TW202326887A - Pusher drive unit and test handler - Google Patents

Pusher drive unit and test handler Download PDF

Info

Publication number
TW202326887A
TW202326887A TW111148565A TW111148565A TW202326887A TW 202326887 A TW202326887 A TW 202326887A TW 111148565 A TW111148565 A TW 111148565A TW 111148565 A TW111148565 A TW 111148565A TW 202326887 A TW202326887 A TW 202326887A
Authority
TW
Taiwan
Prior art keywords
pusher
diaphragm
flexure
test
thruster
Prior art date
Application number
TW111148565A
Other languages
Chinese (zh)
Other versions
TWI823719B (en
Inventor
李昌澤
Original Assignee
韓商细美事有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 韓商细美事有限公司 filed Critical 韓商细美事有限公司
Publication of TW202326887A publication Critical patent/TW202326887A/en
Application granted granted Critical
Publication of TWI823719B publication Critical patent/TWI823719B/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Vending Machines For Individual Products (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Special Conveying (AREA)

Abstract

A pusher drive unit and a test handler are provided. The pusher drive unit includes a driving block, a gas supplying module and a diaphragm. The driving block has an inner space with an open end corresponding to a pusher and a gas inlet communicating with the inner space. The gas supplying module is connected to the gas inlet. The diaphragm is formed a driving chamber and connected to the pusher. Based on the pressure of the gas introduced from the gas supplying module into the driving chamber, the driving chamber is deformed or restored while the pusher advances or retreats relative to the electronic accessory. A central region of the diaphragm is connected to the pusher, an edge region of the diaphragm is engaged to the driving chamber, and an intermediate region between the central region and the edge region is formed to have at least one curved portion.

Description

推進器驅動單元以及測試分類機Thruster drive unit and test sorter

本發明的實施例涉及用於對半導體元件(semiconductor device)等電子配件檢查電性能的測試分類機。Embodiments of the present invention relate to a test sorter for checking electrical performance of electronic components such as semiconductor devices.

為了對經一系列製程製造的半導體元件檢查電性能(電特性等)，可以使用測試設備。In order to check electrical performance (electrical characteristics, etc.) of semiconductor elements manufactured through a series of processes, testing equipment can be used.

測試設備包括測試分類機以及測試器(tester)，並構成為若測試分類機搬動半導體元件而將其與測試器電連接則測試器將測試訊號提供到半導體元件並分析來自半導體元件的輸出訊號，從而能夠檢查半導體元件的電性能。The test equipment includes a test sorter and a tester, and is configured such that if the test sorter moves the semiconductor device and electrically connects it to the tester, the tester supplies a test signal to the semiconductor device and analyzes an output signal from the semiconductor device , so that the electrical performance of the semiconductor element can be checked.

測試分類機可以包括將要檢查的半導體元件加熱或冷卻到測試溫度的溫度調節單元。所以，檢查半導體元件的測試空間可以在執行測試製程的期間營造成高溫氛圍或營造成低溫氛圍。The test sorter may include a temperature adjustment unit that heats or cools the semiconductor element to be inspected to a test temperature. Therefore, the test space for inspecting the semiconductor device can be created into a high temperature atmosphere or a low temperature atmosphere during the execution of the test process.

在測試空間中搬動半導體元件的結構由於以暴露在通過溫度調節單元營造的高溫環境或者低溫環境中的狀態重複工作，產生的應力高而可能容易損壞。The structure that transports semiconductor elements in the test space may be easily damaged due to high stress due to repeated work in a state of being exposed to a high-temperature environment or a low-temperature environment created by a temperature adjustment unit.

(專利文獻1)韓國授權專利公報第10-1228207號(2013.01.30)(Patent Document 1) Korean Granted Patent Publication No. 10-1228207 (2013.01.30)

(專利文獻2)韓國公開專利公佈第10-2014-0141405號(2014.12.10)(Patent Document 2) Korean Laid-Open Patent Publication No. 10-2014-0141405 (2014.12.10)

(專利文獻3)韓國公開專利公佈第10-2017-0049690號(2017.05.11)(Patent Document 3) Korean Laid-Open Patent Publication No. 10-2017-0049690 (2017.05.11)

本發明的實施例旨在提供能夠更積極地抑制應力引起的損壞的推進器驅動單元以及測試分類機。Embodiments of the present invention aim to provide thruster drive units and test sorters that more aggressively suppress stress-induced damage.

本發明的實施例旨在提供能夠在高溫環境或者低溫環境下保障更穩定的可工作性的推進器驅動單元以及測試分類機。Embodiments of the present invention aim to provide a thruster drive unit and a test sorter capable of ensuring more stable workability in a high-temperature environment or a low-temperature environment.

所要解決的課題不限於此，所屬技術領域具有通常知識者可以從下面的記載明確地理解未提及的其它課題。The problems to be solved are not limited to these, and other problems not mentioned can be clearly understood from the following description by those skilled in the art.

根據本發明的實施例，可以是，提供一種推進器驅動單元，包括：驅動塊，具有形成有與將電子配件向測試器側加壓的推進器相對的開放端的內部空間以及與所述內部空間連通的氣體導入孔；氣體供應模組，連接於所述氣體導入孔；以及隔膜，在所述內部空間形成與所述開放端切斷且與所述氣體導入孔連通的驅動室，並通過所述開放端與所述推進器連接，並且根據從所述氣體供應模組導入到所述驅動室的氣體的壓力而將所述驅動室變形為放大或復原的同時使所述推進器相對於所述電子配件前進或後退，所述隔膜的中央區域與所述推進器連接，所述隔膜的邊緣區域結合於所述驅動室，所述中央區域和所述邊緣區域之間的中間區域形成為具有至少一個屈曲部。According to an embodiment of the present invention, there may be provided a pusher drive unit, including: a drive block having an inner space formed with an open end opposite to a pusher that pressurizes an electronic accessory to the tester side; A connected gas introduction hole; a gas supply module connected to the gas introduction hole; and a diaphragm forming a driving chamber cut off from the open end and communicating with the gas introduction hole in the internal space, and passing through the The open end is connected to the pusher, and the drive chamber is deformed to enlarge or restore according to the pressure of the gas introduced into the drive chamber from the gas supply module while making the pusher relative to the drive chamber The electronic accessory advances or retreats, the central area of the diaphragm is connected to the pusher, the edge area of the diaphragm is combined with the drive chamber, and the middle area between the central area and the edge area is formed to have at least one flexure.

可以是，所述隔膜提供為所述屈曲部根據導入到所述驅動室的所述氣體的壓力而能夠自由變形。可以是，所述屈曲部沿著所述中間區域的周邊方向設置。The diaphragm may be provided such that the bent portion is freely deformable according to the pressure of the gas introduced into the drive chamber. It may be that the bending portion is arranged along the peripheral direction of the middle region.

作為一例，可以是，所述屈曲部彎曲成向所述推進器相對於所述電子配件前進的方向鼓起。可以是，向所述推進器相對於所述電子配件前進的方向鼓起的所述屈曲部提供為具有通過包括所述屈曲部的頂點的頂點區間彼此連接的一對直線區間，一對所述直線區間形成為彼此平行。在此，可以是，所述頂點區間形成為與一對所述直線區間相比具有較厚的厚度。As an example, the bending portion may be bent so as to bulge in a direction in which the pusher advances relative to the electronic component. It may be that the flexed portion swollen toward a direction in which the pusher advances with respect to the electronic accessory is provided to have a pair of linear sections connected to each other by a vertex section including an apex of the flexed portion, a pair of the The linear sections are formed parallel to each other. Here, the apex section may be formed thicker than the pair of straight line sections.

作為另一例，可以是，所述屈曲部彎曲成向所述推進器相對於所述電子配件後退的方向鼓起。向所述推進器相對於所述電子配件後退的方向鼓起的所述屈曲部提供為具有通過包括所述屈曲部的頂點的頂點區間彼此連接的一對直線區間，一對所述直線區間形成為彼此平行。As another example, the bending portion may be bent so as to bulge in a direction in which the pusher retreats relative to the electronic component. The flex portion bulged toward a direction in which the pusher retreats with respect to the electronic accessory is provided to have a pair of straight line sections connected to each other by an apex section including an apex of the flexure portion, a pair of the straight line sections forming to be parallel to each other.

作為又另一例，可以是，所述隔膜形成為作為所述屈曲部具有不同的第一屈曲部和第二屈曲部。可以是，所述第一屈曲部彎曲成向所述推進器相對於所述電子配件前進的方向鼓起，所述第二屈曲部彎曲成向所述推進器相對於所述電子配件後退的方向鼓起。As yet another example, the diaphragm may be formed to have different first and second bending portions as the bending portion. It may be that the first flexing portion is bent to bulge toward the direction in which the propeller advances relative to the electronic accessory, and the second flexing portion is bent in a direction in which the propeller retreats relative to the electronic accessory muster.

可以是，所述第一屈曲部配置於所述第二屈曲部的外側。It may be that the first bending portion is disposed outside the second bending portion.

可以是，所述第一屈曲部和所述第二屈曲部連續形成。可以是，包括所述第一屈曲部的頂點的第一頂點區間和包括所述第二屈曲部的頂點的第二頂點區間通過公共直線區間彼此連接，所述第一屈曲部以及所述第二屈曲部分別具有連接於所述第一頂點區間的第一直線區間以及連接於所述第二頂點區間的第二直線區間，所述第一屈曲部和所述第二屈曲部共有的公共直線區間、所述第一屈曲部的所述第一直線區間以及所述第二屈曲部的所述第二直線區間形成為彼此平行。It may be that the first bending portion and the second bending portion are continuously formed. It may be that the first vertex section including the vertex of the first flexure part and the second vertex section including the vertex of the second flexure part are connected to each other by a common straight line section, and the first flexure part and the second flexure part The buckling parts respectively have a first straight line section connected to the first vertex section and a second straight line section connected to the second vertex section, the common straight line section shared by the first buckling part and the second buckling part, The first straight section of the first flexion portion and the second straight section of the second flexion portion are formed parallel to each other.

可以是，所述中央區域從所述邊緣區域隔開，所述中央區域與所述邊緣區域隔開的方向為所述推進器相對於所述電子配件前進的方向。It may be that the central area is separated from the edge area, and the direction in which the central area is separated from the edge area is a direction in which the propeller advances relative to the electronic accessory.

可以是，所述隔膜由包括原料橡膠以及增強纖維的橡膠組合物形成。可以是，述原料橡膠包括矽橡膠，所述增強纖維是芳醯胺纖維。The diaphragm may be formed of a rubber composition including raw rubber and reinforcing fibers. Optionally, the raw material rubber includes silicone rubber, and the reinforcing fibers are aramid fibers.

根據本發明的實施例，可以是，提供一種測試分類機，包括：推進器，為了電子配件和測試器的電連接而將所述電子配件向所述測試器側加壓；以及推進器驅動單元，為了所述推進器對所述電子配件的加壓以及解除加壓而使所述推進器相對於所述電子配件前進或後退，所述推進器驅動單元包括：驅動塊，具有形成有與所述推進器相對的開放端的內部空間以及與所述內部空間連通的氣體導入孔；氣體供應模組，連接於所述氣體導入孔；以及隔膜，在所述內部空間形成與所述開放端切斷且與所述氣體導入孔連通的驅動室，並通過所述開放端與所述推進器連接，並且根據從所述氣體供應模組導入到所述驅動室的氣體的壓力而將所述驅動室變形為放大或復原的同時使所述推進器移動，所述隔膜的中央區域與所述推進器連接，所述隔膜的邊緣區域結合於所述驅動室，所述中央區域和所述邊緣區域之間的中間區域形成為具有至少一個屈曲部。According to an embodiment of the present invention, it may be that a test sorter is provided, including: a pusher, which pressurizes the electronic accessory to the side of the tester for electrical connection between the electronic accessory and the tester; and a pusher driving unit , for the pusher to pressurize and depressurize the electronic accessory so that the pusher advances or retreats relative to the electronic accessory, the pusher driving unit includes: a driving block having a The internal space of the opposite open end of the propeller and the gas introduction hole communicating with the internal space; the gas supply module connected to the gas introduction hole; and the diaphragm formed in the internal space and cut off from the open end. and a driving chamber communicated with the gas introduction hole, and connected to the impeller through the open end, and the driving chamber is connected to the driving chamber according to the pressure of the gas introduced into the driving chamber from the gas supply module. The propeller is moved while being deformed to enlarge or restore, the central area of the diaphragm is connected to the propeller, the edge area of the diaphragm is combined with the driving chamber, and the center area and the edge area are connected to each other. An intermediate region therebetween is formed with at least one flexure.

在根據本發明的實施例的測試分類機中，可以是，所述隔膜提供為所述屈曲部根據導入到所述驅動室的所述氣體的壓力而能夠自由變形，所述屈曲部沿著所述中間區域的周邊方向設置。In the test sorter according to an embodiment of the present invention, it may be that the diaphragm is provided such that the flexure portion is freely deformable according to the pressure of the gas introduced into the driving chamber, and the flexure portion is along the set in the peripheral direction of the middle area.

根據本發明的實施例，可以是，提供一種測試分類機，包括：測試腔室，提供測試空間；溫度調節單元，將搬入到所述測試空間中的電子配件加熱或冷卻到測試溫度；推進器，為了所述電子配件和測試器的電連接而將所述電子配件向所述測試器側加壓；以及推進器驅動單元，為了所述推進器對所述電子配件的加壓以及解除加壓而使所述推進器相對於所述電子配件前進或後退，所述推進器驅動單元包括：驅動塊，具有形成有與所述推進器相對的開放端的內部空間以及與所述內部空間連通的氣體導入孔；氣體供應模組，連接於所述氣體導入孔；隔膜，在所述內部空間形成與所述開放端切斷且與所述氣體導入孔連通的驅動室，並通過所述開放端與所述推進器連接，並且根據從所述氣體供應模組導入到所述驅動室的氣體的壓力而將所述驅動室變形為放大或復原的同時使所述推進器移動；以及彈性模組，將彈力對所述推進器向所述推進器相對於所述電子配件後退的方向提供，所述隔膜形成為中央區域與所述推進器連接，並邊緣區域結合於所述驅動室，並且所述中央區域和所述邊緣區域之間的中間區域具有第一屈曲部以及第二屈曲部，所述隔膜提供為所述屈曲部根據所述氣體的壓力而能夠自由變形，所述隔膜由包括原料橡膠和增強纖維的橡膠組合物形成，所述中央區域從所述邊緣區域隔開，所述中央區域與所述邊緣區域隔開的方向為所述推進器相對於所述電子配件前進的方向，所述第一屈曲部以及所述第二屈曲部沿著所述中間區域的周邊方向設置，所述第一屈曲部彎曲成向所述推進器相對於所述電子配件前進的方向鼓起，所述第二屈曲部在所述第一屈曲部的內側彎曲成向所述推進器相對於所述電子配件後退的方向鼓起。According to an embodiment of the present invention, it may be that a test sorter is provided, including: a test chamber, providing a test space; a temperature adjustment unit, heating or cooling the electronic accessories moved into the test space to the test temperature; a propeller , pressurizing the electronic accessory to the tester side for electrical connection between the electronic accessory and the tester; and a pusher driving unit for pressurizing and depressurizing the electronic accessory by the pusher To advance or retreat the pusher relative to the electronic accessory, the pusher drive unit includes: a drive block having an inner space formed with an open end opposite to the pusher and a gas communicating with the inner space. an introduction hole; a gas supply module connected to the gas introduction hole; a diaphragm forming a drive chamber cut off from the open end and communicating with the gas introduction hole in the internal space, and connected to the gas introduction hole through the open end. the pusher is connected and moves the pusher while deforming the drive chamber to enlarge or restore according to the pressure of gas introduced into the drive chamber from the gas supply module; and an elastic module, providing elastic force to the pusher in a direction in which the pusher retreats relative to the electronic accessory, the diaphragm is formed such that a central area is connected to the pusher, an edge area is combined with the driving chamber, and the The intermediate region between the central region and the edge region has a first flexed portion and a second flexed portion, the diaphragm is provided so that the flexed portion can freely deform according to the pressure of the gas, and the diaphragm is made of raw rubber It is formed of a rubber composition with reinforcing fibers, the central area is separated from the edge area, and the direction in which the central area is separated from the edge area is the advancing direction of the propeller relative to the electronic accessory, so The first flexure portion and the second flexure portion are arranged along the peripheral direction of the middle area, the first flexure portion is bent to bulge toward the direction in which the pusher advances relative to the electronic accessory, and the The second flexed portion is bent inside the first flexed portion to bulge in a direction in which the pusher retreats relative to the electronic accessory.

在根據本發明的實施例的測試分類機中，可以是，所述原料橡膠包括將對所述測試溫度的耐熱性和耐寒性一起具有的矽橡膠，所述增強纖維是長度為0.8mm至1.2mm的對位芳綸短纖維。In the test classifier according to the embodiment of the present invention, it may be that the raw rubber includes silicon rubber that has both heat resistance and cold resistance to the test temperature, and the reinforcing fiber has a length of 0.8 mm to 1.2 mm. mm of para-aramid staple fiber.

課題的解決手段會通過下面說明的實施例、圖式等變得更具體且清楚。另外，在下面會追加提出除提及的解決手段以外的各種解決手段。Means for solving the problems will become more concrete and clear from examples, drawings, and the like described below. In addition, various solutions other than the above-mentioned solutions will be additionally proposed below.

根據本發明的實施例，能夠更積極地抑制隔膜由於重複工作所產生的應力引起的損壞而防止隔膜的使用壽命縮短。另外，通過在測試溫度下也確保隔膜的穩定的可工作性而能夠提高檢查可靠性。According to the embodiments of the present invention, it is possible to more actively suppress damage of the diaphragm due to stress generated by repeated work to prevent shortening of the service life of the diaphragm. In addition, inspection reliability can be improved by ensuring stable workability of the diaphragm also at the test temperature.

發明的效果不限於此，所屬技術領域具有通常知識者可以從本說明書以及所附圖式明確地理解未提及的其它效果。The effects of the invention are not limited thereto, and other effects not mentioned can be clearly understood from the present specification and the attached drawings by those skilled in the art.

以下，參照圖式來詳細說明本發明的實施例，以使得本發明所屬技術領域中具有通常知識的人能夠容易地實施。但是，本發明可以以各種不同方式實現，不限於在此說明的實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement. However, the present invention can be implemented in various ways and is not limited to the embodiments described here.

在說明本發明的實施例時，當判斷為針對相關習知功能或結構的具體說明不必要地混淆本發明的主旨時省略其具體說明，起到類似功能以及作用的部分在所有圖式中使用相同的標號。When describing the embodiments of the present invention, when it is judged that the specific descriptions for related known functions or structures unnecessarily obscure the gist of the present invention, the detailed descriptions are omitted, and the parts with similar functions and effects are used in all drawings same label.

在說明書中使用的用語中的至少一部分是考慮本發明中的功能所定義的，因此可以根據使用者、操作者意圖、慣例等不同。因而，應基於整個說明書的內容來解釋其用語。另外，在說明書中，當稱包括某個構成要件時，只要沒有特意相反的記載，其意指可以還包括其它構成要件而不是排除其它構成要件。而且，當稱某個部分與另一部分連接(或者，結合)時，其不僅包括直接連接(或者，結合)的情況，還包括隔著其它部分而間接連接(或者，結合)的情況。At least some of the terms used in the specification are defined in consideration of the functions in the present invention, and thus may be different according to users, operators' intentions, practices, and the like. Therefore, the terms thereof should be interpreted based on the contents of the entire specification. In addition, in the specification, when it is said that a certain constituent element is included, it means that other constituent elements may be included rather than excluded, unless there is an intentional statement to the contrary. Also, when it is said that a certain part is connected (or, combined) with another part, it includes not only a case of being directly connected (or, combined) but also a case of being indirectly connected (or, combined) through other parts.

另一方面，在圖式中，出於便於理解，構成要件的尺寸或形狀、線的厚度等可能多少誇大呈現。On the other hand, in the drawings, the size and shape of constituent elements, the thickness of lines, and the like may be somewhat exaggerated for the sake of understanding.

本發明可以相同或類似地用於對半導體元件等各種電子配件檢查電性能(電特性等)，本發明的實施例觀察電子配件為半導體元件的情況。The present invention can be used in the same or similar manner to check the electrical performance (electrical characteristics, etc.) of various electronic components such as semiconductor components, and the embodiment of the present invention observes the case that the electronic component is a semiconductor component.

根據本發明的實施例的半導體元件測試設備的結構示意性地示出在圖1中。The structure of a semiconductor element testing apparatus according to an embodiment of the present invention is schematically shown in FIG. 1 .

參照圖1，根據本發明的實施例的半導體元件測試設備可以包括測試分類機30以及測試器90。而且，測試分類機30可以包括裝載器(loader)40、第一腔室50、測試腔室60、第二腔室70以及卸載器(unloader)80。Referring to FIG. 1 , a semiconductor component testing apparatus according to an embodiment of the present invention may include a test sorter 30 and a tester 90 . Also, the test sorter 30 may include a loader 40 , a first chamber 50 , a test chamber 60 , a second chamber 70 and an unloader 80 .

若容納有要檢查的半導體元件SD的用戶托盤(customer tray)5投放到測試分類機30，則裝載器40可以將容納在用戶托盤5中的半導體元件SD裝載到裝載位置上的測試托盤(test tray)20。裝載位置的測試托盤20可以移送到第一腔室50。If the user tray (customer tray) 5 containing the semiconductor element SD to be checked is thrown into the test sorter 30, then the loader 40 can load the semiconductor element SD contained in the user tray 5 to the test tray (test tray) on the loading position. tray) 20. The test tray 20 at the loading position may be transferred to the first chamber 50 .

第一腔室50可以提供保管來自裝載器40的測試托盤20的空間。容納在測試托盤20中的半導體元件可以在第一腔室50中調節到第一溫度。第一溫度可以是與用於在測試腔室60中執行的測試製程的測試溫度相同或近似的溫度。所以，半導體元件可以在第一腔室50中加熱或冷卻到與測試溫度相同或近似的溫度。第一腔室50可以稱為持溫腔室(soak chamber)。保管在第一腔室50中的測試托盤20可以移送到測試腔室60。The first chamber 50 may provide a space for storing the test tray 20 from the loader 40 . The semiconductor elements accommodated in the test tray 20 may be adjusted to a first temperature in the first chamber 50 . The first temperature may be the same or similar temperature as the test temperature used for the test process performed in the test chamber 60 . Therefore, the semiconductor element can be heated or cooled in the first chamber 50 to the same or similar temperature as the test temperature. The first chamber 50 may be called a soak chamber. The test tray 20 stored in the first chamber 50 can be transferred to the test chamber 60 .

測試腔室60可以提供對半導體元件執行測試製程的測試空間(測試側)。來自第一腔室50的測試托盤20可以搬入到測試空間。調節成第一溫度的半導體元件可以在測試空間中通過溫度調節單元(可以構成為將通過加熱器加熱的氣體(空氣)或者通過液化氮氣體冷卻的氣體(空氣)供應到測試空間。)加熱或冷卻到測試溫度，並與測試器90電連接。所以，可以檢查半導體元件在測試空間中是否在高溫環境或者低溫環境下也正常發揮電性能。測試器可以通過將測試訊號提供到半導體元件並分析來自半導體元件的輸出訊號，檢查半導體元件的電性能。容納有完成檢查的半導體元件的測試托盤20可以從測試腔室60移動到第二腔室70。The test chamber 60 may provide a test space (test side) in which a test process is performed on the semiconductor device. The test trays 20 from the first chamber 50 can be moved into the test space. The semiconductor element adjusted to the first temperature may be heated in the test space by the temperature adjustment unit (which may be configured to supply gas (air) heated by a heater or gas (air) cooled by liquefied nitrogen gas to the test space.) or Cool to test temperature and electrically connect to tester 90. Therefore, it can be checked whether the semiconductor element normally exhibits electrical performance in a high-temperature environment or a low-temperature environment in the test space. A tester can check the electrical performance of a semiconductor device by providing a test signal to the semiconductor device and analyzing an output signal from the semiconductor device. The test tray 20 containing the inspected semiconductor components may be moved from the test chamber 60 to the second chamber 70 .

第二腔室70可以提供保管來自測試腔室60的測試托盤20的空間。容納在測試托盤20中的半導體元件可以在第二腔室70中調節到第二溫度。第二溫度可以是常溫或接近常溫的溫度。所以，半導體元件可以在第二腔室70中回歸到常溫或者接近常溫的溫度。第二腔室70可以稱為回溫腔室(de-soak chamber)。保管在第二腔室70中的測試托盤20可以移送到卸載器80的卸載位置。The second chamber 70 may provide a space for storing the test tray 20 from the test chamber 60 . The semiconductor components accommodated in the test tray 20 may be adjusted to a second temperature in the second chamber 70 . The second temperature may be normal temperature or a temperature close to normal temperature. Therefore, the semiconductor element can return to normal temperature or a temperature close to normal temperature in the second chamber 70 . The second chamber 70 may be referred to as a de-soak chamber. The test tray 20 stored in the second chamber 70 can be moved to the unloading position of the unloader 80 .

卸載器80可以將容納在卸載位置上的測試托盤20中的半導體元件卸載而移動到空的用戶托盤5。半導體元件可以在卸載器80中按照基於測試製程結果的等級容納到用戶托盤5。The unloader 80 can unload the semiconductor components accommodated in the test tray 20 at the unloading position and move to the empty customer tray 5 . The semiconductor components may be accommodated in the user tray 5 in the unloader 80 in ranks based on test process results.

可以是，測試分類機30包括連接板，測試器90包括測試板。可以是，測試腔室60和測試器90配置成彼此相鄰，連接板提供於測試腔室60的測試空間。連接板和測試板可以彼此電連接。It may be that the test sorter 30 includes a connecting board, and the tester 90 includes a testing board. It may be that the test chamber 60 and the tester 90 are arranged adjacent to each other, and the connecting plate is provided in the test space of the test chamber 60 . The connection board and the test board can be electrically connected to each other.

圖2是示出測試分類機30的元件加壓裝置的結構圖。參照圖2，容納在測試托盤20中的半導體元件可以在測試空間中被元件加壓裝置300加壓成與連接板的夾具板10的測試夾具12分別接觸。FIG. 2 is a configuration diagram showing a component pressing device of the test sorter 30 . Referring to FIG. 2 , semiconductor components accommodated in the test tray 20 may be pressed into contact with the test jigs 12 of the jig board 10 of the connection board by the component pressing device 300 in the test space, respectively.

元件加壓裝置300可以包括具有為了半導體元件和測試器90的電連接而將半導體元件向測試器90側即夾具板10側加壓而使半導體元件與測試夾具12分別接觸的推進器140的推動單元100，以及為了推進器140對半導體元件的加壓以及解除加壓而使推進器140相對於半導體元件前進或後退的推進器驅動單元200。The component pressing device 300 may include a pusher 140 that presses the semiconductor component to the side of the tester 90, that is, the side of the fixture plate 10, so that the semiconductor component and the test fixture 12 are respectively contacted for the electrical connection of the semiconductor component and the tester 90. The unit 100 and the pusher drive unit 200 for moving the pusher 140 forward or backward relative to the semiconductor element for pressurization and depressurization of the semiconductor element by the pusher 140 .

以下，為了便於說明，在推進器140的移動方向中，將推進器140為了加壓半導體元件而前進的方向稱為前方，將推進器140為了解除對半導體元件的加壓而後退的方向稱為後方。Hereinafter, for convenience of description, among the moving directions of the pusher 140, the direction in which the pusher 140 advances to pressurize the semiconductor element is referred to as the front, and the direction in which the pusher 140 retreats to release the pressurization of the semiconductor element is referred to as the forward direction. rear.

測試夾具12可以在夾具板10中以一定間隔配置。夾具板10可以具有與測試托盤20接觸的托盤阻擋器11。托盤阻擋器11可以從夾具板10向推動單元100側即後方凸出。測試夾具12的每一個可以具有作為與半導體元件的球(ball)之類端子電接通的接通端子的接通針13，以及與測試托盤20中分別容納半導體元件的載架模組21接觸的載架阻擋器14。接通針13可以是彈簧針(pogo pin)。載架阻擋器14可以向推動單元100側凸出。可以是，載架阻擋器14的每一個具有多個向後方凸出的導針15，載架模組21的每一個具有分別被***對應的測試夾具12的導針15的導槽(或者導孔)26。The test fixtures 12 may be arranged at intervals in the fixture plate 10 . The jig plate 10 may have a tray stopper 11 in contact with the test tray 20 . The tray stopper 11 may protrude from the jig plate 10 toward the pushing unit 100 side, that is, rearward. Each of the test jigs 12 may have contact pins 13 as contact terminals electrically connected to terminals such as balls of the semiconductor elements, and to be in contact with the carrier modules 21 respectively accommodating the semiconductor elements in the test trays 20. Carriage stopper 14. The contact pin 13 may be a pogo pin. The carriage stopper 14 may protrude toward the pushing unit 100 side. It may be that each of the carrier stoppers 14 has a plurality of guide pins 15 protruding rearward, and each of the carrier modules 21 has guide grooves (or guide pins 15) that are respectively inserted into the corresponding test fixtures 12. holes) 26.

測試托盤20的載架模組21可以獨立地容納半導體元件並固定容納的半導體元件的位置。載架模組21可以以與測試夾具12對應的間隔配置。載架模組21的每一個包括主體22以及支承部件24。可以是，主體22在測試托盤20中提供為能夠在推進器140的移動方向即前方和後方上多少活動，容納半導體元件的空腔23佈置於主體22的中央部分。空腔23可以形成為具有前方和後方開放的構造。支承部件24可以提供於空腔23的前方部分而支承容納在空腔23中的半導體元件，並具有使得支承的半導體元件的端子暴露的接通孔。所以，被支承部件24支承的半導體元件的每一個的端子可以通過支承部件24的接通孔與接通針13接通。The carrier module 21 of the test tray 20 may independently accommodate semiconductor components and fix the position of the accommodated semiconductor components. The carrier modules 21 may be arranged at intervals corresponding to the test fixtures 12 . Each of the carrier modules 21 includes a main body 22 and a support member 24 . It may be that the main body 22 is provided in the test tray 20 to be somewhat movable in the direction of movement of the pusher 140 , that is, front and rear, and the cavity 23 for accommodating semiconductor elements is arranged at a central portion of the main body 22 . The cavity 23 may be formed to have a front and rear open configuration. The support member 24 may be provided at a front portion of the cavity 23 to support the semiconductor element accommodated in the cavity 23 and have a through hole exposing a terminal of the supported semiconductor element. Therefore, the terminals of each of the semiconductor elements supported by the support member 24 can be connected to the contact pins 13 through the contact holes of the support member 24 .

推動單元100可以包括能夠向前方和後方往復移動的可動部件110、沿著可動部件110的移動方向對載架模組21的每一個執行加壓以及解除加壓的載架加壓塊120以及使可動部件110往復的線性致動器130。推動單元100的推進器140可以在載架加壓塊120的每一個的中央部分提供為能夠向前方和後方往復移動，並且若通過推進器驅動單元200前進則能夠將半導體元件向測試器90側加壓。The pushing unit 100 may include a movable part 110 capable of reciprocating forward and rearward movement, a carriage pressurizing block 120 that pressurizes and depressurizes each of the carriage modules 21 along a moving direction of the movable part 110, and a The movable part 110 is reciprocated by a linear actuator 130 . The pusher 140 of the pushing unit 100 may be provided at a central portion of each of the carrier press blocks 120 so as to be capable of reciprocating forward and backward, and the semiconductor element can be moved toward the tester 90 side if advanced by the pusher driving unit 200. Pressurize.

推進器140可以配置成分別貫通載架加壓塊120的中央部分。推進器140的每一個可以包括通過推進器驅動單元200移動的加壓杆141、144、在加壓杆141、144的前方根據加壓杆141、144的移動方向與半導體元件接觸或解除接觸的接觸部件142以及在加壓杆141、144和接觸部件142之間向接觸部件142提供彈力的彈性部件即壓縮螺旋彈簧143。可以是，加壓杆141、144具有分割為前杆141和後杆144的構造，壓縮螺旋彈簧143介於前杆141和接觸部件142之間。The pushers 140 may be configured to penetrate through central portions of the carrier pressing blocks 120, respectively. Each of the pushers 140 may include pressurizing rods 141, 144 moved by the pusher driving unit 200, and contacts or releases of the semiconductor elements in front of the pressurizing rods 141, 144 according to the moving direction of the pressurizing rods 141, 144. The contact member 142 and the compression coil spring 143 which is an elastic member that provides elastic force to the contact member 142 between the pressing rods 141 , 144 and the contact member 142 . The pressurizing rods 141 and 144 may have a structure divided into a front rod 141 and a rear rod 144 , and the compression coil spring 143 may be interposed between the front rod 141 and the contact member 142 .

圖3是示出元件加壓裝置300的一部分的放大圖。參照圖2以及圖3，推進器驅動單元200可以包括具有在前方形成有與推進器140的後杆144的每一個相對的開放端216的內部空間以及與內部空間的每一個連通的氣體導入孔215的驅動塊210、與驅動塊210的氣體導入孔215連接的氣體供應模組260以及在驅動塊210的內部空間的每一個形成與開放端216切斷且與氣體導入孔215連通的氣密性的驅動室214的隔膜230。隔膜230可以通過將驅動塊210的內部空間分別劃分為前方部分和後方部分，將後方部分作為驅動室214，將驅動室214的每一個與開放端216切斷。可以是，推進器140的後杆144是後方的頭部145通過開放端216分別連接於隔膜230，隔膜230根據從氣體供應模組260向驅動室214導入的氣體的壓力而將驅動室214分別變形為放大或復原為原狀的同時使後杆144前進或後退。FIG. 3 is an enlarged view showing a part of the component pressing device 300 . Referring to FIGS. 2 and 3 , the pusher driving unit 200 may include an internal space having an open end 216 formed in front opposite to each of the rear rods 144 of the pusher 140 and a gas introduction hole communicating with each of the internal spaces. Each of the driving block 210 at 215, the gas supply module 260 connected to the gas introduction hole 215 of the driving block 210, and the inner space of the driving block 210 form an airtight air-tight valve that is cut off from the open end 216 and communicated with the gas introduction hole 215. diaphragm 230 of drive chamber 214. The diaphragm 230 may separate each of the driving chambers 214 from the open end 216 by dividing the inner space of the driving block 210 into a front portion and a rear portion, respectively, using the rear portion as the driving chamber 214 . It can be that the rear rod 144 of the thruster 140 is connected to the diaphragm 230 through the open end 216 through the head 145 at the rear, and the diaphragm 230 separates the driving chamber 214 according to the pressure of the gas introduced from the gas supply module 260 to the driving chamber 214. The rear lever 144 is moved forward or backward while being deformed to be enlarged or restored to its original shape.

驅動塊210可以由彼此層疊的後板211、中間板212以及前板213構成。可以是，前板213層疊於中間板212的前方部分，後板211層疊於中間板212的後方部分。The driving block 210 may be composed of a rear plate 211 , a middle plate 212 , and a front plate 213 stacked on each other. It may be that the front plate 213 is stacked on the front portion of the middle plate 212 , and the rear plate 211 is stacked on the rear portion of the middle plate 212 .

在後板211可以設置氣體導入孔215。在中間板212可以設置包括驅動室214的內部空間。內部空間也可以提供為跨後板211和中間板212。在前板213可以設置開放端216。開放端216也可以提供為跨中間板212和前板213。A gas introduction hole 215 may be provided in the rear plate 211 . An inner space including a driving chamber 214 may be provided in the middle plate 212 . An internal space may also be provided across the rear panel 211 and the middle panel 212 . An open end 216 may be provided at the front plate 213 . An open end 216 may also be provided spanning the middle panel 212 and the front panel 213 .

推進器140的後杆144的每一個可以包括連接於隔膜230的頭部145、從頭部145向前方延伸的杆體146。頭部145的每一個可以具有與隔膜230結合的結合槽147。杆體146可以以通過開放端216從驅動塊210向前方凸出的長度形成。Each of the rear rods 144 of the pusher 140 may include a head 145 connected to the diaphragm 230 , and a rod body 146 extending forward from the head 145 . Each of the heads 145 may have a coupling groove 147 coupled with the diaphragm 230 . The rod body 146 may be formed in a length protruding forward from the driving block 210 through the open end 216 .

隔膜230的每一個可以具有中央區域、邊緣區域以及中間區域。隔膜230的每一個可以是中央區域從邊緣區域隔開。隔膜230的每一個可以是中央區域從邊緣區域隔開的方向為前方，由此形成為大致碗結構。若將隔膜230形成為整體向前方鼓起的碗結構，則能夠容易引導來自氣體供應模組260氣體壓力下的隔膜230的變形。Each of the diaphragms 230 may have a central region, an edge region, and a middle region. Each of the membranes 230 may have a central region separated from an edge region. Each of the diaphragms 230 may have a direction in which the central region is spaced from the edge region to the front, thereby forming a substantially bowl structure. If the diaphragm 230 is formed as a bowl structure that bulges forward as a whole, deformation of the diaphragm 230 under the gas pressure from the gas supply module 260 can be easily guided.

隔膜230可以是中央區域與後杆144的頭部145分別結合。在隔膜230的中央區域的每一個可以設置向前方凸出的結合凸起232。結合凸起232可以與頭部145的結合槽147分別嵌合而與結合槽147結合。隔膜230可以是邊緣區域與驅動室214分別結合。隔膜230可以是邊緣區域嵌合於後板211和所述中間板212之間而與驅動室214分別結合。The diaphragm 230 may have a central region combined with the head 145 of the rear rod 144, respectively. A coupling protrusion 232 protruding forward may be provided at each of central regions of the diaphragms 230 . The coupling protrusions 232 can respectively fit into the coupling grooves 147 of the head portion 145 to be coupled to the coupling grooves 147 . The diaphragm 230 may have an edge region combined with the driving chamber 214, respectively. The diaphragm 230 may be fitted between the rear plate 211 and the middle plate 212 at an edge area to be respectively combined with the driving chamber 214 .

推進器驅動單元200可以還包括導套240以及壓縮螺旋彈簧250。The pusher driving unit 200 may further include a guide bush 240 and a compression coil spring 250 .

導套240可以分別提供於驅動塊210的開放端216。導套240可以分別引導杆體146的移動。壓縮螺旋彈簧250的每一個可以在後杆144和驅動塊210之間設置成圍繞杆體146。導套240配置於開放端216，因此壓縮螺旋彈簧250可以配置於後杆144和導套240之間。可以是，頭部145在前方具備第一彈簧槽，導套240在後方具備第二彈簧槽，壓縮螺旋彈簧250的每一個可以兩側端部分別***到第一彈簧槽和第二彈簧槽。Guide bushes 240 may be provided to the open ends 216 of the driving blocks 210, respectively. The guide sleeves 240 can respectively guide the movement of the rod bodies 146 . Each of the compression coil springs 250 may be disposed to surround the rod body 146 between the rear rod 144 and the driving block 210 . The guide sleeve 240 is disposed on the open end 216 , so the compression coil spring 250 can be disposed between the rear rod 144 and the guide sleeve 240 . It may be that the head 145 has a first spring groove at the front, and the guide sleeve 240 has a second spring groove at the rear, and each of the compression coil springs 250 can be inserted into the first spring groove and the second spring groove at both ends.

若中斷通過氣體導入孔215進行的氣體供應，則即使不去除驅動室214的氣體(氣體也可以從驅動室去除。)，也能夠減小驅動室214的壓力。所以，壓縮螺旋彈簧250復原，後杆144可以後退。壓縮螺旋彈簧250可以構成對推進器140向後退方向賦予彈力的彈力賦予構件。If the gas supply through the gas introduction hole 215 is interrupted, the pressure of the driving chamber 214 can be reduced without removing the gas from the driving chamber 214 (the gas can also be removed from the driving chamber). Therefore, the compression coil spring 250 is restored, and the rear lever 144 can retreat. The compression coil spring 250 can constitute an elastic force imparting member that imparts elastic force to the pusher 140 in the backward direction.

氣體供應模組260可以作為氣體的一例將空氣通過各氣體導入孔215向各驅動室214供應，並調節供應的空氣的量。氣體供應模組260可以包括用於將空氣壓縮後供應的壓縮空氣生成器(氣體供應源)262、根據測試分類機30的控制裝置的控制而調整從壓縮空氣生成器262向驅動室214供應的空氣的壓力的壓力調整器264以及作為用於容許或切斷來自驅動室214的空氣供應的流量調節閥發揮功能的電磁閥266。The gas supply module 260 can supply air to each drive chamber 214 through each gas introduction hole 215 as an example of gas, and can adjust the amount of supplied air. The gas supply module 260 may include a compressed air generator (gas supply source) 262 for supplying compressed air. A pressure regulator 264 for air pressure and a solenoid valve 266 function as a flow rate regulating valve for allowing or blocking air supply from the drive chamber 214 .

元件加壓裝置300可以如下工作。The component pressing device 300 can work as follows.

容納有半導體元件的測試托盤20搬入到測試空間而在夾具板10的後方配置成半導體元件與測試夾具12對應。The test tray 20 accommodating semiconductor elements is carried into the test space and arranged behind the jig plate 10 so that the semiconductor elements correspond to the test jigs 12 .

之後，線性致動器130工作而可動部件110前進，提供到可動部件110的前方的載架加壓塊120與載架模組21接觸而加壓載架模組21。由此，若測試托盤20前進而接觸於托盤阻擋器11，則測試托盤20不能再前進。Afterwards, the linear actuator 130 operates to advance the movable part 110 , and the carrier pressing block 120 provided to the front of the movable part 110 contacts the carrier module 21 to press the carrier module 21 . Therefore, if the test tray 20 advances and contacts the tray stopper 11, the test tray 20 cannot advance further.

接著，載架模組21移動而半導體元件的端子與測試夾具12的接通針13接觸。同時，載架模組21接觸於載架阻擋器14而固定載架模組21的位置。此時，導針15***到載架模組21的導槽26而載架模組21相對於測試夾具12引導到準確的位置。Then, the carrier module 21 moves and the terminals of the semiconductor device come into contact with the connection pins 13 of the test fixture 12 . At the same time, the carrier module 21 contacts the carrier stopper 14 to fix the position of the carrier module 21 . At this time, the guide pin 15 is inserted into the guide groove 26 of the carrier module 21 and the carrier module 21 is guided to an accurate position relative to the test fixture 12 .

與這樣的工作一起，電磁閥266以開啟工作，被壓縮的空氣從壓縮空氣生成器262通過壓力調整器264調整為預定的壓力後通過氣體導入孔215供應到驅動室214。Along with this operation, the solenoid valve 266 is opened, and the compressed air is adjusted to a predetermined pressure from the compressed air generator 262 by the pressure regulator 264 and supplied to the driving chamber 214 through the air introduction hole 215 .

供應到驅動室214的空氣使隔膜230變形，驅動室214放大而推後杆144使其前進。隨著這樣的後杆144的移動，前杆141前進，配置於前杆141的前端的接觸部件142分別加壓半導體元件。因此，半導體元件的端子與接通針13接觸。半導體元件在這樣的狀態下被檢查電性能。The air supplied to the drive chamber 214 deforms the diaphragm 230, the drive chamber 214 expands and the rear rod 144 is pushed forward. As the rear rod 144 moves, the front rod 141 advances, and the contact member 142 arranged at the front end of the front rod 141 presses the semiconductor elements. Therefore, the terminal of the semiconductor element is in contact with the contact pin 13 . The semiconductor element is checked for electrical properties in such a state.

在圖2以及圖3的元件加壓裝置300中適用的隔膜230等示出在圖4中。Diaphragm 230 and the like used in component pressurizing device 300 of FIGS. 2 and 3 are shown in FIG. 4 .

參照圖3以及圖4，可以是，隔膜230形成為具有中央區域和邊緣區域之間的中間區域為直線形的同時隨著前往前方縮小的傾斜，各個中間區域可以以折疊狀態介於驅動塊210的內部空間內壁和後杆144的頭部145之間。Referring to FIG. 3 and FIG. 4 , it may be that the diaphragm 230 is formed to have a rectilinear intermediate area between the central area and the edge area, and at the same time, the inclination decreases as it goes forward, and each intermediate area can be interposed between the drive block 210 in a folded state. Between the inner wall of the inner space and the head 145 of the rear rod 144 .

若在隔膜230的中間區域的每一個以折疊狀態夾於驅動塊210的內部空間內壁和後杆144的頭部145之間的狀態下，隔膜230根據來自氣體供應模組260的空氣壓力重複變形並復原，則由於在隔膜230的中間區域產生的應力高而隔膜230的中間區域可能容易損壞。另外，在由溫度調節單元在測試空間營造的高溫氛圍或者低溫氛圍下，可能產生隔膜230的形狀變化或加速隔膜230的損壞(破裂等)。If each of the intermediate regions of the diaphragm 230 is sandwiched between the inner wall of the inner space of the drive block 210 and the head 145 of the rear rod 144 in a folded state, the diaphragm 230 repeats the operation according to the air pressure from the air supply module 260. deformed and restored, the middle region of the diaphragm 230 may be easily damaged due to the high stress generated therein. In addition, in a high-temperature atmosphere or a low-temperature atmosphere created by the temperature adjustment unit in the test space, a shape change of the diaphragm 230 may occur or damage (rupture, etc.) of the diaphragm 230 may be accelerated.

隔膜的變形例示出在圖5至圖8中。根據這些變形例，在半導體元件測試設備中，可以改善提及的與隔膜230相關的事項。Modifications of the diaphragm are shown in FIGS. 5 to 8 . According to these modification examples, in the semiconductor element testing apparatus, the mentioned matters related to the diaphragm 230 can be improved.

當與圖3以及圖4所示的隔膜230相比較時，圖5所示的隔膜230A的變形例的不同點可以僅在於，中央區域和邊緣區域之間的中間區域提供為能夠無約束地自由變形，並由包括原料橡膠以及增強纖維的橡膠組合物形成。When compared with the diaphragm 230 shown in FIGS. 3 and 4 , the modification of the diaphragm 230A shown in FIG. 5 may differ only in that the intermediate region between the central region and the edge region is provided to be free without restriction. Deformed and formed from a rubber composition including raw rubber and reinforcing fibers.

圖5所示的隔膜230A的變形例是中間區域提供為能夠無約束地自由變形，因此能夠抑制中間區域重複變形並復原引起的損壞而長久使用。In the modified example of the diaphragm 230A shown in FIG. 5 , the middle region is provided to be freely deformable without restraint, so that damage caused by repeated deformation and recovery of the middle region can be suppressed for long-term use.

可以是，原料橡膠包括將在測試溫度的高溫下耐得住的耐熱性以及在測試溫度的低溫下耐得住的耐寒性全部具有的矽橡膠，增強纖維是芳醯胺纖維。通常，矽橡膠可以在-50℃至200℃的溫度範圍內使用。根據這樣的矽橡膠，圖5所示的隔膜230A的變形例可以在測試溫度下不發生形狀變化而保持彈性等固有性質。增強纖維可以是長度為0.8mm至1.2mm的對位芳綸短纖維。增強纖維提高原料橡膠間的附著力，可以對圖5所示的隔膜230A的變形例加大耐久性，賦予上升的氣體切斷率。The raw rubber may include silicone rubber having both heat resistance at a high test temperature and cold resistance at a low test temperature, and the reinforcing fibers may be aramid fibers. Generally, silicone rubber can be used in the temperature range of -50°C to 200°C. According to such silicone rubber, the modified example of the diaphragm 230A shown in FIG. 5 can maintain inherent properties such as elasticity without changing its shape at the test temperature. The reinforcing fibers may be para-aramid staple fibers with a length of 0.8 mm to 1.2 mm. The reinforcing fibers improve the adhesion between the raw rubbers, thereby increasing the durability of the modified example of the diaphragm 230A shown in FIG. 5 , and imparting an increased gas cut-off rate.

當與圖5所示的隔膜230A相比較時，圖6所示的隔膜230B的變形例的不同點可以僅在於，在能夠自由變形的中間區域形成減少應力的至少一個屈曲部233。隨著中間區域能夠自由變形，屈曲部233也能夠無約束地自由地變形。When compared with the diaphragm 230A shown in FIG. 5 , the modified example of the diaphragm 230B shown in FIG. 6 may differ only in that at least one buckling portion 233 for reducing stress is formed in a freely deformable middle region. As the intermediate region is free to deform, the flexure 233 is also free to deform without restraint.

屈曲部233可以沿著中間區域的周邊方向設置而具有環結構。屈曲部233可以彎曲成向後方鼓起。向後方鼓起的屈曲部233當中間區域在空氣壓力下變形後向原狀復原時能夠通過向後方鼓起的形狀自身提高復原力。The flex portion 233 may be disposed along a peripheral direction of the middle region to have a ring structure. The flex portion 233 may be bent to bulge rearward. The rearwardly swollen bent portion 233 can improve the restoring force by the rearwardly swollen shape itself when the middle region is deformed by air pressure and then returns to its original shape.

屈曲部233也可以彎曲成向前方鼓起而不是向後方鼓起。若屈曲部233向前方鼓起，則當中間區域在空氣壓力下變形時能夠積極地引導中間區域的變形。The flex portion 233 may also be bent so as to bulge forward instead of bulging rearward. If the bent portion 233 bulges forward, the deformation of the middle region can be actively guided when the middle region is deformed by air pressure.

當與圖6所示的隔膜230B相比較時，圖7所示的隔膜230C的變形例的不同點可以僅在於，作為屈曲部具有彼此不同的第一屈曲部234和第二屈曲部235。根據彼此不同的第一屈曲部234和第二屈曲部235，能夠更彈性地應對在中間區域產生的應力而減少應力。When compared with the diaphragm 230B shown in FIG. 6 , the modified example of the diaphragm 230C shown in FIG. 7 may differ only in that it has a first flexed portion 234 and a second flexed portion 235 that are different from each other as flexed portions. According to the first flexure portion 234 and the second flexure portion 235 that are different from each other, it is possible to more elastically cope with the stress generated in the intermediate region and reduce the stress.

可以是，第一屈曲部234和第二屈曲部235中的任一個彎曲成向前方鼓起而另一個彎曲成向後方鼓起。如此，根據彼此不同方向的第一屈曲部234和第二屈曲部235，能夠同時期待中間區域的變形的積極引導以及中間區域的復原力上升。Either one of the first bending portion 234 and the second bending portion 235 may be bent to swell forward and the other may be bent to swell rearward. In this way, positive guidance of deformation in the middle region and increase in restoring force in the middle region can be expected at the same time by the first bending portion 234 and the second bending portion 235 in different directions.

可以是，第一屈曲部234彎曲成向前方鼓起，第二屈曲部235彎曲成向後方鼓起。可以是，第一屈曲部234配置於第二屈曲部235的外側，第一屈曲部234和第二屈曲部235連續形成。隨著向後方鼓起的第二屈曲部235配置於第一屈曲部234的內側，能夠將中間區域的上升的復原力積極地適用於後杆144的後退引導。根據連續的第一屈曲部234和第二屈曲部235，能夠使第一屈曲部234和第二屈曲部235之間重疊，由此與確保的面積相應地擴大第一屈曲部234和第二屈曲部235的尺寸，能夠加大中間區域的變形的積極引導以及中間區域的復原力上升效果。It may be that the first bending portion 234 is bent to bulge forward, and the second bending portion 235 is bent to bulge rearward. It may be that the first flexed portion 234 is disposed outside the second flexed portion 235 , and the first flexed portion 234 and the second flexed portion 235 are continuously formed. As the second flexing portion 235 swollen rearward is disposed inside the first flexing portion 234 , the rising restoring force in the middle region can be positively applied to guide the retreat of the rear bar 144 . According to the continuous first flexed portion 234 and the second flexed portion 235, the first flexed portion 234 and the second flexed portion 235 can be overlapped, thereby expanding the first flexed portion 234 and the second flexed portion according to the secured area. The size of the portion 235 can increase the effect of positively guiding the deformation of the middle region and increasing the restoring force of the middle region.

當與圖7所示的隔膜230C相比較時，圖8所示的隔膜230D的變形例的不同點可以僅在於，彼此不同的第一屈曲部236和第二屈曲部237形成為具有直線區間。When compared with the diaphragm 230C shown in FIG. 7 , the modified example of the diaphragm 230D shown in FIG. 8 may differ only in that the first flexed portion 236 and the second flexed portion 237 that are different from each other are formed to have linear sections.

圖8所示的隔膜230D的變形例可以是，包括第一屈曲部236的頂點的第一頂點區間236a和包括第二屈曲部237的頂點的第二頂點區間237a通過公共直線區間238彼此連接。而且，第一屈曲部236以及第二屈曲部237可以分別具有連接於第一頂點區間236a的第一直線區間以及連接於第二頂點區間237a的第二直線區間。而且，第一屈曲部236和第二屈曲部237共有的公共直線區間238、第一屈曲部236的第一直線區間以及第二屈曲部237的第二直線區間可以形成為彼此平行。而且，第一頂點區間236a可以形成為與第一屈曲部236的第一直線區間以及公共直線區間238相比具有較厚的厚度。A modification of the diaphragm 230D shown in FIG. 8 may be such that a first apex section 236 a including the apex of the first flexed part 236 and a second apex section 237 a including the apex of the second flexed part 237 are connected to each other by a common straight line section 238 . Furthermore, the first flexion portion 236 and the second flexion portion 237 may respectively have a first straight line section connected to the first apex section 236 a and a second straight line section connected to the second apex section 237 a. Also, the common straight line section 238 shared by the first flexion part 236 and the second flexion part 237 , the first straight line section of the first flexion part 236 , and the second straight line section of the second flexion part 237 may be formed parallel to each other. Also, the first apex section 236 a may be formed to have a thicker thickness than the first straight section of the first flexion part 236 and the common straight section 238 .

根據相對厚的第一頂點區間236a，能夠保持成當中間區域在空氣壓力下變形時向前方鼓起而承擔中間區域的積極變形的第一屈曲部236的第一直線區間與公共直線區間238平行，大體上能夠通過第一屈曲部236的第一直線區間的長度發生變化的方式限制中間區域的變形。這可以更可靠地將中間區域的變形力傳遞到後杆144，能夠顯著減小在中間區域產生的應力。According to the relatively thick first apex section 236a, the first linear section of the first buckling portion 236, which can be held to bulge forward when the middle area deforms under air pressure to undertake positive deformation of the middle area, is parallel to the common straight line section 238, Basically, the deformation of the middle region can be limited by the change of the length of the first straight section of the first flexure 236 . This can more reliably transmit the deforming force of the middle region to the rear rod 144, and can significantly reduce the stress generated in the middle region.

根據第二屈曲部237的第二直線區間與公共直線區間238平行的形狀，能夠進一步加大中間區域的復原力上升效果。According to the shape in which the second straight line section of the second bending portion 237 is parallel to the common straight line section 238 , the effect of increasing the restoring force in the middle area can be further increased.

以上，說明了本發明，但本發明不限於所公開的實施例以及所附圖式，所屬技術領域具有通常知識者可以在不脫離本發明的技術構思的範圍內進行各種變形。另外，在本發明的實施例中所說明的技術構思既可以各自獨立地實施，也可以彼此組合兩個以上來實施。The present invention has been described above, but the present invention is not limited to the disclosed embodiments and the attached drawings, and various modifications can be made by those skilled in the art without departing from the technical concept of the present invention. In addition, the technical ideas described in the embodiments of the present invention may be implemented independently or in combination of two or more of them.

5:用戶托盤 10:夾具板 11:托盤阻擋器 12:測試夾具 13:接通針 14:載架阻擋器 15:導針 20:測試托盤 21:載架模組 22:主體 23:空腔 24:支承部件 26:導槽 30:測試分類機 40:裝載器 50:第一腔室 60:測試腔室 70:第二腔室 80:卸載器 90:測試器 100:推動單元 110:可動部件 120:載架加壓塊 130:線性致動器 140:推進器 141:前杆 142:接觸部件 143、250:壓縮螺旋彈簧 144:後杆 145:頭部 146:杆體 147:結合槽 200:推進器驅動單元 210:驅動塊 211:後板 212:中間板 213:前板 214:驅動室 215:氣體導入孔 216:開放端 230、230A、230B、230C、230D:隔膜 232:結合凸起 233:屈曲部 234、236:第一屈曲部 235、237:第二屈曲部 236a:第一頂點區間 237a:第二頂點區間 238:公共直線區間 240:導套 260:氣體供應模組 262:壓縮空氣生成器 264:壓力調整器 266:電磁閥 300:元件加壓裝置 SD:半導體元件 5: User Tray 10: Fixture board 11: Tray stopper 12: Test fixture 13: connect the needle 14: Carrier stopper 15: guide pin 20:Test Tray 21: Carrier module 22: Subject 23: cavity 24: Supporting parts 26: guide groove 30:Test sorter 40:Loader 50: First chamber 60: Test chamber 70:Second chamber 80: Uninstaller 90: Tester 100: push unit 110: Movable parts 120: carrier pressure block 130: Linear Actuator 140: Thruster 141: front rod 142: contact parts 143, 250: compression coil spring 144: rear rod 145: head 146: rod body 147: combination slot 200: Thruster drive unit 210: drive block 211: rear plate 212: middle plate 213: front plate 214: drive room 215: gas inlet hole 216: Open end 230, 230A, 230B, 230C, 230D: diaphragm 232: Combination bump 233: Flexion 234, 236: the first flexion 235, 237: Second flexion 236a: the first vertex interval 237a: the second vertex interval 238: Public straight line interval 240: guide sleeve 260: Gas Supply Module 262: Compressed air generator 264:Pressure regulator 266:Solenoid valve 300: Component pressurization device SD: semiconductor device

圖1是示出根據本發明的實施例的半導體元件測試設備的結構的示意圖。FIG. 1 is a schematic diagram showing the structure of a semiconductor element testing apparatus according to an embodiment of the present invention.

圖2是示出圖1所示的測試分類機的元件加壓裝置的結構圖。FIG. 2 is a block diagram showing a component pressing device of the test sorter shown in FIG. 1 .

圖3是示出圖2所示的元件加壓裝置的一部分的放大圖。FIG. 3 is an enlarged view showing a part of the component pressing device shown in FIG. 2 .

圖4是示出適用於圖2以及圖3的元件加壓裝置中的隔膜以及其周邊結構的結構圖。FIG. 4 is a structural view showing a diaphragm and its peripheral structure used in the component pressurizing device shown in FIGS. 2 and 3 .

圖5至圖8是示出根據本發明的實施例的半導體元件測試設備中隔膜的變形例以及其周邊結構的結構圖。5 to 8 are structural diagrams showing modifications of the diaphragm in the semiconductor element testing apparatus according to the embodiment of the present invention and its peripheral structure.

144:後杆 144: rear rod

145:頭部 145: head

146:杆體 146: rod body

147:結合槽 147: combination slot

210:驅動塊 210: drive block

211:後板 211: rear plate

212:中間板 212: middle plate

213:前板 213: front plate

214:驅動室 214: drive room

215:氣體導入孔 215: gas inlet hole

216:開放端 216: Open end

230D:隔膜 230D: Diaphragm

232:結合凸起 232: Combination bump

236:第一屈曲部 236: First flexion

237:第二屈曲部 237: Second flexion

236a:第一頂點區間 236a: the first vertex interval

237a:第二頂點區間 237a: the second vertex interval

238:公共直線區間 238: Public straight line interval

240:導套 240: guide sleeve

250:壓縮螺旋彈簧 250: Compression coil spring

Claims (20)

一種推進器驅動單元，包括： 驅動塊，具有形成有與將電子配件向測試器側加壓的推進器相對的開放端的內部空間，以及與所述內部空間連通的氣體導入孔； 氣體供應模組，連接於所述氣體導入孔；以及 隔膜，在所述內部空間形成與所述開放端切斷且與所述氣體導入孔連通的驅動室，並通過所述開放端與所述推進器連接，並且根據從所述氣體供應模組導入到所述驅動室的氣體的壓力，而將所述驅動室變形為放大或復原的同時使所述推進器相對於所述電子配件前進或後退， 所述隔膜的中央區域與所述推進器連接， 所述隔膜的邊緣區域結合於所述驅動室， 所述中央區域和所述邊緣區域之間的中間區域形成為具有至少一個屈曲部。 A thruster drive unit comprising: a drive block having an internal space formed with an open end opposite to a pusher for pressurizing the electronic accessory toward the tester side, and a gas introduction hole communicating with the internal space; a gas supply module connected to the gas inlet; and The diaphragm forms a driving chamber cut off from the open end and communicated with the gas introduction hole in the internal space, and is connected to the impeller through the open end, and is introduced according to the gas supply module. the pressure of the gas to the drive chamber to deform the drive chamber to enlarge or restore while advancing or retreating the thruster relative to the electronic assembly, the central region of the diaphragm is connected to the propeller, an edge region of the diaphragm is bonded to the drive chamber, An intermediate region between the central region and the edge region is formed with at least one buckle. 如請求項1所述的推進器驅動單元，其中所述隔膜提供為所述屈曲部根據導入到所述驅動室的所述氣體的壓力而能夠自由變形。The thruster driving unit according to claim 1, wherein the diaphragm is provided such that the flexed portion is freely deformable according to the pressure of the gas introduced into the driving chamber. 如請求項2所述的推進器驅動單元，其中所述屈曲部沿著所述中間區域的周邊方向設置。The thruster driving unit as claimed in claim 2, wherein the flexure portion is arranged along a peripheral direction of the middle region. 如請求項3所述的推進器驅動單元，其中所述屈曲部彎曲成向所述推進器相對於所述電子配件前進的方向鼓起。The thruster drive unit according to claim 3, wherein the flexure portion is bent to bulge toward a direction in which the thruster advances relative to the electronic accessory. 如請求項4所述的推進器驅動單元，其中所述屈曲部提供為具有通過包括所述屈曲部的頂點的頂點區間彼此連接的一對直線區間，所述一對直線區間形成為彼此平行。The thruster driving unit according to claim 4, wherein the flexure is provided to have a pair of straight line sections connected to each other by a vertex section including a vertex of the flexure section, the pair of straight line sections being formed parallel to each other. 如請求項5所述的推進器驅動單元，其中所述頂點區間形成為與所述一對直線區間相比具有較厚的厚度。The thruster driving unit according to claim 5, wherein the apex section is formed to have a thicker thickness than the pair of straight line sections. 如請求項3所述的推進器驅動單元，其中所述屈曲部彎曲成向所述推進器相對於所述電子配件後退的方向鼓起。The thruster drive unit according to claim 3, wherein the flexure portion is bent to bulge in a direction in which the thruster retreats relative to the electronic accessory. 如請求項7所述的推進器驅動單元，其中所述屈曲部提供為具有通過包括所述屈曲部的頂點的頂點區間彼此連接的一對直線區間，所述一對直線區間形成為彼此平行。The thruster driving unit according to claim 7, wherein the flexure portion is provided to have a pair of straight line sections connected to each other by a vertex section including a vertex of the flexure portion, the pair of straight line sections being formed parallel to each other. 如請求項3所述的推進器驅動單元，其中所述隔膜形成為所述屈曲部具有不同的第一屈曲部和第二屈曲部。The thruster drive unit according to claim 3, wherein the diaphragm is formed such that the flexure has different first flexures and second flexures. 如請求項9所述的推進器驅動單元，其中所述第一屈曲部彎曲成向所述推進器相對於所述電子配件前進的方向鼓起，所述第二屈曲部彎曲成向所述推進器相對於所述電子配件後退的方向鼓起。The thruster drive unit according to claim 9, wherein the first flexure part is bent to bulge toward the direction in which the propeller advances relative to the electronic accessory, and the second flexure part is bent to protrude toward the The device bulges in the direction of retreating relative to the electronic accessory. 如請求項10所述的推進器驅動單元，其中所述第一屈曲部配置於所述第二屈曲部的外側。The propeller drive unit according to claim 10, wherein the first flexed portion is disposed outside the second flexed portion. 如請求項10所述的推進器驅動單元，其中所述第一屈曲部和所述第二屈曲部連續形成。The thruster drive unit according to claim 10, wherein the first flexure and the second flexure are formed continuously. 如請求項12所述的推進器驅動單元，其中： 包括所述第一屈曲部的頂點的第一頂點區間和包括所述第二屈曲部的頂點的第二頂點區間通過公共直線區間彼此連接， 所述第一屈曲部以及所述第二屈曲部分別具有連接於所述第一頂點區間的第一直線區間以及連接於所述第二頂點區間的第二直線區間， 所述第一屈曲部和所述第二屈曲部共有的所述公共直線區間、所述第一屈曲部的所述第一直線區間以及所述第二屈曲部的所述第二直線區間形成為彼此平行。 The propeller drive unit of claim 12, wherein: a first vertex section including the vertex of the first flexure and a second vertex section including the vertex of the second flexure are connected to each other by a common straight line section, The first flexion portion and the second flexion portion respectively have a first straight line section connected to the first apex section and a second straight line section connected to the second apex section, The common straight-line section shared by the first flexion portion and the second flexion portion, the first straight-line section of the first flexion portion, and the second straight-line section of the second flexion portion are formed to be mutually parallel. 如請求項1所述的推進器驅動單元，其中所述中央區域從所述邊緣區域隔開，所述中央區域與所述邊緣區域隔開的方向為所述推進器相對於所述電子配件前進的方向。The thruster driving unit according to claim 1, wherein the central area is separated from the edge area, and the central area is separated from the edge area in a direction in which the propeller advances relative to the electronic accessory direction. 如請求項1所述的推進器驅動單元，其中所述隔膜由包括原料橡膠以及增強纖維的橡膠組合物形成。The propeller drive unit according to claim 1, wherein the diaphragm is formed of a rubber composition including raw rubber and reinforcing fibers. 如請求項15所述的推進器驅動單元，其中所述原料橡膠包括矽橡膠，所述增強纖維是芳醯胺纖維。The propeller drive unit according to claim 15, wherein the raw rubber includes silicon rubber, and the reinforcing fibers are aramid fibers. 一種測試分類機，包括： 推進器，為了電子配件和測試器的電連接而將所述電子配件向所述測試器側加壓；以及 推進器驅動單元，為了所述推進器對所述電子配件的加壓以及解除加壓而使所述推進器相對於所述電子配件前進或後退， 所述推進器驅動單元包括： 驅動塊，具有形成有與所述推進器相對的開放端的內部空間以及與所述內部空間連通的氣體導入孔； 氣體供應模組，連接於所述氣體導入孔；以及 隔膜，在所述內部空間形成與所述開放端切斷且與所述氣體導入孔連通的驅動室，並通過所述開放端與所述推進器連接，並且根據從所述氣體供應模組導入到所述驅動室的氣體的壓力，而將所述驅動室變形為放大或復原的同時使所述推進器移動， 所述隔膜的中央區域與所述推進器連接， 所述隔膜的邊緣區域結合於所述驅動室， 所述中央區域和所述邊緣區域之間的中間區域形成為具有至少一個屈曲部。 A test sorter comprising: a pusher that pressurizes the electronic accessory toward the tester side for electrical connection of the electronic accessory and the tester; and a thruster drive unit for advancing or retreating the pusher relative to the electronic component for pressurizing and depressurizing the electronic component by the pusher, The propeller drive unit includes: a drive block having an inner space formed with an open end opposite to the impeller and a gas introduction hole communicating with the inner space; a gas supply module connected to the gas inlet; and The diaphragm forms a driving chamber cut off from the open end and communicated with the gas introduction hole in the internal space, and is connected to the impeller through the open end, and is introduced according to the gas supply module. the pressure of the gas to the drive chamber to deform the drive chamber to enlarge or restore while moving the pusher, the central region of the diaphragm is connected to the propeller, an edge region of the diaphragm is bonded to the drive chamber, An intermediate region between the central region and the edge region is formed with at least one buckle. 如請求項17所述的測試分類機，其中所述隔膜提供為所述屈曲部根據導入到所述驅動室的所述氣體的壓力而能夠自由變形，所述屈曲部沿著所述中間區域的周邊方向設置。A test sorter as claimed in claim 17, wherein said diaphragm is provided such that said flexure is freely deformable according to the pressure of said gas introduced into said drive chamber, said flexure along the Peripheral direction settings. 一種測試分類機，包括： 測試腔室，提供測試空間； 溫度調節單元，將搬入到所述測試空間中的電子配件加熱或冷卻到測試溫度； 推進器，為了所述電子配件和測試器的電連接而將所述電子配件向所述測試器側加壓；以及 推進器驅動單元，為了所述推進器對所述電子配件的加壓以及解除加壓而使所述推進器相對於所述電子配件前進或後退， 所述推進器驅動單元包括： 驅動塊，具有形成有與所述推進器相對的開放端的內部空間以及與所述內部空間連通的氣體導入孔； 氣體供應模組，連接於所述氣體導入孔； 隔膜，在所述內部空間形成與所述開放端切斷且與所述氣體導入孔連通的驅動室，並通過所述開放端與所述推進器連接，並且根據從所述氣體供應模組導入到所述驅動室的氣體的壓力，而將所述驅動室變形為放大或復原的同時使所述推進器移動；以及 彈性模組，將彈力對所述推進器向所述推進器相對於所述電子配件後退的方向提供， 所述隔膜形成為中央區域與所述推進器連接，並且邊緣區域結合於所述驅動室，並且所述中央區域和所述邊緣區域之間的中間區域具有第一屈曲部以及第二屈曲部，所述隔膜提供為所述第一屈曲部及所述第二屈曲部根據所述氣體的壓力而能夠自由變形，所述隔膜由包括原料橡膠和增強纖維的橡膠組合物形成， 所述中央區域從所述邊緣區域隔開，所述中央區域與所述邊緣區域隔開的方向為所述推進器相對於所述電子配件前進的方向， 所述第一屈曲部以及所述第二屈曲部沿著所述中間區域的周邊方向設置，所述第一屈曲部彎曲成向所述推進器相對於所述電子配件前進的方向鼓起，所述第二屈曲部在所述第一屈曲部的內側彎曲成向所述推進器相對於所述電子配件後退的方向鼓起。 A test sorter comprising: The test chamber provides a test space; a temperature adjustment unit, which heats or cools the electronic accessories moved into the test space to the test temperature; a pusher that pressurizes the electronic accessory toward the tester side for electrical connection of the electronic accessory and the tester; and a thruster drive unit for advancing or retreating the pusher relative to the electronic component for pressurizing and depressurizing the electronic component by the pusher, The propeller drive unit includes: a drive block having an inner space formed with an open end opposite to the impeller and a gas introduction hole communicating with the inner space; a gas supply module connected to the gas inlet; The diaphragm forms a driving chamber cut off from the open end and communicated with the gas introduction hole in the internal space, and is connected to the impeller through the open end, and is introduced according to the gas supply module. pressure of gas to the drive chamber to deform the drive chamber to enlarge or restore while moving the pusher; and an elastic module, providing elastic force to the pusher in a direction in which the pusher retreats relative to the electronic accessory, The diaphragm is formed such that a central area is connected to the pusher and an edge area is combined with the driving chamber, and an intermediate area between the central area and the edge area has a first buckle and a second buckle, The diaphragm is provided such that the first bending portion and the second bending portion are freely deformable according to the pressure of the gas, the diaphragm is formed of a rubber composition including raw rubber and reinforcing fibers, The central area is separated from the edge area, and the direction in which the central area is separated from the edge area is the advancing direction of the propeller relative to the electronic accessory, The first flexure part and the second flexure part are arranged along the peripheral direction of the middle area, and the first flexure part is bent to bulge toward the direction in which the pusher advances relative to the electronic accessory, so that The second bending portion is bent inside the first bending portion to bulge in a direction in which the pusher retreats relative to the electronic accessory. 如請求項19所述的測試分類機，其中所述原料橡膠包括對所述測試溫度具有耐熱性和耐寒性兩者的矽橡膠，所述增強纖維是長度為0.8mm至1.2mm的對位芳綸短纖維。The test classifier according to claim 19, wherein the raw rubber includes silicone rubber having both heat resistance and cold resistance to the test temperature, and the reinforcing fibers are para-arylene with a length of 0.8 mm to 1.2 mm. Alon staple fiber.
TW111148565A 2021-12-30 2022-12-16 Pusher drive unit and test handler TWI823719B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0192568 2021-12-30
KR1020210192568A KR20230102440A (en) 2021-12-30 2021-12-30 Phsher drive unit and test handler

Publications (2)

Publication Number Publication Date
TW202326887A true TW202326887A (en) 2023-07-01
TWI823719B TWI823719B (en) 2023-11-21

Family

ID=86969914

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111148565A TWI823719B (en) 2021-12-30 2022-12-16 Pusher drive unit and test handler

Country Status (3)

Country Link
KR (1) KR20230102440A (en)
CN (1) CN116371759A (en)
TW (1) TWI823719B (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101228207B1 (en) 2010-12-08 2013-01-30 세크론 주식회사 Pushing apparatus for testing a semiconductor device and test handler including the same
CN103293458B (en) * 2012-02-29 2017-03-01 宰体有限公司 Inspection device for components
KR20140141405A (en) 2013-05-29 2014-12-10 세메스 주식회사 Test handler
TWI564576B (en) * 2015-08-14 2017-01-01 Hon Tech Inc Electronic components crimping device and its application test classification equipment
KR20170049690A (en) 2015-10-27 2017-05-11 세메스 주식회사 Apparatus for connecting a semiconductor of test handler
CN107464763A (en) * 2016-06-03 2017-12-12 细美事有限公司 For promoting the device of semiconductor packages
KR101877667B1 (en) * 2017-02-28 2018-07-11 세메스 주식회사 Method of testing semiconductor packages

Also Published As

Publication number Publication date
CN116371759A (en) 2023-07-04
TWI823719B (en) 2023-11-21
KR20230102440A (en) 2023-07-07

Similar Documents

Publication Publication Date Title
JP4537394B2 (en) Contact pusher, contact arm and electronic component testing equipment
KR100748483B1 (en) apparatus for contacting devices to test sockets in semiconductor test handler
KR100671397B1 (en) Apparatus for contacting devices to test sockets in semiconductor test handler
US8410807B2 (en) Test system and probe apparatus
US7304487B2 (en) Test method of semiconductor devices
TWI559006B (en) Pushing apparatus for test handler
KR20120063576A (en) Pushing apparatus for testing a semiconductor device and test handler including the same
TW201702620A (en) Pusher assembly and match plate for test handler saves manufacturing cost and increases the reliability of the product
TW202326887A (en) Pusher drive unit and test handler
KR101173391B1 (en) Pushing apparatus for testing a semiconductor device and test handler including the same
KR20170049690A (en) Apparatus for connecting a semiconductor of test handler
KR20140101458A (en) Pushing apparatus for test handler
KR102187839B1 (en) Test handler
KR102037925B1 (en) Apparatus for contacting semiconductor device in a test handler
KR101640473B1 (en) Auto alignment contact connecting unit for test handler
KR102371540B1 (en) Apparatus for testing semiconductor devices
KR102252739B1 (en) Test handler
KR102289097B1 (en) Pushing apparatus and match plate for test handler
KR102638649B1 (en) Semiconductor device pressing apparatus and test handler comprising the same
KR100900055B1 (en) Connector testing jig
KR20230165082A (en) Pushing distance adjuster of pusher for pushing electronic component and interface board for tester
TWI741747B (en) Pressing mechanism of handler
TW202015285A (en) Electronic component crimp device and test handler using the same capable of effectively reducing the component configuration and assembly operations of the crimp tool
KR100813208B1 (en) Tray transfer apparatus for handler
KR20200076385A (en) Test handler