TW481433U - A folded fin heat sink and a heat exchanger employing the heat sink - Google Patents

A folded fin heat sink and a heat exchanger employing the heat sink

Info

Publication number
TW481433U
TW481433U TW089207113U TW89207113U TW481433U TW 481433 U TW481433 U TW 481433U TW 089207113 U TW089207113 U TW 089207113U TW 89207113 U TW89207113 U TW 89207113U TW 481433 U TW481433 U TW 481433U
Authority
TW
Taiwan
Prior art keywords
heat sink
folded fin
heat
exchanger employing
heat exchanger
Prior art date
Application number
TW089207113U
Other languages
English (en)
Inventor
Blaine C Wotring
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW481433U publication Critical patent/TW481433U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW089207113U 1999-04-30 2000-05-23 A folded fin heat sink and a heat exchanger employing the heat sink TW481433U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/303,806 US6199624B1 (en) 1999-04-30 1999-04-30 Folded fin heat sink and a heat exchanger employing the heat sink

Publications (1)

Publication Number Publication Date
TW481433U true TW481433U (en) 2002-03-21

Family

ID=23173787

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089207113U TW481433U (en) 1999-04-30 2000-05-23 A folded fin heat sink and a heat exchanger employing the heat sink

Country Status (4)

Country Link
US (1) US6199624B1 (zh)
JP (1) JP3278809B2 (zh)
CN (1) CN1187816C (zh)
TW (1) TW481433U (zh)

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FI974293A0 (fi) * 1997-11-21 1997-11-21 Muuntolaite Oy Kylelement foer ojaemnt foerdelad vaermebelastning
JP3990519B2 (ja) * 1999-09-30 2007-10-17 富士通株式会社 ファンユニット
TW478723U (en) * 2000-09-14 2002-03-01 Foxconn Prec Components Co Ltd Fan fixing device
JP4431263B2 (ja) * 2000-09-29 2010-03-10 山洋電気株式会社 電子部品冷却装置
TW588932U (en) * 2000-12-20 2004-05-21 Foxconn Prec Components Co Ltd Heat sink module
US6397931B1 (en) * 2001-02-27 2002-06-04 The United States Of America As Represented By The Secretary Of The Air Force Finned heat exchanger
US6912128B2 (en) 2001-08-09 2005-06-28 Celestica International Inc. Electronics cooling subassembly
US20030066626A1 (en) * 2001-10-04 2003-04-10 John Bird Cooling system having independent fan location
US6590770B1 (en) 2002-03-14 2003-07-08 Modine Manufacturing Company Serpentine, slit fin heat sink device
US6668910B2 (en) 2002-04-09 2003-12-30 Delphi Technologies, Inc. Heat sink with multiple surface enhancements
WO2003098705A1 (en) * 2002-05-17 2003-11-27 Schripsema Jason E Photovoltaic module with adjustable heat sink and method of fabrication
TW535489B (en) * 2002-05-31 2003-06-01 Peng Jian Composite working method of heat conduction device and the product thereof
US7046515B1 (en) * 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
US6830097B2 (en) 2002-09-27 2004-12-14 Modine Manufacturing Company Combination tower and serpentine fin heat sink device
US6672374B1 (en) * 2002-10-23 2004-01-06 Jeh-Ren Lin Heat sink coupling device
US6712128B1 (en) 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
WO2005006435A1 (en) * 2003-07-09 2005-01-20 C C K Innovations Sdn Bhd Heat sink
CN2672865Y (zh) * 2003-11-14 2005-01-19 鸿富锦精密工业（深圳）有限公司 散热器
TWI251460B (en) * 2004-01-09 2006-03-11 Delta Electronics Inc Compound heat sink with multi-directional fins
US7055577B2 (en) * 2004-02-12 2006-06-06 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device for electronic device
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
CN2694488Y (zh) * 2004-03-18 2005-04-20 鸿富锦精密工业（深圳）有限公司 散热装置
US20060011324A1 (en) * 2004-07-13 2006-01-19 Rogers C J Wound, louvered fin heat sink device
CN100342530C (zh) * 2004-07-30 2007-10-10 奇鋐科技股份有限公司 具有导引风管及风罩的散热模组
CN100414695C (zh) * 2004-07-30 2008-08-27 奇鋐科技股份有限公司 具有导引风管的散热模组
US7182124B2 (en) * 2004-08-31 2007-02-27 Egbon Electronics Ltd. Heat sink structure
US20060081357A1 (en) * 2004-10-20 2006-04-20 Wen-Hao Liu Radiation module
US20060093476A1 (en) * 2004-10-29 2006-05-04 Stanley Gavin D Fan stator
US7178587B2 (en) * 2004-12-20 2007-02-20 Asia Vital Component Co., Ltd. Heat-dissipating module
KR100719702B1 (ko) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US7289322B2 (en) * 2005-10-24 2007-10-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US7347251B2 (en) * 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
CN101222835A (zh) * 2007-01-12 2008-07-16 富准精密工业(深圳)有限公司 散热装置
TW200905458A (en) * 2007-07-30 2009-02-01 Inventec Corp Heat-dissipating module
JP4992808B2 (ja) * 2008-04-16 2012-08-08 トヨタ自動車株式会社 熱交換器の製造方法
US9228732B2 (en) 2008-07-08 2016-01-05 Us Vaopto, Inc. Modular LED lighting systems, including flexible, rigid, and waterproof lighting strips and connectors
US7972040B2 (en) 2008-08-22 2011-07-05 Virginia Optoelectronics, Inc. LED lamp assembly
US20100170657A1 (en) * 2009-01-06 2010-07-08 United Technologies Corporation Integrated blower diffuser-fin heat sink
EP2224480A1 (en) * 2009-02-25 2010-09-01 Te-Lung Chen The Improved Structure of a Radiator
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
CN102324408A (zh) * 2011-08-15 2012-01-18 苏州欧姆尼克新能源科技有限公司 折叠翅片式散热器
US20130056186A1 (en) 2011-09-06 2013-03-07 Carl Schalansky Heat exchanger produced from laminar elements
JP5653872B2 (ja) * 2011-09-22 2015-01-14 古河電気工業株式会社 筐体用冷却装置
US9538693B2 (en) * 2013-03-15 2017-01-03 A.K. Stamping Company, Inc. Aluminum EMI / RF shield
JP2016009003A (ja) * 2014-06-23 2016-01-18 株式会社リコー 冷却装置、画像投射装置、電子機器
US10488028B2 (en) * 2017-05-03 2019-11-26 Fluence Bioengineering, Inc. Systems and methods for a heat sink
CN108323360A (zh) * 2018-04-09 2018-07-27 王承辉 大棚种植的节能温度调节装置
US10966335B2 (en) * 2019-04-29 2021-03-30 Semiconductor Components Industries, Llc Fin frame assemblies
CN113432097A (zh) * 2021-06-29 2021-09-24 深圳市海洋王照明工程有限公司 散热结构件及灯具

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JP2548124B2 (ja) * 1985-08-29 1996-10-30 松下電器産業株式会社 ヒ−トシンク装置
JPH0754876B2 (ja) * 1985-09-04 1995-06-07 松下電器産業株式会社 ヒ−トシンク装置
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
JP2806745B2 (ja) * 1993-07-08 1998-09-30 株式会社ピーエフユー ファン一体型発熱素子冷却装置
JP2804690B2 (ja) * 1992-08-06 1998-09-30 株式会社ピーエフユー 高発熱素子の冷却構造
JP3017396B2 (ja) * 1994-05-18 2000-03-06 株式会社ピーエフユー ファン付きヒートシンク装置
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
GB2303970A (en) * 1995-07-31 1997-03-05 Ming Der Chiou CPU heat dissipating apparatus
US5661638A (en) * 1995-11-03 1997-08-26 Silicon Graphics, Inc. High performance spiral heat sink
JPH09149598A (ja) * 1995-11-20 1997-06-06 Seiko Epson Corp 冷却ファンおよび冷却ファン組立体
US5706169A (en) * 1996-05-15 1998-01-06 Yeh; Robin Cooling apparatus for a computer central processing unit
US6026895A (en) * 1998-02-06 2000-02-22 Fujitsu Limited Flexible foil finned heatsink structure and method of making same
US6021844A (en) * 1998-06-03 2000-02-08 Batchelder; John Samuel Heat exchange apparatus

Also Published As

Publication number Publication date
CN1187816C (zh) 2005-02-02
CN1272693A (zh) 2000-11-08
JP2000332172A (ja) 2000-11-30
US6199624B1 (en) 2001-03-13
JP3278809B2 (ja) 2002-04-30

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees