TWI663895B - 用以形成微細介層孔的印刷電路板用樹脂疊層體及在樹脂絕緣層設有微細介層孔的多層印刷電路板與其製造方法 - Google Patents

用以形成微細介層孔的印刷電路板用樹脂疊層體及在樹脂絕緣層設有微細介層孔的多層印刷電路板與其製造方法 Download PDF

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Publication number
TWI663895B
TWI663895B TW104117710A TW104117710A TWI663895B TW I663895 B TWI663895 B TW I663895B TW 104117710 A TW104117710 A TW 104117710A TW 104117710 A TW104117710 A TW 104117710A TW I663895 B TWI663895 B TW I663895B
Authority
TW
Taiwan
Prior art keywords
resin
insulating layer
circuit board
printed circuit
laser
Prior art date
Application number
TW104117710A
Other languages
English (en)
Chinese (zh)
Other versions
TW201611670A (zh
Inventor
鈴木卓也
Original Assignee
日商三菱瓦斯化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱瓦斯化學股份有限公司 filed Critical 日商三菱瓦斯化學股份有限公司
Publication of TW201611670A publication Critical patent/TW201611670A/zh
Application granted granted Critical
Publication of TWI663895B publication Critical patent/TWI663895B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW104117710A 2014-06-03 2015-06-02 用以形成微細介層孔的印刷電路板用樹脂疊層體及在樹脂絕緣層設有微細介層孔的多層印刷電路板與其製造方法 TWI663895B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-115093 2014-06-03
JP2014115093 2014-06-03

Publications (2)

Publication Number Publication Date
TW201611670A TW201611670A (zh) 2016-03-16
TWI663895B true TWI663895B (zh) 2019-06-21

Family

ID=54766781

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104117710A TWI663895B (zh) 2014-06-03 2015-06-02 用以形成微細介層孔的印刷電路板用樹脂疊層體及在樹脂絕緣層設有微細介層孔的多層印刷電路板與其製造方法

Country Status (5)

Country Link
JP (1) JP6551405B2 (ko)
KR (1) KR102126109B1 (ko)
CN (1) CN106416437A (ko)
TW (1) TWI663895B (ko)
WO (1) WO2015186712A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018181742A1 (ja) 2017-03-31 2020-02-13 三菱瓦斯化学株式会社 プリント配線板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186719A (ja) * 1997-12-19 1999-07-09 Hitachi Chem Co Ltd 多層配線板の製造方法
JP2000022297A (ja) * 1998-06-30 2000-01-21 Kyocera Corp 配線基板およびその製造方法
JP2002313914A (ja) * 2001-04-18 2002-10-25 Sony Corp 配線形成方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
TWI352565B (ko) * 2004-02-04 2011-11-11 Ibiden Co Ltd

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Publication number Priority date Publication date Assignee Title
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
JP3899544B2 (ja) 1996-03-06 2007-03-28 日立化成工業株式会社 多層配線板の製造方法
JPH11140275A (ja) * 1997-11-11 1999-05-25 Sumitomo Chem Co Ltd 多官能シアン酸エステル樹脂組成物およびプリント配線板
JPH11342492A (ja) * 1998-05-29 1999-12-14 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザー孔あけ用補助シート
JPH11330667A (ja) * 1998-05-12 1999-11-30 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザー孔あけ用補助材料
JP2001007535A (ja) 1999-06-17 2001-01-12 Mitsubishi Gas Chem Co Inc 信頼性に優れたスルーホールを有する多層プリント配線板の製造方法
JP4300687B2 (ja) 1999-10-28 2009-07-22 味の素株式会社 接着フィルムを用いた多層プリント配線板の製造法
JP4683758B2 (ja) 2001-04-26 2011-05-18 京セラ株式会社 配線基板の製造方法
DE50108246D1 (de) 2001-09-01 2006-01-05 Trumpf Lasertechnik Gmbh Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte
JP4707289B2 (ja) 2001-09-27 2011-06-22 京セラ株式会社 多層配線基板の製造方法
KR100443375B1 (ko) * 2001-12-28 2004-08-09 삼성전기주식회사 빌드업 다층 인쇄회로기판의 제조방법
JP2003231762A (ja) * 2002-02-13 2003-08-19 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2005005283A (ja) 2003-06-09 2005-01-06 Mitsubishi Gas Chem Co Inc レーザー孔あけ補助シート
JP4817733B2 (ja) * 2005-07-06 2011-11-16 富士通株式会社 金属表面処理液、積層体および積層体の製造方法
JP2007307599A (ja) 2006-05-20 2007-11-29 Sumitomo Electric Ind Ltd スルーホール成形体およびレーザー加工方法
KR101960247B1 (ko) 2007-11-22 2019-03-21 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조 방법
EP2925482A1 (en) * 2012-11-29 2015-10-07 Corning Incorporated Sacrificial cover layers for laser drilling substrates and methods thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186719A (ja) * 1997-12-19 1999-07-09 Hitachi Chem Co Ltd 多層配線板の製造方法
JP2000022297A (ja) * 1998-06-30 2000-01-21 Kyocera Corp 配線基板およびその製造方法
JP2002313914A (ja) * 2001-04-18 2002-10-25 Sony Corp 配線形成方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
TWI352565B (ko) * 2004-02-04 2011-11-11 Ibiden Co Ltd

Also Published As

Publication number Publication date
CN106416437A (zh) 2017-02-15
JPWO2015186712A1 (ja) 2017-04-20
WO2015186712A1 (ja) 2015-12-10
KR20170012228A (ko) 2017-02-02
KR102126109B1 (ko) 2020-06-23
JP6551405B2 (ja) 2019-07-31
TW201611670A (zh) 2016-03-16

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