TWI598889B - Conductive particles with insulating particles, conductive material, and connection structure - Google Patents

Conductive particles with insulating particles, conductive material, and connection structure Download PDF

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Publication number
TWI598889B
TWI598889B TW102143594A TW102143594A TWI598889B TW I598889 B TWI598889 B TW I598889B TW 102143594 A TW102143594 A TW 102143594A TW 102143594 A TW102143594 A TW 102143594A TW I598889 B TWI598889 B TW I598889B
Authority
TW
Taiwan
Prior art keywords
particles
conductive
insulating
insulating particles
conductive particles
Prior art date
Application number
TW102143594A
Other languages
English (en)
Chinese (zh)
Other versions
TW201423766A (zh
Inventor
Shigeo Mahara
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201423766A publication Critical patent/TW201423766A/zh
Application granted granted Critical
Publication of TWI598889B publication Critical patent/TWI598889B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW102143594A 2012-11-28 2013-11-28 Conductive particles with insulating particles, conductive material, and connection structure TWI598889B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012259824 2012-11-28

Publications (2)

Publication Number Publication Date
TW201423766A TW201423766A (zh) 2014-06-16
TWI598889B true TWI598889B (zh) 2017-09-11

Family

ID=50827809

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143594A TWI598889B (zh) 2012-11-28 2013-11-28 Conductive particles with insulating particles, conductive material, and connection structure

Country Status (5)

Country Link
JP (1) JP5530571B1 (fr)
KR (1) KR102095291B1 (fr)
CN (1) CN104584141B (fr)
TW (1) TWI598889B (fr)
WO (1) WO2014084173A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107148653B (zh) 2014-12-04 2019-03-29 积水化学工业株式会社 导电糊剂、连接结构体及连接结构体的制造方法
KR102529562B1 (ko) * 2015-05-20 2023-05-09 세키스이가가쿠 고교가부시키가이샤 도전성 점착재 및 도전성 기재 부착 도전성 점착재
WO2017010445A1 (fr) * 2015-07-14 2017-01-19 積水化学工業株式会社 Matériau conducteur et structure de connexion
KR102624796B1 (ko) * 2015-09-24 2024-01-12 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료, 및 접속 구조체
CN111971757B (zh) * 2018-04-04 2023-03-14 积水化学工业株式会社 导电性粒子、其制造方法、导电材料及连接结构体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3103956B2 (ja) * 1993-06-03 2000-10-30 ソニーケミカル株式会社 異方性導電膜
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
US20100025089A1 (en) * 2004-01-07 2010-02-04 Jun Taketatsu Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
JP4380327B2 (ja) * 2004-01-07 2009-12-09 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP4993880B2 (ja) * 2005-07-06 2012-08-08 旭化成イーマテリアルズ株式会社 異方導電性接着シート及び微細接続構造体
JP4472779B2 (ja) * 2008-03-21 2010-06-02 積水化学工業株式会社 硬化性組成物、異方性導電材料及び接続構造体
JP4386145B2 (ja) * 2009-05-08 2009-12-16 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP4386146B2 (ja) * 2009-05-08 2009-12-16 日立化成工業株式会社 フィルム状回路接続材料、回路部材の接続構造及びその製造方法
KR101222375B1 (ko) * 2009-09-08 2013-01-15 세키스이가가쿠 고교가부시키가이샤 절연 입자 부착 도전성 입자, 절연 입자 부착 도전성 입자의 제조 방법, 이방성 도전 재료 및 접속 구조체
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体
WO2012137335A1 (fr) * 2011-04-07 2012-10-11 日立化成工業株式会社 Matériau de connexion de circuit et son utilisation, et structure de connexion et son procédé de production
JP5698080B2 (ja) * 2011-06-28 2015-04-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体

Also Published As

Publication number Publication date
TW201423766A (zh) 2014-06-16
KR20150090018A (ko) 2015-08-05
CN104584141B (zh) 2017-04-12
KR102095291B1 (ko) 2020-03-31
CN104584141A (zh) 2015-04-29
JP5530571B1 (ja) 2014-06-25
JPWO2014084173A1 (ja) 2017-01-05
WO2014084173A1 (fr) 2014-06-05

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