TWI355539B - Light source module, illuminating apparatus and li - Google Patents

Description

1355539 P51950123TW 21879twf.doc/006 - 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源模組及其應用，且特別是有1355539 P51950123TW 21879twf.doc/006 - IX. Description of the Invention: [Technical Field] The present invention relates to a light source module and an application thereof, and particularly

關於一種構造簡單、成本低廉且出光品質良好的光源模組 及其應用。 W 【先前技術】 隨著製造技術的進步，照明裝置的類型也越來越多樣 化，而其應用領域也越來越廣泛。液晶顯示器便是一種應 用照明裝置（即背光模組）來達到顯示效果的電子產品。^ • 年來，液晶顯示器的應用越來越多樣化，例如常被用於手 、 提電腦(丨叩邮computer)、監視器（monitor)、相機(camera)、 自動櫃員機(automatic teller machine)、電視(tdevision)以及 航空顯示(displays in avionics)上。 一通常，液晶顯示器需要藉由照明裝置來照明欲被顯示 的資訊。照明裝置可採用不同的光源，例如螢光燈管 (flu0rescent lamp)或發光二極體(Hght emitting 灿㈣。螢光 _ 燈管成本較低m要複雜的控制電路，然而卻有色飽 矛度不足與可罪度不南等缺點。因此，近來提出以發光二 極體作為液晶顯示器之光源的技術。相較於日光燈泡，發 f二極體具有使用壽命較長、替代容易、高可靠度以及^ 車乂佳的色飽和度等優點。然而，大多數商用可取得的 發光二極體’其彩度的選擇是有限的且彩度會隨時間改變。 圖1所示為美國專利第6,666,567號所揭露之—種應 用撐高式發光二極體(raised LED)的發光二極體光源1〇〇， 1355539 P51950123TW 21879twf.doc/006 用來改進組合光(combined light)的彩度。此樓高式發光二 極體100包括一發光二極體101。此發光二極體101包在A light source module with simple structure, low cost and good light quality and its application. W [Prior Art] With the advancement of manufacturing technology, the types of lighting devices are becoming more diverse, and their application fields are becoming more and more extensive. A liquid crystal display is an electronic product that uses a lighting device (ie, a backlight module) to achieve a display effect. ^ • The application of LCD monitors has become more and more diverse over the years, such as the use of hands, computers (monitoring computers), monitors, cameras, automatic teller machines, televisions. (tdevision) and display in avionics. Generally, a liquid crystal display needs to illuminate information to be displayed by a lighting device. The lighting device can use different light sources, such as a fluorescent lamp or a light emitting diode. The fluorescent lamp has a lower cost and requires complicated control circuits, but the color is insufficient. And the sinfulness and other disadvantages. Therefore, the technology of using the light-emitting diode as the light source of the liquid crystal display has recently been proposed. Compared with the daylight bulb, the hair-emitting diode has a long service life, easy replacement, high reliability, and ^ The advantages of car color saturation, etc. However, most commercially available light-emitting diodes have limited chroma selection and chroma changes over time. Figure 1 shows US Patent No. 6,666,567 The disclosed light-emitting diode light source 1 539, 1355539 P51950123TW 21879twf.doc/006 is used to improve the chroma of the combined light. The light-emitting diode 100 includes a light-emitting diode 101. The light-emitting diode 101 is wrapped in

發光二極體封裝102裡。此發光二極體封裝102被支撐在 具有光學凹孔的底板103上方，以容許光從發光二極體的 底部出射。此外，反射性的凸出物(reflective protrusion)可 置於此撐高式發光二極體的下方，用以改變光的行進方 向。另外’一種由日光燈泡及發光二極體組合成的架構也 被提出來，以形成一種混合式光源(hybridlights〇llrce)。In the light emitting diode package 102. The light emitting diode package 102 is supported above the bottom plate 103 having optical recesses to allow light to exit from the bottom of the light emitting diode. In addition, a reflective protrusion can be placed under the elevated light emitting diode to change the direction of travel of the light. In addition, an architecture composed of a daylight bulb and a light-emitting diode has also been proposed to form a hybrid light source (hybridlights).

圖2和圖3繪示揭露於美國專利第6,608,614號的一 種液晶顯示器背光源200，其包含一個可提供第一彩度光 線的第一發光二極體陣列2〇1及一個可提供第二彩度光線 的第二發光二極體陣列202。從發光二極體陣列2〇1和2〇2 發射出的光穿過光組合元件3〇1(例如，波導元件），然後朝 向液晶顯示面板302投射。發光二極體晶粒發射的光通常 近乎垂直於晶粒表面的方向，因此從發光二極體陣列2〇1 及202發射出的光的方向近乎各自垂直及平行於面板表 面:需要分離的光組合元件3()1來調整光線的方向。此外， 僅能藉由控制系統來改變第二發光二極體陣列搬的彩 度，以調整組合光的彩度。 圖4缚tf另—種習知的具封裝發光二極體裸晶粒的 裝置(We，—)。此L_n側式出射裝 以4 =句度的組合光’但光強度較差。另外，封 裝1^極體晶粒結構通t佔較大的面積。 身又而σ大夕數從發光二極體裸晶粒發射的光其行 1355539 P51950123TW 2l879twf.doc/006 直於晶粒表面。因此，發光二極體裸晶教 ㈣要翻整，使得從發光二極體裸晶粒發射 =;標物前，有機會組合及混合成想要的彩度 與低战供n賴組，其料結構簡單 • w本發明之另—目的是提供-種照明裝置，其結構簡 單、低本低廉，並可提供均勻的光源。 本發明的又一目的是提供一種液晶顯示器，可應用上 • 述之照明裝置達到良好的顯示效果。 〜 • 為達上述或是其他目的，本發明提出一種光源模組， 其主要包括一光學載板(optical piate)與至少一發光元件 (light emitting device)。光學載板包括一散熱核心板(heat dissipation core plate)以及配置於散熱核心板上的至少一電 子電路層（electric circuit layer)。此外，發光元件配置於光 學載板上，並電性連接至電子電路層。 Φ 在本發明之一實施例中，光源模組例如是具有多個發 光元件’且這些發光元件分別配置於光學載板的相對兩 側，並電性連接至所對應的電子電路層。 在本發明之一實施例中’散熱核心板的一側緣具有至 少一斜面，且發光元件配置於斜面之上。 在本發明之一實施例中，散熱核心板的一側緣具有兩 相交斜面’且每一斜面之上分別配置有至少一個發光元件。 在本發明之一實施例中’發光元件例如是一發光二極FIG. 2 and FIG. 3 illustrate a liquid crystal display backlight 200 disclosed in US Pat. No. 6,608,614, which includes a first LED array 2 〇1 for providing first chroma light and a second color providing A second light emitting diode array 202 of light. The light emitted from the light emitting diode arrays 2〇1 and 2〇2 passes through the light combining element 3〇1 (e.g., the waveguide element) and is then projected toward the liquid crystal display panel 302. The light emitted by the light-emitting diode grains is generally nearly perpendicular to the direction of the crystal grain surface, so that the light emitted from the light-emitting diode arrays 2〇1 and 202 is nearly perpendicular and parallel to the panel surface: light to be separated Combine element 3()1 to adjust the direction of the light. In addition, the chroma of the second light-emitting diode array can only be changed by the control system to adjust the chroma of the combined light. Figure 4 is a conventional device (We, -) having a bare die packaged with a light-emitting diode. This L_n side exit is combined with 4 = sentence combined light 'but the light intensity is poor. In addition, the sealing structure of the 1^ pole body has a large area. The light emitted from the bare die of the light-emitting diode is 1355539 P51950123TW 2l879twf.doc/006 straight to the grain surface. Therefore, the light-emitting diode bare crystal teaches (4) to be trimmed so that the bare die emits from the light-emitting diode = before the target, there is a chance to combine and mix into the desired chroma and low war for the group. The material structure is simple. • Another object of the invention is to provide a lighting device which is simple in structure, low in cost and can provide a uniform light source. It is still another object of the present invention to provide a liquid crystal display which can be applied to the above-described illumination device to achieve a good display effect. To achieve the above or other objects, the present invention provides a light source module that mainly includes an optical piate and at least one light emitting device. The optical carrier board includes a heat dissipation core plate and at least one electric circuit layer disposed on the heat dissipation core board. Further, the light emitting element is disposed on the optical carrier and electrically connected to the electronic circuit layer. In one embodiment of the present invention, the light source module has a plurality of light emitting elements, for example, and these light emitting elements are respectively disposed on opposite sides of the optical carrier and electrically connected to the corresponding electronic circuit layers. In an embodiment of the invention, the one side edge of the heat dissipation core plate has at least one slope, and the light emitting element is disposed above the slope. In an embodiment of the invention, one side edge of the heat dissipation core plate has two intersecting slopes ' and at least one light-emitting element is disposed on each of the slopes. In an embodiment of the invention, the light-emitting element is, for example, a light-emitting diode

7 1355539 P51950123TW 21879twf.doc/006 體裸晶粒。此外，發光二極體裸晶粒例如是藉由覆晶接合 技術或是打線接合技術而與電子電路層接合。 當採用打線接合技術來連接發光二極體裸晶粒與電 子電路層時’電子電路層更例如可具有至少一凹孔 (cavity) ’而發光二極體裸晶粒配置於此凹孔内。此外，凹 孔例如可暴絡出散熱核心板，並使發光二極體裸晶粒直接 配置於散熱核心板表面。此外，凹孔之内表面上例如可具 有一光反射層。7 1355539 P51950123TW 21879twf.doc/006 Body die. Further, the bare die of the light emitting diode is bonded to the electronic circuit layer by, for example, a flip chip bonding technique or a wire bonding technique. When the wire bonding technique is used to connect the bare die and the electronic circuit layer, the electronic circuit layer may have, for example, at least one cavity, and the bare die of the light emitting diode is disposed in the recess. In addition, the recessed holes can, for example, blew out the heat dissipation core plate, and the bare die of the light emitting diode is directly disposed on the surface of the heat dissipation core plate. Further, the inner surface of the recessed hole may have, for example, a light reflecting layer.

在本發明之一實施例中，光源模組更可包括一透明材 料，其配置於光學載板上，用以包封(encapsulate)上述之發 光二極體裸晶粒。其中，透明材料例如是選自環氧化物 (epoxy)、矽氧聚合物(silicone)及上述該等所組成之族群其 中之一。 八 在本發明之一實施例中，上述之發光元件也可以 已封裝的發光二極體。In an embodiment of the invention, the light source module further includes a transparent material disposed on the optical carrier for encapsulating the bare die of the light emitting diode. Among them, the transparent material is, for example, one selected from the group consisting of an epoxy, a silicone, and the like. In an embodiment of the invention, the light-emitting element described above may also be a packaged light-emitting diode.

在本發明之一實施例中，散熱核心板的材料係選自八 電材質、電性導體、熱傳導導體及上述該等所組成之族^ 其中之一。 、矸 心板可為平板式熱管 在本發明之一實施例中，散熱核 (flatted heat pipe)。 在本發明之一實施例中，電子電路層例如是一 路板。此外，電子電路層也可以是至少一介電屏斑 導電層所構成的-多層結構。其中，介電層的^少: 自氧化物、陶瓷材料及上述該等所組成之族群其中2以k 8 1355539 P51950123TW 21879twf.doc/006 在本發明之一實施例中，發光元件可發出多種顏色的 光線。 本發明更提出一種應用上述之光源模組的照明裝 置，主要是藉由一底板結合至少一上述的光源模組，其中 光子載板配置於底板上’以提供一光源。 在本發明之一實施例中，上述之照明裝置更包括至少 一光學突出物，其配置於兩相鄰光學載板之間。 3在本發明之一實施例中，上述之光學突出物的形狀例 如是角錐形(pyramidal)、圓錐形(conic)、拋物面形(parab〇lic) 或半球形(semi-spherical)。 在本發明之一實施例中，上述之照明裝置的底板上具 有至少一插槽，而光學載板對應插置於插槽上。 在本發明之一實施例中，上述之照明裝置更包括一散 熱片（heatsink)，其相對發光元件而配置於底板的另一側， 且光學載板連接散熱片。 在本發明之一實施例中，上述之照明裝置的光學載板 例如是穿過底板而與散熱片結合。 在本發明之一實施例中，上述之照明裝置更包括一控 制器（controller)，其經由電子電路層而電性連接至所對應 的發光元件。 〜 在本發明之一實施例中，上述之照明裝置更包括一光 學元件’用以導引發光元件所發出的光線。 在本發明之一實施例中，上述之光學元件例如是擴散 片（light diffuser)或波導元件(wave guide)。 1355539 P51950123TW 21879twf.doc/006 时本發明更應用上述之照明裝置，而提出一種液晶顯示 器，主要包括一液晶面板與上述之照明裴置。其中，照明 裝置與液晶面板組裝，以提供液晶岐顯示^光源Γ 在本發明之-實施例中，上述之液晶顯示器更包括至 少一光學膜片，其配置於液晶面板與照明裝置之間。 在本發明之-實施例中，上述之光學膜片包括擴散 片、稜鏡片、增光片及上述該等所組成之族群其中之一。 、基於上述，本發明藉由散熱核心板與電子電路層所構 成的光學載板來搭載發光元件，因此結構簡單並可降低製 本。此外，散熱核心板可幫助光源模組散熱，因此可 提高產品可靠度。將光源模組應用於照明裝置時，可產生 具有良好之光強度糾均勻度的光源，且此絲也可做為 液晶顯示器的背光源，践提高液晶顯示器的顯示品質。 4為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂’下文特舉實麵，魏合所_式，料細說明如 下。 【實施方式】 本發明提出一種構造簡單、成本低廉且出光品質良好 的光源模組，主要是藉由散熱核心板與電子電路層所構成 的光學載板來搭載發光元件。其中，電子電路層的製作容 易’並可整合發光元件的縣，將發光元件電性連^至外 部電路’以達到簡化製程的效果。此外，散熱核心板有助 於將發光2件運作時的熱能傳導至外#，料助光源模組 散熱，提咼產品可靠度。另外，散熱核心板上可具有斜面 p5l95〇123TW 21879twf.doc/006 °又什，以調整發光元件的光線方向，進一步提升光源模組 的出光品質。 本發明更整合至少一光源模組提出一種照明裝置，其 主要是藉由一底板結合光源模組，以藉由光源模組上的光 原來達到&供一光源的效果。此外，本發明更可將此照明 裝置應用於液晶顯示器中，以提供液晶面板顯示光源，其 $中由於此照明裝置的出光品質較佳，因此可連帶提升液晶 ，不器的顯示品質。以下將搭配圖示列舉多個實施例，來 說明本發明之相關内容與特徵。 圖5A與5B分別緣示本發明之實施例之一種光源模 、、且如圖5A與5B所示，光源模組5〇〇主要包括光學載板 510與至少一發光元件52〇。光學載板“ο包括一散熱核心 板512以及配置於散熱核心板512上的至少一電子電路層 514。此外，發光元件520配置於光學載板51〇上，並電性 連接至電子電路層514，以藉由電子電路層514連接至外 部電路。 上述之散熱核心板512主要是用來承載電子電路層 5H與發光元件52〇，並可提供散熱的效果。因此，散熱核 〜板512的材料例如可選自介電材質、電性導體、熱傳導 導體及上述該等所組成之族群其中之一。此外，本發明亦 可直接採用一般已知的散熱元件來作為散熱核心板512 ^ 例如，政熱核心板512可為一平板式熱管。此平板式熱管 内部具有中空腔室，可通入導熱介質’以達到更佳的散熱 效率。 P51950123TW 21879twf.doc/006 本實施例之散熱核心板512的相對兩側皆配置有一電 子電路層514以及一發光元件520，其中發光元件520電 性連接至所對應的電子電路層514。值得注意的是，圖5A 與5B所繪示的光源模組500僅是作為示例用，本發明並 不限定發光元件520與電子電路層514的數量。實際上， 如圖5C所示’光學載板510的同一側上更可配置多個特 定分佈的發光元件520。 本發明為了得到不同顏色的光輸出，可應用發出不同 顏色光線的發光元件520。更詳細地說，例如可選用可同 時發出多種色光的單一個發光元件520，或是可選用多個 可發出不同顏色光線的發光元件520。 為了調整發光元件520的光線方向，本實施例例如在 散熱核心板512的一側緣上形成至少一斜面512a，並將發 光元件520配置於斜面512a之上。在圖5A與5B所繪示 的實施例中，散熱核心板512的側緣上例如具有兩相交斜 面512a，且每一斜面512a之上分別配置有至少一個發光 元件520。 值得注意的是，本發明並不限定上述斜面的數量、位 置，甚至也可以將斜面改為曲面。或是，如圖5C所示， 散熱核心板512上不具有斜面。 電子電路層514的位置可以隨著發光元# 52〇的分佈 位置與實際設計而有所不同。例如’ 5A所綠示的電子 電路層5Μ覆蓋散熱核心板S12的斜面512a與部分的兩相 對平面512b，而® 5B所緣示的電子電路層514僅覆蓋散 12 P51950123TW 21879twf.doc/006 熱核心板512的斜面512a。此外，電子電路層514可以選 用各種型_祕基板，例如可以是—印刷電路板，直接 貼合於散熱核心板512上。另外，電子電路層514也可以 是由至少-介電層與至少-導電層所構成的—多層線路結 構’其例如是以增層法(build_up)逐層形成在散熱核心板 512上。其令，介電層的材料可以選自氧化物、陶曼材料 及上述該等所組成之族群其中之一，導電層的材料例如是 銅(Cu)、鋁(A1)等金屬導電材料。 發光元件520例如是一發光二極體裸晶粒，並例如可 依據發光二極體裸晶粒的型態，選擇藉由例如覆晶接合技 術或是打線接合技術等不同的接合技術來連接 裸晶粒與電子電路層514。_〜6(：依序_== 同型態的發光二極體裸晶粒與其適用的接合結構。 如圖6A所示，發光二極體裸晶粒61〇在同一側上具 有第-電極610a與第二電極61〇b，其例如是以覆晶接合 技術，透過多個導電凸塊（c〇nductive bump)、導電膠 (conductive paste)、焊料(s〇ider)等導電材料612而與電子 電路層614上的多個接點（未繪示)接合。此外’若使用導 電凸塊612接合發光二極體裸晶粒61〇與電子電路層 614’更可在發光二極體裸晶粒61〇與電子電路層614之間 填入底膠(imderfill)，以提高導電凸塊612的可靠度。此種 接合方式可適用於具有高積集度佈線的電子電路層614。 圖6B繪示以邊緣打線接合方式連接發光二極體裸晶 粒620與電子電路層624的例子。其中，發光二極體裸晶In an embodiment of the invention, the material of the heat dissipation core plate is selected from the group consisting of an eight-electric material, an electrical conductor, a heat conduction conductor, and one of the above-mentioned families. The core plate may be a flat heat pipe. In one embodiment of the invention, a flatted heat pipe is used. In an embodiment of the invention, the electronic circuit layer is, for example, a board. Further, the electronic circuit layer may also be a multi-layered structure composed of at least one dielectric screen conductive layer. Wherein, the dielectric layer is less: from the oxide, the ceramic material and the group consisting of the above, wherein 2 is k 8 1355539 P51950123TW 21879twf.doc/006 In one embodiment of the invention, the light-emitting element can emit a plurality of colors The light. The invention further provides an illumination device using the above-mentioned light source module, which mainly comprises at least one of the above-mentioned light source modules by a bottom plate, wherein the photonic carrier plate is disposed on the bottom plate to provide a light source. In an embodiment of the invention, the illumination device further includes at least one optical protrusion disposed between two adjacent optical carriers. In an embodiment of the invention, the shape of the optical protrusion is, for example, a pyramidal, a conic, a parablic or a semi-spherical. In an embodiment of the invention, the illumination device has at least one slot on the bottom plate, and the optical carrier is correspondingly inserted into the slot. In an embodiment of the invention, the lighting device further includes a heatsink disposed on the other side of the bottom plate with respect to the light emitting element, and the optical carrier is coupled to the heat sink. In an embodiment of the invention, the optical carrier of the illumination device described above is coupled to the heat sink, for example, through the bottom plate. In an embodiment of the invention, the illumination device further includes a controller electrically coupled to the corresponding light emitting element via the electronic circuit layer. In an embodiment of the invention, the illumination device further includes an optical element for directing light emitted by the light-emitting element. In an embodiment of the invention, the optical element is, for example, a light diffuser or a wave guide. 1355539 P51950123TW 21879twf.doc/006 The present invention further applies the above illumination device, and proposes a liquid crystal display, which mainly comprises a liquid crystal panel and the above illumination device. Wherein, the illumination device is assembled with the liquid crystal panel to provide a liquid crystal display. In the embodiment of the invention, the liquid crystal display further includes at least one optical film disposed between the liquid crystal panel and the illumination device. In an embodiment of the invention, the optical film comprises a diffusion sheet, a ruthenium sheet, a brightness enhancement sheet, and one of the groups of the above. Based on the above, the present invention mounts a light-emitting element by an optical carrier plate composed of a heat dissipation core plate and an electronic circuit layer, so that the structure is simple and the cost can be reduced. In addition, the cooling core board helps the light source module to dissipate heat, thus improving product reliability. When the light source module is applied to the illumination device, a light source with good uniformity of light intensity can be generated, and the wire can also be used as a backlight of the liquid crystal display to improve the display quality of the liquid crystal display. The above and other objects, features and advantages of the present invention will become more apparent and understood. [Embodiment] The present invention proposes a light source module which is simple in structure, low in cost, and excellent in light-emitting quality, and mainly mounts a light-emitting element by an optical carrier plate composed of a heat dissipation core plate and an electronic circuit layer. Among them, the electronic circuit layer can be easily fabricated and the light-emitting element can be electrically connected to the external circuit to achieve a simplified process. In addition, the heat-dissipating core board helps to transfer the heat energy of the two-piece light-emitting device to the outside, and the material-assisted light source module dissipates heat to improve product reliability. In addition, the heat dissipation core plate can have a slope p5l95〇123TW 21879twf.doc/006 °, in order to adjust the light direction of the light-emitting element, and further improve the light-emitting quality of the light source module. The present invention further integrates at least one light source module to provide an illumination device, which mainly combines a light source module with a bottom plate to achieve the effect of providing a light source by the light on the light source module. In addition, the present invention can further apply the illumination device to a liquid crystal display to provide a liquid crystal panel display light source, wherein the illumination quality of the illumination device is better, so that the display quality of the liquid crystal can be improved. The related content and features of the present invention will be described below by exemplifying a plurality of embodiments. 5A and 5B respectively illustrate a light source module of an embodiment of the present invention, and as shown in Figs. 5A and 5B, the light source module 5A mainly includes an optical carrier 510 and at least one light emitting element 52A. The optical carrier board ο includes a heat dissipation core board 512 and at least one electronic circuit layer 514 disposed on the heat dissipation core board 512. Further, the light emitting element 520 is disposed on the optical carrier board 51 and electrically connected to the electronic circuit layer 514. The heat dissipation core plate 512 is mainly used to carry the electronic circuit layer 5H and the light-emitting element 52, and can provide heat dissipation effect. Therefore, the material of the heat dissipation core-plate 512 is provided. For example, it may be selected from the group consisting of a dielectric material, an electrical conductor, a heat conducting conductor, and the like. Further, the present invention can also directly use a commonly known heat dissipating component as the heat dissipating core board 512. For example, The heat core plate 512 can be a flat heat pipe. The flat heat pipe has a hollow chamber inside, and can pass the heat conducting medium to achieve better heat dissipation efficiency. P51950123TW 21879twf.doc/006 The heat dissipation core plate 512 of the embodiment An electronic circuit layer 514 and a light-emitting element 520 are disposed on opposite sides, wherein the light-emitting element 520 is electrically connected to the corresponding electronic circuit layer 514. The light source module 500 illustrated in FIGS. 5A and 5B is for example only, and the present invention does not limit the number of the light emitting element 520 and the electronic circuit layer 514. In fact, the optical carrier 510 is shown in FIG. 5C. A plurality of specifically distributed light-emitting elements 520 can be disposed on the same side. In order to obtain light outputs of different colors, the light-emitting elements 520 emitting light of different colors can be applied. In more detail, for example, multiple color lights can be simultaneously emitted. The single light-emitting element 520, or a plurality of light-emitting elements 520 that can emit light of different colors. In order to adjust the light direction of the light-emitting element 520, the embodiment forms at least one slope on one side of the heat-dissipating core board 512, for example. 512a, and illuminating element 520 is disposed on the inclined surface 512a. In the embodiment illustrated in Figures 5A and 5B, the side edge of the heat dissipation core plate 512 has, for example, two intersecting slopes 512a, and each of the slopes 512a is respectively At least one light-emitting element 520 is disposed. It should be noted that the present invention does not limit the number and position of the above-mentioned slopes, and may even change the slope to a curved surface. As shown in Fig. 5C, the heat dissipation core plate 512 does not have a slope. The position of the electronic circuit layer 514 may vary depending on the distribution position of the light-emitting element #52〇 and the actual design. For example, the electronic circuit layer shown in '5A green 5Μ covers the inclined surface 512a of the heat dissipation core board S12 and a portion of the opposite planes 512b, and the electronic circuit layer 514 indicated by the ® 5B covers only the slope 512a of the thermal core board 512 of the 12 P51950123TW 21879twf.doc/006. In addition, the electronic circuit The layer 514 can be selected from various types of secret substrates, for example, a printed circuit board, which is directly attached to the heat dissipation core board 512. Alternatively, the electronic circuit layer 514 may be formed of at least a dielectric layer and at least a conductive layer - a multilayer wiring structure which is formed on the heat dissipation core plate 512 layer by layer, for example, in a build-up manner. The material of the dielectric layer may be selected from the group consisting of an oxide, a Taman material, and one of the above-mentioned groups, and the material of the conductive layer is, for example, a metal conductive material such as copper (Cu) or aluminum (A1). The light-emitting element 520 is, for example, a bare die of a light-emitting diode, and may be connected to bare by different bonding technologies such as flip chip bonding or wire bonding, for example, depending on the type of the bare die of the light-emitting diode. Die and electronic circuit layer 514. _~6(: sequentially _== the same type of light-emitting diode bare die and its suitable bonding structure. As shown in FIG. 6A, the bare LED die 61 has the first electrode on the same side 610a and the second electrode 61〇b, which is formed by, for example, a flip chip bonding technique, through conductive materials 612 such as a plurality of conductive bumps, conductive pastes, solders, etc. A plurality of contacts (not shown) on the electronic circuit layer 614 are bonded. Further, if the conductive bumps 612 are used to bond the LEDs 61 and the electronic circuit layer 614', the LEDs can be exposed in the LED. An iminder is filled between the pellet 61 and the electronic circuit layer 614 to improve the reliability of the conductive bump 612. This bonding method is applicable to the electronic circuit layer 614 having a high accumulation of wiring. An example in which the LED die 620 and the electronic circuit layer 624 are connected by edge bonding, wherein the LED is exposed

13 1355539 P51950123TW 21879twf.doc/006 粒620在同一側上具有第一電極62〇a與第二電極62%， 且第一電極620a與第二電極620b分別以打線接合技術， 透過多條導線622連接至電子電路層624上的多個接點(未 繪示）。值得注意的是，本實施例之電子電路層624更例如 具有一凹孔624a，而發光二極體裸晶粒62〇可藉由黏著膠 (未繪示）配置於此凹孔624a内，以調整發光二極體裸晶粒 620的高度，有助於打線動作的進行。此外，凹孔62如例 如可暴露出散熱核心板626，而發光二極體裸晶粒62〇可 直接配置於散熱核心板626的表面，以幫助發光二極體裸 晶粒620的散熱。在此，本發明所建議之較佳的作法是將 發光二極體晶粒620對應的耦接電極(即上述之接點)設計 在電子電路層624上，而散熱核心板626本身並不作為電 極。藉由電子電路層624的連接’可輕易使多個發光i極 體裸晶粒620之間形成串聯，因此可避免驅動電流過大， 不易控制的問題。當然’本發明亦不排除將散熱核心板6 2 6 作為電極的作法。另外，凹孔624a的内表面上例如可具有 :光反射層628,其有助於提高光源模組整體的光^出 里。完成打線接合後，更例如可形成一包封發光二極體裸 晶粒620與導線622的透明材料629，此透明材料6四例 如是選自環氧化物、石夕氧聚合物及上述該等所組成之族群 其中之一。 、 圖6C繪示以中心打線接合方式連接發光二極體裸晶 粒630與電子電路層634的例子。發光二極體裸晶粒㈣ 具有頂電極（top electrode)630a與底電極作⑽〇m 1355539 P51950123TW 21879twf.doc/〇〇613 1355539 P51950123TW 21879twf.doc/006 The particle 620 has a first electrode 62〇a and a second electrode 62% on the same side, and the first electrode 620a and the second electrode 620b are respectively connected by a wire bonding technique through a plurality of wires 622. A plurality of contacts (not shown) on the electronic circuit layer 624. It should be noted that the electronic circuit layer 624 of the embodiment further has a recess 624a, and the LED die 〇 can be disposed in the recess 624a by an adhesive (not shown). Adjusting the height of the bare die 620 of the light-emitting diode contributes to the wire-drawing action. In addition, the recess 62 can expose the heat dissipation core plate 626, for example, and the LED die 62 can be directly disposed on the surface of the heat dissipation core plate 626 to help dissipate heat from the LED die 620. Herein, the preferred method proposed by the present invention is to design the coupling electrode corresponding to the LED 620 (ie, the above contact) on the electronic circuit layer 624, and the heat dissipation core plate 626 itself does not serve as an electrode. . The connection between the plurality of light-emitting i-pole bare dies 620 can be easily formed in series by the connection of the electronic circuit layer 624, so that the problem of excessive driving current and difficulty in control can be avoided. Of course, the invention does not exclude the use of the heat-dissipating core plate 6 2 6 as an electrode. Further, the inner surface of the recessed hole 624a may have, for example, a light reflecting layer 628 which contributes to improvement of the light source of the entire light source module. After the wire bonding is completed, for example, a transparent material 629 encapsulating the bare die 620 of the LED and the wire 622 may be formed. The transparent material 6 is, for example, selected from the group consisting of an epoxide, a sulphur oxide polymer, and the like. One of the ethnic groups formed. FIG. 6C illustrates an example in which the LED 630 and the electronic circuit layer 634 are connected by a center wire bonding method. The bare die of the light-emitting diode (4) has a top electrode 630a and a bottom electrode (10) 〇m 1355539 P51950123TW 21879twf.doc/〇〇6

deCtr〇de)63〇b，其中發光二極體裸晶粒63〇經 6働直接與電子電路層辦的接點(未繪示)接合 極630a以打線接合技術，透過導線632連接至電子厚 634的其他接點(未繪示）。其中，底電極㈣匕例麵: 導電膠或是焊軸f子電路層634的接點(未繪示)接:。 完成打線接合後，更例如可形成_包封發光二 : 630與導線632的透明材料㈣，此透明材料⑽例DeCtr〇de) 63〇b, wherein the bare LEDs 63 of the LEDs are directly connected to the contacts (not shown) of the electronic circuit layer via the bonding pads 630a by wire bonding technology, and connected to the electron thickness through the wires 632. Other contacts of 634 (not shown). Wherein, the bottom electrode (four) 匕 example: conductive adhesive or soldering shaft f sub-circuit layer 634 contact (not shown)::. After the wire bonding is completed, for example, a transparent material (4) of the encapsulating light-emitting diode 630 and the wire 632 can be formed, and the transparent material (10) is exemplified.

自環氧化物、魏聚合物及上親等所組狀族群其令之 ——· 〇 除了上述採用發光二極體裸晶粒作為發光元件之 外，本發明也可以採用已經封裝完成的發光二極體或是盆 他可提供射光輪it}的辆、作為發光元件，使其與電子 路層接5。然而’發光元件之選用可依據設計與實際的· 求而有所不同，相_結構與接合方式以現有的技術水^ 為基準，應林領域技術人參照本發明之揭露後 易推及’在此便不再詳述。 二The group consisting of epoxide, Wei polymer and upper parent makes it possible to use - in addition to the above-mentioned bare die of the light-emitting diode as the light-emitting element, the present invention can also adopt the light-emitting diode which has been packaged. The body or the basin can provide the light-emitting wheel it} as a light-emitting element to be connected to the electronic circuit. However, the selection of the illuminating element may be different according to the design and the actual requirements. The phase _ structure and the bonding method are based on the existing technical water, and the technical person in the field of the forest is easy to push and refer to This will not be detailed. two

本U更提出-種整合了至少—個上述之光源模組 的照明裝置。ffil 7Α即繪示依照本發明之實施例的一種照 明，置’而圖7為此照明I置的局部放大圖。值得注意 的是’雖然本實施例的㈣裝置是由多個紐模組所^ 成，但在其他實施例中，本發_照㈣置也可以僅具有 -個光源模組。如® 7A與7B所示，此照明裝置700主要 包括-底板710與多個光學載板72〇，其中光學載板— 配置於底板710上。每—光學載板72()的結構如上述實施 15 P51950123TW 21879twf.doc/006 例所述’在此不再詳細贅述。此外，諸如散熱核心板722 的斜面設計、發光元件726的數量與配置、各個構件的材 質、發光元件726與電子電路層724的接合方式等内容， 也請參照上述實施例。 請再參考圖7A與7B ’本實施例為了提高光輸出量， 在相鄰兩光學載板720之間配置至少一光學突出物73〇(本 實施例繪示多個光學突出物730)，其形狀可為角錐形、圓 錐形、拋物面形、半球形或其他經過特殊設計的形狀。這 些光學突出物730可以反射發光元件726發出的光線至特 定的方向。此外，為了結合光學載板720與底板71〇，本 實施例例如在底板上形成多個插槽712，而使光學載板72〇 可對應插置於插槽712上。 本實施例之照明裝置700更可包括—散熱片74〇，其 相對發光元件726而配置於底板710的另一側，並連接至 光學載板720。此外，為了提供更好的散熱效果，光學載 板720更例如可穿過底板710而與散熱片740結合。 本實施例之照明裝置700更可包括一控制器（未繪 示）’其經由所對應的光學載板720的電子電路層724電^ 連接至發光元件726，用以控制發光元件726的運作，例 如，提供發光元件726電源、控制發光元件726的亮度， 以及調整發光元件726的光線混合效果。此外，如圖 所繪示的照明裝置700的剖面圖所示，為了均勻化照明裝 置700的出光或控制出光方向，照明裝置更可包括一 光學元件750，用以導引發光元件726(請見圖7A與7B) 1355539 P51950123TW 21879twf.doc/006 所發出的光線。此光學S件75〇例如是擴散片或波導元件。 。。圖8繪示本發明應用上述之照明裝置的一種液晶顯示 益。如圖8所示，液晶顯示器_主要是由液晶面板81〇 與照明裝置820所構成。其中，液晶面板81〇配置於照明 裝置820上方，以接收照明裝置82〇所提供的光源s而顯 不相關影像資訊。關於照明裝置⑽的詳細結構請參昭前 述實施例，在此不再詳細贅述。此外，液晶顯示器綱更 可在液晶面板81〇與照明裝置82〇之間配置至少一光學膜 片830,例如擴散片、稜鏡片、增光片及上述該等所組成 之族群其中之-，用以提升光源的品質。 γ ®圖f為模擬由液晶面板表面測得的光強度與位置的關 糸圖。八中’縱軸表示液晶面板表面水平方向與垂直方向 的光強度’而橫軸表示液晶面板上的㈣位置。由結果可 ^利用本發0㈣提出的照明裝置，其發光元件的配置與 來與由散熱核心板上的斜面或是光學載板之間的 來進行調整，因此可在液晶面板的水平方向與 你担古^上皆提供良好的光強度與光均勻度。如此，有助 於扣鬲液晶顯示器的顯示品質。 y曰所述，本發明所提出的光源模組、照明裝置以及 UtfH至少具有下列特徵與優點： 缸水㈣？由散熱核心板與電子電路層所構成的光學載 二载I光元件，結構簡單並可降低製作成本。 步，^Γ子電路層的製作容易’並可整合發光元件的封 裝料光元件電性連接至外部電路，有助於簡化製程。才This U further proposes a lighting device that integrates at least one of the above-described light source modules. Ffil 7 绘 shows a lighting according to an embodiment of the present invention, and FIG. 7 is a partially enlarged view of the illumination I. It should be noted that although the (4) device of the present embodiment is formed by a plurality of button modules, in other embodiments, the present device may have only one light source module. As shown in Figures 7A and 7B, the illumination device 700 primarily includes a bottom plate 710 and a plurality of optical carrier plates 72, wherein the optical carrier plates are disposed on the bottom plate 710. The structure of each optical carrier 72() is as described above in the example of P51950123TW 21879 twf.doc/006 and will not be described in detail herein. Further, for example, the bevel design of the heat dissipation core plate 722, the number and arrangement of the light-emitting elements 726, the material of each member, the bonding manner of the light-emitting element 726 and the electronic circuit layer 724, and the like are also referred to the above embodiment. Referring to FIG. 7A and FIG. 7B again, in order to increase the light output, at least one optical protrusion 73 配置 is disposed between two adjacent optical carrier plates 720 (the present embodiment shows a plurality of optical protrusions 730). The shape can be pyramidal, conical, parabolic, hemispherical or other specially designed shapes. These optical protrusions 730 can reflect the light emitted by the light-emitting element 726 to a particular direction. In addition, in order to combine the optical carrier 720 with the bottom plate 71, the present embodiment forms a plurality of slots 712, for example, on the bottom plate, so that the optical carrier 72 can be correspondingly inserted into the slot 712. The illuminating device 700 of the present embodiment may further include a heat sink 74A disposed on the other side of the bottom plate 710 with respect to the light emitting element 726 and connected to the optical carrier 720. In addition, in order to provide a better heat dissipation effect, the optical carrier 720 can be integrated with the heat sink 740, for example, through the bottom plate 710. The illuminating device 700 of the present embodiment may further include a controller (not shown) that is electrically connected to the illuminating element 726 via the electronic circuit layer 724 of the corresponding optical carrier 720 for controlling the operation of the illuminating element 726. For example, a light source of the light-emitting element 726 is provided, the brightness of the light-emitting element 726 is controlled, and the light mixing effect of the light-emitting element 726 is adjusted. In addition, as shown in the cross-sectional view of the illumination device 700, as shown in the cross-sectional view of the illumination device 700, in order to homogenize the light output of the illumination device 700 or control the light output direction, the illumination device may further include an optical component 750 for guiding the light-emitting component 726 (see Figures 7A and 7B) 1355539 P51950123TW 21879twf.doc/006 Light emitted. This optical S piece 75 is, for example, a diffusion sheet or a waveguide element. . . Fig. 8 is a view showing a liquid crystal display of the present invention using the above illumination device. As shown in Fig. 8, the liquid crystal display is mainly composed of a liquid crystal panel 81A and an illumination device 820. The liquid crystal panel 81 is disposed above the illumination device 820 to receive the light source s provided by the illumination device 82 to display image information. The detailed structure of the illuminating device (10) is described in the foregoing embodiments, and will not be described in detail herein. In addition, the liquid crystal display unit can be disposed between the liquid crystal panel 81A and the illumination device 82A, such as a diffusion film, a silicon film, a brightness enhancement film, and the like. Improve the quality of the light source. The γ ® map f is a graph that simulates the light intensity and position measured from the surface of the liquid crystal panel. The horizontal axis represents the light intensity in the horizontal direction and the vertical direction of the liquid crystal panel, and the horizontal axis represents the (four) position on the liquid crystal panel. According to the result, the illumination device proposed in the present invention can be adjusted by the arrangement between the light-emitting elements and the inclined surface of the heat-dissipating core board or the optical carrier, so that the horizontal direction of the liquid crystal panel can be used with you. Both the light and the light uniformity are provided. In this way, it helps to buckle the display quality of the liquid crystal display. As described in the above, the light source module, the illumination device and the UtfH proposed by the present invention have at least the following features and advantages: Cylinder water (4)? The optically loaded two-load I-light component composed of a heat-dissipating core board and an electronic circuit layer has a simple structure and can reduce the manufacturing cost. In this way, the fabrication of the circuit layer is easy, and the package light element integrated with the light-emitting element is electrically connected to an external circuit, which contributes to simplifying the process. only

17 1355539 P51950123TW 21879twf.doc/00617 1355539 P51950123TW 21879twf.doc/006

三、 散熱核心板可將發光元件運作時的熱能傳導至 外界，以幫助光源模組散熱，提高產品可靠度。 四、 散熱核心板上可具有斜面設計，以調整發光元件 的光線方向，因此可改善出光品質。 五、 光學載板之間可配置光學突出物來調整出光方 向’因此可改善出光品質。3. The heat dissipation core board can transmit the heat energy of the light-emitting component to the outside to help the heat dissipation of the light source module and improve product reliability. Fourth, the heat dissipation core board can have a beveled design to adjust the light direction of the light-emitting elements, thereby improving the light-emitting quality. 5. Optical protrusions can be placed between the optical carriers to adjust the light direction. This improves the light quality.

六、 應用本發明之照明裝置可提供良好的光源，不論 在水平方向與垂直方向上皆可提供良好的光強度與光均勻 度，因此有助於提高液晶顯示器的顯示品質。 —雖然本發明已以多個實施例揭露如上，然其並非用以 ，疋本發明，，何所屬領域中具有通常知識者，在不脫離 發明之精神和範_，#可作些許之更動與卿，因此 發明之保護範圍當視⑽之申請專利範圍所者為 準0 【圖式簡單說明】6. The illumination device of the present invention can provide a good light source, which can provide good light intensity and light uniformity both in the horizontal direction and the vertical direction, thereby contributing to the improvement of the display quality of the liquid crystal display. The present invention has been disclosed in the above several embodiments, but it is not intended to be used in the present invention, and the general knowledge in the field of the invention may be changed without departing from the spirit and scope of the invention. Therefore, the scope of protection of the invention is subject to the scope of the patent application of (10). [Simplified illustration]

圖1〜4分w會示習知多種不同型態的光源。 ^ 5A〜5C纟會示本發明之實施例之—種光源模組。 曰％r伽甘6C依序繪示本發明不同型態的發光二極體裸 a曰粒與其適用的接合結構。 =7A綠示依照本發明之實施例的一種照明農置。 圖％為圖7A之照明裝置的局部放大圖。 圖7C為圖7A之照明裝置的剖面圖。 器。圖8繪示本發明應用上述之照明裝置的一種液晶顯示 18 ㊣ 1355539 P51950123TW 21879twf.doc/006 圖9為模擬由液晶面板表面測得的光強度與位置的關 係圖。 【主要元件符號說明】 100 :發光二極體光源 101 :發光二極體 102 :發光二極體封裝 103 :底板 200 :液晶顯示器 201 :第一發光二極體陣列 202 :第二發光二極體陣列 301 :光組合元件 302 .液晶顯不面板 500 :光源模組 510 :光學載板 512 :散熱核心板 512a :斜面 512b :平面 514 :電子電路層 520 :發光元件 610 :發光二極體裸晶粒 610a :第一電極 610b :第二電極 612 :導電材料 614 :電子電路層Figures 1 to 4 show w for a variety of different types of light sources. ^5A~5C纟 will show a light source module of an embodiment of the present invention.曰%r gamma 6C sequentially shows different types of luminescent diodes of the present invention and their suitable bonding structures. = 7A Green shows an illumination farm in accordance with an embodiment of the present invention. Figure % is a partial enlarged view of the lighting device of Figure 7A. Figure 7C is a cross-sectional view of the lighting device of Figure 7A. Device. Fig. 8 is a view showing a liquid crystal display of the present invention using the above illumination device. 18 1355539 P51950123TW 21879twf.doc/006 FIG. 9 is a graph showing the relationship between the light intensity and the position measured by the surface of the liquid crystal panel. [Main component symbol description] 100: Light-emitting diode light source 101: Light-emitting diode 102: Light-emitting diode package 103: Base plate 200: Liquid crystal display 201: First light-emitting diode array 202: Second light-emitting diode Array 301: optical combination element 302. liquid crystal display panel 500: light source module 510: optical carrier 512: heat dissipation core board 512a: slope 512b: plane 514: electronic circuit layer 520: light-emitting element 610: light-emitting diode bare crystal Particle 610a: first electrode 610b: second electrode 612: conductive material 614: electronic circuit layer

19 1355539 P51950123TW 21879twf.doc/006 • 620:發光二極體裸晶粒 _ 620a :第一電極 620b :第二電極 622 :導線 624 :電子電路層 624a :凹孔 626 :散熱核心板 628 :光反射層 ® 629:透明材料 • 630:發光二極體裸晶粒 630a :頂電極 630b :底電極 632 :導線 634 :電子電路層 639 :透明材料 700 :照明裝置 φ 710 :底板 712 :插槽 720:光學載板 722:散熱核心板 724 :電子電路層 726 :發光元件 730 :光學突出物 740 :散熱片19 1355539 P51950123TW 21879twf.doc/006 • 620: LED die _ 620a: first electrode 620b: second electrode 622: wire 624: electronic circuit layer 624a: recess 626: heat sink core plate 628: light reflection Layer® 629: transparent material • 630: light-emitting diode bare die 630a: top electrode 630b: bottom electrode 632: wire 634: electronic circuit layer 639: transparent material 700: illumination device φ 710: bottom plate 712: slot 720: Optical carrier 722: heat dissipation core plate 724: electronic circuit layer 726: light-emitting element 730: optical protrusion 740: heat sink

20 1355539 P51950123TW 21879twf.doc/006 « 800 :液晶顯示器 810 .液晶面板 820 :照明裝置 830 :光學膜片20 1355539 P51950123TW 21879twf.doc/006 « 800 : LCD 810 . LCD panel 820 : Lighting 830 : Optical diaphragm

Claims (1)

13555391355539 100-10-18 十、申請專利範圍： .1. 一種照明裝置，包括： 一底板；. 至少一光學載板，包括： 一散熱核心板’貫穿該底板，其中一部分的該 散熱核心板與另一部份的該散熱核心板分別位於該 .底板的相對兩側；100-10-18 X. Patent application scope: .1. A lighting device comprising: a bottom plate; at least one optical carrier plate comprising: a heat dissipation core plate 'through the bottom plate, a part of the heat dissipation core plate and another a part of the heat dissipation core plates are respectively located on opposite sides of the bottom plate; 兩電子電路層，分別配置於該散熱核心板一端 的相對兩侧，且該兩電子電路層直接接觸該散熱核心 板；以及 多個發光元件，分別配置於該光學載板的相對兩側， 並且为別電性連接至相應的該電子電路層。 2·如申請專利範圍第丨項所述之照明裝置，其中該散 熱核心板的該端具有兩相交斜面，且該些斜面之上分別配 置有至少一發光元件。Two electronic circuit layers are respectively disposed on opposite sides of one end of the heat dissipation core board, and the two electronic circuit layers directly contact the heat dissipation core board; and a plurality of light emitting elements are respectively disposed on opposite sides of the optical carrier board, and It is electrically connected to the corresponding electronic circuit layer. 2. The illuminating device of claim 2, wherein the end of the heat dissipation core plate has two intersecting slopes, and at least one of the light-emitting elements is disposed on the slopes. 3. 如申請專利範圍第2項所述之照明裝置，其中各該 發光元件為發光二極體裸晶粒。 4. 如申明專利範圍第3項所述之照明裝置，其中各該 發光二極11裸純是藉由覆晶接合技術與城的該電子電 路層接合。 5. 如申π專利範圍第3項所述之照明裝置，其中各該 體裸晶粒是#由打線接合技術與相應的該電子電 路層接合。 6. 如申請專利_第5項所述之_裝置，其中各該 22 丄 100-10-18 ^子兒路層具有至少—凹孔，而各 置於相應的該凹孔内。 °Λ發先一極體裸晶粒配 7.如申請專利範圍第6項所 :孔暴露出該散熱核心板的相應該斜面月=，其中各該 7 日粒配置於該散熱核心板的相應該斜面二極 .如申請專利範圍第6項所 凹孔之内表面上具有-献射層。〜、㈣置，其中各該3. The illumination device of claim 2, wherein each of the light-emitting elements is a bare die of a light-emitting diode. 4. The illuminating device of claim 3, wherein each of the illuminating diodes 11 is barely bonded to the electronic circuit layer of the city by a flip chip bonding technique. 5. The illuminating device of claim 3, wherein each of the bare dies is joined to the corresponding electronic circuit layer by a wire bonding technique. 6. The device of claim 5, wherein each of the 22 丄 100-10-18 ^ sub-layers has at least a recessed hole and each is placed in the corresponding recessed hole. Λ 先 先 先 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸It should be a beveled pole. As shown in the sixth aspect of the patent application, the inner surface of the recess has a radiation-emitting layer. ~, (four) set, each of which 個透9明:Γϊ利範圍第3項所述之照明裝置，更包括多 發光置於該光學載板上’用以分別包封該些 士尤—極體稞晶粒。 10.如申請專利範圍第9項所述之照明裝置，其中該些 + f材料係選自每氧化物、♦氧聚合物及上 之族群其中之一。 u_.如申請專利範圍第1項所述之照明裝置，其中各該 發光元件為已封裝的發光二極體。A illuminating device according to item 3 of the profit-making scope, further comprising a plurality of illuminating plates disposed on the optical carrier plate for encapsulating the swarf-pole body dies respectively. 10. The illumination device of claim 9, wherein the +f materials are selected from the group consisting of peroxide, oxypolymer, and a group thereof. U. The illumination device of claim 1, wherein each of the light-emitting elements is a packaged light-emitting diode. 12.如申請專利範圍第1項所述之照明裝置，其中該散 熱核心板的材料係選自介電材質、電性導體、熱傳導導體 及上述該等所組成之族群其中之一。 13·如申請專利範圍第1項所述之照明裝置，其中該散 熱核心板為平板式熱管。 14. 如申請專利範圍第1項所述之照明裝置，其中各該 電子電路層為一印刷電路板或由至少一介電層與至少一導 電層所構成的一多層結構。 15. 如申請專利範圍第14項所述之照明裝置，其中該介 23 100-10-18 自氧化物、陶瓷材料及上述該等所組成之 16 :申請專利範圍第j項所述之照明裝置，其中該些 a先凡件發出多種顏色的光線。 小—Ρ上如申請專利範圍第i項所述之照明裝置，更包括至 夕光學突出物，配置於兩相鄰光學載板之間。 18=申請專利範圍第17項所述之照明裝置，其中該光 1出物的形狀包括角錐形、圓錐形、抛物面形或半球形。 柄/目專利範圍第1項所述之㈣裝置，其中該底 有至少一插槽’而該光學載板插置並穿過該插槽。 20‘如中請專利範圍第！項所述之照明裝置，更包括一 片’其相對該些發光元件她置於該底板的另一側， 且该光學載板連接該散熱片。 錢2丨‘如申請專利範圍第2〇項所述之照明裝置，其中該 予载板穿過該底板而與該散熱片結合。 田22.如申請專利範圍第1項所述之照明裂置，更包括一 j驅動發光元件的控彻，其_該 性連接至該些發光元件。 ⑽層而I 二·：申請專利範圍第i項所述之照明裝置，更包括— 予兀牛，用以導引該些發光元件所發出的光線。 24. 如申請專利範圍第23項所述之照明襄置， 予元件包括擴散片或波導元件。 ” 。先 25. —種液晶顯示器，包括： 一液晶面板； 24 1355539 100-10-18 -照明裝置，與該液晶面板組裝，以提供該液晶面板 顯示用之光源，該照明裝置包括： 一底板； 至少一光學载板，包括： 一政熱核心板，貫穿該底板，其中一部分 的該散熱核心板與另一部份的該散熱核心板分 別位於S亥底板的相對兩側； 兩電子電路層，分別配置於該散熱核心板 厂端的相對兩側，且該兩電子電路層直接接觸 邊散熱核心板；以及 多個發光元件’分觀置於縣學載板的相對 兩側’並且分別電性連接至相應的該電子電路層。 26.如申#專利範圍第25項所述之液晶顯示器，其中該 兩相交斜面’且該些斜面之上分別 些述之液―該 該發28光覆r接= 電路層接合。 接合技術與相應的該電子 29.如申請專利範圍第27項所述之 π 該發光二極體裸晶粒是萨 曰曰加盗’其中各 電路層接合。疋稭朴線接合技術與相應的該電子 30·如申請專利範園第29項所述之液晶顯示器，其中各 25 1355539 100-10-18 該電子電路層具有至少一凹孔，而各該發光二極體裸⑤ 配置於相應的該凹孔内。 31. 如申清專利範圍第30項所述之液晶顯示器，1中各 該凹孔暴露出該散熱核心板的相應該斜面，且各該發光二 極體裸晶粒配置於該散熱核心板的相應該斜面。 32. 如申凊專利範圍第3〇項所述之液晶顯示器，1中各 該凹孔之内表面上具有一光反射層。 一 33. 如申凊專利範圍第27項所述之液晶顯示器，更包括 多個透明材料，其配置於該光學載板上，用以分別包封該 些發光二極體裸晶粒。 " 34. 如申請專利範圍第33項所述之液晶顯示器，其中該 些透明材料係選自環氧化物、矽氧聚合物及上述該等所組 成之族群其令之―。 '、、 35·如申請專利範圍第25項所述之液晶顯示器，其中該 些發光元件為已封裝的發光二極體。 』36.如申請專利範圍第25項所述之液晶顯示器，其中該 散熱核心板的材料係選自介電材質、電性導體、熱傳= 體及上述該等所組成之族群其中之一。 3 7.如申請專利範圍第2 5項所述之光源模組，其 ，、、、核心板為平板式熱管。 人 =如申請專利範圍第25項所述之液晶顯示器，其中各 導電層— 板或由至少-介電層與至少- 如申咐專利範圍第38項所述之液晶顯示器，其中該 26 1355539 100-10-18 介電層的材料係選自氧化物、陶瓷材料及上述該等所組成 之族群其中之一。 40. 如申請專利範圍第25項所述之液晶顯示器，其中該 些發光元件發出多種顏色的光線。 41. 如申請專利範圍第25項所述之液晶顯示器，其中該 照明裝置更包括至少一光學突出物，配置於兩相鄰光 板之間。12. The illuminating device of claim 1, wherein the material of the heat dissipating core plate is selected from the group consisting of a dielectric material, an electrical conductor, a heat conducting conductor, and one of the groups of the above. 13. The lighting device of claim 1, wherein the heat dissipation core plate is a flat heat pipe. 14. The illumination device of claim 1, wherein each of the electronic circuit layers is a printed circuit board or a multilayer structure of at least one dielectric layer and at least one conductive layer. 15. The illuminating device of claim 14, wherein the illuminating device is the same as the oxide, the ceramic material, and the above-mentioned composition: , wherein the a first piece of light emits multiple colors of light. The illumination device as described in claim i, further comprising an optical protrusion according to the invention, disposed between two adjacent optical carriers. The illuminating device of claim 17, wherein the shape of the light output comprises a pyramid shape, a conical shape, a parabolic shape or a hemispherical shape. The device of claim 4, wherein the bottom has at least one slot and the optical carrier is inserted through the slot. 20 ‘If you are in the middle of the patent scope! The illumination device of the present invention further includes a sheet that is disposed on the other side of the substrate relative to the light-emitting elements, and the optical carrier is coupled to the heat sink. The illuminating device of claim 2, wherein the preloading plate passes through the bottom plate to be coupled to the heat sink. Field 22. The illumination splitting of claim 1, further comprising controlling the light-emitting elements to be connected to the light-emitting elements. (10) Layer and I 2: The lighting device described in claim i, further includes - a yak for guiding the light emitted by the light-emitting elements. 24. The illumination device of claim 23, wherein the component comprises a diffuser or a waveguide component. First, a liquid crystal display comprising: a liquid crystal panel; 24 1355539 100-10-18 - a lighting device assembled with the liquid crystal panel to provide a light source for display of the liquid crystal panel, the lighting device comprising: a bottom plate At least one optical carrier board includes: a thermal core plate extending through the bottom plate, wherein a portion of the heat dissipation core plate and another portion of the heat dissipation core plate are respectively located on opposite sides of the S-floor; two electronic circuit layers , respectively disposed on opposite sides of the heat-dissipating core board, and the two electronic circuit layers directly contact the side heat-dissipating core board; and a plurality of light-emitting elements are disposed on opposite sides of the county carrier board and are respectively electrically The liquid crystal display according to claim 25, wherein the two intersecting slopes and the liquids on the slopes are respectively described above.接 = circuit layer bonding. Bonding technology and corresponding electrons 29. As described in claim 27 of the scope of the patent, the bare diode of the light-emitting diode is a snail The circuit layer is bonded to the liquid crystal display according to claim 29, wherein each of the electronic circuit layers has at least one recessed hole. And each of the light-emitting diodes 5 is disposed in the corresponding recessed hole. 31. The liquid crystal display according to claim 30, wherein the recessed holes in the one of the recessed holes of the heat-dissipating core board are exposed. And the liquid crystal display of the heat-dissipating core plate is disposed on the inner surface of each of the recessed holes of the heat-dissipating core plate. A liquid crystal display according to claim 27, further comprising a plurality of transparent materials disposed on the optical carrier for respectively encapsulating the light emitting diodes The liquid crystal display of claim 33, wherein the transparent material is selected from the group consisting of an epoxide, a siloxane polymer, and the group of the above-mentioned ones. , 35. If the scope of patent application is 25 The liquid crystal display, wherein the light-emitting elements are packaged light-emitting diodes. The liquid crystal display of claim 25, wherein the material of the heat-dissipating core plate is selected from a dielectric material, The electric conductor, the heat transfer body, and one of the above-mentioned groups of the above-mentioned ones. The light source module according to claim 25, wherein the core plate is a flat heat pipe. The liquid crystal display of claim 25, wherein each of the conductive layers - the board or the at least - dielectric layer and at least - the liquid crystal display of claim 38, wherein the 26 1355539 100 -10-18 The material of the dielectric layer is selected from the group consisting of oxides, ceramic materials, and the like. 40. The liquid crystal display of claim 25, wherein the light emitting elements emit light of a plurality of colors. The liquid crystal display of claim 25, wherein the illumination device further comprises at least one optical protrusion disposed between two adjacent light plates. 42. 如申請專利範圍第41項所述之液晶顯示器，其中該 些光學突出物的形狀包括角錐形、圓錐形、拋物面形或= 球形。 43. 如申請專利範圍第25項所述之液晶顯示器，其中該 底板上具有至少一插槽，而該光學載板對應插置並穿過该 插槽。42. The liquid crystal display of claim 41, wherein the shape of the optical protrusions comprises a pyramidal shape, a conical shape, a parabolic shape or a spherical shape. The liquid crystal display of claim 25, wherein the substrate has at least one slot, and the optical carrier is correspondingly inserted and passed through the slot. ” 44·如申請專利範圍第25項所述之液晶顯示器，其中. 照明裝置更包括—散熱片，其相對該些發光it件而配 遠底板的另-側’且該光學載板連接該散熱片。 45. 如申請專利範圍第Μ項所述之液晶顯示器，其中 光學載板穿過誠；^與該散糾結纟。 ’、 46. 如申請專利範圍第25項所述之液晶顯示器，更私 驅動發光元件的控制器，其經由該些電子電路詹 電性連接至該些發光元件。 ㈣ 4 7.如申請專利範圍第2 9項所述之液晶顯示器，更包 > -光學膜片，其配置於該液晶面板與該心 伙如申請專利範圍第47項所述之液晶顯示器，其中 27 135553944. The liquid crystal display of claim 25, wherein the illuminating device further comprises a heat sink, the other side of the bottom plate is coupled to the light emitting parts, and the optical carrier is connected to the heat sink. 45. The liquid crystal display of claim 25, wherein the optical carrier passes through the singularity; and the liquid crystal display according to claim 25, a controller for driving a light-emitting element, which is electrically connected to the light-emitting elements via the electronic circuits. (4) 4 7. The liquid crystal display according to claim 29, further comprising > - optical film , which is disposed on the liquid crystal panel and the liquid crystal display as described in claim 47, wherein 27 1355539 100-10-18 光學膜片包括擴散片、棱鏡片、增光片及上述該等所組成 之族群其中之一。 28100-10-18 The optical film comprises a diffusion sheet, a prism sheet, a brightness enhancement sheet, and one of the groups of the above. 28