TWI443351B - - Google Patents
Info
- Publication number
- TWI443351B TWI443351B TW101106816A TW101106816A TWI443351B TW I443351 B TWI443351 B TW I443351B TW 101106816 A TW101106816 A TW 101106816A TW 101106816 A TW101106816 A TW 101106816A TW I443351 B TWI443351 B TW I443351B
- Authority
- TW
- Taiwan
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101106816A TW201337287A (en) | 2012-03-01 | 2012-03-01 | Probe probing force setting method and probing method and system using the method |
| CN2012101756731A CN103293342A (en) | 2012-03-01 | 2012-05-31 | Probe needle pressure setting method and point measurement method and system applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101106816A TW201337287A (en) | 2012-03-01 | 2012-03-01 | Probe probing force setting method and probing method and system using the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201337287A TW201337287A (en) | 2013-09-16 |
| TWI443351B true TWI443351B (en) | 2014-07-01 |
Family
ID=49094564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101106816A TW201337287A (en) | 2012-03-01 | 2012-03-01 | Probe probing force setting method and probing method and system using the method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103293342A (en) |
| TW (1) | TW201337287A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI498565B (en) * | 2013-12-11 | 2015-09-01 | Mpi Corp | Probe system, probe height adjusting method, and probe position sensing method |
| CN104793118B (en) * | 2014-01-17 | 2017-11-03 | 中芯国际集成电路制造(上海)有限公司 | The method for setting testing needle pressure |
| TWI623761B (en) * | 2016-10-20 | 2018-05-11 | 旺矽科技股份有限公司 | Chip probing apparatus and chip probing method |
| CN112014710B (en) * | 2020-08-27 | 2023-04-21 | 泉芯集成电路制造(济南)有限公司 | Acupressure adaptation method, acupressure adaptation device, acupressure equipment and readable storage medium |
| CN113759228A (en) * | 2021-09-10 | 2021-12-07 | 长江存储科技有限责任公司 | Acceptance test system and method |
| CN115932518A (en) * | 2021-10-01 | 2023-04-07 | 致茂电子(苏州)有限公司 | Wafer detection method and detection equipment |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142536A (en) * | 2001-10-31 | 2003-05-16 | Shin Etsu Handotai Co Ltd | Characteristic value measuring apparatus and method therefor, and probe contact method |
| TWI302201B (en) * | 2006-04-11 | 2008-10-21 | Promos Technologies Inc | Inspecting method and adjusting method of pressure of probe |
| US7663390B2 (en) * | 2007-06-25 | 2010-02-16 | Hitachi High-Technologies Corporation | Inspection apparatus and method |
| CN101726673B (en) * | 2008-10-16 | 2012-12-05 | 旺矽科技股份有限公司 | Spot measurement device |
| CN101958263B (en) * | 2009-07-14 | 2013-01-02 | 致茂电子(苏州)有限公司 | Semiconductor grain point measurement machine test method and semiconductor grain point measurement machine |
| CN102254220A (en) * | 2011-04-13 | 2011-11-23 | 致茂电子(苏州)有限公司 | Probe deviation detection system and method thereof of LED die point measurement machine |
| CN102338850B (en) * | 2011-08-04 | 2014-01-15 | 东莞市福地电子材料有限公司 | Ceramic package type LED (light emitting diode) spot measurement device and method |
| TWM428357U (en) * | 2011-11-11 | 2012-05-01 | Mpi Corp | Probe pressure detection circuit and point testing system using the same |
-
2012
- 2012-03-01 TW TW101106816A patent/TW201337287A/en unknown
- 2012-05-31 CN CN2012101756731A patent/CN103293342A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201337287A (en) | 2013-09-16 |
| CN103293342A (en) | 2013-09-11 |