divided area
51‧‧‧像素 51‧‧‧ pixels
51a‧‧‧中心像素 51a‧‧‧ center pixel
52‧‧‧重心位置 52‧‧‧ Center of Gravity
60‧‧‧分割區域 60‧‧‧ divided area
61‧‧‧圖案區域 61‧‧‧Pattern area
62‧‧‧背景區域 62‧‧‧ background area
63‧‧‧圖案凹部 63‧‧‧ pattern recess
64‧‧‧圖案凸部 64‧‧‧ pattern convex
71、71a、71b、71c‧‧‧箭頭 71, 71a, 71b, 71c‧‧‧ arrows
72、72A‧‧‧像素 72, 72A‧‧‧ pixels
80‧‧‧程式 80‧‧‧program
81、81a‧‧‧箭頭 81, 81a‧‧‧arrow
82‧‧‧像素 82‧‧‧ pixels
211‧‧‧照明部 211‧‧‧Lighting Department
212‧‧‧光學系統 212‧‧‧optical system
213‧‧‧攝影部 213‧‧‧Photography Department
411‧‧‧圖像分割部 411‧‧‧Image segmentation section
412‧‧‧適性區域特定部 412‧‧‧Suitable area specific department
413‧‧‧位置偏移量取得部 413‧‧‧Position offset acquisition unit
414‧‧‧位置偏移量算出部 414‧‧‧Position shift calculation unit
510‧‧‧像素排列 510‧‧‧Pixel arrangement
S10~S18‧‧‧步驟 S10 ~ S18‧‧‧step
圖1係顯示圖案檢查裝置之構成之圖。 FIG. 1 is a diagram showing the configuration of a pattern inspection device.
圖2係顯示電腦之構成之圖。 Fig. 2 is a diagram showing the structure of a computer.
圖3係顯示圖案檢查裝置之功能構成之方塊圖。 FIG. 3 is a block diagram showing a functional configuration of the pattern inspection device.
圖4係顯示檢查基板之處理流程之圖。 FIG. 4 is a diagram showing a processing flow for inspecting a substrate.
圖5係顯示分割區域群之圖。 FIG. 5 is a diagram showing a divided region group.
圖6係顯示分割區域之一部分之圖。 FIG. 6 is a diagram showing a part of the divided area.
圖7係顯示分割區域之一部分之圖。 FIG. 7 is a diagram showing a part of the divided area.
圖8係顯示適性區域之圖。 FIG. 8 is a diagram showing an adaptive region.
圖9係顯示不適性區域之圖。 FIG. 9 is a diagram showing an uncomfortable area.
圖10係顯示分割區域群中複數個適性區域之圖。 FIG. 10 is a diagram showing a plurality of adaptive regions in a segmented region group.
圖11係用以說明偏移量取得處理之圖。 FIG. 11 is a diagram for explaining offset obtaining processing.
圖12係顯示被檢查分割區域之像素排列之圖。 FIG. 12 is a diagram showing a pixel arrangement of the divided region under inspection.
圖13係顯示對應於不適性區域之被檢查分割區域之像素排列之圖。 FIG. 13 is a diagram showing a pixel arrangement of the inspected divided area corresponding to the uncomfortable area.
圖1係顯示本發明一實施形態之圖案檢查裝置1之構成之圖。圖案檢查裝置1係例如檢查電子零件被安裝前之印刷基板(亦稱為印刷配線基板)之外觀之裝置。 FIG. 1 is a diagram showing a configuration of a pattern inspection apparatus 1 according to an embodiment of the present invention. The pattern inspection apparatus 1 is, for example, an apparatus for inspecting the appearance of a printed circuit board (also referred to as a printed wiring board) before electronic components are mounted.
此處，印刷基板係於樹脂基板9(以下簡稱為「基板9」)之表面藉由銅等之導電性材料而形成有配線圖案者。在印刷基板之製造中，於基板9之表面設置有導電性材料之膜(導電膜)。於導電膜上形成有作為感光材料之光阻膜，且基於設計資料之圖案的圖像係藉由描繪裝置(直繪(direct patterning)裝置)被直接地描繪於該光阻膜上。對描繪有圖案之基板9實施顯影處理、蝕刻處理、光阻剝離處理等。藉此，於基板9上形成有配線圖案。對基板9之蝕刻處理係例如藉由對基板9施予蝕刻液所進行之濕式蝕刻。作為對基板9之蝕刻處理，亦可進行例如利用電漿等之乾式蝕刻。又，亦可使用顯示設計圖案之光罩而使圖案被形成(曝光)於光阻膜上。 Here, the printed circuit board is formed by forming a wiring pattern on the surface of a resin substrate 9 (hereinafter referred to simply as "substrate 9") with a conductive material such as copper. In the manufacture of a printed circuit board, a film (conductive film) of a conductive material is provided on the surface of the substrate 9. A photoresist film as a photosensitive material is formed on the conductive film, and an image of a pattern based on design data is directly drawn on the photoresist film by a drawing device (direct patterning device). The patterned substrate 9 is subjected to a development process, an etching process, a photoresist peeling process, and the like. As a result, a wiring pattern is formed on the substrate 9. The etching process for the substrate 9 is, for example, wet etching by applying an etchant to the substrate 9. As the etching process for the substrate 9, dry etching using a plasma or the like may be performed, for example. In addition, a mask for displaying a design pattern may be used to form (expose) the pattern on the photoresist film.
圖案檢查裝置1具備有對基板9進行拍攝之裝置本體2、及控制圖案檢查裝置1之整體動作並且實現後述之運算部等之電腦3。裝置本體2具有拍攝基板9而取得多層次(multi-gradation)之攝影圖像(之資料)之攝影裝置21、保持基板9之平台22、及將平台22相對於攝影裝置21相對地移動之平台驅動部23。攝影裝置21具有將照明光出射之照明部211、將照明光導引至基板9並且供來自基板9之光入射之光學系統212、及將藉由光學系統212所成像之基板9的像轉換為電氣訊號之攝影部213。平台驅動部23係由滾珠螺桿、導軌、馬達等所構成。電腦3控制平台驅動部23及攝影裝置21，藉此拍攝基板9上之既定區域。 The pattern inspection device 1 is provided with a device body 2 that images the substrate 9 and a computer 3 that controls the overall operation of the pattern inspection device 1 and realizes a calculation unit and the like described later. The device body 2 includes a photographing device 21 that captures a multi-gradation photographic image (data) of the substrate 9, a platform 22 that holds the substrate 9, and a platform that relatively moves the platform 22 relative to the photographing device 21. Driving section 23. The photographing device 21 includes an illumination section 211 that emits illumination light, an optical system 212 that guides the illumination light to the substrate 9 and allows light from the substrate 9 to enter, and converts an image of the substrate 9 imaged by the optical system 212 into Electrical signal of the photography department 213. The platform driving unit 23 is composed of a ball screw, a guide rail, a motor, and the like. The computer 3 controls the platform driving unit 23 and the photographing device 21 to photograph a predetermined area on the substrate 9.
圖2係顯示電腦3之構成之圖。電腦3係包含進行各種運算處理之CPU(Central Processing Unit；中央處理單元)31、儲存基本程式之ROM(Read-Only Memory；唯讀記憶體)32及儲存各種資訊之RAM(Random Access Memory；隨機存取記憶體)33之一般電腦系統之構成。電腦3進一步包含有進行資訊儲存之固定磁碟34、進行圖像等之各種資訊之顯示之顯示器35、接受來自操作者之輸入之鍵盤36a及滑鼠36b、自光碟、磁碟、光磁碟等之電腦可讀取之記錄媒體8進行資訊之讀取之讀取裝置37、以及在與圖案檢查裝置1之其他構成之間收發訊號之通訊部38。 FIG. 2 is a diagram showing the configuration of the computer 3. The computer 3 includes a CPU (Central Processing Unit) 31 for performing various arithmetic processing, a ROM (Read-Only Memory) 32 for storing basic programs, and a RAM (Random Access Memory) for storing various information. Access memory) 33 is a general computer system. The computer 3 further includes a fixed disk 34 for storing information, a display 35 for displaying various information such as images, a keyboard 36a and a mouse 36b that accept input from an operator, a self-optical disk, a magnetic disk, and an optical magnetic disk. A reading device 37 that reads information from a computer-readable recording medium 8 and a communication unit 38 that transmits and receives signals to and from other components of the pattern inspection device 1.
在電腦3中，程式80事先經由讀取裝置37而自記錄媒體8被讀出並被儲存於固定磁碟34。CPU 31依照程式80一邊利用RAM 33與固定磁碟34，一邊執行運算處理。 In the computer 3, the program 80 is read from the recording medium 8 via the reading device 37 in advance and stored in the fixed disk 34. The CPU 31 executes arithmetic processing while using the RAM 33 and the fixed magnetic disk 34 in accordance with the program 80.
圖3係顯示圖案檢查裝置1之功能構成之方塊圖，在圖3中，以標示符號3之虛線矩形來包圍由電腦3之CPU 31、ROM 32、RAM 33、固定磁碟34等所實現之功能構成。電腦3具有位置偏移量取得裝置41、檢查部42及儲存部49。位置偏移量取得裝置41具有圖像分割部411、適性區域特定部412、位置偏移量取得部413、及位置偏移量算出部414。儲存部49儲存CAM資料(或CAD(Computer Aided Design；電腦輔助設計)資料)等之設計資料48。關於該等構成所實現之功能的細節於後述之。再者，該等功能既可由專用的電路所建構，亦可局部地利用專用的電路。 FIG. 3 is a block diagram showing the functional configuration of the pattern inspection device 1. In FIG. 3, a dashed rectangle with a symbol 3 surrounds the CPU 31, ROM 32, RAM 33, fixed disk 34, and the like implemented by the computer 3. Functional composition. The computer 3 includes a position shift amount acquiring device 41, an inspection unit 42, and a storage unit 49. The position shift amount acquisition device 41 includes an image division section 411, an adaptive region specifying section 412, a position shift amount acquisition section 413, and a position shift amount calculation section 414. The storage unit 49 stores design data 48 such as CAM data (or CAD (Computer Aided Design) data). The details of the functions performed by these constituents are described later. Furthermore, these functions can be constructed by dedicated circuits, or they can be partially utilized.
圖4係顯示圖案檢查裝置1檢查基板9之處理流程之圖。此處，將作為1批量(以下稱為「對象批量」)而被製造之複數片基板9設為檢查對象。包含於對象批量之複數片基板9係用於相同產品之製造，而形成有相同之配線圖案。 FIG. 4 is a diagram showing a processing flow for inspecting the substrate 9 by the pattern inspection device 1. Here, a plurality of substrates 9 manufactured as one batch (hereinafter referred to as "target batch") are set as inspection targets. The plurality of substrates 9 included in the target lot are used for the manufacture of the same product, and the same wiring pattern is formed.
在圖案檢查裝置1中，首先，於形成基板9之表面之配線圖案(以下，將實際上基板9上之配線圖案稱為「實際圖案」)時所利用之設計資料48，會被輸入至儲存部49而進行準備(步驟S10)。本實施形態之設計資料48係顯示設計圖案之向量資料。設計資料48亦可為網格資料(Raster data)。包含於對象批量之複數片基板9上之實際圖案，係根據設計資料48而藉由蝕刻處理等所形成。 In the pattern inspection device 1, first, the design data 48 used when forming the wiring pattern on the surface of the substrate 9 (hereinafter, the wiring pattern on the substrate 9 is actually referred to as the "actual pattern") is input to the storage. The unit 49 prepares (step S10). The design data 48 of this embodiment is vector data showing a design pattern. The design data 48 may also be Raster data. The actual patterns on the plurality of substrates 9 included in the target lot are formed by an etching process or the like according to the design data 48.
在圖像分割部411中，生成顯示設計圖案之二值化圖像(以下稱為「參考圖像」)。在參考圖像中，複數個像素係沿著列方向及行方向被排列，並對包含於設計圖案之圖案區域之各像素賦予一值(例如1)，而對包含於背景區域之各像素賦予另一值(例如0)。如圖5所示，參考圖像6係分割為複數個區域60(以下稱為「分割區域60」)(步驟S11)。例如，參考圖像6係沿著列方向及行方向 被等分割，複數個分割區域60係相同之大小。複數個分割區域60亦可為不同之大小。在以下之說明中，將複數個分割區域60之集合稱為「分割區域群」。 The image division unit 411 generates a binary image (hereinafter referred to as a "reference image") in which a design pattern is displayed. In the reference image, a plurality of pixels are arranged along the column direction and the row direction, and a value (for example, 1) is assigned to each pixel included in the pattern region of the design pattern, and each pixel included in the background region is assigned Another value (for example, 0). As shown in FIG. 5, the reference image 6 is divided into a plurality of regions 60 (hereinafter referred to as "divided regions 60") (step S11). For example, the reference image 6 is equally divided in the column direction and the row direction, and the plurality of divided regions 60 are the same size. The plurality of divided regions 60 may also have different sizes. In the following description, a set of a plurality of divided regions 60 is referred to as a "divided region group".
圖6及圖7係顯示分割區域60之一部分之圖。若藉由圖像分割部411而取得分割區域群，適性區域特定部412便將參考圖像6中不包含於圖案區域61之各像素、即包含於背景區域62之各像素作為對象像素，分別對以45度間隔所設定之8個方向測量自對象像素至圖案區域61之邊緣為止之距離(以下稱為「背景測量距離」)。在圖6中，以箭頭81(對1個箭頭標示符號81a)來表示以像素82作為對象像素之情形時之8個方向的背景測量距離。 6 and 7 are diagrams showing a part of the divided area 60. When the segmented area group is obtained by the image segmentation unit 411, the adaptive region specification unit 412 uses the pixels in the reference image 6 that are not included in the pattern region 61, that is, the pixels included in the background region 62 as the target pixels, respectively. The distance from the target pixel to the edge of the pattern area 61 is measured in eight directions set at 45-degree intervals (hereinafter referred to as "background measurement distance"). In FIG. 6, the background measurement distance in eight directions when the pixel 82 is used as the target pixel is indicated by an arrow 81 (the symbol 81 a is indicated by one arrow).
於對象像素中，在僅1個方向之背景測量距離為既定之判定距離以上，且其他7個方向之背景測量距離未滿判定距離之情形時，對象像素係作為凹部像素而被檢出。圖6中之像素82，由於僅以箭頭81a所示之背景測量距離為判定距離以上，因此像素82為凹部像素。凹部像素表示圖案區域61之凹部63(以下稱為「圖案凹部63」)之存在。再者，背景測量距離之上限被預先設定，圖6中之箭頭81a成為上限之背景測量距離。凹部像素之探索亦可對背景區域62中每既定數量之像素來進行(凸部像素之探索亦相同)。 Among the target pixels, when the background measurement distance in only one direction is greater than a predetermined determination distance and the background measurement distance in the other 7 directions is less than the determination distance, the target pixel is detected as a recessed pixel. In the pixel 82 in FIG. 6, since only the background measurement distance shown by the arrow 81 a is equal to or greater than the determination distance, the pixel 82 is a recessed pixel. The recessed pixel indicates the presence of a recessed portion 63 (hereinafter referred to as "patterned recessed portion 63") of the pattern region 61. The upper limit of the background measurement distance is set in advance, and the arrow 81a in FIG. 6 becomes the upper limit of the background measurement distance. The exploration of the recessed pixels can also be performed for each predetermined number of pixels in the background area 62 (the same applies to the exploration of the protruding pixels).
適性區域特定部412，進一步將包含於圖案區域61之各像素作為對象像素，而分別對以45度間隔所設定之8個方向測量自對象像素至圖案區域61之邊緣為止之距離(以下稱為「圖案測量距離」)。在圖7中，以箭頭71(對3個箭頭標示符號71a、71b、71c)來表示以像素72、72A作為對象像素之情形時之8個方向的圖案測量距離。 The adaptive region specifying unit 412 further uses each pixel included in the pattern region 61 as a target pixel, and measures the distance from the target pixel to the edge of the pattern region 61 in each of eight directions set at 45-degree intervals (hereinafter referred to as "Pattern measurement distance"). In FIG. 7, the pattern measurement distances in the eight directions when the pixels 72 and 72A are used as the target pixels are indicated by arrows 71 (the three arrows are denoted by the symbols 71 a, 71 b, and 71 c).
然後，於對象像素中，在僅1個方向之圖案測量距離為既定之判定距離以上，且其他7個方向之圖案測量距離未滿判定距離之情形時，對象像素係作為凸部像素而被檢出。圖7中之像素72，由於僅以箭頭71a所示之圖案測量距離為判定距離以上，因此像素72為凸部像素(在圖7中，顯示焊點之前端之凸部像素)。又，像素72A，由於以箭頭71b、71c所示之2個圖案測量距離為判定距離以上，因此像素72A並非凸部像素。凸部像素表示圖案區域61之凸部64(以下稱為「圖案凸部64」)之存在。再者，圖案測量距離之上限被預先設定，圖7中之箭頭71a、71b成為上限之圖案測量距離。 Then, when the pattern measurement distance in only one direction is greater than the predetermined determination distance and the pattern measurement distance in the other 7 directions is less than the determination distance, the target pixel is detected as a convex pixel. Out. The pixel 72 in FIG. 7 is a projection pixel only because the distance measured by the pattern shown by the arrow 71 a is equal to or more than the determination distance. In FIG. 7, the pixel at the front of the solder joint is shown as a convex pixel. In addition, the pixel 72A is not a convex pixel because the measurement distance of the two patterns shown by arrows 71b and 71c is equal to or greater than the determination distance. The convex portion pixel indicates the existence of a convex portion 64 (hereinafter referred to as "pattern convex portion 64") of the pattern region 61. The upper limit of the pattern measurement distance is set in advance, and the arrows 71 a and 71 b in FIG. 7 become the upper limit of the pattern measurement distance.
適性區域特定部412，求出包含於各分割區域60之凸部像素及凹部像素之個數，該個數為既定數以上之分割區域60係作為適性區域(步驟S12)而被特定出。在圖8中，將作為適性區域而被特定出之3個分割區域60縱向地排列而加以顯示。另一方面，凸部像素及凹部像素之個數未滿既定數之分割區域60，係作為不適性區域而被特定出。在圖9中，將作為不適性區域而被特定出之3個分割區域60縱向地排列而加以顯示。在圖10中，對參考圖像6之分割區域群中作為適性區域而被特定出之分割區域60標示平行斜線。 The adaptive region specifying unit 412 obtains the number of convex pixels and concave pixels included in each divided region 60. The divided region 60 having a predetermined number or more is specified as an adaptive region (step S12). In FIG. 8, three divided regions 60 that are specified as adaptive regions are arranged vertically and displayed. On the other hand, the divided areas 60 in which the number of the convex pixels and the concave pixels are less than a predetermined number are specified as uncomfortable areas. In FIG. 9, three divided regions 60 that are specified as uncomfortable regions are arranged vertically and displayed. In FIG. 10, a parallel oblique line is assigned to a divided region 60 that is specified as a suitable region in the divided region group of the reference image 6.
如後所述，在基板9之檢查中，進行該基板9之攝影圖像與參考圖像6之對位。在該對位中，求出參考圖像6之各分割區域60所示之圖案與和該圖案一致(或大致一致)之攝影圖像中之圖案之間之位置偏移量。為了對各分割區域60精度良好地求出位置偏移量，較佳為該分割區域60所示之圖案某種程度包含圖案凹 部63及圖案凸部64(理由將於後述之)。因此，在適性區域特定部412中，將分割區域群中凹部像素及凸部像素之個數為既定數以上之分割區域60，作為適於取得位置偏移量之處理(位置偏移量取得部413所進行之處理，以下稱為「偏移量取得處理」)之適性區域而使用。換言之，分割區域群中凹部像素及凸部像素之個數未滿既定數之分割區域60，係作為不適於偏移量取得處理之不適性區域而使用。不適性區域係分割區域群中不包含於複數個適性區域之分割區域60。 As described later, in the inspection of the substrate 9, the alignment between the photographed image of the substrate 9 and the reference image 6 is performed. In this alignment, the amount of positional deviation between the pattern shown in each divided region 60 of the reference image 6 and the pattern in the photographic image that coincides with (or substantially coincides with) the pattern is obtained. In order to obtain the positional shift amount accurately for each of the divided regions 60, it is preferable that the pattern shown in the divided region 60 includes the pattern recessed portion 63 and the pattern raised portion 64 to some extent (the reason will be described later). Therefore, in the adaptive region specifying unit 412, the divided region 60 in which the number of the concave pixels and the convex pixels in the divided region group is equal to or greater than a predetermined number is used as a process suitable for obtaining the position shift amount (position shift amount acquiring unit The processing performed by 413 is hereinafter referred to as the "offset acquisition processing"). In other words, the divided regions 60 in which the number of the concave pixels and the convex pixels in the divided region group are less than a predetermined number are used as unsuitable regions that are not suitable for the offset obtaining process. The uncomfortable area is a divided area 60 that is not included in the plurality of adaptive areas in the divided area group.
接著，在裝置本體2中，包含於對象批量之複數片基板9中之最先之基板9被載置於平台22(參照圖1)上，基板9上之既定區域係藉由平台驅動部23被配置於攝影部213之攝影區域。然後，藉由攝影部213取得顯示實際圖案之攝影圖像(以下稱為「實際圖案圖像」)，且被輸出至位置偏移量取得裝置41(步驟S13)。在實際圖案圖像中，與參考圖像6相同地，複數個像素係沿著列方向及行方向被排列。實際圖案圖像之解析度與參考圖像6之解析度相同。換言之，配合攝影部213之攝影圖像之解析度，自設計資料48生成參考圖像6。參考圖像6之一像素所示之基板9上之區域之尺寸，與實際圖案圖像之一像素所示之基板9上之區域之尺寸相同。 Next, in the device body 2, the first substrate 9 included in the plurality of substrates 9 in the target lot is placed on the stage 22 (see FIG. 1). A predetermined area on the substrate 9 is provided by the stage driving unit 23. It is arranged in a photographing area of the photographing section 213. Then, a photographed image (hereinafter referred to as an “actual pattern image”) showing an actual pattern is acquired by the imaging unit 213, and is output to the position shift amount acquisition device 41 (step S13). In the actual pattern image, as in the reference image 6, a plurality of pixels are arranged along the column direction and the row direction. The resolution of the actual pattern image is the same as that of the reference image 6. In other words, the reference image 6 is generated from the design data 48 in accordance with the resolution of the photographed image of the photographing section 213. The size of the area on the substrate 9 shown by one pixel of the reference image 6 is the same as the size of the area on the substrate 9 shown by one pixel of the actual pattern image.
在位置偏移量取得部413中，實際圖案圖像被既定之臨限值所值化，生成顯示實際圖案之二值化圖像(以下稱為「被檢查圖像」)。然後，被檢查圖像與參考圖像6之間之偏移量取得處理在作為適性區域之各分割區域60進行，而對各適性區域取得位置偏移量(步驟S14)。 In the position shift amount obtaining unit 413, the actual pattern image is valued by a predetermined threshold value, and a binary image (hereinafter referred to as a "checked image") displaying the actual pattern is generated. Then, an offset amount acquisition process between the inspected image and the reference image 6 is performed in each of the divided regions 60 that are adaptive regions, and a positional offset amount is acquired for each adaptive region (step S14).
圖11係用以說明偏移量取得處理之圖。在圖11中， 顯示相對於後述之被檢查分割區域50(以虛線之矩形來顯示)，將分割區域60(以標示平行斜線之實線矩形來顯示)朝上下左右位移而配置之情況。在本處理例中，與參考圖像6之分割區域群相同地，藉由沿著列方向及行方向分割被檢查圖像，而於被檢查圖像中，特定出對應於參考圖像6之各分割區域60之區域50(顯示與該分割區域60相同基板9上之位置之區域，以下稱為「被檢查分割區域50」)。在偏移量取得處理中，如圖11中之中央所示，在將分割區域60之整體重疊於對應於該分割區域60之被檢查分割區域50之整體之狀態下，求出分割區域60之各像素之值與和該像素重疊之被檢查圖像之像素之值的差(絕對值)。然後，作為評價值而取得相對於分割區域60整體之像素所得到之該差值的和。 FIG. 11 is a diagram for explaining offset obtaining processing. In FIG. 11, it is shown that the divided region 60 (shown by a solid rectangle with parallel oblique lines) is shifted up, down, left, and right with respect to the inspected divided region 50 (shown by a dashed rectangle) described later. In this processing example, similarly to the divided region group of the reference image 6, the image to be inspected is divided along the column direction and the row direction, and among the images to be inspected, the image corresponding to the reference image 6 is specified. An area 50 of each divided area 60 (an area showing a position on the same substrate 9 as the divided area 60, hereinafter referred to as a "inspected divided area 50"). In the offset obtaining process, as shown in the center in FIG. 11, the entire area of the divided area 60 is superimposed on the entire area of the inspected divided area 50 corresponding to the divided area 60, and the number of the divided areas 60 is obtained. The difference (absolute value) between the value of each pixel and the value of a pixel of the inspected image overlapping the pixel. Then, the sum of the difference values obtained with respect to the pixels of the entire divided area 60 is obtained as an evaluation value.
又，於被檢查圖像上，一邊將分割區域60自被檢查分割區域50之位置一次一個像素地朝上下左右(列方向及行方向)移動，一邊同樣地取得評價值。如此，以將被檢查分割區域50之中心像素設為中央之M列N行(M及N為任意整數)之像素排列之各個像素與分割區域60之中心像素重疊之方式，一邊配置分割區域60一邊取得評價值。然後，於被檢查分割區域50中，重疊有分割區域60之中心像素之複數像素中、得到成為既定之臨限值以下之評價值之像素，係作為特定像素而被特定出。在被配置於分割區域60之中心像素與特定像素重疊之位置之狀態下，分割區域60與被檢查圖像的差相對較小。 In addition, the evaluation value was obtained in the same way while moving the divided area 60 from the position of the inspected divided area 50 one pixel at a time up and down (column direction and row direction). In this way, the divided regions 60 are arranged on the side such that the pixels in the pixel array of M columns and N rows (M and N are arbitrary integers) in the center of the inspected divided region 50 are set to overlap the central pixels of the divided region 60. Get the evaluation value. Then, among the plurality of pixels in which the center pixel of the divided region 60 is superimposed in the inspected divided region 50, a pixel that has obtained an evaluation value below a predetermined threshold value is specified as a specific pixel. In a state where the central pixel of the divided area 60 overlaps a specific pixel, the difference between the divided area 60 and the inspected image is relatively small.
圖12係顯示將被檢查分割區域50之中心像素51a設為中央之5列5行之像素51之排列510(即像素排列510)之圖，並對特定像素51標示平行斜線。在作為適性區域之分割區域60之偏 移量取得處理中，複數個特定像素51係而作為特定像素群而聚集成一塊。然後，作為該分割區域60之位置偏移量，而取得自被檢查分割區域50之中心像素51a朝向特定像素群之重心位置52之向量。位置偏移量包含列方向之成分及行方向之成分，並於以下之說明中，將該等成分稱為「列方向之位置偏移量」及「行方向之位置偏移量」。如上所述，在位置偏移量取得部413中，一邊將參考圖像6之各適性區域朝上下左右移動，一邊求出該適性區域與被檢查圖像之差，藉此取得該適性區域之位置偏移量。 FIG. 12 is a diagram showing an arrangement 510 (ie, pixel arrangement 510) of the pixels 51 of 5 columns and 5 rows in the center with the central pixel 51a of the inspected divided area 50 as the center, and parallel oblique lines are marked for specific pixels 51. In the offset amount acquisition processing of the divided region 60 as the adaptive region, the plurality of specific pixels 51 are grouped together as a specific pixel group. Then, as a position shift amount of the divided region 60, a vector from the center pixel 51a of the inspected divided region 50 toward the center of gravity position 52 of the specific pixel group is obtained. The position shift amount includes a component in a row direction and a component in a row direction. In the following description, these components are referred to as a “position shift amount in a column direction” and a “position shift amount in a row direction”. As described above, in the position shift amount obtaining unit 413, while moving each of the adaptive regions of the reference image 6 up, down, left, and right, the difference between the adaptive region and the inspected image is obtained, thereby obtaining the adaptive region. Position offset.
再者，在即便配合M列N行之像素排列510之任一像素51配置分割區域60仍無法得到臨限值以下之評價值(無法取得特定像素51)之情形時，對與上述像素排列510鄰接之新像素排列，進行與上述相同之處理。在偏移量取得處理中，至取得特定像素51為止、或者至既定數量之新像素排列被設定為止，重複進行上述處理。在即便設定既定數量之新像素排列仍無法取得特定像素51之情形時，停止重複進行上述處理，例如將該分割區域60自適性區域變更為不適性區域 Furthermore, even if the divided area 60 cannot be obtained even if any of the pixels 51 of the pixel array 510 of M columns and N rows is arranged in the divided region 60 (the specific pixel 51 cannot be obtained), the pixel array 510 The adjacent new pixel array is subjected to the same processing as described above. In the offset acquisition processing, the above-mentioned processing is repeated until a specific pixel 51 is acquired or until a predetermined number of new pixel arrays are set. When a specific pixel 51 cannot be obtained even if a predetermined number of new pixel arrangements are set, the above-mentioned processing is stopped and repeated, for example, the segmented region 60 is changed from an adaptive region to an uncomfortable region.
在圖案檢查裝置1中，將各分割區域60之位置設為參數之位置偏移量之算式(以下稱為「偏移量計算式」)被預先設定。例如，在算式1之偏移量計算式中，使用圖10所示之分割區域60之中心像素之列方向之位置Xb及行方向之位置Yb，來表示列方向之位置偏移量△X及行方向之位置偏移量△Y。於算式1中，αx、βx、γx、αy、βy、γy為係數。 In the pattern inspection apparatus 1, a calculation formula (hereinafter referred to as a “shift amount calculation formula”) of the position shift amount using the position of each divided region 60 as a parameter is set in advance. For example, in the offset calculation formula of Formula 1, the position Xb in the column direction and the position Yb in the row direction of the center pixel of the divided region 60 shown in FIG. 10 are used to indicate the position offset ΔX and Position shift amount ΔY in the row direction. In Equation 1, αx, βx, γx, αy, βy, and γy are coefficients.
[算式1]△X=αx‧Xb+βx‧Yb+γx △Y=αy‧Xb+βy‧Yb+γy [Equation 1] △ X = αx‧Xb + βx‧Yb + γx △ Y = αy‧Xb + βy‧Yb + γy
在位置偏移量算出部414中，根據複數個適性區域之位置(圖10中之附加平行斜線之分割區域60之位置)、及藉由位置偏移量取得部413所取得之該複數個適性區域之位置偏移量，來求出偏移量計算式之係數αx、βx、γx、αy、βy、γy(的值)(步驟S15)。例如，該等係數係藉由最小平方法來求出。最小平方法在從算式1所導出之算式2中，複數個適性區域中之中心像素之列方向之位置Xb及行方向之位置Yb、以及列方向之位置偏移量△X及行方向之位置偏移量△Y被代入。然後，算式2之Ex及Ey便由最小之係數αx。βx、γx、αy、βy、γy所求出。 In the position shift amount calculation unit 414, based on the positions of the plurality of suitability regions (the positions of the divided regions 60 with parallel oblique lines in FIG. 10) and the plurality of suitability obtained by the position shift amount acquisition unit 413, The positional shift amount of the area is used to obtain the coefficients αx, βx, γx, αy, βy, and γy (values) of the shift amount calculation formula (step S15). For example, these coefficients are obtained by the least square method. In the least square method in Equation 2 derived from Equation 1, the position of the central pixel in the column direction Xb and the row direction position Yb in the plurality of adaptive regions, and the position offset △ X in the column direction and the position in the row direction The offset amount ΔY is substituted. Then, Ex and Ey in Equation 2 have the smallest coefficient αx. βx, γx, αy, βy, and γy are obtained.
[算式2]Ex=Σ(αx‧Xb+βx‧Yb+γx-△X)2 Ey=Σ(αy‧Xb+βy‧Yb+γy-△Y)2 [Equation 2] Ex = Σ (αx‧Xb + βx‧Yb + γx- △ X) 2 Ey = Σ (αy‧Xb + βy‧Yb + γy- △ Y) 2
若偏移量計算式之係數被求出，各個不適性區域(圖10中之白色分割區域60)之中心像素之列方向之位置Xb及行方向之位置Yb，便被代入偏移量計算式。藉此，對該不適性區域，求出列方向之位置偏移量△X及行方向之位置偏移量△Y(步驟S16)。如前所述般，偏移量計算式之係數αx、βx、γx、αy、βy、γy係根據複數個適性區域之位置偏移量、以及該複數個適性區域之列方向及行方向之位置來求出。又，不適性區域之位置偏移量係使用該不適性區域之列方向及行方向之位置，而藉由偏移量計算式所求出。因此，不適性區域之位置偏移量，實質上可視為係根據複數個適性區域之位置偏移量、及不適性區域與複數個適性區域之位置關係所求出。 If the coefficient of the offset calculation formula is obtained, the position Xb in the column direction and the position Yb in the row direction of the center pixel of each uncomfortable area (the white divided area 60 in FIG. 10) are substituted into the offset calculation formula. . Thereby, the positional shift amount ΔX in the column direction and the positional shift amount ΔY in the row direction are obtained for the uncomfortable area (step S16). As mentioned above, the coefficients αx, βx, γx, αy, βy, and γy of the offset calculation formula are based on the position offsets of the plurality of adaptive regions, and the positions of the column directions and the row directions of the plurality of adaptive regions. Come to find out. In addition, the position shift amount of the uncomfortable area is obtained by using the shift amount calculation formula using the position in the column direction and the row direction of the uncomfortable area. Therefore, the positional shift amount of the uncomfortable area can be substantially determined as the position shift amount of the plurality of adaptive areas and the positional relationship between the uncomfortable area and the plurality of adaptive areas.
於檢查部42中，例如在將參考圖像6之各分割區域60之中心像素配置於自對應之被檢查分割區域50之中心像素51a僅移動該分割區域60之位置偏移量之位置之狀態下，來取得顯示該分割區域60與被檢查圖像之差異之差分區域圖像。差分區域圖像係於已被對位之參考圖像6及被檢查圖像中，顯示分割區域60之各像素之值與和該像素重疊之被檢查圖像之像素之值之互斥或(exclusive or；XOR)的二值化圖像。差分區域圖像顯示缺線候補像素。於相互鄰接之缺陷候補像素之集合之大小較既定之面積臨限值大之情形時，該缺陷候補像素之集合係作為缺陷區域而被檢出。 In the inspection unit 42, for example, a state in which the center pixel of each divided region 60 of the reference image 6 is arranged at a position shifted only by the position shift amount of the corresponding divided region 60 from the center pixel 51 a of the corresponding inspected divided region 50. Next, a difference area image showing the difference between the divided area 60 and the image under inspection is acquired. The difference area image is a mutually exclusive or (in the reference image 6 and the inspected image that has been aligned, showing the values of the pixels of the divided area 60 and the values of the pixels of the inspected image that overlap the pixel or ( exclusive or; XOR). The difference area image shows missing line candidate pixels. When the size of the set of adjacent defective candidate pixels is larger than a predetermined area threshold, the set of defective candidate pixels is detected as a defective area.
在檢查部42之處理之另一例中，於被檢查圖像之各位置，作為圖案之寬度或背景寬度而取得圖案區域之寬度或背景區域之寬度。又，在圖案檢查裝置1中，相對於參考圖像6之各位置設定有寬度之臨限值，於已被對位之參考圖像6及被檢查圖像中，取得與被檢查圖像之各位置重疊之參考圖像6之位置之臨限值。然後，將被檢查圖像之該位置之圖案寬度或背景寬度，與該臨限值進行比較，藉此判定被檢查圖像之該位置是否為缺陷。如以上所述，在檢查部42中，使用各分割區域60之位置偏移量，而一邊進行參考圖像6及被檢查圖像之對位，一邊取得相對被檢查圖像之檢查結果(步驟S17)。 In another example of the processing performed by the inspection unit 42, the width of the pattern area or the width of the background area is obtained as the pattern width or the background width at each position of the inspected image. Further, in the pattern inspection device 1, threshold values of widths are set with respect to each position of the reference image 6, and the reference image 6 and the inspected image which have been aligned acquire and compare with the inspected image. Threshold value of the position of the reference image 6 where the positions overlap. Then, the pattern width or background width of the position of the inspected image is compared with the threshold value, thereby determining whether the position of the inspected image is a defect. As described above, the inspection unit 42 uses the position shift amount of each of the divided areas 60 to obtain the inspection result with respect to the inspected image while aligning the reference image 6 and the inspected image (step S17).
若對最先之基板9之檢查結束，包含於對象批量之第2片基板9便藉由攝影部213所拍攝，而取得被檢查圖像(步驟S18、S13)。接著，與上述同樣地，取得適性區域之位置偏移量，來求出偏移量計算式之係數(步驟S14、S15)。包含於對象批量之複數片基板9由於基於相同之設計資料48，因此分割區域群之適性區域在複 數片基板9中皆相同。然後，取得不適性區域之位置偏移量，並自已被定位之參考圖像6及被檢查圖像取得檢查結果(步驟S16、S17)。若對包含於對象批量之所有基板9進行上述步驟S13~S17之處理，圖案檢查裝置1之處理便結束(步驟S18)。 When the inspection of the first substrate 9 is completed, the second substrate 9 included in the target lot is captured by the imaging unit 213 to obtain an image to be inspected (steps S18 and S13). Next, in the same manner as described above, the position shift amount of the adaptive region is obtained, and the coefficient of the shift amount calculation formula is obtained (steps S14 and S15). Since the plurality of substrates 9 included in the target lot are based on the same design data 48, the appropriate regions of the divided region group are the same in the plurality of substrates 9. Then, the position shift amount of the uncomfortable area is obtained, and the inspection results are obtained from the reference image 6 and the inspected image that have been positioned (steps S16, S17). If the above-mentioned steps S13 to S17 are performed on all the substrates 9 included in the target lot, the processing of the pattern inspection device 1 ends (step S18).
此處，說明對分割區域群之所有分割區域60進行偏移量取得處理之比較例之圖案檢查裝置。在比較例之圖案檢查裝置中，例如亦對圖9之3個分割區域60進行偏移量取得處理。圖9之上段、中段及下段之分割區域60之圖案，分別僅由朝列方向、行方向及傾斜方向延伸之直線狀圖案要素所構成。因此，如圖13之上段、中段及下段所示，在以被檢查分割區域50之中心像素51a為中央之M列N行之像素排列510中，標示平行斜線之特定像素51分別沿著列方向、行方向及傾斜方向排成一列。其結果，難以正確地取得特定像素51所排列方向之位置偏移量。假如，即便作為位置偏移量而取得自被檢查分割區域50之中心像素51a朝向特定像素群中之重心位置之向量，該位置偏移量之可靠性也很低，而會於檢查部42所檢查之該分割區域60之檢查結果中，經常出現將並非為缺陷之部位作為缺陷而檢出之錯誤資訊。於分割區域60顯示在一方向上具有周期性之其他圖案之情形時亦相同。 Here, a pattern inspection device of a comparative example that performs offset amount acquisition processing on all the divided regions 60 of the divided region group will be described. In the pattern inspection device of the comparative example, for example, the offset acquisition process is also performed on the three divided regions 60 in FIG. 9. The patterns of the divided regions 60 in the upper, middle, and lower sections of FIG. 9 are each composed of only linear pattern elements extending in the column direction, the row direction, and the oblique direction. Therefore, as shown in the upper, middle, and lower sections of FIG. 13, in the pixel arrangement 510 of M columns and N rows centered on the center pixel 51a of the segmentation area 50 to be inspected, the specific pixels 51 marked with parallel oblique lines are respectively along the column direction , Row direction and oblique direction. As a result, it is difficult to accurately obtain the position shift amount in the direction in which the specific pixels 51 are arranged. If the vector obtained from the center pixel 51a of the segmentation area 50 to be inspected as the position shift amount is directed to the position of the center of gravity in the specific pixel group, the reliability of the position shift amount is very low, and will be obtained by the inspection section 42. In the inspection result of the divided area 60 to be inspected, there is often an error message that a portion that is not a defect is detected as a defect. The same applies when the divided area 60 displays other patterns having periodicity in one direction.
相對於此，包含圖案凹部63或圖案凸部64之分割區域60之圖案，不會僅為朝一方向延伸之直線狀之圖案要素。換言之，在凹部像素或凸部像素被檢出之分割區域60(參照圖8)中，該凹部像素或凸部像素成為該分割區域60所示之圖案之特徵點，而使特定像素51於上述M列N行之像素排列510中難以排成一列。實際上，包含於各分割區域60之凹部像素及凸部像素之個數、即 特徵點之個數越多，便越難使特定像素51排成一列，凹部像素及凸部像素之個數表示該分割區域60之對偏移量取得處理之適性度。 On the other hand, the pattern of the divided area 60 including the pattern concave portion 63 or the pattern convex portion 64 is not merely a linear pattern element extending in one direction. In other words, in the divided region 60 (refer to FIG. 8) in which the concave or convex pixel is detected, the concave or convex pixel becomes a characteristic point of the pattern shown in the divided region 60, and the specific pixel 51 is placed in the above-mentioned manner. It is difficult to arrange a pixel array 510 in M columns and N rows. In fact, the more the number of concave pixels and convex pixels included in each divided area 60, that is, the greater the number of feature points, the more difficult it is to arrange specific pixels 51 in a row. The number of concave pixels and convex pixels is expressed The degree of suitability of the division area 60 for the offset acquisition processing.
在圖案檢查裝置1中，藉由求出各分割區域60相對於偏移量取得處理之適性度，而自分割區域群特定出複數個適性區域，並藉由偏移量取得處理來取得各適性區域之位置偏移量。然後，對不適性區域，根據複數個適性區域之位置偏移量、及不適性區域與複數個適性區域之位置關係，來求出位置偏移量。如此，使用適於偏移量取得處理之適性區域之位置偏移量來求出不適於偏移量取得處理之不適性區域之位置偏移量，藉此可精度良好地求出參考圖像6及被檢查圖像之各分割區域60之位置偏移量。又，由於僅對複數個適性區域進行偏移量取得處理，因此相較於對所有分割區域60進行偏移量取得處理之情形，可減少位置偏移量取得部413之處理量，亦即，可縮短位置偏移量之取得所需要之時間。 In the pattern inspection device 1, the suitability of each divided region 60 with respect to the offset acquisition process is obtained, and a plurality of adaptive regions are specified from the divided region group, and the respective suitability is acquired by the offset acquisition process. The position offset of the area. Then, for the uncomfortable area, the position shift amount is obtained based on the positional shift amounts of the plurality of adaptive regions and the positional relationship between the uncomfortable region and the plurality of adaptive regions. In this way, the position offset of the unsuitable region that is not suitable for the offset acquisition process is obtained by using the position offset of the appropriate region that is suitable for the offset acquisition process, so that the reference image 6 can be accurately obtained. And the amount of positional deviation of each of the divided areas 60 of the image under inspection. In addition, since the offset acquisition processing is performed only on a plurality of adaptive regions, the processing amount of the position offset acquisition unit 413 can be reduced compared to the case where the offset acquisition processing is performed on all the divided regions 60, that is, The time required to obtain the position offset can be shortened.
又，在偏移量取得處理中，一邊將參考圖像6之各適性區域朝上下左右移動，一邊求出該適性區域與被檢查圖像的差。藉此，可容易地取得該適性區域之位置偏移量。此外，將各分割區域60之位置設為參數之偏移量計算式被預先設定，根據複數個適性區域之位置偏移量、及該複數個適性區域之位置，來求出偏移量計算式之係數。藉此，可迅速地求出不適性區域之位置偏移量。 In the shift amount acquisition process, the difference between the adaptive region and the image under test is obtained while moving each adaptive region of the reference image 6 up, down, left, and right. This makes it possible to easily obtain the position shift amount of the adaptive region. In addition, an offset calculation formula that sets the position of each divided region 60 as a parameter is set in advance, and the offset calculation formula is obtained based on the position offsets of the plurality of adaptive regions and the positions of the plurality of adaptive regions. Coefficient. Thereby, the position shift amount of the uncomfortable area can be quickly obtained.
在檢查部42中，使用各分割區域60之位置偏移量，一邊進行參考圖像6及被檢查圖像之對位，一邊取得對被檢查圖像之檢查結果。此時，藉由對每個分割區域60進行參考圖像6及被檢查圖像之對位，可精度良好地取得(減少錯誤資訊)被檢查圖像之檢查結果。 The inspection unit 42 uses the positional shift amount of each of the divided areas 60 to obtain the inspection result of the inspection image while aligning the reference image 6 and the inspection image. At this time, by aligning the reference image 6 and the inspected image for each of the divided regions 60, the inspection result of the inspected image can be accurately obtained (reduced error information).
在上述位置偏移量取得裝置41及圖案檢查裝置1中可進行各種變形。 Various modifications can be made in the above-mentioned position shift amount acquisition device 41 and pattern inspection device 1.
在適性區域特定部412中，雖將凹部像素及凸部像素作為特徵點，而對包含於各分割區域60所示之圖案之特徵點進行檢測，藉此實現容易地求出該分割區域60對偏移量取得處理之適性度，但特徵點亦可為凹部像素及凸部像素以外。例如，於各分割區域60所示之圖案中，亦可將作為圖案要素之多邊形圖形之頂點、或圖案要素之邊緣之曲線部(不含直線)作為特徵點而進行處理。此外，適性度亦可藉由特徵點之檢測以外之方法來求出。 In the adaptive region specifying unit 412, although the concave pixels and the convex pixels are used as feature points, the feature points included in the pattern shown in each divided region 60 are detected, thereby achieving easy calculation of the pair of divided regions 60. The offset obtains the suitability of the process, but the characteristic points may be other than the concave pixels and the convex pixels. For example, in the pattern shown in each of the divided regions 60, a vertex of a polygonal figure as a pattern element or a curved portion (excluding a straight line) of an edge of the pattern element may be processed as a feature point. In addition, the degree of fitness can also be determined by methods other than the detection of feature points.
在圖像分割部411中，亦可取得被檢查圖像之分割區域群。於該情形時，進行自該分割區域群特定出複數個適性區域來求出各適性區域與參考圖像6的差之偏移量取得處理。如上所述，在圖案檢查裝置1中，對被檢查圖像及參考圖像6之2個圖像中之一圖像進行分割來取得分割區域群，而自該分割區域群特定出適於偏移量取得處理之複數個適性區域。又，在偏移量取得處理中，一邊將該一圖像之各適性區域朝上下左右移動，一邊求出該適性區域與該2個圖像中之另一圖像的差，藉此取得該適性區域之位置偏移量。 The image segmentation unit 411 may also obtain a segmented area group of the image to be inspected. In this case, a plurality of adaptive regions are specified from the divided region group to obtain an offset amount of the difference between each adaptive region and the reference image 6. As described above, in the pattern inspection apparatus 1, one of two images of the inspected image and the reference image 6 is divided to obtain a segmented area group, and the segmented area group is specified to be suitable for the biased area. A plurality of adaptive regions are processed by the displacement acquisition process. Further, in the offset acquisition process, the respective adaptive regions of the one image are moved up, down, left, and right, and the difference between the adaptive region and the other of the two images is obtained to obtain the difference. Position offset of the adaptive region.
另一方面，在藉由拍攝基板9所取得之被檢查圖像中包含有缺陷等之情形時，會無法精度良好地求出分割區域之適性度。因此，就精度良好地求出各分割區域之適性度之觀點而言，較佳為自顯示設計圖案之設計資料48所導出之參考圖像6取得分割區域群。又，於複數片基板9中，在根據相同之設計資料48而形成有實際圖案之情形時，藉由自該設計資料48所導出之參考圖像6 取得分割區域群，可對複數片基板9之被檢查圖像，使用相同之適性區域，而效率良好地進行複數片基板9之檢查。 On the other hand, in the case where a defect or the like is included in the inspected image obtained by capturing the substrate 9, it is impossible to accurately determine the suitability of the divided region. Therefore, from the viewpoint of accurately determining the suitability of each divided region, it is preferable to obtain the divided region group from the reference image 6 derived from the design data 48 of the display design pattern. Moreover, in the case where an actual pattern is formed in the plurality of substrates 9 based on the same design data 48, the division area group can be obtained by using the reference image 6 derived from the design data 48, and the plurality of substrates 9 can be obtained. For the images to be inspected, the inspection of the plurality of substrates 9 is performed efficiently using the same adaptive region.
作為取得2個圖像間之位置偏移量之偏移量取得處理，亦可使用參照圖11及圖12所說明之方法以外之方法。在偏移量取得處理中，可採用有關圖案匹配(Pattern matching)之各種方法(例如，正規化相關匹配法(Normalized Correlation method)等)。 As the offset amount obtaining process for obtaining the positional offset amount between the two images, a method other than the method described with reference to FIGS. 11 and 12 may be used. In the offset obtaining process, various methods related to pattern matching (for example, a normalized correlation method, etc.) can be adopted.
在上述實施形態中，雖取得將實際圖案圖像值化所得之被檢查圖像與二值化之參考圖像6之間之位置偏移量，但在偏移量取得處理中，作為被檢查圖像亦可使用多層次之實際圖案圖像。於該情形時，例如作為參考圖像而生成對圖案區域61及背景區域62分別賦予被檢查圖像之圖案區域之平均值及背景區域之平均值所得之設計圖案之圖像。然後，於多層次之被檢查圖像及該參考圖像中，進行利用位置偏移量取得裝置41之上述處理。於檢查部42中亦可同樣地，取得對多層次之被檢查圖像之檢查結果。 In the above embodiment, although the position shift amount between the inspected image obtained by digitizing the actual pattern image and the binarized reference image 6 is obtained, it is regarded as the inspected in the shift amount acquisition process. The image can also use multiple layers of actual pattern images. In this case, for example, an image of a design pattern obtained by assigning the average value of the pattern region and the average value of the background region to the pattern region 61 and the background region 62 as the reference image is generated as a reference image. Then, the above-mentioned processing using the position shift amount obtaining device 41 is performed on the multi-layered inspected image and the reference image. Similarly, the inspection unit 42 can obtain inspection results for a multi-level inspection image.
算式1之偏移量計算式僅為一例，亦可使用二次或高次之算式。又，在位置偏移量算出部414中，亦可不使用偏移量計算式來求出不適性區域之位置偏移量。例如，亦可藉由使用位於各不適性區域之周圍之多個適性區域之位置偏移量、及該等適性區域與該不適性區域之位置關係之差值運算，來求出該不適性區域之位置偏移量。 The offset calculation formula of Formula 1 is only an example, and a quadratic or higher-order formula can also be used. In addition, the position shift amount calculation unit 414 may obtain the position shift amount of the uncomfortable area without using the shift amount calculation formula. For example, the uncomfortable area can also be calculated by using the position offset of a plurality of uncomfortable areas located around each uncomfortable area and the positional relationship between the appropriate area and the uncomfortable area. The position offset.
作為圖案檢查裝置1之檢查對象之基板，亦可為半導體基板或玻璃基板等。又，在圖案檢查裝置1中，除了基板以外，亦可對薄膜狀之對象物或立體狀之對象物等進行檢查。 The substrate to be inspected by the pattern inspection device 1 may be a semiconductor substrate, a glass substrate, or the like. In addition, in the pattern inspection device 1, in addition to a substrate, a thin-film object, a three-dimensional object, and the like can be inspected.
求出2個圖像之位置偏移量之位置偏移量取得裝置 41，亦可用於描繪裝置等，而可用於取得各種類之圖像之位置偏移量。 The position offset obtaining device 41 for obtaining the position offset of the two images can also be used for a drawing device and the like, and can be used to obtain the position offset of various types of images.
上述實施形態及各變形例之構成只要不相互矛盾即可適當地加以組合。 The configurations of the above-described embodiment and each modification can be appropriately combined as long as they do not contradict each other.
雖已對發明詳細地描述而進行說明，但前述之說明係僅為例示而非用以限定者。因此，只要不脫離本發明之範圍，即可實現多種之變形與態樣。 Although the invention has been described in detail, the foregoing description is for illustration only and is not intended to be limiting. Therefore, without departing from the scope of the present invention, various modifications and aspects can be realized.
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