TWI350823B - Substrate cutting device and method for cutting a substrate using the same - Google Patents

Substrate cutting device and method for cutting a substrate using the same

Info

Publication number
TWI350823B
TWI350823B TW097110079A TW97110079A TWI350823B TW I350823 B TWI350823 B TW I350823B TW 097110079 A TW097110079 A TW 097110079A TW 97110079 A TW97110079 A TW 97110079A TW I350823 B TWI350823 B TW I350823B
Authority
TW
Taiwan
Prior art keywords
substrate
cutting
same
cutting device
substrate cutting
Prior art date
Application number
TW097110079A
Other languages
Chinese (zh)
Other versions
TW200940461A (en
Inventor
Yi Lung Liu
Chun Kai Huang
Original Assignee
Foxsemicon Integrated Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Tech Inc filed Critical Foxsemicon Integrated Tech Inc
Priority to TW097110079A priority Critical patent/TWI350823B/en
Publication of TW200940461A publication Critical patent/TW200940461A/en
Application granted granted Critical
Publication of TWI350823B publication Critical patent/TWI350823B/en

Links

TW097110079A 2008-03-21 2008-03-21 Substrate cutting device and method for cutting a substrate using the same TWI350823B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097110079A TWI350823B (en) 2008-03-21 2008-03-21 Substrate cutting device and method for cutting a substrate using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097110079A TWI350823B (en) 2008-03-21 2008-03-21 Substrate cutting device and method for cutting a substrate using the same

Publications (2)

Publication Number Publication Date
TW200940461A TW200940461A (en) 2009-10-01
TWI350823B true TWI350823B (en) 2011-10-21

Family

ID=44868011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110079A TWI350823B (en) 2008-03-21 2008-03-21 Substrate cutting device and method for cutting a substrate using the same

Country Status (1)

Country Link
TW (1) TWI350823B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI476064B (en) * 2011-11-07 2015-03-11 Metal Ind Res & Dev Ct A method for cutting brittle material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI476064B (en) * 2011-11-07 2015-03-11 Metal Ind Res & Dev Ct A method for cutting brittle material

Also Published As

Publication number Publication date
TW200940461A (en) 2009-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees