TW537108U - Improved structure for polishing positioning ring of wafer - Google Patents

Improved structure for polishing positioning ring of wafer

Info

Publication number
TW537108U
TW537108U TW90219986U TW90219986U TW537108U TW 537108 U TW537108 U TW 537108U TW 90219986 U TW90219986 U TW 90219986U TW 90219986 U TW90219986 U TW 90219986U TW 537108 U TW537108 U TW 537108U
Authority
TW
Taiwan
Prior art keywords
wafer
positioning ring
improved structure
polishing positioning
polishing
Prior art date
Application number
TW90219986U
Other languages
Chinese (zh)
Inventor
Shui-Yuan Chen
Shui-Sheng Chen
Tien-Ting Chen
Original Assignee
Shui-Yuan Chen
Shui-Sheng Chen
Tien-Ting Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shui-Yuan Chen, Shui-Sheng Chen, Tien-Ting Chen filed Critical Shui-Yuan Chen
Priority to TW90219986U priority Critical patent/TW537108U/en
Publication of TW537108U publication Critical patent/TW537108U/en

Links

TW90219986U 2001-11-20 2001-11-20 Improved structure for polishing positioning ring of wafer TW537108U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90219986U TW537108U (en) 2001-11-20 2001-11-20 Improved structure for polishing positioning ring of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90219986U TW537108U (en) 2001-11-20 2001-11-20 Improved structure for polishing positioning ring of wafer

Publications (1)

Publication Number Publication Date
TW537108U true TW537108U (en) 2003-06-11

Family

ID=29247207

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90219986U TW537108U (en) 2001-11-20 2001-11-20 Improved structure for polishing positioning ring of wafer

Country Status (1)

Country Link
TW (1) TW537108U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9937601B2 (en) 2003-11-13 2018-04-10 Applied Materials, Inc. Retaining ring with Shaped Surface
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9937601B2 (en) 2003-11-13 2018-04-10 Applied Materials, Inc. Retaining ring with Shaped Surface
US10766117B2 (en) 2003-11-13 2020-09-08 Applied Materials, Inc. Retaining ring with shaped surface
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
US11577361B2 (en) 2003-11-13 2023-02-14 Applied Materials, Inc. Retaining ring with shaped surface and method of forming
US11850703B2 (en) 2003-11-13 2023-12-26 Applied Materials, Inc. Method of forming retaining ring with shaped surface

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