TW201625372A - Manufacture method of radiator and radiator - Google Patents
Manufacture method of radiator and radiator Download PDFInfo
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- TW201625372A TW201625372A TW104138696A TW104138696A TW201625372A TW 201625372 A TW201625372 A TW 201625372A TW 104138696 A TW104138696 A TW 104138696A TW 104138696 A TW104138696 A TW 104138696A TW 201625372 A TW201625372 A TW 201625372A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
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- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明係有關於散熱器的製造方法及散熱器。 The present invention relates to a method of manufacturing a heat sink and a heat sink.
例如,專利文獻1揭露了將基板與立設於基板的複數的棒狀散熱片以摩擦壓接的方式固相接合之散熱器的製造方法。專利文獻1的摩擦壓接步驟包括將基板的表面與棒狀的散熱片靠合後,將基板與棒狀散熱片直線地來回移動,以摩擦熱形成高溫層的摩擦步驟、以及施加頂鍛力(upset force)的壓接步驟。 For example, Patent Document 1 discloses a method of manufacturing a heat sink in which a substrate and a plurality of rod-shaped fins that are erected on a substrate are friction-bonded to each other. The frictional crimping step of Patent Document 1 includes a step of moving the substrate and the rod-shaped fins linearly back and forth, a frictional step of forming a high temperature layer by frictional heat, and applying an upset force after the surface of the substrate is brought into contact with the fin-shaped fins. (upset force) crimping step.
如第13(a)圖~第13(d)圖,習知的散熱器的製造方法中,階段地顯示基板與棒狀散熱片之間的接合狀態的概要側剖面圖。第14(a)圖~第14(d)圖是對應第13(a)圖~第13(d)圖的概要平面圖。 As shown in the thirteenth (a)th to thirteenthth (th)th drawings, in the conventional method of manufacturing a heat sink, a schematic side cross-sectional view showing a state of joining between the substrate and the rod fins is shown in stages. Figures 14(a) to 14(d) are schematic plan views corresponding to Figs. 13(a) to 13(d).
如第13(a)圖所示,習知的散熱器的製造方法中,將基板110的表面110a與棒狀散熱片120的端面120a靠合,且將棒狀散熱片120相對於基板110直線地來回移動,進行摩擦步驟。該摩擦步驟中,將棒狀散熱片120來回移動於圖面的左右方向(參照箭頭)。 As shown in FIG. 13(a), in the conventional method of manufacturing a heat sink, the surface 110a of the substrate 110 is brought into contact with the end surface 120a of the rod fin 120, and the rod fin 120 is linear with respect to the substrate 110. Move back and forth to perform the rubbing step. In the rubbing step, the rod fins 120 are moved back and forth in the left and right direction of the drawing (see an arrow).
如第13(b)圖~第13(d)圖,藉由摩擦壓接步驟形成圓角130。圓角130是因為摩擦壓接步驟,棒狀散熱片120 的前端側軟化擠出母材而形成於棒狀散熱片120的前端的外周緣的部位。如第13(a)圖所示,進行摩擦壓接步驟時,基板110的表面110a會形成一直與棒狀散熱片120接觸的第一領域X、以及因為來回移動而與棒狀散熱片120反覆地接觸或不接觸的第二領域Y、Y。 As shown in Figures 13(b) to 13(d), the fillet 130 is formed by a frictional crimping step. The rounded corner 130 is due to the frictional crimping step, the rod fins 120 The front end side is softened and extruded to form a base material, and is formed at a portion of the outer peripheral edge of the tip end of the rod fins 120. As shown in Fig. 13(a), when the frictional crimping step is performed, the surface 110a of the substrate 110 is formed into the first field X which is always in contact with the rod fins 120, and overlaps with the rod fins 120 because of the back and forth movement. The second field Y, Y with or without contact.
專利文獻1:日本特開平11-340392號公報 Patent Document 1: Japanese Patent Laid-Open No. Hei 11-340392
第二領域Y、Y在摩擦壓接步驟中會因為非接觸時露在空氣下而被冷卻。因此,第二領域Y、Y較第一領域X摩擦熱小。因此,如第13(b)圖~第13(d)圖所示,即使棒狀散熱片120的來回移動會形成圓角130,但摩擦熱低的第二領域Y、Y與圓角130仍可能變得不容易接合,隨著接合強度變小,接合部可能會產生接合缺陷Q。 The second field Y, Y is cooled in the friction crimping step because it is exposed to the air when not in contact. Therefore, the second field Y, Y is smaller than the first field X friction heat. Therefore, as shown in FIGS. 13(b) to 13(d), even if the rod-shaped fins 120 move back and forth to form the rounded corners 130, the second areas Y, Y and the rounded corners 130 with low frictional heat are still It may become difficult to join, and as the joint strength becomes small, the joint may generate the joint defect Q.
另一方面,如第14(a)圖~第14(d)圖的網狀所示的領域(發熱部Z)階段地顯示伴隨摩擦步驟的進行而產生摩擦熱的領域。如第14(a)圖所示,發熱部Z在初期狀態摩擦熱較低,因此形成垂直於振幅方向(以下稱為「垂直方向」)的細長橢圓形。如第14(b)圖~第14(d)圖所示,發熱部Z在進行摩擦步驟時,垂直方向的長度尺寸不變,但振幅方向的長度尺寸會漸漸變大。圓角130的形狀因為受到摩擦熱的影響,所以會伴隨著發熱部Z的形狀的變形而變大成略相似的形狀。也就是,圓角130會有垂直方向的長度尺寸比振幅方向的長度尺寸變得更大的傾向。換言之,摩擦壓接步驟中,因為振 幅方向(來回移動方向)一定,因此會有圓角130無法平衡良好地形成的問題。 On the other hand, the field (heat generating portion Z) shown in the mesh shape of the fourteenth (a)th to fourteenthth (dth) figure shows the field which generate|occur|produces friction heat with the progress of a rubbing process. As shown in Fig. 14(a), the heat generating portion Z has a low frictional heat in the initial state, and thus has an elongated elliptical shape perpendicular to the amplitude direction (hereinafter referred to as "vertical direction"). As shown in Figs. 14(b) to 14(d), when the heat generating portion Z performs the rubbing step, the length dimension in the vertical direction does not change, but the length dimension in the amplitude direction gradually increases. Since the shape of the rounded corner 130 is affected by the frictional heat, it is deformed into a slightly similar shape along with the deformation of the shape of the heat generating portion Z. That is, the rounded corner 130 has a tendency that the length dimension in the vertical direction becomes larger than the length dimension in the amplitude direction. In other words, in the friction crimping step, because of the vibration The direction of the web (the direction of movement back and forth) is constant, so there is a problem that the rounded corners 130 cannot be formed in a well-balanced manner.
從這個觀點來看,本發明的目的是提供一種散熱器之製造方法,能夠提高接合強度且防止接合缺陷的產生,更能夠平衡良好地接合棒狀散熱片。又,本發明的目的是提供一種散熱器,其棒狀散熱片能平衡良好地接合。 From this point of view, an object of the present invention is to provide a method for manufacturing a heat sink which can improve the joint strength and prevent the occurrence of joint defects, and can better bond the rod fins in a well-balanced manner. Further, it is an object of the present invention to provide a heat sink in which the rod fins can be joined in a well-balanced manner.
為了解決上述問題,本發明提出一種散熱器的製造方法,該散熱器具有銅或銅合金製的基板以及立設於該基板的複數的鋁或鋁合金製的棒狀散熱片,包括:準備步驟,將該基板加熱到400~500℃;以及摩擦壓接步驟,將複數的該棒狀散熱片的端面靠合到被加熱的該基板的表面,且將該基板與該棒狀散熱片直線地來回移動,進行摩擦壓接。 In order to solve the above problems, the present invention provides a method of manufacturing a heat sink having a substrate made of copper or a copper alloy and a plurality of rod-shaped heat sinks made of aluminum or aluminum alloy erected on the substrate, including: a preparation step Heating the substrate to 400-500 ° C; and a friction bonding step of affixing the end faces of the plurality of rod-shaped fins to the surface of the heated substrate, and linearly aligning the substrate with the rod-shaped fins Move back and forth for friction crimping.
根據上述製造方法,即使基板與棒狀散熱片之間形成不接觸的領域,因為預先對基板加熱,所以能夠抑制該領域的溫度下降。因此,藉由將基板的表面與圓角確實地接合,能夠提高接合強度,且能夠防止接合缺陷產生。又,因為預先加熱基板,所以在摩擦壓接步驟的初期狀態下,棒狀散熱片會大幅軟化。藉此,基板的表面與棒狀散熱片的端面之間所形成的發熱部在摩擦壓接的振幅方向以及與該振幅方向垂直的垂直方向上會平衡良好地形成。伴隨而來的是,能夠減小圓角的振幅方向的長度尺寸與垂直方向的長度尺寸的差,所以能夠平衡良好地接合。 According to the above manufacturing method, even in the field where the substrate and the rod-shaped fin are not in contact with each other, since the substrate is heated in advance, the temperature drop in the field can be suppressed. Therefore, by reliably bonding the surface of the substrate to the round corners, the joint strength can be improved, and the occurrence of joint defects can be prevented. Further, since the substrate is heated in advance, the rod-shaped fins are largely softened in the initial state of the friction welding step. Thereby, the heat generating portion formed between the surface of the substrate and the end surface of the rod-shaped fin is formed to be well balanced in the amplitude direction of the friction welding and the vertical direction perpendicular to the amplitude direction. As a result, the difference between the length dimension in the amplitude direction of the round corner and the length dimension in the vertical direction can be reduced, so that the joint can be joined in a well-balanced manner.
又,以銅或銅合金形成該基板,以鋁或鋁合金形成該棒狀散熱片,藉此能夠提高熱傳導性。又,能夠嘗試輕量 化或減低材料成本。 Further, the substrate is formed of copper or a copper alloy, and the rod-shaped fins are formed of aluminum or an aluminum alloy, whereby the thermal conductivity can be improved. Also, can try to be lightweight Reduce or reduce material costs.
又,該摩擦壓接步驟中,設定振幅在1.2~1.8mm為佳。根據上述製造方法,能夠更加提高接合強度,且能夠更防止接合缺陷的產生。 Further, in the friction welding step, it is preferable to set the amplitude to be 1.2 to 1.8 mm. According to the above manufacturing method, the joint strength can be further improved, and the occurrence of joint defects can be further prevented.
又,本發明提出一種散熱器,包括:銅或銅合金製的基板;以及複數的鋁或鋁合金製的棒狀散熱片,立設於該基板,該散熱器是將預先加熱的該基板與該棒狀散熱片以摩擦壓接的方式接合而成,其中在該基板與複數的該棒狀散熱片之間的接合部形成有圓角,該圓角的最小徑與最大徑的比為0.75~0.99。 Moreover, the present invention provides a heat sink comprising: a substrate made of copper or a copper alloy; and a plurality of rod-shaped heat sinks made of aluminum or aluminum alloy, which are erected on the substrate, the heat sink is a substrate which is preheated and The rod-shaped fins are joined by friction welding, wherein a joint between the substrate and the plurality of rod fins is formed with rounded corners, and the ratio of the minimum diameter to the maximum diameter of the round corner is 0.75. ~0.99.
根據上述構造。能夠縮小圓角的最大徑與最小徑的差,因此能夠平衡良好地接合棒狀散熱片。 According to the above configuration. Since the difference between the maximum diameter and the minimum diameter of the rounded corner can be reduced, the rod-shaped heat sink can be joined in a well-balanced manner.
根據本發明的散熱器的製造方法,能夠提高接合強度且防止接合缺陷的產生,更能夠平衡良好地接合棒狀散熱片。又,根據本發明的散熱器,棒狀散熱片能平衡良好地接合。 According to the method of manufacturing a heat sink of the present invention, it is possible to improve the joint strength and prevent the occurrence of joint defects, and it is possible to bond the rod fins in a well-balanced manner. Further, according to the heat sink of the present invention, the rod fins can be joined in a well-balanced manner.
1‧‧‧散熱器 1‧‧‧heatsink
1A‧‧‧第一實驗體 1A‧‧‧First experimental body
1B‧‧‧第二實驗體 1B‧‧‧Second experimental body
2‧‧‧基板 2‧‧‧Substrate
2a‧‧‧表面 2a‧‧‧ surface
3‧‧‧棒狀散熱片 3‧‧‧ Rod Heatsink
3a‧‧‧端面 3a‧‧‧ end face
4‧‧‧圓角 4‧‧‧ fillet
4a‧‧‧下面 4a‧‧‧ below
10‧‧‧第一冶具 10‧‧‧First tooling
20‧‧‧第二冶具 20‧‧‧Second tooling
21‧‧‧孔部 21‧‧‧ Hole Department
110‧‧‧基板 110‧‧‧Substrate
110a‧‧‧表面 110a‧‧‧ surface
120‧‧‧棒狀散熱片 120‧‧‧ Rod heat sink
120a‧‧‧端面 120a‧‧‧ end face
130‧‧‧圓角 130‧‧‧ fillet
Q‧‧‧接合缺陷 Q‧‧‧ joint defect
X‧‧‧第一領域 X‧‧‧First field
Y‧‧‧第二領域 Y‧‧‧second field
Z、Z1‧‧‧發熱部 Z, Z1‧‧‧Fever Department
第1圖係顯示本發明的實施形態的散熱器的立體圖,(a)是全體圖;(b)是放大圖。 Fig. 1 is a perspective view showing a heat sink according to an embodiment of the present invention, wherein (a) is a whole view and (b) is an enlarged view.
第2圖係顯示本實施形態的散熱器的製造方法的剖面圖,(a)顯示準備步驟;(b)顯示摩擦壓接步驟的靠合步驟。 Fig. 2 is a cross-sectional view showing a method of manufacturing the heat sink according to the embodiment, (a) showing a preparation step, and (b) showing a step of a frictional pressure bonding step.
第3圖係顯示本實施形態的散熱器的製造方法的剖面圖,(a)顯示摩擦壓接步驟的摩擦步驟及壓接步驟;(b)顯示取出步驟。 Fig. 3 is a cross-sectional view showing a method of manufacturing the heat sink of the embodiment, (a) showing a rubbing step and a crimping step of the friction welding step, and (b) showing an extracting step.
第4(a)~4(d)圖係本實施形態的散熱器的製造方法中階段地顯示基板與棒狀散熱片的接合狀態的概要側剖面圖。 4(a) to 4(d) are schematic cross-sectional views showing a state in which the substrate and the rod fin are joined in a step of manufacturing the heat sink according to the embodiment.
第5(a)~5(d)圖是對應第4(a)~4(d)圖的概要平面圖。 Figures 5(a) to 5(d) are schematic plan views corresponding to the 4th (a) to 4th (d) drawings.
第6(a)圖係顯示實施例的試驗體的立體圖;第6(b)圖係顯示實施例的試驗片的立體圖;第6(c)圖係顯示圓角的平剖面圖。 Fig. 6(a) is a perspective view showing the test body of the embodiment; Fig. 6(b) is a perspective view showing the test piece of the embodiment; and Fig. 6(c) is a plan sectional view showing rounded corners.
第7圖係顯示實施例的製造方法的條件的表。 Fig. 7 is a table showing the conditions of the manufacturing method of the examples.
第8圖係顯示實施例的基板加熱溫度與接合強度的關係。 Fig. 8 is a graph showing the relationship between the substrate heating temperature and the bonding strength of the examples.
第9圖係顯示實施例的接合部的剖面微組織圖。 Fig. 9 is a sectional microstructure view showing the joint portion of the embodiment.
第10圖係顯示實施例的基板加熱溫度與圓角直徑比的關係。 Fig. 10 is a graph showing the relationship between the substrate heating temperature and the rounded corner diameter ratio of the examples.
第11圖係顯示實施例的圓角直徑比與接合效率的關係。 Fig. 11 is a graph showing the relationship between the fillet diameter ratio of the examples and the joining efficiency.
第12圖係顯示實施例的振幅與棒狀散熱片接合率的關係。 Fig. 12 is a graph showing the relationship between the amplitude of the embodiment and the bonding rate of the rod fins.
第13(a)~13(d)圖係習知的散熱器的製造方法中階段地顯示基板與棒狀散熱片的接合狀態的概要側剖面圖。 13(a) to 13(d) are schematic side cross-sectional views showing a state in which the substrate and the rod fin are joined in a stage in a conventional method of manufacturing a heat sink.
第14(a)~14(d)圖是對應第13(a)~13(d)圖的概要平面圖。 Figures 14(a) to 14(d) are schematic plan views corresponding to the 13th (a) to 13th (d) drawings.
本發明的實施形態會參照圖式詳細說明。首先,說明本實施形態的散熱器1。如第1(a)圖所示,散熱器1包括基板2、棒狀散熱片3。散熱器1例如對IC或電晶體等的半導體元件進行放熱的構件。 Embodiments of the present invention will be described in detail with reference to the drawings. First, the heat sink 1 of the present embodiment will be described. As shown in Fig. 1(a), the heat sink 1 includes a substrate 2 and a rod-shaped fin 3. The heat sink 1 is, for example, a member that radiates heat to a semiconductor element such as an IC or a transistor.
基板2呈板狀。基板2的材料可從能夠摩擦壓接的 金屬中適當地選擇,本實施形態中使用銅或銅合金。以銅或銅合金做基板2,能夠提高熱傳導性。 The substrate 2 has a plate shape. The material of the substrate 2 can be frictionally crimped The metal is appropriately selected, and in the present embodiment, copper or a copper alloy is used. The substrate 2 is made of copper or a copper alloy, and the thermal conductivity can be improved.
棒狀散熱片3呈圓柱狀。棒狀散熱片3等間隔地立設複數根於基板2的表面2a。棒狀散熱片3的材料可從能夠摩擦壓接的金屬中適當地選擇,但本實施形態中使用鋁或鋁合金。使用鋁或鋁合金來形成棒狀散熱片3,藉此能夠嘗試輕量化或減低材料成本。棒狀散熱片3的平剖面在本實施形態中呈圓形,但也可以是橢圓、多角形等其他的形狀。 The rod fins 3 have a cylindrical shape. The rod fins 3 are erected at equal intervals on the surface 2a of the substrate 2. The material of the rod fins 3 can be appropriately selected from metals capable of friction welding, but aluminum or aluminum alloy is used in the present embodiment. The rod-shaped fins 3 are formed using aluminum or an aluminum alloy, whereby it is possible to attempt to reduce the weight or the material cost. The flat cross section of the rod fins 3 is circular in the present embodiment, but may be other shapes such as an ellipse or a polygon.
如第1(b)圖所示,基板2與棒狀散熱片3之間的接合部會形成圓角4。圓角4是因為摩擦壓接步驟使得棒狀散熱片3的前端側軟化,母材擠出而形成於棒狀散熱片3的前端的外周的部位。圓角4的下面全體接合(附著)於基板2的表面2a。圓角4的最小徑對最大徑的比在0.75~0.99。 As shown in Fig. 1(b), the joint portion between the substrate 2 and the rod fins 3 is formed with rounded corners 4. In the rounded corner 4, the tip end side of the rod-shaped fins 3 is softened by the friction welding step, and the base material is extruded to be formed on the outer peripheral portion of the tip end of the rod-shaped fins 3. The lower surface of the rounded corner 4 is entirely bonded (attached) to the surface 2a of the substrate 2. The ratio of the minimum diameter to the maximum diameter of the fillet 4 is between 0.75 and 0.99.
接著,說明本實施形態的散熱器的製造方法。散熱器的製造方法中,會進行準備步驟、摩擦壓接步驟、取出步驟。 Next, a method of manufacturing the heat sink according to the embodiment will be described. In the method of manufacturing the heat sink, a preparation step, a friction pressure bonding step, and an extraction step are performed.
準備步驟如第2(a)圖所示,是加熱基板2,且將基板2配置於第一冶具10,將棒狀散熱片3配置於第二冶具20的步驟。基板2例如以管式加熱器加熱。加熱溫度在本實施形態中設定為360~500℃,更佳的是400~500℃。加熱溫度會因應要接合的基板2及棒狀散熱片3的材料而適當地設定。加熱溫度經過適當設定,使得接合部不會產生接合缺陷,且讓進行摩擦壓接後形成的圓角4的最小徑對最大徑的比在0.75~0.99。 The preparation step is a step of heating the substrate 2, disposing the substrate 2 in the first jig 10, and disposing the rod fins 3 in the second jig 20 as shown in Fig. 2(a). The substrate 2 is heated, for example, by a tube heater. The heating temperature is set to 360 to 500 ° C, more preferably 400 to 500 ° C in the present embodiment. The heating temperature is appropriately set depending on the materials of the substrate 2 and the rod fins 3 to be joined. The heating temperature is appropriately set so that the joint portion does not cause joint defects, and the ratio of the minimum diameter to the maximum diameter of the rounded corner 4 formed after the friction pressure bonding is 0.75 to 0.99.
第一冶具10能夠固定基板2,且能夠在水平方向來 回移動。第二冶具20具備複數的孔部21,延伸設置於高度方向。孔部21形成圓柱狀的中空部。孔部21的內徑與棒狀散熱片3的外徑略相等。當棒狀散熱片3***孔部21,棒狀散熱片3的前端側會露出。準備步驟中,配置被第一冶具10所加熱的基板2,且配置複數的棒狀散熱片3於第二冶具20的孔部21。另外,為了使摩擦壓接步驟在加熱基板2後迅速進行,準備步驟的基板2的加熱溫度會與摩擦壓接步驟時的基板2的溫度實質地相等。 The first tooling 10 can fix the substrate 2 and can come in the horizontal direction Move back. The second jig 20 has a plurality of holes 21 extending in the height direction. The hole portion 21 forms a cylindrical hollow portion. The inner diameter of the hole portion 21 is slightly equal to the outer diameter of the rod fins 3. When the rod fins 3 are inserted into the hole portion 21, the front end side of the rod fins 3 is exposed. In the preparation step, the substrate 2 heated by the first jig 10 is disposed, and a plurality of rod fins 3 are disposed in the hole portion 21 of the second jig 20 . Further, in order to rapidly perform the frictional pressure bonding step after heating the substrate 2, the heating temperature of the substrate 2 in the preparation step is substantially equal to the temperature of the substrate 2 in the friction welding step.
摩擦壓接步驟是以摩擦壓接來接合加熱的基板2與棒狀散熱片3的步驟。摩擦壓接步驟會進行靠合步驟、摩擦步驟、壓接步驟。靠合步驟中,如第2(b)圖所示,會讓第一冶具10及第二冶具20相對移動,將棒狀散熱片3的端面3a靠合在基板2的表面2a。 The friction crimping step is a step of joining the heated substrate 2 and the rod fins 3 by friction welding. The frictional crimping step performs a folding step, a rubbing step, and a crimping step. In the step of the closing step, as shown in Fig. 2(b), the first jig 10 and the second jig 20 are relatively moved, and the end surface 3a of the rod fin 3 is brought into contact with the surface 2a of the substrate 2.
如第3(a)圖所示,摩擦步驟中,使第一冶具10相對於第二冶具20來回移動,讓靠合部產生摩擦熱。摩擦步驟中,本實施形態中,在第3(a)圖的左右方向上直線來回移動。藉由摩擦步驟,基板2的表面2a與棒狀散熱片3a彼此摩擦,產生摩擦熱,軟化的母材排出外部。 As shown in Fig. 3(a), in the rubbing step, the first jig 10 is moved back and forth relative to the second jig 20 to cause frictional heat to be generated by the engaging portion. In the rubbing step, in the present embodiment, the straight line moves back and forth in the horizontal direction of the third (a) drawing. By the rubbing step, the surface 2a of the substrate 2 and the rod-shaped fins 3a rub against each other to generate frictional heat, and the softened base material is discharged to the outside.
摩擦步驟的條件可以適當地設定,但例如設定頻率在100~260Hz,將振幅設定在1.0~2.0mm(較佳的是1.2~1.8mm),將摩擦壓力設定在0.5~2.0MPa。又,將摩擦步驟的時間設定在1~3秒左右。摩擦步驟結束後,直接轉移到壓接步驟。 The conditions of the rubbing step can be appropriately set, for example, the set frequency is 100 to 260 Hz, the amplitude is set to 1.0 to 2.0 mm (preferably 1.2 to 1.8 mm), and the frictional pressure is set to 0.5 to 2.0 MPa. Moreover, the time of the rubbing step is set to about 1 to 3 seconds. After the rubbing step is over, transfer directly to the crimping step.
壓接步驟中,不讓第一冶具10及第二冶具20來回 移動,而朝向彼此接近的方向推壓。壓接步驟的條件可以適當地設定,但例如頂鍛壓力設定在80~120MPa,頂鍛時間設定在5~12秒。 In the crimping step, the first jig 10 and the second jig 20 are not allowed to go back and forth. Move and push in the direction of approaching each other. The conditions of the crimping step can be appropriately set, but for example, the upset pressure is set at 80 to 120 MPa, and the upset time is set at 5 to 12 seconds.
藉由摩擦步驟在接合部(基板2的表面2a與棒狀散熱片3的端面3a的靠合部)產生摩擦熱後,停止來回移動,當透過壓接步驟施加頂鍛壓力,基板2與棒狀散熱片3彼此接合。另外,摩擦步驟時,基板2與棒狀散熱片3彼此摩擦,軟化的母材被擠出接合部的外側而形成圓角4。 After the frictional heat is generated in the joint portion (the abutment portion of the surface 2a of the substrate 2 and the end surface 3a of the rod-shaped fin 3) by the rubbing step, the back and forth movement is stopped, and when the punching pressure is applied through the crimping step, the substrate 2 and the rod are applied. The fins 3 are joined to each other. Further, in the rubbing step, the substrate 2 and the rod fins 3 rub against each other, and the softened base material is extruded outside the joint portion to form the rounded corner 4.
取出步驟如第3(b)圖所示,是將第一冶具10後退,從第二冶具20取出散熱器1的步驟。 The take-out step is as shown in Fig. 3(b), which is a step of retreating the first jig 10 and taking out the heat sink 1 from the second jig 20.
接著,說明本實施形態的摩擦壓接步驟中的圓角4的形成過程。第4(a)~4(d)圖係本實施形態的散熱器的製造方法中階段地顯示基板與棒狀散熱片的接合狀態的概要側剖面圖。第5(a)~5(d)圖是對應第4(a)~4(d)圖的概要平面圖。 Next, the formation process of the rounded corners 4 in the friction welding step of the present embodiment will be described. 4(a) to 4(d) are schematic cross-sectional views showing a state in which the substrate and the rod fin are joined in a step of manufacturing the heat sink according to the embodiment. Figures 5(a) to 5(d) are schematic plan views corresponding to the 4th (a) to 4th (d) drawings.
首先,如第13圖所示,習知的摩擦壓接步驟中的第二領域Y會因為棒狀散熱片120的來回移動,反覆與棒狀散熱片120接觸或非接觸,因而曝露在空氣下被冷卻。相對於此,如第4(a)圖所示,本實施形態的摩擦壓接步驟中,即使基板2與棒狀散熱片3之間形成非接觸的領域,因為預先對基板2加熱,所以能夠抑制該領域的溫度下降。藉此,如第4(b)~(d)圖所示,圓角4的下面4a與基板2的表面2a會確實地接合(附著),因此能夠提高接合強度,且能夠防止接合缺陷產生。 First, as shown in Fig. 13, the second field Y in the conventional friction crimping step is repeatedly contacted or non-contact with the rod fin 120 due to the back and forth movement of the rod fin 120, and thus exposed to the air. It is cooled. On the other hand, as shown in Fig. 4(a), in the friction welding step of the present embodiment, even if the substrate 2 and the rod fins 3 are formed in a non-contact area, since the substrate 2 is heated in advance, it is possible to Suppress the temperature drop in this area. As a result, as shown in FIGS. 4(b) to 4(d), the lower surface 4a of the rounded corner 4 and the surface 2a of the substrate 2 are reliably joined (attached), so that the joint strength can be improved and the occurrence of joint defects can be prevented.
另一方面,如第5(a)~(d)圖的以網狀表示的 領域(發熱部Z1)階段地顯示伴隨著摩擦步驟的進行而產生摩擦熱的領域。如第5(a)圖所示,本實施形態中對基板2預先加熱,因此能夠縮小基板2與棒狀散熱片3之間,持續接觸的領域、與非接觸領域之間的摩擦熱的不均衡。藉此,在摩擦步驟的初期階段,棒狀散熱片3的前端會比習知更大幅軟化,因此發熱部Z1呈圓形或接近圓形的形狀。如第5(b)~(d)所示,發熱部Z1在摩擦步驟進行時,振幅方向(來回方向)的長度尺寸與垂直方向(垂直於振幅方向的方向)的長度尺寸會以大致一定的比例逐漸增大。也就是說,發熱部Z1在摩擦步驟進行時,會以與第5(a)圖的初期狀態大致相似的形狀變大。 On the other hand, as shown in Fig. 5(a) to (d) in the form of a net The field (heat generating portion Z1) shows a field in which friction heat is generated along with the progress of the rubbing step. As shown in Fig. 5(a), in the present embodiment, since the substrate 2 is heated in advance, it is possible to reduce the frictional heat between the substrate 2 and the rod-shaped fins 3 and the field of continuous contact and the non-contact area. balanced. Thereby, in the initial stage of the rubbing step, the front end of the rod-shaped fins 3 is softened more significantly than conventionally, and thus the heat generating portion Z1 has a circular or nearly circular shape. As shown in the fifth (b) to (d), when the heat generating portion Z1 is subjected to the rubbing step, the length dimension of the amplitude direction (reverse direction) and the length dimension of the vertical direction (the direction perpendicular to the amplitude direction) are substantially constant. The proportion is gradually increasing. In other words, when the friction step is performed, the heat generating portion Z1 is enlarged in a shape substantially similar to the initial state of the fifth (a) diagram.
圓角4的形狀會受到摩擦熱的影響,因此會隨著發熱部Z1的形狀的變形而以略相似的形狀變大。藉此,圓角4比起習知技術,能夠縮小振幅方向的長度尺寸與垂直方向的長度尺寸的差。因此,根據本實施形態的摩擦壓接步驟,能夠抑制接合部的振幅方向與垂直方向的接合強度的不均。也就是,能夠平衡良好地接合基板2與棒狀散熱片3。 The shape of the rounded corner 4 is affected by the frictional heat, and therefore becomes slightly similar in shape as the shape of the heat generating portion Z1 is deformed. Thereby, the rounded corner 4 can reduce the difference between the length dimension in the amplitude direction and the length dimension in the vertical direction as compared with the conventional technique. Therefore, according to the friction welding step of the present embodiment, it is possible to suppress the unevenness of the joint strength between the amplitude direction and the vertical direction of the joint portion. That is, the substrate 2 and the rod fins 3 can be bonded in a well-balanced manner.
又,藉由預先加熱基板2,能夠在摩擦步驟時比習知技術更早地軟化棒狀散熱片3,因此能夠縮短摩擦步驟的時間。 Moreover, by heating the substrate 2 in advance, the rod-shaped fins 3 can be softened earlier than the conventional technique in the rubbing step, so that the time of the rubbing step can be shortened.
接著說明本發明的實施例。本實施例中,將第6(a)圖所示的第一實驗體1A及第二實驗體1B配合後述的複數的加熱溫度而分別形成8個並進行拉伸實驗。第一實驗體1A及第二 實驗體1B由相同形狀組成,任一者皆是由基板2與複數的棒狀散熱片3所構成。基板2與棒狀散熱片3的接合部會各自形成圓角4。複數的棒狀散熱片3沿著基板2相對的邊各排一列。 Next, an embodiment of the present invention will be described. In the present embodiment, the first test body 1A and the second test body 1B shown in Fig. 6(a) were each formed into a plurality of heating temperatures, which will be described later, and eight tensile tests were performed. First experimental body 1A and second The test body 1B is composed of the same shape, and either of the substrate 2 and the plurality of rod-shaped fins 3 are formed. The joint portions of the substrate 2 and the rod fins 3 are each formed with rounded corners 4. A plurality of rod fins 3 are arranged in a row along the opposite sides of the substrate 2.
基板2設定縱長95mm、橫長95mm、板厚5mm。棒狀散熱片3設定外徑2.4mm、長度60mm。第一實驗體1A的基板2的材料使用銅C1020-1/2H(JIS),棒狀散熱片3的材料使用鋁合金A1070(JIS)。另一方面,第二實驗體1B的基板2的材料使用銅C1020-1/2H(JIS),棒狀散熱片3的材料使用鋁合金A4043(JIS)。實施例的製造方法中的接合條件如第7圖所示。 The substrate 2 was set to have a vertical length of 95 mm, a lateral length of 95 mm, and a plate thickness of 5 mm. The rod fins 3 were set to have an outer diameter of 2.4 mm and a length of 60 mm. The material of the substrate 2 of the first test body 1A was copper C1020-1/2H (JIS), and the material of the rod-shaped heat sink 3 was made of aluminum alloy A1070 (JIS). On the other hand, the material of the substrate 2 of the second experimental body 1B was copper C1020-1/2H (JIS), and the material of the rod-shaped heat sink 3 was made of aluminum alloy A4043 (JIS). The joining conditions in the production method of the examples are shown in Fig. 7.
銅C1020-1/2H(JIS)是Cu以99.96%以上形成的無氧銅。1/2H是指加工硬化將拉伸強度調質到1/4H與3/4H的中間。鋁合金A1070(JIS)是Si:0.20%以下,Fe:0.25%以下,Cu:0.04%以下,Mn:0.03%以下,Mg:0.03%以下,Zn:0.04%以下,V:0.05%以下,Ti:0.03%以下,其他:0.03%以下,Al:99.7%以上所構成。鋁合金A4043(JIS)是Si:4.5~6.0%以下,Fe:0.8%以下,Cu:0.30%以下,Mn:0.05%以下,Mg:0.05%以下,Zn:0.10%以下,Ti:0.20%以下,其他:0.15%以下,Al:剩餘比例所構成。 Copper C1020-1/2H (JIS) is an oxygen-free copper formed of Cu of 99.96% or more. 1/2H means work hardening to adjust the tensile strength to the middle of 1/4H and 3/4H. Aluminum alloy A1070 (JIS) is Si: 0.20% or less, Fe: 0.25% or less, Cu: 0.04% or less, Mn: 0.03% or less, Mg: 0.03% or less, Zn: 0.04% or less, V: 0.05% or less, Ti : 0.03% or less, others: 0.03% or less, and Al: 99.7% or more. Aluminum alloy A4043 (JIS) is Si: 4.5 to 6.0% or less, Fe: 0.8% or less, Cu: 0.30% or less, Mn: 0.05% or less, Mg: 0.05% or less, Zn: 0.10% or less, and Ti: 0.20% or less , Other: 0.15% or less, Al: The remaining ratio is composed.
實施例的製造方法與前述實施形態大致相等,但如第7圖所示,實施例的摩擦壓接步驟中,設定基板2的加熱溫度為25℃、250℃、300℃、350℃、400℃、450℃、475℃、500℃共8個階段,在每個加熱溫度形成第一實驗體1A及第二實驗體1B。鋁的熔點約660℃,因此當設定加熱溫度比500℃大的話,會有棒狀散熱片3熔融的可能性。因此,基板2的加熱溫度 的上限設定為500℃。另外,實施例的製造方法中,將第6(a)圖所示的M方向設定為振幅方向(來回移動方向)。N方向是垂直於M方向的垂直方向。 The manufacturing method of the embodiment is substantially the same as that of the above embodiment. However, as shown in Fig. 7, in the friction welding step of the embodiment, the heating temperature of the substrate 2 is set to 25 ° C, 250 ° C, 300 ° C, 350 ° C, 400 ° C. At a temperature of 450 ° C, 475 ° C, and 500 ° C, the first experimental body 1A and the second experimental body 1B were formed at each heating temperature. Since the melting point of aluminum is about 660 ° C, when the heating temperature is set to be larger than 500 ° C, the rod-shaped fins 3 may be melted. Therefore, the heating temperature of the substrate 2 The upper limit is set to 500 °C. Further, in the manufacturing method of the embodiment, the M direction shown in Fig. 6(a) is set to the amplitude direction (reverse direction). The N direction is a vertical direction perpendicular to the M direction.
拉伸實驗中,如第6(b)圖所示,切斷基板2的一部分,採取基板2與一根的棒狀散熱片3所組成的試驗片。如第6(c)圖所示,圓角4的最大徑ψ max與最小徑ψ min會以游標卡尺量測。 In the tensile test, as shown in Fig. 6(b), a part of the substrate 2 was cut, and a test piece composed of the substrate 2 and one of the rod-shaped fins 3 was taken. As shown in Figure 6(c), the maximum diameter ψ max and the minimum diameter ψ min of the fillet 4 are measured with a vernier caliper.
第8圖顯示實施例的基板加熱溫度與接合強度的關係。第8圖所示的結果R1顯示第一實驗體1A的接合強度的結果。另一方面,結果R2顯示第二實驗體1B的接合強度的結果。如結果R1所示,第一實驗體1A中,當基板2的加熱溫度在400℃以上500℃以下的話,至少可獲得50MPa以上的接合強度。又,如結果R2所示,第二實驗體1B中,當基板2的加熱溫度在350℃的話,至少可獲得30MPa以上的接合強度,當在400℃以上500℃以下的話,至少可獲得90MPa以上的接合強度。 Fig. 8 shows the relationship between the substrate heating temperature and the bonding strength of the examples. The result R1 shown in Fig. 8 shows the result of the joint strength of the first test body 1A. On the other hand, the result R2 shows the result of the joint strength of the second test body 1B. As shown in the result R1, in the first test body 1A, when the heating temperature of the substrate 2 is 400 ° C or more and 500 ° C or less, at least 50 MPa or more of the joint strength can be obtained. Further, as shown in the result R2, in the second test body 1B, when the heating temperature of the substrate 2 is 350 ° C, at least 30 MPa or more of the bonding strength can be obtained, and when it is 400 ° C or more and 500 ° C or less, at least 90 MPa or more can be obtained. Joint strength.
又,第8圖的虛線S1顯示鋁合金A1070構成的棒狀散熱片3的母材強度(拉伸強度),虛線S2顯示鋁合金A4043構成的棒狀散熱片3的母材強度(拉伸強度)。結果R1(鋁合金A1070)中,當基板2的加熱溫度在400℃以上500℃以下的話,接合強度會達到母材強度的50%以上。換言之,當基板2的加熱溫度不滿400℃的話,接合強度就不滿母材強度的50%。 Further, the broken line S1 in Fig. 8 shows the base material strength (tensile strength) of the rod-shaped fins 3 composed of the aluminum alloy A1070, and the broken line S2 shows the base material strength (tensile strength) of the rod-shaped fins 3 composed of the aluminum alloy A4043. ). As a result, in the case of R1 (aluminum alloy A1070), when the heating temperature of the substrate 2 is 400 ° C or more and 500 ° C or less, the bonding strength is 50% or more of the strength of the base material. In other words, when the heating temperature of the substrate 2 is less than 400 ° C, the bonding strength is less than 50% of the strength of the base material.
結果R2(鋁合金A4043)中,當基板2的加熱溫度在400℃以上500℃以下的話,接合強度會達到母材強度的80%以上。換言之,當基板2的加熱溫度不滿400℃的話,接合強度 就不滿母材強度的80%。 As a result, in the case of R2 (aluminum alloy A4043), when the heating temperature of the substrate 2 is 400 ° C or more and 500 ° C or less, the bonding strength is 80% or more of the strength of the base material. In other words, when the heating temperature of the substrate 2 is less than 400 ° C, the joint strength It is less than 80% of the strength of the base metal.
第9圖係實施例的接合部的剖面微組織圖。如第9圖的左欄所示,基板2的加熱溫度在350℃的話,圓角4的寬度方向兩側不與基板2接合,形成接合缺陷Q、Q。另一方面,如第9圖的右欄所示,加熱溫度在475℃的話,基板2的表面2a與圓角4的下面全體接合,接合部看不到接合缺陷。加熱溫度在475℃情況下,能夠在接合界面確認1μm左右的極薄的銅與鋁的反應層,兩者金屬接合。 Fig. 9 is a sectional microstructure view of the joint portion of the embodiment. As shown in the left column of Fig. 9, when the heating temperature of the substrate 2 is 350 °C, the both sides in the width direction of the rounded corner 4 are not joined to the substrate 2, and joint defects Q and Q are formed. On the other hand, as shown in the right column of Fig. 9, when the heating temperature is 475 °C, the surface 2a of the substrate 2 is bonded to the entire lower surface of the rounded corner 4, and the joint portion does not have a joint defect. When the heating temperature is 475 ° C, an extremely thin reaction layer of copper and aluminum of about 1 μm can be confirmed at the joint interface, and the two are joined by metal.
考量第8圖及第9圖的結果,當基板2的加熱溫度設定在400~500℃的話,接合部沒有接合缺陷,可獲得充分的接合強度,因此是較適當的選擇。 When the heating temperature of the substrate 2 is set to 400 to 500 ° C in consideration of the results of Figs. 8 and 9, the joint portion has no joint defects and sufficient joint strength can be obtained, which is a suitable choice.
第10圖顯示實施例的基板加熱溫度與圓角的直徑比的關係。在此圖中,不論棒狀散熱片3的材料的差別,以相同形狀的(菱形)的描點來顯示。圓角直徑比如第6(c)圖所示,是圓角4的最小徑ψ min比上最大徑ψ max的值(ψ min/ψ max)。如第10圖所示,圓角直徑比隨著基板2的加熱溫度的增加而接近1.0。又,圓角直徑比在0.75以上的基板2的加熱溫度是400℃。 Fig. 10 is a graph showing the relationship between the substrate heating temperature of the embodiment and the diameter ratio of the rounded corners. In this figure, regardless of the difference in material of the rod fins 3, the same shape (diamond) is used for the display. The fillet diameter, as shown in Fig. 6(c), is the value of the minimum diameter ψ min of the rounded corner 4 to the maximum diameter ψ max (ψ min / ψ max). As shown in Fig. 10, the fillet diameter ratio approaches 1.0 as the heating temperature of the substrate 2 increases. Further, the heating temperature of the substrate 2 having a rounded corner diameter ratio of 0.75 or more was 400 °C.
第11圖顯示實施例的圓角直徑比與接合效率的關係。又,在此圖中,不論棒狀散熱片3的材料的差別,以相同形狀的(菱形)的描點來顯示。接合效率是將拉伸實驗獲得的接合強度(參照第8圖)除去各材料的棒狀散熱片3的母材強度的值。又,接合強度及母材強度是將拉伸實驗中的破損壓力除以棒狀散熱片3的母材的原本剖面積而得。因此,接合效率也 可能會有超過100%的情況。 Fig. 11 shows the relationship between the fillet diameter ratio of the examples and the joining efficiency. Further, in this figure, regardless of the difference in material of the rod fins 3, the same shape (diamond) is used for the display. The joining efficiency is a value obtained by removing the joint strength of the rod-shaped fins 3 of the respective materials from the joint strength obtained by the tensile test (see Fig. 8). Further, the joint strength and the base material strength were obtained by dividing the breakage pressure in the tensile test by the original cross-sectional area of the base material of the rod-shaped fins 3. Therefore, the joint efficiency is also There may be more than 100% of the cases.
如第11圖所示,圓角直徑比在0.75以上的話,接合效率在40%以上。也就是,當圓角4的最大徑ψ max與最小徑ψ min的差小的話,接合效率也會變高。另一方面,當圓角直徑比不滿0.75的話,接合效率也不滿40%,接合效率變低。考量第10圖及第11圖的結果,當加熱溫度在400℃以上的話,圓角直徑比在0.75以上,並且可獲得充分的接合強度。也就是,當加熱溫度在400℃以上的話,可平衡良好且強力地接合。 As shown in Fig. 11, when the fillet diameter ratio is 0.75 or more, the joining efficiency is 40% or more. That is, when the difference between the maximum diameter ψ max of the rounded corner 4 and the minimum diameter ψ min is small, the joining efficiency also becomes high. On the other hand, when the fillet diameter ratio is less than 0.75, the joining efficiency is less than 40%, and the joining efficiency is lowered. Considering the results of Figs. 10 and 11, when the heating temperature is 400 ° C or more, the round diameter ratio is 0.75 or more, and sufficient joint strength can be obtained. That is, when the heating temperature is 400 ° C or more, the bonding can be well balanced and strongly.
又,本實施例中,將第6(a)圖所示的第二實驗體1B(鋁合金A4043)配合後述複數的振幅形成5個,進行棒狀散熱片接合率實驗。棒狀散熱片接合率實驗中,形成第二實驗體1B(棒狀散熱片3合計設置40根),計算沒有脫落、折損,還接合在基板2的棒狀散熱片3的根數比例。 In the present embodiment, the second experimental body 1B (aluminum alloy A4043) shown in Fig. 6(a) was formed by combining five amplitudes of the plural numbers described later, and a rod-shaped fin junction ratio experiment was performed. In the rod-shaped fin joint ratio test, the second test body 1B (the total of the rod-shaped fins 3 was provided in 40) was formed, and the ratio of the number of the rod-shaped fins 3 joined to the substrate 2 was calculated without dropping or breaking.
棒狀散熱片接合率實驗中,將摩擦壓接步驟的振幅設定微0.8mm、1.0mm、1.2mm、1.6mm、1.8mm,以各自的振幅形成實驗體。又,基板2的加熱溫度一律設定為350℃。如第12圖所示,當振幅在1.2mm以上,棒狀散熱片接合率在70%以上。又,當振幅不滿1.2mm,棒狀散熱片接合率不滿70%。因此,摩擦壓接步驟的振幅設定在1.2~1.8mm較佳。 In the rod fin junction ratio experiment, the amplitude of the rubbing pressure bonding step was set to be 0.8 mm, 1.0 mm, 1.2 mm, 1.6 mm, and 1.8 mm, and the test bodies were formed with respective amplitudes. Further, the heating temperature of the substrate 2 was uniformly set to 350 °C. As shown in Fig. 12, when the amplitude is 1.2 mm or more, the rod fins have a bonding ratio of 70% or more. Further, when the amplitude is less than 1.2 mm, the rod-like fin joint rate is less than 70%. Therefore, the amplitude of the frictional crimping step is preferably set to 1.2 to 1.8 mm.
1‧‧‧散熱器 1‧‧‧heatsink
2‧‧‧基板 2‧‧‧Substrate
2a‧‧‧表面 2a‧‧‧ surface
3‧‧‧棒狀散熱片 3‧‧‧ Rod Heatsink
4‧‧‧圓角 4‧‧‧ fillet
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