TW201620096A - Electronic component conveying device, electronic component inspection device and electronic component pressing device - Google Patents
Electronic component conveying device, electronic component inspection device and electronic component pressing device Download PDFInfo
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- TW201620096A TW201620096A TW104139019A TW104139019A TW201620096A TW 201620096 A TW201620096 A TW 201620096A TW 104139019 A TW104139019 A TW 104139019A TW 104139019 A TW104139019 A TW 104139019A TW 201620096 A TW201620096 A TW 201620096A
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Abstract
Description
本發明係關於一種電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置。 The present invention relates to an electronic component conveying device, an electronic component inspection device, and an electronic component pressing device.
自先前以來，例如眾所周知有檢查IC(integrated circuit，積體電路)元件等電子零件之電氣特性之電子零件檢查裝置，於該電子零件檢查裝置組裝有用以將IC元件搬送至檢查部之保持部為止之電子零件搬送裝置。於檢查IC元件時，藉由電子零件搬送裝置之固持部而固持之IC元件配置於保持部。而且，固持部將IC元件向保持部按壓。藉此，IC元件之複數個端子分別被壓抵於設置於保持部之複數個探針接腳，IC元件之各端子與各探針接腳接觸並電性地連接。 For example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (integrated circuit) component has been known, and the electronic component inspection device is assembled to transport the IC component to the holding portion of the inspection unit. Electronic parts transfer device. When the IC component is inspected, the IC component held by the holding portion of the electronic component transfer device is placed on the holding portion. Further, the holding portion presses the IC element toward the holding portion. Thereby, the plurality of terminals of the IC component are respectively pressed against the plurality of probe pins provided in the holding portion, and the terminals of the IC component are in contact with each of the probe pins and electrically connected.
又，存在如下情形：於檢查IC元件時，將IC元件調整為所期望之溫度而進行其檢查。於該情形時存在採用如下冷卻構造之情況，即，使具有多片散熱片之散熱器抵接於IC元件，且將作為冷卻用氣體之空氣自噴嘴向散熱片噴射(例如，參照專利文獻1)。 Further, there is a case where the IC element is adjusted to a desired temperature and the inspection is performed when the IC element is inspected. In this case, there is a case where a heat sink having a plurality of fins is brought into contact with the IC element, and air as a cooling gas is ejected from the nozzle to the heat sink (for example, refer to Patent Document 1) ).
[專利文獻1]日本專利特開2007-005685號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-005685
然而，於專利文獻1，完全未揭示冷卻構造中將冷卻用氣體供給 至噴嘴之供給源與噴嘴係經由怎樣的配管而連結。 However, in Patent Document 1, it is not disclosed at all that the cooling gas is supplied in the cooling structure. The supply source to the nozzle is connected to the nozzle via which pipe.
本發明之目的在於提供一種可進行準確地進行按壓構件之溫度控制、與防止按壓構件相對於按壓構件配置構件之裝卸時之重新配管作業變得繁雜之中之至少一者的電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置。 An object of the present invention is to provide an electronic component conveying apparatus capable of performing at least one of the temperature control of the pressing member and the re- piping operation in which the pressing member is prevented from being attached or detached to the pressing member arranging member. Electronic component inspection device and electronic component pressing device.
此種目的藉由下述之本發明而達成。 Such an object is achieved by the invention described below.
本發明之電子零件搬送裝置之特徵在於包括：按壓構件，其能夠按壓電子零件；及按壓構件配置構件，其具有能夠流通流體之連通孔，且供配置按壓構件。 An electronic component conveying apparatus according to the present invention includes: a pressing member capable of pressing an electronic component; and a pressing member arranging member having a communication hole through which a fluid can flow, and a pressing member disposed.
藉此，可進行準確地進行按壓構件之溫度控制、與防止按壓構件相對於按壓構件配置構件之裝卸時之重新配管作業變得繁雜之至少一者。 Thereby, it is possible to perform at least one of the temperature control of the pressing member and the re- piping operation when the pressing member is prevented from being attached or detached to the pressing member arranging member.
於本發明之電子零件搬送裝置中，較佳為，於自按壓上述電子零件之方向俯視之情形時，上述連通孔配置於與配置上述按壓構件之區域不同之區域。 In the electronic component conveying apparatus of the present invention, it is preferable that the communication hole is disposed in a region different from a region in which the pressing member is disposed when viewed from a direction in which the electronic component is pressed.
藉此，可將上述不同之區域設定為用以形成連通孔之區域，因此，可容易地確保連通孔。 Thereby, the different regions described above can be set as the regions for forming the communication holes, and therefore, the communication holes can be easily secured.
於本發明之電子零件搬送裝置中，較佳為，於上述按壓構件配置構件配置複數個上述按壓構件。 In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the pressing members are disposed in the pressing member arranging member.
藉此，例如於檢查電子零件之情形時，可將複數個電子零件一次壓抵於進行該電子零件之檢查之檢查部，因此，可實現檢查效率之提 高。 Thereby, for example, when the electronic component is inspected, a plurality of electronic components can be pressed against the inspection unit that performs the inspection of the electronic component at a time, thereby improving the inspection efficiency. high.
於本發明之電子零件搬送裝置中，較佳為，上述按壓構件藉由上述流體而冷卻。 In the electronic component conveying apparatus of the present invention, it is preferable that the pressing member is cooled by the fluid.
藉此，例如於檢查電子零件之情形時，可將該電子零件調整為適合檢查之溫度。 Thereby, for example, when the electronic component is inspected, the electronic component can be adjusted to a temperature suitable for inspection.
於本發明之電子零件搬送裝置中，較佳為，上述按壓構件配置構件形成板形狀。 In the electronic component conveying apparatus of the present invention, it is preferable that the pressing member arranging member has a plate shape.
藉此，例如不管按壓構件之配置數量或配置態樣如何，均可充分地確保能夠配置該等之區域。又，不管按壓構件之配置數量或配置態樣如何，亦均可將按壓構件配置構件設為共通地使用之構件，因此，使得製造時之成本下降。 Thereby, for example, regardless of the number of arrangements or the arrangement of the pressing members, it is possible to sufficiently ensure that the regions can be arranged. Further, regardless of the number of arrangement of the pressing members or the arrangement of the pressing members, the pressing member arranging members can be used as members that are commonly used, and therefore, the cost at the time of manufacture is lowered.
於本發明之電子零件搬送裝置中，較佳為，於自按壓上述電子零件之方向俯視之情形時，上述按壓構件配置構件形成矩形。 In the electronic component conveying apparatus of the present invention, it is preferable that the pressing member arranging member has a rectangular shape when viewed from a direction in which the electronic component is pressed.
藉此，例如不管按壓構件之配置數量或配置態樣如何，均可充分地確保能夠配置該等之區域。又，不管按壓構件之配置數量或配置態樣如何，亦均可將按壓構件配置構件設為共通地使用之構件，因此，使得製造時之成本下降。 Thereby, for example, regardless of the number of arrangements or the arrangement of the pressing members, it is possible to sufficiently ensure that the regions can be arranged. Further, regardless of the number of arrangement of the pressing members or the arrangement of the pressing members, the pressing member arranging members can be used as members that are commonly used, and therefore, the cost at the time of manufacture is lowered.
於本發明之電子零件搬送裝置中，較佳為，上述連通孔配置於上述按壓構件配置構件之角部。 In the electronic component conveying apparatus of the present invention, it is preferable that the communication hole is disposed at a corner of the pressing member arranging member.
藉此，可將上述按壓構件配置構件之角部設定為用以形成連通孔之區域，因此，可容易地確保連通孔。 Thereby, the corner portion of the pressing member arranging member can be set as a region for forming the communication hole, and therefore the communication hole can be easily secured.
於本發明之電子零件搬送裝置中，較佳為，設置有保持上述連通孔之氣密性之密封構件。 In the electronic component conveying apparatus of the present invention, it is preferable that a sealing member that maintains the airtightness of the communication hole is provided.
藉此，可防止流體自連通孔向外部漏出。 Thereby, it is possible to prevent the fluid from leaking to the outside from the communication hole.
於本發明之電子零件搬送裝置中，較佳為，於自按壓上述電子零件之方向俯視之情形時，上述密封構件形成橢圓形狀。 In the electronic component conveying apparatus of the present invention, it is preferable that the sealing member has an elliptical shape when viewed from a direction in which the electronic component is pressed.
藉此，可利用1個密封構件一次保持複數個連通孔之氣密性。 Thereby, the airtightness of a plurality of communication holes can be maintained at one time by one sealing member.
於本發明之電子零件搬送裝置中，較佳為，上述連通孔設置有複數個，1個上述密封構件以保持上述複數個連通孔中之至少2個上述連通孔之氣密性之方式設置。 In the electronic component conveying apparatus of the present invention, preferably, the plurality of communication holes are provided, and one of the sealing members is provided to maintain airtightness of at least two of the plurality of communication holes.
藉此，較之針對各連通孔分別設置密封構件之情形時，可使裝置構成簡單。 Thereby, the device configuration can be simplified as compared with the case where the sealing members are respectively provided for the respective communication holes.
於本發明之電子零件搬送裝置中，較佳為，上述連通孔設置有複數個，沿著上述按壓構件配置構件之長度方向配置有上述複數個連通孔中之至少2個上述連通孔。 In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the communication holes are provided, and at least two of the plurality of communication holes are disposed along a longitudinal direction of the pressing member arrangement member.
藉此，可儘可能寬地確保能夠配置按壓構件之區域，因此，選擇按壓構件之配置數量或配置態樣之自由度提高。 Thereby, the area where the pressing member can be disposed can be ensured as wide as possible, and therefore, the degree of freedom in selecting the number of arrangement or arrangement of the pressing members is improved.
於本發明之電子零件搬送裝置中，較佳為，上述按壓構件配置構件係安裝於具有與上述連通孔連通之安裝構件側連通孔之按壓構件配置構件安裝構件，上述連通孔之大小大於上述安裝構件側連通孔之大小。 In the electronic component conveying apparatus of the present invention, it is preferable that the pressing member arranging member is attached to a pressing member arranging member mounting member having a mounting member side communication hole that communicates with the communication hole, and the size of the communication hole is larger than the mounting. The size of the communication hole on the component side.
藉此，不管安裝構件側連通孔之形成位置如何，均可使該安裝構件側連通孔與連通孔連通。 Thereby, the connection member side communication hole can communicate with the communication hole regardless of the formation position of the attachment member side communication hole.
於本發明之電子零件搬送裝置中，較佳為，於自按壓上述電子零件之方向俯視之情形時，上述連通孔包含上述安裝構件側連通孔。 In the electronic component conveying apparatus of the present invention, it is preferable that the communication hole includes the attachment member side communication hole when viewed from a direction in which the electronic component is pressed.
藉此，不管安裝構件側連通孔之形成位置如何，均可使該安裝構件側連通孔與連通孔連通。 Thereby, the connection member side communication hole can communicate with the communication hole regardless of the formation position of the attachment member side communication hole.
於本發明之電子零件搬送裝置中，較佳為，上述安裝構件側連通孔之設置數量多於上述連通孔之設置數量。 In the electronic component conveying apparatus of the present invention, it is preferable that the number of the communication member side communication holes is larger than the number of the communication holes.
藉此，可將例如插塞等***至未使用之連通孔而堵住該連通孔。 Thereby, for example, a plug or the like can be inserted into an unused communication hole to block the communication hole.
於本發明之電子零件搬送裝置中，較佳為，於自按壓上述電子零件之方向俯視之情形時，於將上述按壓構件配置構件之長度方向設為X方向，且將與該X方向正交之方向設為Y方向時，上述連通孔於X方向配置有4個，且於Y方向配置有2個。 In the electronic component conveying apparatus of the present invention, it is preferable that the longitudinal direction of the pressing member arranging member is the X direction and orthogonal to the X direction when viewed from the direction in which the electronic component is pressed. When the direction is the Y direction, the communication holes are arranged in four in the X direction and two in the Y direction.
藉此，不管按壓構件之配置數量或配置態樣如何，按壓構件配置構件均成為通用性較高者。 Thereby, regardless of the number of arrangement or arrangement of the pressing members, the pressing member arranging members are highly versatile.
於本發明之電子零件搬送裝置中，較佳為，位於上述X方向之最近之上述連通孔彼此之中心間距離為240mm±20mm，位於上述X方向之最遠之上述連通孔彼此之中心間距離為260mm±20mm，位於上述Y方向之上述連通孔彼此之中心間距離為93.5mm±20mm。 In the electronic component conveying apparatus of the present invention, preferably, the distance between the centers of the nearest communication holes located in the X direction is 240 mm ± 20 mm, and the distance between the centers of the communication holes located farthest from the X direction It is 260 mm ± 20 mm, and the distance between the centers of the above-mentioned communication holes in the above Y direction is 93.5 mm ± 20 mm.
藉此，不管按壓構件之配置數量或配置態樣如何，按壓構件配置 構件均成為通用性較高者。 Thereby, regardless of the number of configurations or the arrangement of the pressing members, the pressing member configuration The components are all highly versatile.
本發明之電子零件檢查裝置之特徵在於包括：按壓構件，其能夠按壓電子零件；按壓構件配置構件，其具有能夠流通流體之連通孔，且供配置按壓構件；及檢查部，其檢查上述電子零件。 An electronic component inspection apparatus according to the present invention includes: a pressing member capable of pressing an electronic component; a pressing member arranging member having a communication hole through which a fluid can flow, and a pressing member; and an inspection portion for inspecting the electronic component .
藉此，可進行準確地進行按壓構件之溫度控制、與防止按壓構件相對於按壓構件配置構件之裝卸時之重新配管作業變得繁雜之中之至少一者。 Thereby, at least one of the temperature control of the pressing member and the re- piping operation at the time of attaching and detaching the pressing member to the pressing member arranging member can be performed.
本發明之電子零件按壓裝置之特徵在於包括：按壓構件，其能夠按壓電子零件；及按壓構件配置構件，其具有能夠流通流體之連通孔，且供配置按壓構件。 An electronic component pressing device according to the present invention includes: a pressing member capable of pressing an electronic component; and a pressing member arranging member having a communication hole through which a fluid can flow, and a pressing member disposed.
藉此，可進行準確地進行按壓構件之溫度控制、與防止按壓構件相對於按壓構件配置構件之裝卸時之重新配管作業變得繁雜之中之至少一者。 Thereby, at least one of the temperature control of the pressing member and the re- piping operation at the time of attaching and detaching the pressing member to the pressing member arranging member can be performed.
1‧‧‧檢查裝置 1‧‧‧Checking device
2‧‧‧供給部 2‧‧‧Supply Department
3‧‧‧供給側排列部 3‧‧‧Supply side alignment
4‧‧‧搬送部 4‧‧‧Transportation Department
5‧‧‧檢查部 5‧‧‧Inspection Department
6‧‧‧回收側排列部 6‧‧‧Recycling side alignment
7‧‧‧回收部 7‧‧Recycling Department
8‧‧‧控制部 8‧‧‧Control Department
9‧‧‧IC元件 9‧‧‧IC components
10‧‧‧搬送裝置 10‧‧‧Transporting device
11‧‧‧基座 11‧‧‧Base
12‧‧‧蓋 12‧‧‧ Cover
13‧‧‧鉤 13‧‧‧ hook
14‧‧‧扣結件 14‧‧‧Deductions
41‧‧‧梭子 41‧‧‧ Shuttle
42‧‧‧供給機器人 42‧‧‧Supply robot
43‧‧‧檢查機器人 43‧‧‧Check the robot
44‧‧‧回收機器人 44‧‧‧Recycling robot
45‧‧‧插口佈局組件 45‧‧‧ socket layout components
46‧‧‧手單元(按壓構件) 46‧‧‧Hand unit (pressing member)
47‧‧‧基座(按壓構件配置構件) 47‧‧‧Base (pressing member configuration member)
47A‧‧‧基座(按壓構件配置構件) 47A‧‧‧Base (pressing member configuration member)
47B‧‧‧基座(按壓構件配置構件) 47B‧‧‧Base (pressing member configuration member)
48‧‧‧冷卻用構造體 48‧‧‧Cooling structure
49‧‧‧密封構件(襯墊) 49‧‧‧ Sealing member (cushion)
51‧‧‧保持部 51‧‧‧ Keeping Department
111‧‧‧基座面 111‧‧‧ base surface
141‧‧‧母側構件 141‧‧‧Female side members
142‧‧‧公側構件 142‧‧‧Male side members
151‧‧‧前蓋 151‧‧‧ front cover
151a‧‧‧退避部 151a‧‧‧Retreating Department
152‧‧‧後蓋 152‧‧‧Back cover
153‧‧‧左側蓋 153‧‧‧left cover
153a‧‧‧彎折部 153a‧‧‧Folding
154‧‧‧右側蓋 154‧‧‧ right side cover
154a‧‧‧彎折部 154a‧‧‧Bend
341‧‧‧載置平台 341‧‧‧Loading platform
411‧‧‧袋體 411‧‧‧ bag body
421‧‧‧支持框架 421‧‧‧Support framework
422‧‧‧移動框架 422‧‧‧Mobile framework
423‧‧‧手單元 423‧‧‧Hand unit
431‧‧‧支持框架 431‧‧‧Support framework
432‧‧‧移動框架(按壓構件配置構件安裝構件) 432‧‧‧Moving frame (pressing member arranging member mounting member)
433‧‧‧框架側連通孔(安裝構件側連通孔) 433‧‧‧Frame side communication hole (connection member side communication hole)
434‧‧‧接頭 434‧‧‧Connector
435‧‧‧管 435‧‧‧ tube
436‧‧‧框架側鉤 436‧‧‧Frame side hook
441‧‧‧支持框架 441‧‧‧Support framework
442‧‧‧移動框架 442‧‧‧Mobile framework
443‧‧‧手單元 443‧‧‧Hand unit
461‧‧‧接觸塊 461‧‧‧Contact block
462‧‧‧散熱器 462‧‧‧ radiator
463‧‧‧散熱板 463‧‧‧heat plate
471‧‧‧緣部 471‧‧‧Edge
472‧‧‧缺損部 472‧‧‧Defects Department
473‧‧‧緣部 473‧‧‧Edge
474‧‧‧缺損部 474‧‧‧Defects Department
475‧‧‧***孔 475‧‧‧ insertion hole
476a‧‧‧升降用貫通孔 476a‧‧‧Drilling through hole
476b‧‧‧貫通孔 476b‧‧‧through hole
476c‧‧‧貫通孔 476c‧‧‧through hole
476d‧‧‧凹部 476d‧‧‧ recess
476e‧‧‧貫通孔 476e‧‧‧through hole
477‧‧‧連通孔 477‧‧‧Connected holes
477a‧‧‧大開口部 477a‧‧‧ Large opening
478‧‧‧角部 478‧‧‧ corner
479‧‧‧吸引用貫通孔 479‧‧‧Attraction through hole
481‧‧‧噴出口 481‧‧‧Spray outlet
482‧‧‧管 482‧‧‧ tube
A1‧‧‧第1區域(按壓構件配置區域) A1‧‧‧1st area (pressing member arrangement area)
A2‧‧‧第2區域(連通孔配置區域) A2‧‧‧2nd area (connecting hole arrangement area)
C‧‧‧冷媒 C‧‧‧Refrigerant
Lmax‧‧‧最大長度(全長) Lmax‧‧‧Maximum length (full length)
L1‧‧‧中心間距離 L 1 ‧‧‧Center distance
L2‧‧‧中心間距離 L 2 ‧‧‧Center distance
L3‧‧‧中心間距離 L 3 ‧‧‧Center distance
Tmax‧‧‧最大厚度 Tmax‧‧‧max thickness
Wmax‧‧‧最大寬度 Wmax‧‧‧Maximum width
W1‧‧‧中心間距離 W 1 ‧‧‧Center distance
圖1係表示本發明之電子零件檢查裝置之第1實施形態之概略圖。 Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention.
圖2係表示圖1所示之電子零件檢查裝置之主要部分之作動狀態之俯視圖。 Fig. 2 is a plan view showing an operation state of a main part of the electronic component inspection device shown in Fig. 1.
圖3係表示圖1所示之電子零件檢查裝置之搬送部之檢查機器人之概略分解立體圖。 Fig. 3 is a schematic exploded perspective view showing the inspection robot of the conveying unit of the electronic component inspection device shown in Fig. 1;
圖4係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列4行之矩陣狀之8個按壓構件之態樣)。 Fig. 4 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (in the form of eight pressing members arranged in a matrix of two rows and four rows).
圖5係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列4行之矩陣狀之8個按壓構件之態樣)。 Fig. 5 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (in the form of eight pressing members arranged in a matrix of two rows and four rows).
圖6係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列4行之矩陣狀之8個按壓構件之態樣)。 Fig. 6 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (in the form of eight pressing members arranged in a matrix of two rows and four rows).
圖7係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列2行之矩陣狀之4個按壓構件之態樣)。 Fig. 7 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having four pressing members arranged in a matrix of two rows and two rows).
圖8係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列3行之矩陣狀之6個按壓構件之態樣)。 Fig. 8 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having six pressing members arranged in a matrix of two rows and three rows).
圖9係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列6行之矩陣狀之12個按壓構件之態樣)。 Fig. 9 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having twelve pressing members arranged in a matrix of two rows and six rows).
圖10係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列8行之矩陣狀之16個按壓構件之態樣)。 Fig. 10 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having 16 pressing members arranged in a matrix of two rows and eight rows).
圖11係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為1列4行之矩陣狀之4個按壓構件之態樣)。 Fig. 11 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having four pressing members arranged in a matrix of one row and four rows).
圖12係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為1列8行之矩陣狀之8個按壓構件之態樣)。 Fig. 12 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (in the form of eight pressing members arranged in a matrix of one row and eight rows).
圖13係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為1列8行之矩陣狀之8個按壓構件之態樣)。 Fig. 13 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (in the form of eight pressing members arranged in a matrix of one row and eight rows).
圖14係表示圖4~圖13所示之插口佈局組件中之冷卻構造之立體圖。 Fig. 14 is a perspective view showing a cooling structure in the socket layout assembly shown in Figs. 4 to 13;
圖15係表示安裝於本發明之電子零件搬送裝置(第2實施形態)之搬送部之檢查機器人之插口佈局組件中之冷卻構造的立體圖。 FIG. 15 is a perspective view showing a cooling structure of the socket layout module of the inspection robot attached to the transport unit of the electronic component transport apparatus (second embodiment) of the present invention.
圖16係表示本發明之電子零件搬送裝置(第3實施形態)之搬送部之檢查機器人的圖((a)為俯視圖，(b)為垂直剖視圖)。 Fig. 16 is a view showing an inspection robot of a conveyance unit of the electronic component conveying apparatus (third embodiment) of the present invention ((a) is a plan view, and (b) is a vertical cross-sectional view).
圖17係表示本發明之電子零件搬送裝置(第3實施形態)之搬送部之檢查機器人的圖((a)為俯視圖，(b)為垂直剖視圖)。 17 is a view showing an inspection robot of a conveyance unit of the electronic component conveying device (third embodiment) of the present invention ((a) is a plan view and (b) is a vertical cross-sectional view).
圖18係表示本發明之電子零件搬送裝置(第3實施形態)之搬送部之檢查機器人的圖((a)為俯視圖，(b)為垂直剖視圖)。 FIG. 18 is a view showing an inspection robot of the transport unit of the electronic component transport apparatus (third embodiment) of the present invention ((a) is a plan view and (b) is a vertical cross-sectional view).
圖19(a)、(b)係表示本發明之電子零件搬送裝置(第4實施形態)中之插口佈局組件之安裝過程的概略立體圖。 19(a) and 19(b) are schematic perspective views showing the mounting process of the socket layout unit in the electronic component conveying apparatus (fourth embodiment) of the present invention.
圖20係表示本發明之電子零件搬送裝置(第5實施形態)中之插口佈局組件之概略立體圖。 Fig. 20 is a schematic perspective view showing a socket layout unit in the electronic component conveying device (fifth embodiment) of the present invention.
以下，基於隨附圖式所示之較佳之實施形態對本發明之電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置詳細地進行說明。 Hereinafter, the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings.
圖1係表示本發明之電子零件檢查裝置之第1實施形態之概略圖。圖2係表示圖1所示之電子零件檢查裝置之主要部分之作動狀態之俯視圖。圖3係表示圖1所示之電子零件檢查裝置之搬送部之檢查機器人之概略分解立體圖。圖4~圖6係分別表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列4行之矩陣狀之8個按壓構件之態樣)。圖7係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列2行之矩陣狀之4個按壓構件之態樣)。圖8係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列3行之矩陣狀之6個按壓構件之態樣)。圖9係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列6行之矩陣狀之12個按壓構件之態樣)。圖10係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為2列8行之矩陣狀之16個按壓構件之態樣)。圖11係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為1列4行之矩陣狀之4個按壓構件之態樣)。圖12係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為1列8行之矩陣狀之8個按壓構件之態 樣)。圖13係表示能夠安裝於圖3所示之檢查機器人之插口佈局組件之俯視圖(具有配置為1列8行之矩陣狀之8個按壓構件之態樣)。圖14係表示圖4~圖13所示之插口佈局組件中之冷卻構造之立體圖。 Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a plan view showing an operation state of a main part of the electronic component inspection device shown in Fig. 1. Fig. 3 is a schematic exploded perspective view showing the inspection robot of the conveying unit of the electronic component inspection device shown in Fig. 1; 4 to 6 are plan views each showing a socket layout assembly that can be attached to the inspection robot shown in Fig. 3 (there are eight pressing members arranged in a matrix of two rows and four rows). Fig. 7 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having four pressing members arranged in a matrix of two rows and two rows). Fig. 8 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having six pressing members arranged in a matrix of two rows and three rows). Fig. 9 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having twelve pressing members arranged in a matrix of two rows and six rows). Fig. 10 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having 16 pressing members arranged in a matrix of two rows and eight rows). Fig. 11 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (a configuration having four pressing members arranged in a matrix of one row and four rows). Figure 12 is a plan view showing a socket layout assembly that can be mounted to the inspection robot shown in Figure 3 (with eight pressing members arranged in a matrix of one column and eight rows) kind). Fig. 13 is a plan view showing a socket layout assembly which can be attached to the inspection robot shown in Fig. 3 (in the form of eight pressing members arranged in a matrix of one row and eight rows). Fig. 14 is a perspective view showing a cooling structure in the socket layout assembly shown in Figs. 4 to 13;
再者，以下，為了便於說明，如圖1所示，將相互正交之3個軸設為X軸、Y軸及Z軸。又，包含X軸與Y軸之XY平面成為水平，Z軸成為鉛垂。又，亦將與X軸平行之方向稱為「X方向」，亦將與Y軸平行之方向稱為「Y方向」，亦將與Z軸平行之方向稱為「Z方向」。又，將圖3、圖14中(關於圖15~圖20亦相同)之Z軸方向之上側稱為「上」或「上方」，將下側稱為「下」或「下方」。又，本案說明書中所言之「水平」並無限定於完全水平，只要不阻礙電子零件之搬送，亦包含相對於水平傾斜若干(例如未達5°之程度)之狀態。 In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", and the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Further, the upper side in the Z-axis direction in FIGS. 3 and 14 (the same as in FIGS. 15 to 20) is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower". Moreover, the "level" as used in the specification of the present invention is not limited to a complete level, and includes a state in which it is inclined with respect to the horizontal (for example, to the extent of 5 degrees) as long as it does not hinder the conveyance of the electronic component.
圖1所示之檢查裝置(電子零件檢查裝置)1例如係用以對包含BGA(Ball Grid Array，球狀柵陣列)封裝體或LGA(Land Grid Array，平面柵格陣列)封裝體等之IC元件、LCD(Liquid Crystal Display，液晶顯示器)、OLED(Organic Electroluminescence Display，有機電致發光顯示器)、電子紙等之顯示元件、CIS(CMOS Image Sensor，互補金氧半導體影像感測器)、CCD(Charge Coupled Device，電荷耦合器件)、加速度感測器、陀螺儀感測器、壓力感測器等各種感測器、進而包含水晶振子之各種振子等之電子零件之電氣特性進行檢查、測試(以下簡稱為「檢查」)之裝置。再者，以下，為了便於說明，以使用IC元件作為進行檢查之上述電子零件之情形為代表而進行說明，將其設為「IC元件9」。 The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used, for example, for an IC including a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package. Display elements such as components, LCD (Liquid Crystal Display), OLED (Organic Electroluminescence Display), electronic paper, etc., CIS (CMOS Image Sensor, complementary metal oxide semiconductor image sensor), CCD ( Charge Coupled Device, charge sensor, gyro sensor, pressure sensor, etc., and electrical characteristics of electronic components including crystal oscillators, etc. A device referred to as "inspection" for short. In the following, for the sake of convenience of explanation, the case where the IC component is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC component 9".
如圖1所示，檢查裝置1具有供給部2、供給側排列部3、搬送部4、檢查部5、回收側排列部6、回收部7、及進行該等各部之控制之控制部8。又，檢查裝置1具有：基座11，其配置供給部2、供給側排列部3、搬送部4、檢查部5、回收側排列部6及回收部7；及蓋12，其以收納供 給側排列部3、搬送部4、檢查部5及回收側排列部6之方式蓋在基座11上。再者，作為基座11之上表面之基座面111大致水平，於該基座面111配置有供給側排列部3、搬送部4、檢查部5、回收側排列部6之構成構件。又，檢查裝置1除此以外亦可根據需要而具有用以對IC元件9進行加熱之加熱器或腔室等。 As shown in Fig. 1, the inspection apparatus 1 includes a supply unit 2, a supply side array unit 3, a conveyance unit 4, an inspection unit 5, a collection side array unit 6, a collection unit 7, and a control unit 8 that controls the respective units. Further, the inspection apparatus 1 includes a susceptor 11 that is provided with a supply unit 2, a supply-side arranging unit 3, a transport unit 4, an inspection unit 5, a collection-side arranging unit 6, and a recovery unit 7, and a cover 12 for housing The side arrangement portion 3, the conveyance portion 4, the inspection portion 5, and the collection side array portion 6 are covered on the susceptor 11. Further, the base surface 111 as the upper surface of the susceptor 11 is substantially horizontal, and the supply side arranging portion 3, the conveying portion 4, the inspection portion 5, and the recovery side arranging portion 6 are disposed on the base surface 111. Further, the inspection device 1 may have a heater or a chamber for heating the IC element 9 as needed.
此種檢查裝置1以如下方式構成：供給部2將IC元件9供給至供給側排列部3，供給側排列部3排列所供給之IC元件9，搬送部4將經排列之IC元件9搬送至檢查部5，檢查部5檢查所搬送之IC元件9，搬送部4將結束檢查之IC元件9搬送至回收側排列部6並排列，回收部7將排列於回收側排列部6之IC元件9回收。根據此種檢查裝置1，可自動地進行IC元件9之供給、檢查、回收。再者，於檢查裝置1中，藉由除檢查部5以外之構成，即藉由供給部2、供給側排列部3、搬送部4、回收側排列部6、回收部7及控制部8之一部分等而構成搬送裝置(電子零件搬送裝置)10。搬送裝置10進行IC元件9之搬送等。 The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC element 9 to the supply side array unit 3, the supply side array unit 3 arranges the supplied IC element 9, and the transport unit 4 transports the aligned IC elements 9 to In the inspection unit 5, the inspection unit 5 inspects the transported IC device 9 and the transport unit 4 transports the IC elements 9 that have been inspected to the collection side array unit 6 and arranges them. The collection unit 7 arranges the IC elements 9 arranged in the collection side array unit 6 Recycling. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC element 9 can be automatically performed. Further, in the inspection apparatus 1, the configuration other than the inspection unit 5, that is, the supply unit 2, the supply side array unit 3, the transport unit 4, the recovery side array unit 6, the collection unit 7, and the control unit 8 A part (etc.) constitutes a conveying device (electronic component conveying device) 10. The transport device 10 performs transport of the IC component 9 and the like.
以下，對搬送部4及檢查部5之構成進行說明。 Hereinafter, the configuration of the transport unit 4 and the inspection unit 5 will be described.
如圖2所示，搬送部4係如下單元，其將配置於供給側排列部3之載置平台341上之IC元件9搬送至檢查部5為止，並將結束於檢查部5中之檢查之IC元件9搬送至回收側排列部6。此種搬送部4具有梭子41、供給機器人42、檢查機器人43、及回收機器人44。 As shown in FIG. 2, the transport unit 4 is a unit that transports the IC element 9 disposed on the mounting platform 341 of the supply-side arranging unit 3 to the inspection unit 5, and ends the inspection in the inspection unit 5. The IC element 9 is transported to the recovery side aligning portion 6. The transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.
梭子41係用以將載置平台341上之IC元件9搬送至檢查部5之附近為止，進而將已利用檢查部5檢查之檢查完畢之IC元件9搬送至回收側排列部6之附近為止的梭子。於此種梭子41，於X方向排列形成有用以收納(配置)IC元件9之4個袋體(第1配置部)411。又，梭子41係藉由線性導軌而引導，且藉由線性馬達等驅動源而能夠於X方向往返移動。 The shuttle 41 is configured to transport the IC component 9 on the mounting platform 341 to the vicinity of the inspection unit 5, and further transport the inspected IC component 9 inspected by the inspection unit 5 to the vicinity of the collection-side alignment unit 6. shuttle. In the shuttle 41, four bag bodies (first arrangement portions) 411 for accommodating (arranging) the IC elements 9 are formed in the X direction. Further, the shuttle 41 is guided by a linear guide and can be reciprocated in the X direction by a drive source such as a linear motor.
供給機器人42係將配置於載置平台341上之IC元件9搬送至梭子41之機器人。此種供給機器人42具有：支持框架421，其被支持於基座11；移動框架422，其被支持於支持框架421，且能夠相對於支持框架421而於Y方向往返移動；及4個手單元(固持機器人)423，其等被支持於移動框架422。各手單元423具備升降機構及吸附噴嘴，且可藉由吸附而固持IC元件9。 The supply robot 42 transports the IC component 9 disposed on the mounting platform 341 to the robot of the shuttle 41. Such a supply robot 42 has a support frame 421 supported by the base 11 and a moving frame 422 supported by the support frame 421 and capable of reciprocating in the Y direction with respect to the support frame 421; and 4 hand units (holding robot) 423, which is supported by the moving frame 422. Each of the hand units 423 includes an elevating mechanism and an adsorption nozzle, and the IC element 9 can be held by suction.
檢查機器人43係將收納於梭子41之IC元件9向檢查部5搬送，並且將結束檢查之IC元件9自檢查部5向梭子41搬送之機器人。檢查機器人43具有：支持框架431，其被支持於基座11；移動框架(按壓構件配置構件安裝構件)432，其被支持於支持框架431，且能夠相對於支持框架431而於Y方向往返移動；及插口佈局組件45，其安裝(支持)於移動框架432。該插口佈局組件45具有複數個作為按壓構件之能夠按壓IC元件9之手單元46。而且，檢查機器人43於檢查時，可經由各手單元46而將IC元件9壓抵於作為插口之檢查部5。藉此，可對IC元件9施加特定之檢查壓力。再者，關於插口佈局組件45之構成將於下文敍述。 The inspection robot 43 transports the IC component 9 housed in the shuttle 41 to the inspection unit 5, and transports the IC component 9 that has finished the inspection from the inspection unit 5 to the shuttle 41. The inspection robot 43 has a support frame 431 supported by the base 11 and a moving frame (pressing member arrangement member mounting member) 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431 And a socket layout component 45 that is mounted (supported) to the moving frame 432. The jack layout assembly 45 has a plurality of hand units 46 capable of pressing the IC component 9 as pressing members. Further, when the inspection robot 43 is inspected, the IC unit 9 can be pressed against the inspection unit 5 as a socket via each of the hand units 46. Thereby, a specific inspection pressure can be applied to the IC element 9. Further, the configuration of the socket layout component 45 will be described later.
回收機器人44係將結束於檢查部5之檢查之IC元件9搬送至回收側排列部6之機器人。此種回收機器人44具有：支持框架441，其被支持於基座11；移動框架442，其被支持於支持框架441，且能夠相對於支持框架441而於Y方向往返移動；及4個手單元(固持機器人)443，其等被支持於移動框架442。各手單元443具備升降機構及吸附噴嘴，且可藉由吸附而固持IC元件9。 The collection robot 44 is a robot that transports the IC element 9 that has been inspected by the inspection unit 5 to the collection side alignment unit 6 . Such a recycling robot 44 has a support frame 441 supported by the base 11 and a moving frame 442 supported by the support frame 441 and capable of reciprocating in the Y direction with respect to the support frame 441; and 4 hand units (holding robot) 443, which is supported by the moving frame 442. Each of the hand units 443 includes an elevating mechanism and an adsorption nozzle, and the IC element 9 can be held by adsorption.
此種搬送部4以如下方式搬送IC元件9。首先，梭子41向圖中左側移動，供給機器人42將載置平台341上之IC元件9搬送至梭子41(步驟 1)。其次，梭子41向中央移動，檢查機器人43將梭子41上之IC元件9向檢查部5搬送(步驟2)。其次，檢查機器人43將結束於檢查部5之檢查之IC元件9向梭子41搬送(步驟3)。其次，梭子41向圖中右側移動，回收機器人44將梭子41上之檢查完畢之IC元件9搬送至回收側排列部6(步驟4)。藉由重複此種步驟1~步驟4，而可將IC元件9經由檢查部5而向回收側排列部6搬送。 The transfer unit 4 transports the IC element 9 as follows. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC component 9 on the mounting platform 341 to the shuttle 41 (step 1). Next, the shuttle 41 moves toward the center, and the inspection robot 43 transports the IC component 9 on the shuttle 41 to the inspection unit 5 (step 2). Next, the inspection robot 43 transports the IC element 9 that has been inspected by the inspection unit 5 to the shuttle 41 (step 3). Next, the shuttle 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC element 9 on the shuttle 41 to the recovery side array unit 6 (step 4). By repeating such steps 1 to 4, the IC element 9 can be transported to the recovery side aligning unit 6 via the inspection unit 5.
以上，對搬送部4之構成進行了說明，但作為搬送部4之構成，只要可將載置平台341上之IC元件9向檢查部5搬送，並將結束檢查之IC元件9向回收側排列部6搬送，則並無特別限定。例如，亦可省略梭子41，而利用供給機器人42、檢查機器人43及回收機器人44之任一個機器人進行自載置平台341向檢查部5之搬送及自檢查部5向回收側排列部6之搬送。 In the above, the configuration of the transport unit 4 has been described. However, as the configuration of the transport unit 4, the IC element 9 on the mounting platform 341 can be transported to the inspection unit 5, and the IC elements 9 that have finished the inspection are arranged on the recovery side. There is no particular limitation on the movement of the department 6. For example, the shuttle 41 may be omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 may perform the conveyance from the mounting platform 341 to the inspection unit 5 and the transfer from the inspection unit 5 to the collection side alignment unit 6. .
檢查部5係對IC元件9之電氣特性進行檢查、測試之單元。如圖2所示，檢查部5具有配置IC元件9之8個保持部51。於該等保持部51，分別設置有與IC元件9之端子(電極端子)電性地連接之複數個探針接腳(電極端子)(未圖示)。各探針接腳電性地連接於控制部8。於檢查IC元件9時，1個IC元件9配置(保持)於1個保持部(第2配置部)51。配置於保持部51之IC元件9之各端子分別藉由檢查機器人43之手單元46之按壓而以特定之檢查壓力壓抵於各探針接腳。藉此，IC元件9之各端子與各探針接腳電性地連接(接觸)，經由探針接腳而進行IC元件9之檢查。IC元件9之檢查係基於記憶於控制部8之程式而進行。 The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC element 9. As shown in FIG. 2, the inspection unit 5 has eight holding portions 51 on which the IC elements 9 are placed. A plurality of probe pins (electrode terminals) (not shown) electrically connected to terminals (electrode terminals) of the IC element 9 are provided in the holding portions 51, respectively. Each probe pin is electrically connected to the control unit 8. When the IC element 9 is inspected, one IC element 9 is placed (held) in one holding portion (second arrangement portion) 51. Each of the terminals of the IC element 9 disposed in the holding portion 51 is pressed against each of the probe pins with a specific inspection pressure by the pressing of the hand unit 46 of the inspection robot 43. Thereby, each terminal of the IC element 9 is electrically connected (contacted) to each probe pin, and the IC element 9 is inspected via the probe pin. The inspection of the IC component 9 is performed based on the program stored in the control section 8.
控制部8例如具有檢查控制部及驅動控制部。檢查控制部例如係基於記憶於未圖示之記憶體內之程式，而進行配置於檢查部5之IC元件9之電氣特性之檢查等。又，驅動控制部例如控制供給部2、供給側排 列部3、搬送部4、檢查部5、回收側排列部6及回收部7之各部之驅動，而進行IC元件9之搬送等。 The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs inspection of electrical characteristics of the IC component 9 disposed in the inspection unit 5, for example, based on a program stored in a memory (not shown). Further, the drive control unit controls, for example, the supply unit 2 and the supply side row The driving of the IC element 9 and the like are performed by driving the respective portions of the column portion 3, the transport portion 4, the inspection portion 5, the recovery side array portion 6, and the recovery portion 7.
如上所述，檢查機器人43具有安裝於能夠於Y方向往返移動之移動框架432之插口佈局組件45。該插口佈局組件45係用以將IC元件9壓抵於檢查部5之電子零件按壓裝置。 As described above, the inspection robot 43 has the socket layout assembly 45 attached to the moving frame 432 that can reciprocate in the Y direction. The socket layout unit 45 is for pressing the IC component 9 against the electronic component pressing device of the inspection unit 5.
如圖3所示，插口佈局組件45與上述檢查部5之保持部51之數量相同，即，具有8個手單元46及配置、支持該等手單元46之基座(按壓構件配置構件)47。藉此，可將8個IC元件9一次壓抵於檢查部5，因此，可實現檢查效率之提高。 As shown in FIG. 3, the socket layout unit 45 has the same number as the holding portion 51 of the inspection portion 5, that is, has eight hand units 46 and a base (pressing member disposing member) 47 that supports and supports the hand units 46. . Thereby, the eight IC elements 9 can be pressed against the inspection unit 5 at a time, and therefore, the inspection efficiency can be improved.
插口佈局組件45係於將按壓IC元件9之方向設為Z軸方向，且自該方向俯視之情形時，將基座47之長度方向設為X方向，且將與長度方向正交之寬度方向設為Y方向而安裝於移動框架432來使用。此處，作為插口佈局組件45向移動框架432之安裝方法，並無特別限定，例如可列舉利用螺絲固定之方法等。於使用螺絲固定之方法之情形時，插口佈局組件45安裝自由地安裝於移動框架432。藉此，容易更換插口佈局組件45。 The socket layout unit 45 is configured such that when the direction in which the IC element 9 is pressed is set to the Z-axis direction and viewed from the direction, the longitudinal direction of the susceptor 47 is set to the X direction, and the width direction orthogonal to the longitudinal direction is set. It is attached to the moving frame 432 in the Y direction and used. Here, the method of attaching the socket layout unit 45 to the moving frame 432 is not particularly limited, and examples thereof include a method of fixing by screws. In the case of the method of fixing using screws, the socket layout assembly 45 is mounted to be mounted freely on the moving frame 432. Thereby, the socket layout assembly 45 can be easily replaced.
此外，插口佈局組件45係例如根據IC元件9之種類或大小，此外根據檢查之種類等而更換為手單元46之配置數量或配置態樣不同者。 Further, the socket layout unit 45 is replaced with, for example, the type or size of the IC element 9, and is replaced by a different number or arrangement of the hand units 46 depending on the type of inspection or the like.
於圖3所示之構成中，插口佈局組件45係將8個手單元46配置為與檢查部5之保持部51相同之矩陣狀，即，配置為於Y方向為2列、且於X方向為4行之矩陣狀。 In the configuration shown in FIG. 3, the socket layout unit 45 has eight hand units 46 arranged in the same matrix as the holding portion 51 of the inspection unit 5, that is, arranged in two rows in the Y direction and in the X direction. It is a matrix of 4 rows.
而且，於2列4行之配置中，如圖4~圖6所示，亦具有於X方向相鄰之手單元46彼此之間距、即中心間距離不同之插口佈局組件45。圖4所示之插口佈局組件45係於X方向相鄰之手單元46彼此之間距最小者。圖6所示之插口佈局組件45係於X方向相鄰之手單元46彼此之間距 最大者。圖5所示之插口佈局組件45係於X方向相鄰之手單元46彼此之間距為上述最小與上述最大之間之中間者。再者，圖4~圖6所示之插口佈局組件45係於Y方向相鄰之手單元46彼此之間距均相同。 Further, in the arrangement of two rows and four rows, as shown in FIGS. 4 to 6, the socket layout unit 45 having the distance between the hand units 46 adjacent to each other in the X direction, that is, the distance between the centers is also different. The socket layout assembly 45 shown in FIG. 4 is the smallest distance between the hand units 46 adjacent in the X direction. The socket layout component 45 shown in FIG. 6 is located between the hand units 46 adjacent to each other in the X direction. The biggest one. The socket layout assembly 45 shown in Fig. 5 is such that the distance between the adjacent hand units 46 in the X direction is intermediate between the minimum and the maximum. Furthermore, the socket layout assembly 45 shown in FIGS. 4-6 is the same distance between the hand units 46 adjacent to each other in the Y direction.
又，除了2列4行之配置以外，還存在圖7~圖13所示之插口佈局組件45。 Further, in addition to the arrangement of two columns and four rows, the socket layout unit 45 shown in FIGS. 7 to 13 is also present.
圖7所示之插口佈局組件45係4個手單元46配置為於Y方向為2列、且於X方向為2行之矩陣狀。 The socket layout unit 45 shown in FIG. 7 has four hand units 46 arranged in a matrix of two rows in the Y direction and two rows in the X direction.
圖8所示之插口佈局組件45係6個手單元46配置為於Y方向為2列、且於X方向為3行之矩陣狀。 The socket layout unit 45 shown in FIG. 8 has six hand units 46 arranged in a matrix of two rows in the Y direction and three rows in the X direction.
圖9所示之插口佈局組件45係12個手單元46配置為於Y方向為2列、且於X方向為6行之矩陣狀。 The jack layout unit 45 shown in FIG. 9 has twelve hand units 46 arranged in a matrix of two rows in the Y direction and six rows in the X direction.
圖10所示之插口佈局組件45係16個手單元46配置為於Y方向為2列、且於X方向為8行之矩陣狀。 The socket layout unit 45 shown in FIG. 10 has 16 hand units 46 arranged in a matrix of two rows in the Y direction and eight rows in the X direction.
圖11所示之插口佈局組件45係4個手單元46配置為於Y方向為1列、且於X方向為4行之矩陣狀。 The socket layout unit 45 shown in FIG. 11 has four hand units 46 arranged in a matrix of one row in the Y direction and four rows in the X direction.
圖12所示之插口佈局組件45係8個手單元46配置為於Y方向為1列、且於X方向為8行之矩陣狀。 The jack layout unit 45 shown in FIG. 12 has eight hand units 46 arranged in a matrix of one row in the Y direction and eight rows in the X direction.
圖13所示之插口佈局組件45亦係8個手單元46配置為於Y方向為1列、且於X方向為8行之矩陣狀。再者，該插口佈局組件45中之各手單元46係其大小大於圖12所示之插口佈局組件45之各手單元46，又，偏向於基座47之寬度方向之一側即圖中之下側。 The jack layout unit 45 shown in FIG. 13 is also configured such that eight hand units 46 are arranged in a matrix of one row in the Y direction and eight rows in the X direction. Moreover, each of the hand units 46 in the socket layout assembly 45 is larger in size than the hand units 46 of the socket layout assembly 45 shown in FIG. 12, and is biased toward one side of the width direction of the base 47, that is, in the figure. Lower side.
如圖3所示，基座47係構成插口佈局組件45之構件中自下方側安裝於移動框架432者。 As shown in FIG. 3, the base 47 is a member of the socket layout assembly 45 that is attached to the moving frame 432 from the lower side.
該基座47由沿著X方向之橫長之板構件構成，且於其俯視下形成矩形。而且，基座47存在如下2種基座，即配置為2列m行(m為2、3、4、6、8)之手單元46用之基座47A(參照圖4~圖10)，及配置為1列m行(m 為4、8)之手單元46用之基座47B(參照圖11~圖13)。基座47A及47B均與「m」之大小無關而共通地使用。藉此，可實現零件之共通化，使得製造插口佈局組件45時之成本下降。 The base 47 is formed of a horizontally long plate member along the X direction, and is formed in a rectangular shape in plan view. Further, the susceptor 47 has two types of susceptors, that is, a pedestal 47A (see FIGS. 4 to 10) for the hand unit 46 arranged in two rows and m rows (m is 2, 3, 4, 6, and 8). And configured as 1 column m rows (m It is a base 47B for the hand unit 46 of 4, 8) (refer to FIG. 11 to FIG. 13). The pedestals 47A and 47B are used in common regardless of the size of "m". Thereby, the commonality of the parts can be achieved, so that the cost of manufacturing the socket layout component 45 is reduced.
再者，基座47係不管手單元46之配置數量或配置態樣如何，於設計插口佈局組件45時，預先設定即決定於基座47之俯視下相對於該基座47允許配置手單元46之最大區域即第1區域(按壓構件配置區域)A1(參照圖3)。於圖3中，於第1區域A1標註有影線。而且，於該第1區域A1內，可自由地選擇手單元46之配置數量或配置態樣，因此，插口佈局組件45之設計自由度提高。 Moreover, the base 47 is configured to allow the hand unit 46 to be disposed relative to the base 47 in a plan view of the base 47 regardless of the number or arrangement of the hand units 46. The largest area is the first area (pressing member arrangement area) A1 (see Fig. 3). In FIG. 3, hatching is indicated in the first area A1. Further, in the first region A1, the number of arrangement or arrangement of the hand units 46 can be freely selected, and therefore, the degree of freedom in designing the socket layout unit 45 is improved.
如圖4~圖12所示，於基座47之沿著X方向之兩側之緣部471分別等間隔地配置有3個缺損部472。該等缺損部472例如係用以防止基座47與其他構件之干涉者。再者，於圖13中省略缺損部472。 As shown in FIGS. 4 to 12, three defect portions 472 are disposed at equal intervals on the edge portions 471 on both sides of the susceptor 47 along the X direction. The missing portions 472 are used, for example, to prevent interference between the base 47 and other components. Further, the defect portion 472 is omitted in FIG.
又，於基座47之沿著Y方向之一側(圖4~圖13中為右側)之緣部473等間隔地配置有1個缺損部474。該缺損部474例如係用作向各手單元46連接之纜線之配線路徑之一部分。 Further, one defect portion 474 is disposed at equal intervals on the edge portion 473 of one side (the right side in FIGS. 4 to 13) of the susceptor 47 in the Y direction. This defect portion 474 is used, for example, as a part of a wiring path of a cable connected to each hand unit 46.
進而，於基座47，以4個為1組而設置有供用以將各手單元46固定於基座47之螺栓***之***孔475。 Further, in the base 47, four insertion holes 475 for inserting the respective hand units 46 to the base 47 are provided.
於各組之***孔475之附近設置有吸引用貫通孔479。吸引用貫通孔479係將吸附IC元件9之接觸塊461與使接觸塊461產生吸引力之噴射器(未圖示)連接之部分。 A suction through hole 479 is provided in the vicinity of the insertion hole 475 of each group. The suction through hole 479 is a portion that connects the contact block 461 of the adsorption IC element 9 to an ejector (not shown) that generates an attractive force to the contact block 461.
除此以外亦於基座47設置有多個貫通孔或凹部。以下，關於該情況，一面代表性地參照圖4一面進行說明。 In addition to this, a plurality of through holes or recesses are provided in the base 47. Hereinafter, this case will be described with reference to FIG. 4 as a representative.
如圖4所示，配置於基座47之中央部之升降用貫通孔476a係將使IC元件9與接觸塊461一起升降之上述升降機構與對該升降機構供給作動流體之供給源(未圖示)連接之部分。 As shown in FIG. 4, the lifting through hole 476a disposed at the center of the base 47 is a supply mechanism for supplying the operating fluid to the lifting mechanism by the lifting mechanism that raises and lowers the IC component 9 together with the contact block 461 (not shown). Show) the part of the connection.
隔著升降用貫通孔476a而於其兩側且偏向Y方向而配置之貫通孔 476b及476c係將插口佈局組件45安裝於移動框架432時之倒插防止用之貫通孔。貫通孔476b形成圓形，貫通孔476c形成長圓形。藉由該倒插防止，例如於將插口佈局組件45安裝於移動框架432時，即便欲將該插口佈局組件45以與圖4之方向不同而繞Z軸旋轉90度之狀態安裝，亦可阻止該安裝，從而可掌握安裝方向錯誤。又，例如於移動框架432配置有2個之情形時，若欲於一個移動框架432安裝插口佈局組件45但該安裝卻被阻止，則可掌握該插口佈局組件45應安裝於另一個移動框架432。如此，可對特定之移動框架432以正確之安裝方向安裝應安裝於該移動框架432之插口佈局組件45。 Through hole disposed on both sides of the lifting through hole 476a and biased in the Y direction 476b and 476c are through holes for preventing the insertion of the socket layout unit 45 when the frame 523 is moved. The through hole 476b is formed in a circular shape, and the through hole 476c is formed in an oblong shape. By the insertion preventing, for example, when the socket layout assembly 45 is attached to the moving frame 432, even if the socket layout assembly 45 is to be mounted in a state of being rotated by 90 degrees about the Z axis in a direction different from that of FIG. 4, it can be prevented. This installation makes it possible to grasp the wrong orientation of the installation. Moreover, for example, when two mobile frames 432 are arranged, if the socket layout component 45 is to be installed in one moving frame 432 but the installation is blocked, it can be grasped that the socket layout component 45 should be mounted to another moving frame 432. . As such, the socket layout assembly 45 that should be mounted to the moving frame 432 can be mounted to the particular moving frame 432 in the correct mounting orientation.
配置於貫通孔476b之與貫通孔476c相反之側之凹部476d係注入空氣等流體之部分。該凹部476d不貫通基座47。而且，藉由檢測注入至凹部476d之流體是否自該凹部476d漏出，而可判斷插口佈局組件45之新舊。例如，於檢測到流體漏出之情形時，判斷為插口佈局組件45為舊型者，且於未檢測到流體漏出之情形時，判斷為插口佈局組件45為新型者。所謂舊型與新型，例如係指構成插口佈局組件45之構件之構成材料不同。 The concave portion 476d disposed on the side opposite to the through hole 476c of the through hole 476b is injected with a portion of a fluid such as air. The recess 476d does not penetrate the base 47. Moreover, by detecting whether or not the fluid injected into the recess 476d leaks from the recess 476d, the new and old socket layout assembly 45 can be judged. For example, when the fluid leakage is detected, it is determined that the socket layout component 45 is the old type, and when the fluid leakage is not detected, it is determined that the socket layout component 45 is a novelty. The old type and the new type are, for example, different from the constituent materials of the members constituting the socket layout unit 45.
配置於貫通孔476c之與貫通孔476b相反之側之貫通孔476e例如係於將插口佈局組件45安裝於移動框架432之安裝狀態下，作為使自該移動框架432之下表面突出之螺釘之頭退避的退避部，即供***螺釘之頭之***部而發揮功能之部分。 The through hole 476e disposed on the side opposite to the through hole 476b of the through hole 476c is, for example, in a mounted state in which the socket layout assembly 45 is mounted to the moving frame 432 as a head of a screw protruding from the lower surface of the moving frame 432. The retracted portion that is retracted is a portion that functions by inserting the insertion portion of the head of the screw.
如圖3所示，基座47之最大長度(全長)Lmax較佳為100mm以上、400mm以下，更佳為200mm以上、300mm以下。基座47之最大寬度Wmax較佳為50mm以上、200mm以下，更佳為100mm以上、200mm以下。基座47之最大厚度Tmax較佳為4mm以上、10mm以下，更佳為6mm以上、8mm以下。 As shown in FIG. 3, the maximum length (full length) Lmax of the susceptor 47 is preferably 100 mm or more and 400 mm or less, more preferably 200 mm or more and 300 mm or less. The maximum width Wmax of the susceptor 47 is preferably 50 mm or more and 200 mm or less, and more preferably 100 mm or more and 200 mm or less. The maximum thickness Tmax of the susceptor 47 is preferably 4 mm or more and 10 mm or less, more preferably 6 mm or more and 8 mm or less.
作為基座47之構成材料，並無特別限定，例如可使用鋁或鋁合金 等各種金屬材料。 The constituent material of the susceptor 47 is not particularly limited, and for example, aluminum or aluminum alloy can be used. And various metal materials.
如圖14所示，手單元46具有：接觸塊461，其接觸於IC元件9；及散熱器462，其設置於接觸塊461。再者，於圖14中，代表性地描繪有1個手單元46。 As shown in FIG. 14, the hand unit 46 has a contact block 461 that is in contact with the IC component 9 and a heat sink 462 that is disposed on the contact block 461. Further, in FIG. 14, one hand unit 46 is representatively depicted.
接觸塊461係自上側接觸於IC元件9，且可於該接觸狀態下吸附IC元件9。藉此，可固持(吸附固持)IC元件9。又，手單元46亦具有使所固持之IC元件9與接觸塊461一起升降之升降機構(未圖示)。 The contact block 461 is in contact with the IC element 9 from the upper side, and the IC element 9 can be adsorbed in the contact state. Thereby, the IC element 9 can be held (adsorbed and held). Further, the hand unit 46 also has an elevating mechanism (not shown) for elevating and lowering the held IC element 9 together with the contact block 461.
散熱器462配置於接觸塊461上。該散熱器462具有多片散熱板463。 The heat sink 462 is disposed on the contact block 461. The heat sink 462 has a plurality of heat sinks 463.
又，於插口佈局組件45中，可將IC元件9冷卻，藉此，可將該IC元件9調整為適合檢查之溫度。該調整係如圖14所示，藉由具有多個向散熱板463噴出冷媒C之噴出口481之冷卻用構造體48而進行。若冷媒C接觸於散熱板463則散熱器462或接觸塊461被冷卻，隨之，IC元件9亦被冷卻。 Further, in the socket layout unit 45, the IC element 9 can be cooled, whereby the IC element 9 can be adjusted to a temperature suitable for inspection. This adjustment is performed by a cooling structure 48 having a plurality of discharge ports 481 for discharging the refrigerant C to the heat dissipation plate 463 as shown in FIG. 14 . If the refrigerant C contacts the heat dissipation plate 463, the heat sink 462 or the contact block 461 is cooled, and accordingly, the IC element 9 is also cooled.
作為冷媒C，並無特別限定，例如可使用壓縮空氣等流體。 The refrigerant C is not particularly limited, and for example, a fluid such as compressed air can be used.
又，冷媒C較佳為自基座47之寬度方向之中央部，即自內側向外側噴出。藉此，可防止用以將1個IC元件9冷卻之冷媒C將其他IC元件9自接觸塊461吹飛。 Further, the refrigerant C is preferably ejected from the center portion in the width direction of the susceptor 47, that is, from the inside to the outside. Thereby, the refrigerant C for cooling one IC element 9 can be prevented from blowing other IC elements 9 from the contact block 461.
而且，如圖3所示，於基座47設置有能夠流通冷媒C之圓形之連通孔477。連通孔477係於將插口佈局組件45安裝於移動框架432之安裝狀態下，與設置於移動框架432之框架側連通孔(安裝構件側連通孔)433連通。又，於框架側連通孔433之與連通孔477為相反側依序連接有接頭434、管435。藉此，可使自冷媒源(未圖示)流下之冷媒C依序經由管435、接頭434、框架側連通孔433、連通孔477而流向冷卻用構造體48。如此，連通孔477係作為與框架側連通孔433連接且供冷媒C流入之埠(連接口)而發揮功能。於圖3所示之構成中，接頭434係所謂之「直型」 者，但並不限定於此，亦可為所謂之「彎型(角型)」者。 Further, as shown in FIG. 3, a circular communication hole 477 through which the refrigerant C can flow is provided in the susceptor 47. The communication hole 477 is in communication with the frame side communication hole (mounting member side communication hole) 433 provided in the moving frame 432 in a mounted state in which the socket layout unit 45 is attached to the moving frame 432. Further, a joint 434 and a pipe 435 are sequentially connected to the frame side communication hole 433 on the opposite side to the communication hole 477. Thereby, the refrigerant C that has flowed down from the refrigerant source (not shown) can be sequentially flowed to the cooling structure 48 via the pipe 435, the joint 434, the frame side communication hole 433, and the communication hole 477. In this manner, the communication hole 477 functions as a weir (connection port) that is connected to the frame side communication hole 433 and that allows the refrigerant C to flow therein. In the configuration shown in FIG. 3, the joint 434 is a so-called "straight type". However, the present invention is not limited thereto, and may be a so-called "bend type (angular type)".
再者，連通孔477之下游側經由作為冷媒C通過之流路之管482而與冷卻用構造體48連接。又，於圖9、圖10所示之插口佈局組件45中，以管482於中途分支且對各手單元46吹送冷媒C之方式構成。 Further, the downstream side of the communication hole 477 is connected to the cooling structure 48 via a pipe 482 which is a flow path through which the refrigerant C passes. Further, in the socket layout unit 45 shown in FIGS. 9 and 10, the tube 482 is branched in the middle and the refrigerant C is blown to each of the hand units 46.
又，於圖7~圖9、圖11所示之插口佈局組件45中，未使用之連通孔477，即未連接管482之連通孔477例如被***插塞而堵住。因此，較佳為框架側連通孔433之設置數量多於連通孔477之設置數量。 Further, in the socket layout unit 45 shown in FIGS. 7 to 9 and 11, the unused communication hole 477, that is, the communication hole 477 in which the tube 482 is not connected, is inserted into the plug and blocked. Therefore, it is preferable that the number of the frame side communication holes 433 is larger than the number of the communication holes 477.
如圖4~圖13所示，即便於任一個插口佈局組件45中，連通孔477均係於基座47之四角，即於4個角部478附近分別配置有1對。而且，該配置區域於基座47之俯視下成為與第1區域A1不同之第2區域(連通孔配置區域)A2(參照圖3)。如此，基座47分為第1區域A1與第2區域A2。於第1區域A1中，於手單元46本身或其附近存在加熱器、真空吸盤、隨變機構等構造體，故而難以形成連通孔477。然而，藉由設定有第2區域A2，可容易地確保形成連通孔477。 As shown in FIGS. 4 to 13, even in any of the socket layout units 45, the communication holes 477 are attached to the four corners of the base 47, that is, one pair is disposed in the vicinity of the four corner portions 478. Further, the arrangement region is a second region (a communication hole arrangement region) A2 (see FIG. 3) different from the first region A1 in a plan view of the susceptor 47. In this manner, the susceptor 47 is divided into the first area A1 and the second area A2. In the first region A1, a structure such as a heater, a vacuum chuck, or a variable mechanism is present in the hand unit 46 itself or in the vicinity thereof, so that it is difficult to form the communication hole 477. However, by setting the second region A2, it is possible to easily ensure the formation of the communication hole 477.
又，藉由將各連通孔477配設於基座47之角部478附近，即配設於基座47中儘可能位於端部之第2區域A2，而可於手單元46相對於基座47裝卸時防止重新配管之作業變得繁雜。 Further, by arranging the communication holes 477 in the vicinity of the corner portion 478 of the susceptor 47, that is, in the second region A2 of the susceptor 47 as far as possible at the end portion, the hand unit 46 can be opposed to the pedestal 47 The work of preventing re-pipering during loading and unloading becomes complicated.
又，藉由防止配管作業之繁雜化，而防止管482彼此成為複雜地組裝之狀態，從而成為簡單之狀態。藉此，可將冷媒C適量地吹送至手單元46，因此，可準確地進行手單元46(IC元件9)之溫度控制。 Further, by preventing the piping from being complicated, the tubes 482 are prevented from being in a complicated state of being assembled, and the battery is in a simple state. Thereby, the refrigerant C can be appropriately blown to the hand unit 46, so that the temperature control of the hand unit 46 (IC element 9) can be accurately performed.
於各第2區域A2中，2個連通孔477沿著基座47之長度方向，即沿著X方向配置。藉此，可儘可能寬地確保第1區域A1，因此，選擇手單元46之配置數量或配置態樣而設計插口佈局組件45時之自由度進而提高。 In each of the second regions A2, the two communication holes 477 are arranged along the longitudinal direction of the susceptor 47, that is, along the X direction. Thereby, the first area A1 can be secured as wide as possible, and therefore, the degree of freedom in designing the socket layout unit 45 by selecting the number or arrangement of the hand units 46 is further improved.
藉由如以上之配置，基座47上之連通孔477於X方向配置4個，且於Y方向配置2個。而且，位於X方向之最近之連通孔477彼此之中心間 距離L1較佳為240mm±20mm，更佳為240mm±5mm(參照圖3)。位於X方向之最遠之連通孔477彼此之中心間距離L2較佳為260mm±20mm，更佳為260mm±5mm(參照圖3)。位於Y方向之連通孔477彼此之中心間距離W1較佳為93.5mm±20mm，更佳為93.5mm±5mm(參照圖3)。藉由此種數值範圍，而基座47係不管手單元46之配置數量或配置態樣如何均成為通用性較高者。 With the above arrangement, the communication holes 477 on the susceptor 47 are arranged in four in the X direction and two in the Y direction. Further, the distance L 1 between the centers of the nearest communication holes 477 located in the X direction is preferably 240 mm ± 20 mm, more preferably 240 mm ± 5 mm (refer to Fig. 3). 477 communication hole located in the center of each other X-direction furthest distance L 2 is preferably 260mm ± 20mm, more preferably 260mm ± 5mm (see FIG. 3). The distance W 1 between the centers of the communication holes 477 located in the Y direction is preferably 93.5 mm ± 20 mm, more preferably 93.5 mm ± 5 mm (refer to Fig. 3). With such a numerical range, the pedestal 47 is more versatile regardless of the number of configurations or the configuration of the hand unit 46.
如圖3(關於圖4~圖13亦相同)所示，於基座47，於將插口佈局組件45安裝於移動框架432之狀態下，設置有保持連通孔477之與框架側連通孔433之氣密性之密封構件(襯墊)49。各密封構件49於基座47之俯視下形成環狀，且以包圍對應之連通孔477之方式，即與對應之連通孔477同心地配置。藉此，可防止冷媒C自插口佈局組件45與移動框架432之間漏出。 As shown in FIG. 3 (the same applies to FIG. 4 to FIG. 13), the base 47 is provided with a communication hole 433 and a frame-side communication hole 433 in a state where the socket layout unit 45 is attached to the moving frame 432. A hermetic sealing member (pad) 49. Each of the sealing members 49 is formed in a ring shape in a plan view of the susceptor 47, and is disposed concentrically with the corresponding communication hole 477 so as to surround the corresponding communication hole 477. Thereby, it is possible to prevent the refrigerant C from leaking between the socket layout assembly 45 and the moving frame 432.
作為密封構件49之構成材料，並無特別限定，例如，可使用如矽酮橡膠等之各種橡膠材料。 The constituent material of the sealing member 49 is not particularly limited, and for example, various rubber materials such as an anthrone rubber can be used.
圖15係表示安裝於本發明之電子零件搬送裝置(第2實施形態)之搬送部之檢查機器人之插口佈局組件中之冷卻構造的立體圖。 FIG. 15 is a perspective view showing a cooling structure of the socket layout module of the inspection robot attached to the transport unit of the electronic component transport apparatus (second embodiment) of the present invention.
以下，參照該圖對本發明之電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置之第2實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。 In the following, the second embodiment of the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention will be described with reference to the drawings, and the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.
本實施形態除插口佈局組件之手單元之構成不同以外，與上述第1實施形態相同。 This embodiment is the same as the above-described first embodiment except that the configuration of the hand unit of the socket layout unit is different.
如圖15所示，於插口佈局組件45中，以可利用1個手單元46一次固持2個IC元件9並直接按壓之方式構成。 As shown in FIG. 15, in the socket layout unit 45, two IC elements 9 can be held by one hand unit 46 at a time and directly pressed.
又，於該插口佈局組件中，可將來自1個連通孔477之冷媒C用於2個IC元件9之冷卻。藉此，可省略上述圖9、圖10所示之插口佈局組件 45中之管482之分支，因此，可容易地進行管482之引繞即配管。 Further, in the socket layout assembly, the refrigerant C from one communication hole 477 can be used for cooling of the two IC elements 9. Thereby, the socket layout component shown in FIG. 9 and FIG. 10 can be omitted. The branch of the tube 482 in 45, therefore, the piping of the tube 482 can be easily performed.
圖16~圖18係分別表示本發明之電子零件搬送裝置(第3實施形態)之搬送部之檢查機器人之圖((a)為俯視圖，(b)為垂直剖視圖)。 16 to 18 are views showing the inspection robot of the transport unit of the electronic component transport apparatus (third embodiment) of the present invention ((a) is a plan view and (b) is a vertical cross-sectional view).
以下，參照該等圖對本發明之電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置之第3實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。 In the following, the third embodiment of the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention will be described with reference to the drawings, and the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted. .
本實施形態除形成於插口佈局組件之基座之連通孔之形狀不同以外，與上述第1實施形態相同。 This embodiment is the same as the above-described first embodiment except that the shape of the communication hole formed in the base of the socket layout unit is different.
如圖16~圖18所示，於插口佈局組件45之基座47中，2個連通孔477共有其大小(開口直徑)大於移動框架432之框架側連通孔433之大小之大開口部477a。藉此，於基座47之俯視下，大開口部477a包含框架側連通孔433。因此，不管框架側連通孔433之形成位置如何，均可使該框架側連通孔433與2個連通孔477連通。 As shown in FIGS. 16 to 18, in the base 47 of the socket layout unit 45, the two communication holes 477 share a large opening portion 477a whose size (opening diameter) is larger than the frame side communication hole 433 of the moving frame 432. Thereby, the large opening portion 477a includes the frame side communication hole 433 in a plan view of the susceptor 47. Therefore, regardless of the formation position of the frame side communication hole 433, the frame side communication hole 433 can be communicated with the two communication holes 477.
又，密封構件49於基座47之俯視下形成橢圓形狀(軌道形狀)，且於其內側配置有2個連通孔477。藉此，可利用1個密封構件49一次保持2個連通孔477之氣密性，因此，較之相對於各連通孔477分別設置密封構件49之情形，可容易構成插口佈局組件45。 Further, the sealing member 49 is formed in an elliptical shape (track shape) in a plan view of the susceptor 47, and two communication holes 477 are disposed inside the sealing member 49. Thereby, the airtightness of the two communication holes 477 can be maintained by one sealing member 49 at a time. Therefore, the socket layout assembly 45 can be easily formed as compared with the case where the sealing member 49 is provided for each of the communication holes 477.
再者，連通孔477與框架側連通孔433之大小關係，於本實施形態中為連通孔477大於框架側連通孔433，但並不限定於此，大小關係亦可顛倒，即，框架側連通孔433亦可大於連通孔477。 In addition, in the present embodiment, the communication hole 477 is larger than the frame side communication hole 433, but the connection hole 477 is larger than the frame side communication hole 433. However, the size relationship may be reversed, that is, the frame side is connected. The hole 433 may also be larger than the communication hole 477.
圖19係表示本發明之電子零件搬送裝置(第4實施形態)中之插口佈局組件之安裝過程的概略立體圖。 Fig. 19 is a schematic perspective view showing a process of mounting the socket layout unit in the electronic component conveying device (fourth embodiment) of the present invention.
以下，參照該圖對本發明之電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置之第4實施形態進行說明，以與上述實施形態之 不同點為中心進行說明，相同之事項省略其說明。 Hereinafter, a fourth embodiment of the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus according to the present invention will be described with reference to the drawings, and the above-described embodiment. The differences are described centering, and the same matters are omitted.
本實施形態除插口佈局組件向移動框架之安裝構成不同以外，與上述第1實施形態相同。 This embodiment is the same as the above-described first embodiment except that the socket layout component is different from the mounting structure of the moving frame.
如圖19所示，於本實施形態中，將基座47之各缺損部472作為設置鉤13或扣結件14(所謂之「拉式閂鎖」、「A拉式閂鎖」、「A彈簧鎖」，用英語則譯為「draw latch」、「A latch」、「A latch-lock」等)之母側構件141之設置部而使用。 As shown in Fig. 19, in the present embodiment, each of the defective portions 472 of the susceptor 47 is provided as a hook 13 or a fastening member 14 (so-called "pull latch", "A pull latch", "A" The spring lock is used in English as a setting portion of the female member 141 of "draw latch", "A latch", "A latch-lock" or the like.
鉤13係使金屬板彎曲變形為「L」字狀而成者。該鉤13設置、固定於6個缺損部472中之接近各角部478之缺損部472。又，母側構件141設置、固定於位於基座47之長度方向之中央部之缺損部472。作為各構件之固定方法，並無特別限定，例如可列舉利用螺絲固定之方法。 The hook 13 is formed by bending and deforming a metal plate into an "L" shape. The hook 13 is provided and fixed to the defect portion 472 of each of the six defect portions 472 which is close to each of the corner portions 478. Further, the female member 141 is provided and fixed to the defect portion 472 located at the central portion of the base 47 in the longitudinal direction. The fixing method of each member is not particularly limited, and examples thereof include a method of fixing by screws.
為了形成將插口佈局組件45安裝於移動框架432之安裝狀態，首先，如圖19(a)所示，使插口佈局組件45自圖中之左側接近並壓入於移動框架432。藉此，各鉤13可於預先設置於移動框架432之框架側鉤436上滑動，因此，可容易地進行插口佈局組件45之壓入作業。 In order to form the mounting state in which the socket layout assembly 45 is mounted to the moving frame 432, first, as shown in FIG. 19(a), the socket layout assembly 45 is brought close to and pressed into the moving frame 432 from the left side in the drawing. Thereby, each of the hooks 13 can be slid on the frame side hook 436 previously provided on the moving frame 432, so that the press-fitting operation of the socket layout unit 45 can be easily performed.
而且，若達到壓入界限，則如圖19(b)所示，插口佈局組件45之各鉤13與移動框架432之各框架側鉤436扣合。又，此時，預先設置於移動框架432、且作為扣結件14而與母側構件141成對之公側構件142與插口佈局組件45之母側構件141成為鎖定狀態。藉此，可維持插口佈局組件45之安裝狀態，即便移動框架432移動，亦可防止插口佈局組件45自該移動框架432脫離。 Further, when the press-in limit is reached, as shown in FIG. 19(b), the hooks 13 of the socket layout unit 45 are engaged with the frame side hooks 436 of the moving frame 432. Moreover, at this time, the male side member 142 which is previously provided in the moving frame 432 and which is paired with the female side member 141 as the fastening member 14 and the female side member 141 of the socket layout unit 45 are in a locked state. Thereby, the mounting state of the socket layout component 45 can be maintained, and even if the moving frame 432 is moved, the socket layout component 45 can be prevented from being detached from the moving frame 432.
再者，於X方向相鄰之鉤13彼此之間距，即中心間距離L3較佳為203.5mm±20mm，更佳為203.5mm±5mm。 Further, the distance between the hooks 13 adjacent to each other in the X direction, that is, the center-to-center distance L 3 is preferably 203.5 mm ± 20 mm, more preferably 203.5 mm ± 5 mm.
圖20係表示本發明之電子零件搬送裝置(第5實施形態)中之插口佈局組件之概略立體圖。 Fig. 20 is a schematic perspective view showing a socket layout unit in the electronic component conveying device (fifth embodiment) of the present invention.
以下，參照該圖對本發明之電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置之第5實施形態進行說明，以與上述實施形態之不同點為中心進行說明，相同之事項省略其說明。 In the following, the fifth embodiment of the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention will be described with reference to the drawings, and the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.
本實施形態除插口佈局組件具有蓋以外，與上述第4實施形態相同。 This embodiment is the same as the above-described fourth embodiment except that the socket layout unit has a cover.
如圖20所示，於本實施形態中，插口佈局組件45具有前蓋151、後蓋152、左側蓋153及右側蓋154。各蓋係將不鏽鋼等金屬製之板加工而成者，且藉由例如螺絲固定而固定於基座47。 As shown in FIG. 20, in the present embodiment, the socket layout unit 45 has a front cover 151, a rear cover 152, a left side cover 153, and a right side cover 154. Each of the covers is formed by processing a metal plate such as stainless steel, and is fixed to the base 47 by screwing, for example.
前蓋151係於自檢查裝置1之供給部2、回收部7側之正面觀察時位於該正面側之蓋。再者，於前蓋151形成有由缺損部而構成、且防止與上述第4實施形態中記載之鉤13或母側構件141之干涉之退避部151a。 The front cover 151 is a cover located on the front side when viewed from the front side of the supply unit 2 and the collection unit 7 side of the inspection apparatus 1. Further, the front cover 151 is formed with a retracting portion 151a that is configured by a defective portion and that prevents interference with the hook 13 or the female member 141 described in the fourth embodiment.
後蓋152係位於前蓋151之相反側，即位於檢查裝置1之背面側之蓋。於該後蓋152亦形成有與前蓋151之退避部151a相同之退避部(未圖示)。 The rear cover 152 is located on the opposite side of the front cover 151, that is, the cover on the back side of the inspection apparatus 1. A rear portion (not shown) similar to the relief portion 151a of the front cover 151 is also formed in the rear cover 152.
左側蓋153係位於檢查裝置1之左側(圖20中之左側)之蓋。於左側蓋153之下端部形成有朝向右側彎折之彎折部153a。 The left side cover 153 is a cover located on the left side (the left side in Fig. 20) of the inspection apparatus 1. A bent portion 153a bent toward the right side is formed at a lower end portion of the left side cover 153.
右側蓋154係位於檢查裝置1之右側(圖20中之右側)之蓋。於右側蓋154之下端部形成有朝向左側彎折之彎折部154a。 The right side cover 154 is a cover on the right side (the right side in Fig. 20) of the inspection apparatus 1. A bent portion 154a bent toward the left side is formed at a lower end portion of the right side cover 154.
藉由如此配置之各蓋，而可保護手單元46，並且可將利用該手單元46固持之IC元件9之溫度保持為固定。又，可限制引繞於基座47之下表面側之纜線或管等之撓曲。又，於固持未安裝狀態之插口佈局組件45時，可將手指放於彎折部153a、154a而固持、提昇。 The hand unit 46 can be protected by the cover thus configured, and the temperature of the IC component 9 held by the hand unit 46 can be kept constant. Further, the deflection of the cable or the tube or the like that is wound around the lower surface side of the base 47 can be restricted. Further, when the socket layout unit 45 in the unmounted state is held, the fingers can be placed on the bent portions 153a and 154a to be held and raised.
以上，對本發明之電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置之圖示之實施形態進行了說明，但本發明並不限定於此，構成電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置之各部可置換為可發揮相同功能之任意構成者。又，亦可附加任意之 構成物。 In the above, the embodiments of the electronic component conveying device, the electronic component inspection device, and the electronic component pressing device of the present invention have been described. However, the present invention is not limited thereto, and constitutes an electronic component conveying device, an electronic component inspection device, and an electronic device. Each part of the component pressing device can be replaced with any component that can perform the same function. Also, you can attach any Composition.
又，本發明之電子零件搬送裝置、電子零件檢查裝置及電子零件按壓裝置亦可為將上述各實施形態中之任意之2個以上之構成(特徵)組合而成者。 Further, the electronic component conveying device, the electronic component inspection device, and the electronic component pressing device of the present invention may be formed by combining two or more of the configurations (features) of any of the above embodiments.
又，於上述各實施形態中，固持部係以吸引空氣而吸附固持電子零件之方式構成，但並不限定於此，例如，亦能以夾入電子零件之方式固持。 Further, in each of the above-described embodiments, the holding portion is configured to suck and hold air to adsorb and hold the electronic component. However, the present invention is not limited thereto, and for example, it may be held by sandwiching the electronic component.
又，於一次檢查超過16個之(例如32個之)IC元件時，只要將圖10所示之插口佈局組件排列設置4個即可進行該檢查。 Further, when more than 16 (for example, 32) IC elements are inspected at a time, the inspection can be performed by arranging four socket layout components shown in FIG.
45‧‧‧插口佈局組件 45‧‧‧ socket layout components
46‧‧‧手單元(按壓構件) 46‧‧‧Hand unit (pressing member)
47‧‧‧基座(按壓構件配置構件) 47‧‧‧Base (pressing member configuration member)
47A‧‧‧基座(按壓構件配置構件) 47A‧‧‧Base (pressing member configuration member)
49‧‧‧密封構件(襯墊) 49‧‧‧ Sealing member (cushion)
471‧‧‧緣部 471‧‧‧Edge
472‧‧‧缺損部 472‧‧‧Defects Department
473‧‧‧緣部 473‧‧‧Edge
474‧‧‧缺損部 474‧‧‧Defects Department
475‧‧‧***孔 475‧‧‧ insertion hole
476a‧‧‧升降用貫通孔 476a‧‧‧Drilling through hole
476b‧‧‧貫通孔 476b‧‧‧through hole
476c‧‧‧貫通孔 476c‧‧‧through hole
476d‧‧‧凹部 476d‧‧‧ recess
476e‧‧‧貫通孔 476e‧‧‧through hole
477‧‧‧連通孔 477‧‧‧Connected holes
478‧‧‧角部 478‧‧‧ corner
479‧‧‧吸引用貫通孔 479‧‧‧Attraction through hole
482‧‧‧管 482‧‧‧ tube
Claims (18)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014240145A JP2016102683A (en) | 2014-11-27 | 2014-11-27 | Electronic component transportation device, electronic component inspection device and electronic component pressing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201620096A true TW201620096A (en) | 2016-06-01 |
| TWI600128B TWI600128B (en) | 2017-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104139019A TWI600128B (en) | 2014-11-27 | 2015-11-24 | Electronic parts conveying apparatus, electronic parts testing apparatus and electronic parts pressing apparatus |
| TW106127606A TW201743418A (en) | 2014-11-27 | 2015-11-24 | Electronic component conveying device, electronic component inspection device and electronic component pressing device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| TW106127606A TW201743418A (en) | 2014-11-27 | 2015-11-24 | Electronic component conveying device, electronic component inspection device and electronic component pressing device |
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| Country | Link |
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| JP (1) | JP2016102683A (en) |
| TW (2) | TWI600128B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI837360B (en) * | 2020-05-08 | 2024-04-01 | 鴻海精密工業股份有限公司 | Electronic component pin test mechanism |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201819931A (en) * | 2016-11-29 | 2018-06-01 | 日商精工愛普生股份有限公司 | Electronic parts conveying device and electronic parts inspection device capable of accurately and efficiently inspecting electronic parts |
-
2014
- 2014-11-27 JP JP2014240145A patent/JP2016102683A/en active Pending
-
2015
- 2015-11-24 TW TW104139019A patent/TWI600128B/en not_active IP Right Cessation
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI837360B (en) * | 2020-05-08 | 2024-04-01 | 鴻海精密工業股份有限公司 | Electronic component pin test mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016102683A (en) | 2016-06-02 |
| TW201743418A (en) | 2017-12-16 |
| TWI600128B (en) | 2017-09-21 |
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