TW366537B - Method of improving wafer post cleaning after chemical mechanical polishing process - Google Patents
Method of improving wafer post cleaning after chemical mechanical polishing processInfo
- Publication number
- TW366537B TW366537B TW087106124A TW87106124A TW366537B TW 366537 B TW366537 B TW 366537B TW 087106124 A TW087106124 A TW 087106124A TW 87106124 A TW87106124 A TW 87106124A TW 366537 B TW366537 B TW 366537B
- Authority
- TW
- Taiwan
- Prior art keywords
- mechanical polishing
- chemical mechanical
- cleaning
- polishing process
- chips
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A cleaning method of complete removal of particles attached onto surface of chips in post cleaning of chemical mechanical polishing CMP. The method disclosed in the present invention deals with, after CMP of chips, placing the chip into a megasonic tank for megasonic cleaning process before carrying out the post-CMP cleaning process. In addition of injecting D.I. Water in the megasonic tank, NH4OH is also injected for heating with a heater for removal of particles from the chip, being said manufacturing process to provide humidification to the chips.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087106124A TW366537B (en) | 1998-04-21 | 1998-04-21 | Method of improving wafer post cleaning after chemical mechanical polishing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087106124A TW366537B (en) | 1998-04-21 | 1998-04-21 | Method of improving wafer post cleaning after chemical mechanical polishing process |
Publications (1)
Publication Number | Publication Date |
---|---|
TW366537B true TW366537B (en) | 1999-08-11 |
Family
ID=57941136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087106124A TW366537B (en) | 1998-04-21 | 1998-04-21 | Method of improving wafer post cleaning after chemical mechanical polishing process |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW366537B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI816386B (en) * | 2021-05-04 | 2023-09-21 | 美商應用材料股份有限公司 | Hot water generation for chemical mechanical polishing |
-
1998
- 1998-04-21 TW TW087106124A patent/TW366537B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI816386B (en) * | 2021-05-04 | 2023-09-21 | 美商應用材料股份有限公司 | Hot water generation for chemical mechanical polishing |
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Legal Events
Date | Code | Title | Description |
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MK4A | Expiration of patent term of an invention patent |