TW537108U - Improved structure for polishing positioning ring of wafer - Google Patents
Improved structure for polishing positioning ring of waferInfo
- Publication number
- TW537108U TW537108U TW90219986U TW90219986U TW537108U TW 537108 U TW537108 U TW 537108U TW 90219986 U TW90219986 U TW 90219986U TW 90219986 U TW90219986 U TW 90219986U TW 537108 U TW537108 U TW 537108U
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- positioning ring
- improved structure
- polishing positioning
- polishing
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90219986U TW537108U (en) | 2001-11-20 | 2001-11-20 | Improved structure for polishing positioning ring of wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW90219986U TW537108U (en) | 2001-11-20 | 2001-11-20 | Improved structure for polishing positioning ring of wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
TW537108U true TW537108U (en) | 2003-06-11 |
Family
ID=29247207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW90219986U TW537108U (en) | 2001-11-20 | 2001-11-20 | Improved structure for polishing positioning ring of wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW537108U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9937601B2 (en) | 2003-11-13 | 2018-04-10 | Applied Materials, Inc. | Retaining ring with Shaped Surface |
US11260500B2 (en) | 2003-11-13 | 2022-03-01 | Applied Materials, Inc. | Retaining ring with shaped surface |
-
2001
- 2001-11-20 TW TW90219986U patent/TW537108U/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9937601B2 (en) | 2003-11-13 | 2018-04-10 | Applied Materials, Inc. | Retaining ring with Shaped Surface |
US10766117B2 (en) | 2003-11-13 | 2020-09-08 | Applied Materials, Inc. | Retaining ring with shaped surface |
US11260500B2 (en) | 2003-11-13 | 2022-03-01 | Applied Materials, Inc. | Retaining ring with shaped surface |
US11577361B2 (en) | 2003-11-13 | 2023-02-14 | Applied Materials, Inc. | Retaining ring with shaped surface and method of forming |
US11850703B2 (en) | 2003-11-13 | 2023-12-26 | Applied Materials, Inc. | Method of forming retaining ring with shaped surface |
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