TWI403686B - - Google Patents
Info
- Publication number
- TWI403686B TWI403686B TW100104986A TW100104986A TWI403686B TW I403686 B TWI403686 B TW I403686B TW 100104986 A TW100104986 A TW 100104986A TW 100104986 A TW100104986 A TW 100104986A TW I403686 B TWI403686 B TW I403686B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation fin
- heat
- assemblies
- contact surface
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a method for manufacturing heat dissipation device, which comprises the following steps: providing a plurality of heat dissipation fin assemblies and a heat pipe, each heat dissipation fin having a joint surface, the heat pipe comprising a contact surface; carrying out anodizing treatment on the plurality of heat dissipation fin assemblies; carrying out surface roughening treatment on the joint surface of each heat dissipation fin assembly; spraying a metal substance to the contact surface, stacking the plurality of heat dissipation assemblies to interpose the heat pipe with the joint surface of each heat dissipation assembly engaging the contact surface; and applying solder paste to weld the heat dissipation fin assembly. With the above manufacture method, the purposes of increasing heat conduction rate, showing color variation, and causing no thermal resistance can be achieved. The present invention also relates to a heat dissipation device manufactured by the above method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100104986A TW201233971A (en) | 2011-02-15 | 2011-02-15 | Heat dissipation device and manufacture method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100104986A TW201233971A (en) | 2011-02-15 | 2011-02-15 | Heat dissipation device and manufacture method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201233971A TW201233971A (en) | 2012-08-16 |
TWI403686B true TWI403686B (en) | 2013-08-01 |
Family
ID=47070032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100104986A TW201233971A (en) | 2011-02-15 | 2011-02-15 | Heat dissipation device and manufacture method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201233971A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106852073B (en) * | 2017-01-13 | 2019-06-07 | 奇鋐科技股份有限公司 | Heat radiation module |
CN116713706A (en) * | 2023-05-31 | 2023-09-08 | 深圳市鸿慷电子有限公司 | Fin type radiator processing method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM337778U (en) * | 2007-09-28 | 2008-08-01 | Asia Vital Components Co Ltd | Heat dissipation module |
CN101528019A (en) * | 2008-03-07 | 2009-09-09 | 富准精密工业(深圳)有限公司 | Heat radiating device |
TWM368122U (en) * | 2009-03-17 | 2009-11-01 | Jia-Ting Wan | Heat fin with improved heat dissipation for computer and electronic device |
JP2010153443A (en) * | 2008-12-24 | 2010-07-08 | Fujitsu Ltd | Cooling device, cooling-device manufacturing method, and electronic apparatus |
US7779897B2 (en) * | 2007-07-02 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
TWM397509U (en) * | 2010-09-07 | 2011-02-01 | Asia Vital Components Co Ltd | Heat sink structure |
-
2011
- 2011-02-15 TW TW100104986A patent/TW201233971A/en not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7779897B2 (en) * | 2007-07-02 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
TWM337778U (en) * | 2007-09-28 | 2008-08-01 | Asia Vital Components Co Ltd | Heat dissipation module |
CN101528019A (en) * | 2008-03-07 | 2009-09-09 | 富准精密工业(深圳)有限公司 | Heat radiating device |
JP2010153443A (en) * | 2008-12-24 | 2010-07-08 | Fujitsu Ltd | Cooling device, cooling-device manufacturing method, and electronic apparatus |
TWM368122U (en) * | 2009-03-17 | 2009-11-01 | Jia-Ting Wan | Heat fin with improved heat dissipation for computer and electronic device |
TWM397509U (en) * | 2010-09-07 | 2011-02-01 | Asia Vital Components Co Ltd | Heat sink structure |
Also Published As
Publication number | Publication date |
---|---|
TW201233971A (en) | 2012-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |