TWI598222B - 殼體、該殼體的製備方法及應用該殼體的電子裝置 - Google Patents
殼體、該殼體的製備方法及應用該殼體的電子裝置 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title description 2
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 21
- -1 polyethylene terephthalate Polymers 0.000 claims description 21
- 239000010410 layer Substances 0.000 claims description 17
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 12
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 5
- 229920000768 polyamine Polymers 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004922 lacquer Substances 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000004626 polylactic acid Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 150000004702 methyl esters Chemical class 0.000 claims description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims 1
- NXDJCCBHUGWQPG-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;terephthalic acid Chemical compound OCC1CCC(CO)CC1.OC(=O)C1=CC=C(C(O)=O)C=C1 NXDJCCBHUGWQPG-UHFFFAOYSA-N 0.000 claims 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims 1
- 229920000747 poly(lactic acid) Polymers 0.000 claims 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0073—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor of non-flat surfaces, e.g. curved, profiled
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/04—Polymers of ethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
- B29K2033/04—Polymers of esters
- B29K2033/12—Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/003—PET, i.e. poylethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/006—PBT, i.e. polybutylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Casings For Electric Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
本發明涉及一種殼體、該殼體的製備方法及應用該殼體的電子裝置。
隨著現代電子技術的不斷進步和發展,電子裝置取得了相應的發展,同時消費者們對於產品外觀的要求也越來越高。由於金屬殼體在外觀、機構強度、散熱效果等方面具有優勢,故,越來越多的廠商設計出具有金屬殼體的電子裝置來滿足消費者的需求。
但,當殼體僅由金屬構成時,該電子裝置的品質較重,導致該電子裝置的握持感較差。其次,需採用電腦數位控製機床(Computer Numerical Control,CNC)對該金屬殼體進行加工,從而於該金屬殼體內部切削出複雜的內部結構。該CNC處理過程耗時較長,並產生較多的金屬廢料,造成資源浪費。
有鑑於此,有必要提供多種殼體的製備方法及由該方法製得的複合體。
一種殼體,包括金屬基體及依次形成於該金屬基體表面的黏結層與樹脂薄膜,該金屬基體、該黏結層及該樹脂薄膜通過衝壓成型處理後共同形成有一容納腔,該樹脂薄膜位於該容納腔內,該容納腔內通過注塑形成有該殼體所需的內部構件,所述內部構件形成於所述樹脂薄膜上。
一種殼體的製備方法,其包括如下步驟:提供一金屬基體;
於該金屬基體的表面形成一黏結層;於該黏結層上放置一透明的樹脂薄膜後採用紫外光照射該樹脂薄膜以使該黏結層固化;對該形成有黏結層與樹脂薄膜的金屬基體進行衝壓成型處理從而形成一容納腔,且該樹脂薄膜位於該容納腔內;於該容納腔內注塑塑膠,從而於該樹脂薄膜上形成該殼體所需的內部構件。
相較於習知技術,該殼體的製備過程中,無需使用CNC對金屬基體進行切削以形成殼體所需的內部構件,而採用注塑的方式於金屬基體內表面的樹脂薄膜上形成內部構件,不僅金屬資源,還使得該殼體具有金屬外觀、品質較輕的優點。
100‧‧‧電子裝置
10‧‧‧殼體
30‧‧‧本體
11‧‧‧金屬基體
13‧‧‧黏合層
15‧‧‧樹脂薄膜
111‧‧‧容納腔
圖1為本發明一較佳實施方式電子裝置的示意圖。
圖2為圖1所示電子裝置一較佳實施方式殼體的示意圖。
圖3為圖2所示殼體的沿VI~VI線的剖示圖。
請參閱圖1,本發明第一較佳實施例的電子裝置100,可以是但不限於為手機、PDA(Personal Digital Assistant)、平板電腦。所述電子裝置100包括殼體10及裝設於該殼體10上的本體30。
可以理解的,所述電子裝置100還可包括電池(未圖示)及電路板(未圖示)。該電池設置於該本體30上,並與該電路板電性連接。
所述殼體10包括金屬基體11及依次形成於該金屬基體11表面的黏結層13及樹脂薄膜15。該樹脂薄膜15通過該黏結層13與該金屬基體11牢固連接。該樹脂薄膜15及該黏結層13均具有與該金屬基體11相匹配的形狀。
所述金屬基體11的厚度可為0.4~0.8mm。所述金屬基體11的材質可為不銹鋼、鐵、鋁、鋁合金、銅、銅合金、鈦、鈦合金、鎂或鎂合金等。
所述黏結層13的材質可為紫外光固化漆,其厚度可為0.05mm~0.1mm。該黏結層13具有較佳的韌性。
所述樹脂薄膜15的材質可為聚碳酸酯(PC)、聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、聚甲基丙烯酸甲酯(PMMA)或聚乳酸(PLA)。該樹脂薄膜15的厚度可為0.05mm~0.2mm。該樹脂薄膜15具有較佳的韌性。
形成有黏結層13與樹脂薄膜15的金屬基體11通過衝壓成型處理後發生變形從而形成該殼體10所需的形狀。由於樹脂薄膜15及黏結層13均具有較佳的韌性,且樹脂薄膜15通過黏結層13與金屬基體11牢固結合,使得樹脂薄膜15及黏結層13在該金屬基體11發生變形時也會發生變形,並在變形過程中牢固黏合於金屬基體11的表面,從而形成與金屬基體11發生變形後相匹配的形狀。該金屬基體11、黏結層13及樹脂薄膜15發生變形後共同形成有一容納腔111。
所述容納腔111中通過注塑成型處理形成有若干殼體10所需的內部結構(未圖示)。所述內部構件形成於該樹脂薄膜15上。
所述內部構件的材質可為聚對苯二甲酸丁二醇酯(PBT)、聚苯硫醚(PPS)、聚醯胺(PA)、聚丙烯(PP)、聚碳酸酯(PC)、丙烯腈-苯乙烯-丁二烯共聚物(ABS)、熱塑性聚氨酯彈性體(TPU)、聚對苯二甲酸乙二醇酯(PET)或聚對苯二甲酸1,4-環己烷二甲醇酯(PCT)等。
本發明第一較佳實施例的殼體10的製備方法主要包括如下步驟:
提供一金屬基體11。該金屬基體11的厚度可為0.4~0.8mm。該金屬基體11的材質可為不銹鋼、鐵、鋁、鋁合金、銅、銅合金、鈦、鈦合金、鎂或鎂合金等。該金屬基體11可呈薄片狀。
採用印刷等方式於該金屬基體11的一表面形成一黏結層13。該黏結層13可為紫外光固化漆,其厚度可為0.05mm0.1mm。
提供一透明的樹脂薄膜15。所述樹脂薄膜15的材質可為聚碳酸酯(PC)、聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯(PBT)、聚甲基丙烯
酸甲酯(PMMA)或聚乳酸(PLA)。該樹脂薄膜15的厚度可為0.05mm~0.2mm。該樹脂薄膜15具有較佳的韌性。
將該透明的樹脂薄膜15放置於該黏結層13上後,採用紫外光照射該透明的樹脂薄膜15,紫外光穿過該透明的樹脂薄膜15後照射到該黏結層13的表面,以使該黏結層13固化。該紫外光照射的時間可為5~20秒。該樹脂薄膜15可通過該黏結層13與該金屬基體11牢固連接。
對該形成有黏結層13與樹脂薄膜15的金屬基體11進行衝壓成型,以使該金屬基體11發生變形,從而形成該殼體10所需的形狀。由於樹脂薄膜15與黏結層13均具有較佳的韌性,且樹脂薄膜15通過黏結層13與金屬基體11牢固結合,使得樹脂薄膜15與黏結層13在該衝壓成型的過程中也會發生變形,並在變形過程中牢固黏合於金屬基體11的表面,從而形成與金屬基體11發生變形後相匹配的形狀。該金屬基體11、黏結層13及樹脂薄膜15發生變形後共同形成有一容納腔111。
將所述經衝壓成型處理後的金屬基體11放置於一模具(未圖示)中,調節模溫為140~145℃,射出溫度為250~275℃,射出壓力為1300~1700bar,射速為85~105mm/s。於所述模具中注射熔融的塑膠,並於1350~1450bar的壓力下保壓1~2秒,從而於該容納腔111中形成該電子裝置100所需的內部結構(未圖示)。所述內部構件形成於該樹脂薄膜15上。
所述內部構件的材質可為聚對苯二甲酸丁二醇酯(PBT)、聚苯硫醚(PPS)、聚醯胺(PA)、聚丙烯(PP)、聚碳酸酯(PC)、丙烯腈-苯乙烯-丁二烯共聚物(ABS)、熱塑性聚氨酯彈性體(TPU)、聚對苯二甲酸乙二醇酯(PET)或聚對苯二甲酸1,4-環己烷二甲醇酯(PCT)等。
相較於習知技術,該殼體10的製備過程中,無需使用CNC對金屬基體11進行切削以形成殼體10所需的內部構件,而是採用注塑的方式於金屬基體11內表面的樹脂薄膜15上形成內部構件,不僅金屬資源,還使得該殼體10具有金屬外觀、品質較輕的優點。
10‧‧‧殼體
11‧‧‧金屬基體
13‧‧‧黏合層
15‧‧‧樹脂薄膜
111‧‧‧容納腔
Claims (10)
- 一種殼體,包括金屬基體及依次形成於該金屬基體表面的黏結層與樹脂薄膜,其改良在於:該金屬基體、該黏結層及該樹脂薄膜通過衝壓成型處理後共同形成有一容納腔,該樹脂薄膜位於該容納腔內,該容納腔內通過注塑形成有該殼體所需的內部構件,所述內部構件形成於所述樹脂薄膜上。
- 如申請專利範圍第1項所述之殼體,其改良在於:所述金屬基體的厚度為0.4~0.8mm。
- 如申請專利範圍第1項所述之殼體,其改良在於:所述黏結層的材質為紫外光固化漆,其厚度為0.05mm~0.1mm。
- 如申請專利範圍第1項所述之殼體,其改良在於:所述樹脂薄膜的材質為聚碳酸酯、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚甲基丙烯酸甲酯或聚乳酸。
- 如申請專利範圍第1項所述之殼體,其改良在於:所述樹脂薄膜的厚度為0.05mm~0.2mm。
- 如申請專利範圍第1項所述之殼體,其改良在於:所述金屬基體的材質為不銹鋼、鐵、鋁、鋁合金、銅、銅合金、鈦、鈦合金、鎂或鎂合金。
- 如申請專利範圍第1項所述之殼體,其改良在於:所述內部構件的材質為聚對苯二甲酸丁二醇酯、聚苯硫醚、聚醯胺、聚丙烯、聚碳酸酯、丙烯腈-苯乙烯-丁二烯共聚物、熱塑性聚氨酯彈性體、聚對苯二甲酸乙二醇酯或聚對苯二甲酸1,4-環己烷二甲醇酯。
- 一種殼體的製備方法,其包括如下步驟: 提供一金屬基體;於該金屬基體的表面形成一黏結層;於該黏結層上放置一透明的樹脂薄膜後採用紫外光照射該樹脂薄膜以使該黏結層固化;對該形成有黏結層與樹脂薄膜的金屬基體進行衝壓成型處理從而形成一容納腔,且該樹脂薄膜位於該容納腔內;於該容納腔內注塑塑膠,從而於該樹脂薄膜上形成該殼體所需的內部構件。
- 如申請專利範圍第8項所述之殼體的製備方法,其改良在於:所述金屬基體、所述黏結層與所述樹脂薄膜在該衝壓成型處理過程中會發生變形,發生變形後的黏結層、樹脂薄膜及金屬基體形成該容納腔。
- 一種電子裝置,包括殼體及裝設於該殼體上的本體,其改良在於:所述殼體為如申請專利範圍第1-7任一項所述之殼體。
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