TW201607680A

TW201607680A - Polishing method and holder

Info

Publication number: TW201607680A
Application number: TW104110245A
Authority: TW
Inventors: 大月伸悟; 浅野宏
Original assignee: 福吉米股份有限公司
Priority date: 2014-04-01
Filing date: 2015-03-30
Publication date: 2016-03-01
Also published as: CN104972387A; KR20150114408A; JP2015196224A; US20150306727A1

Abstract

A polishing method includes a polishing process of polishing a surface to be polished of an object by relatively rotating a holding fixture and a polishing pad with the surface to be polished of the object held on the holding fixture being pressed against and placed in contact with the polishing pad, while supplying a polishing composition onto the polishing pad. During the polishing process, the object held on the holding fixture turns around with the surface to be polished of the object facing the polishing pad to change the orientation of the object.

Description

研磨方法及保持具 Grinding method and holder

本發明係關於一種研磨方法、及該研磨方法所使用之保持具，該研磨方法具有：研磨步驟，係在將保持具所保持的研磨對象物之研磨面按壓在研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使保持具與前述研磨墊相對旋轉(relative rotation)來對研磨對象物的研磨面進行研磨。 The present invention relates to a polishing method and a holder for use in the polishing method, the polishing method having a polishing step in which a polishing surface of an object to be polished held by a holder is pressed against a polishing pad to be in contact with each other The polishing surface of the object to be polished is polished by relatively rotating the holder with the polishing pad while supplying the polishing composition onto the polishing pad.

習知技術中，為眾人所周知的研磨方法為：在將保持具所保持的研磨對象物之研磨面按壓在研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使保持具與研磨墊相對旋轉來對研磨對象物的研磨面進行研磨。該種類的研磨方法係使用單面研磨裝置或雙面研磨裝置來實施。例如，特開2011-253896號公報揭示有一種研磨方法，係使用單面研磨裝置來對半導體晶圓的單面進行研磨。另外，特開平7-156061號公報揭示有一種研磨方法，係使用雙面研磨裝置同時地對在雙面具有磁性膜的電腦用碟片基板的雙面進行研磨。 In the conventional art, a polishing method which is well known to the public is: when the polishing surface of the object to be polished held by the holder is pressed against the polishing pad to be in contact with the polishing pad, the polishing composition is supplied onto the polishing pad. The polishing surface of the object to be polished is polished while rotating the holder and the polishing pad. This type of polishing method is carried out using a single-side polishing apparatus or a double-side polishing apparatus. For example, JP-A-2011-253896 discloses a polishing method in which a single-sided polishing apparatus is used to polish one surface of a semiconductor wafer. In addition, Japanese Laid-Open Patent Publication No. H7-156061 discloses a polishing method which simultaneously uses a double-side polishing apparatus to simultaneously have a magnetic film on both sides. The computer is polished on both sides of the disc substrate.

以下，依據第12圖A及第12圖B來說明關於單面研磨裝置的構造、及使用該單面研磨裝置之習知技術的研磨方法。如第12圖A所示，單面研磨裝置10係具備：定盤11，以朝垂直方向延伸的轉軸為中心進行旋轉，並且在該定盤11的上面貼附有研磨墊12。研磨墊12上配置有：複數個保持具13，其各自具備以朝垂直方向延伸的轉軸P1為中心進行旋轉的研磨頭14。如第12圖B所示，在各保持具13的研磨頭14的下面，係將複數個(3個)研磨對象物W保持成使研磨面朝向下側的狀態。各保持具13所保持的研磨對象物W係以研磨頭14的轉軸P1為中心而沿著圓周方向排列。 Hereinafter, a structure of a single-side polishing apparatus and a polishing method using a conventional technique using the single-side polishing apparatus will be described based on FIG. 12A and FIG. 12B. As shown in FIG. 12A, the single-sided polishing apparatus 10 includes a fixed disk 11 that rotates around a rotating shaft that extends in the vertical direction, and a polishing pad 12 is attached to the upper surface of the fixed plate 11. The polishing pad 12 is provided with a plurality of holders 13 each having a polishing head 14 that rotates about a rotation axis P1 extending in the vertical direction. As shown in FIG. 12B, on the lower surface of the polishing head 14 of each holder 13, a plurality of (three) polishing objects W are held in a state in which the polishing surface faces downward. The object to be polished W held by each of the holders 13 is arranged in the circumferential direction around the rotation axis P1 of the polishing head 14.

如第12圖A所示，在將保持於保持具13的研磨頭14的下面之研磨對象物W按壓在研磨墊12使其接觸的狀態下，藉由一邊將研磨用組成物15供給至研磨墊12上，一邊使定盤11及保持具13的研磨頭14各別以預定的旋轉次數進行旋轉。藉此，利用研磨墊12及研磨用組成物15來對保持具13所保持的研磨對象物W之研磨面進行研磨。 As shown in FIG. 12A, the polishing object W is placed on the lower surface of the polishing head 14 held by the holder 13 while being pressed against the polishing pad 12, and the polishing composition 15 is supplied to the polishing. On the pad 12, the fixed head 11 and the polishing head 14 of the holder 13 are each rotated by a predetermined number of rotations. Thereby, the polishing surface of the polishing object W held by the holder 13 is polished by the polishing pad 12 and the polishing composition 15 .

然而，在上述使用習知技術的研磨方法的情況下，會有在研磨對象物之研磨面產生研磨不均之情事。具體而言，如第12圖B所示，會有下述情事：相對於離研磨頭 14的轉軸P1較遠側的部位B(位在外側的部位)之研磨量，離研磨頭14的轉軸P1較近側的部位A(位在內側的部位)之研磨量會變得較少。 However, in the case of using the polishing method of the prior art described above, uneven polishing may occur on the polished surface of the object to be polished. Specifically, as shown in Fig. 12B, there is the following situation: relative to the polishing head The amount of polishing of the portion B (the portion located on the outer side) on the far side of the rotating shaft P1 of 14 is less than the amount of polishing of the portion A (the portion located on the inner side) closer to the rotation axis P1 of the polishing head 14 .

認為造成上述問題的原因應該是：供給至研磨對象物W的研磨面之研磨用組成物15。亦即，在進行研磨時，由於研磨頭14係以轉軸P1為中心進行旋轉，所以供給至研磨墊12上的研磨用組成物15會從研磨頭14的外周側進入研磨對象物W與研磨墊12之間，而朝向研磨頭14的徑向內側流去。因此，在研磨對象物W中，對於位在研磨頭14的徑向外側之部位B係利用全新的研磨用組成物15來進行研磨。另一方面，對於位在徑向內側之部位A則是利用不是全新的研磨用組成物15來進行研磨。上述不是全新的研磨用組成物15係用於對位在徑向外側之部位B進行研磨而使得研磨粒等產生消耗。如上所述，可認為用於對研磨對象物W的各部位進行研磨的研磨用組成物15之消耗程度的不同(亦即，研磨用組成物15是新還是舊)，會是造成每個部位的研磨量相異的其中一個原因。再者，上述研磨不均的問題並不限於使用單面研磨裝置的研磨方法，在使用雙面研磨裝置的研磨方法也同樣會產生。 It is considered that the cause of the above problem is the polishing composition 15 supplied to the polishing surface of the object to be polished W. In other words, when the polishing head 14 rotates around the rotation axis P1, the polishing composition 15 supplied to the polishing pad 12 enters the polishing object W and the polishing pad from the outer peripheral side of the polishing head 14 . Between 12, it flows toward the radially inner side of the polishing head 14. Therefore, in the object to be polished W, the new polishing composition 15 is used for polishing the portion B located on the radially outer side of the polishing head 14. On the other hand, the portion A located on the radially inner side is polished by using the polishing composition 15 which is not entirely new. The above-described new polishing composition 15 is not used for polishing the portion B located radially outward, so that the abrasive grains and the like are consumed. As described above, it is considered that the degree of consumption of the polishing composition 15 for polishing each part of the object to be polished W (that is, whether the polishing composition 15 is new or old) causes each part to be caused. One of the reasons for the difference in the amount of grinding. Further, the problem of uneven polishing described above is not limited to the polishing method using a single-side polishing apparatus, and the polishing method using a double-side polishing apparatus also occurs.

本發明係有鑑於上述實情而開發完成者，其目的為：提供一種能夠抑制研磨不均產生的研磨方法、及保持具。 The present invention has been developed in view of the above circumstances, and an object thereof is to provide a polishing method and a holder which can suppress occurrence of uneven polishing.

為了達成上述目的，在本發明的其中一個態樣中，提供一種研磨方法，其具有：研磨步驟，係在將保持具所保持的研磨對象物之研磨面按壓在研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使前述保持具與前述研磨墊相對旋轉來對前述研磨對象物的研磨面進行研磨。在前述研磨步驟中，前述保持具所保持的前述研磨對象物係維持在使前述研磨對象物的研磨面與前述研磨墊呈對向的狀態下進行旋轉，並且變更前述研磨對象物的面向。 In order to achieve the above object, in one aspect of the present invention, there is provided a grinding method having: a grinding step, which is secured by a holder When the polishing surface of the object to be polished is pressed against the polishing pad, the polishing composition is supplied to the polishing pad, and the holder and the polishing pad are relatively rotated to the object to be polished. The ground surface is ground. In the polishing step, the object to be polished held by the holder is rotated while the polishing surface of the object to be polished is opposed to the polishing pad, and the surface of the object to be polished is changed.

前述研磨步驟係包含下述操作為佳：在暫時停止對前述研磨對象物的研磨面進行研磨之操作來變更前述研磨對象物的面向之後，再次開始對前述研磨對象物的研磨面進行研磨。 In the polishing step, it is preferable to perform the operation of polishing the polishing surface of the object to be polished to temporarily change the surface of the object to be polished, and then to polish the polishing surface of the object to be polished again.

前述研磨對象物係前述保持具所保持的複數個研磨對象物中的一個為佳。 It is preferable that the object to be polished is one of a plurality of polishing objects held by the holder.

前述研磨對象物的研磨面亦可是曲面狀。該情況下，係將前述研磨對象物按壓在前述研磨墊，一邊使前述研磨墊變形成為順應曲面狀的研磨面之形狀，一邊對前述研磨對象物的研磨面進行研磨為佳。 The polishing surface of the object to be polished may be curved. In this case, it is preferable to polish the polishing surface of the object to be polished while pressing the polishing pad against the polishing pad and deforming the polishing pad into a shape corresponding to a curved surface.

前述研磨對象物的研磨面亦可是由複數個面所組成。該情況下，係將前述研磨對象物按壓在前述研磨墊，一邊使前述研磨墊變形成為順應前述由複數個面所組成的研磨面之形狀，一邊對前述研磨對象物的研磨面進行研磨為佳。 The polished surface of the object to be polished may be composed of a plurality of faces. In this case, the polishing target is pressed against the polishing pad, and the polishing pad is deformed so as to conform to the shape of the polishing surface composed of the plurality of surfaces, and the polishing surface of the polishing object is preferably polished. .

在前述保持具與前述研磨對象物之間配置間隔件使得前述研磨對象物的研磨面朝向前述研磨墊突出的狀態下，進行前述研磨步驟為佳。 a spacer is disposed between the holder and the polishing target so that the polishing surface of the polishing object protrudes toward the polishing pad, It is preferred to carry out the aforementioned grinding step.

為了達成上述目的，在本發明的另一個態樣中，係提供一種研磨方法所使用的保持具，該研磨方法係將保持具所保持的研磨對象物之研磨面按壓在研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使前述保持具與前述研磨墊相對旋轉來對前述研磨對象物的研磨面進行研磨。前述保持具係具備：研磨頭，用以保持前述研磨對象物；以及旋轉機構，將前述研磨對象物的研磨面維持在與前述研磨墊呈對向的狀態下，使前述研磨頭所保持的前述研磨對象物進行旋轉，並且變更前述研磨對象物的面向。 In order to achieve the above object, in another aspect of the present invention, a holder for use in a polishing method for pressing a polishing surface of an object to be polished held by a holder against a polishing pad is provided. In the state, the polishing composition is polished by rotating the composition to the polishing pad while rotating the holder and the polishing pad. The holder includes: a polishing head for holding the object to be polished; and a rotation mechanism that maintains the polishing surface of the object to be polished in a state of being opposed to the polishing pad to hold the polishing head The object to be polished is rotated, and the surface of the object to be polished is changed.

前述旋轉機構係具備：供前述研磨對象物固定的旋轉台為佳。 The rotation mechanism preferably includes a rotary table to which the polishing target is fixed.

前述保持具係進一步地具備間隔件為佳，其係配置在前述旋轉台與前述研磨對象物之間，使得前述研磨對象物的研磨面朝向研磨墊突出。 It is preferable that the holder further includes a spacer disposed between the rotary table and the polishing target such that a polishing surface of the polishing target protrudes toward the polishing pad.

前述旋轉台係設置成：從前述研磨頭朝向前述研磨墊突出為佳。 The rotary table is preferably formed to protrude from the polishing head toward the polishing pad.

前述研磨頭係構成為：能夠保持複數個研磨對象物為佳。 The polishing head is preferably configured to hold a plurality of polishing objects.

本發明的其他態樣及優點可以由表示本發明的原理之例子的圖式與以下記載而清楚地得知。 Other aspects and advantages of the invention will be apparent from the description of the embodiments of the invention.

10‧‧‧單面研磨裝置 10‧‧‧Single-sided grinding device

11‧‧‧定盤 11‧‧ ‧ fixing

12‧‧‧研磨墊 12‧‧‧ polishing pad

13‧‧‧保持具 13‧‧‧Holding

14‧‧‧研磨頭 14‧‧‧ polishing head

15‧‧‧研磨用組成物 15‧‧‧Finishing composition

21‧‧‧插通孔 21‧‧‧ inserted through hole

22‧‧‧收容凹部 22‧‧‧ containment recess

23‧‧‧轉軸 23‧‧‧ shaft

24‧‧‧旋轉台 24‧‧‧Rotating table

25‧‧‧操作構件 25‧‧‧Operating components

26‧‧‧馬達 26‧‧‧Motor

30‧‧‧間隔件 30‧‧‧ spacers

A‧‧‧部位 A‧‧‧ parts

B‧‧‧部位 B‧‧‧ parts

P1‧‧‧轉軸 P1‧‧‧ shaft

P2‧‧‧軸線 P2‧‧‧ axis

W‧‧‧研磨對象物 W‧‧‧ Grinding objects

W1‧‧‧研磨面 W1‧‧‧Grinding surface

W2‧‧‧研磨面 W2‧‧‧Grinding surface

W3‧‧‧研磨面 W3‧‧‧Grinding surface

W3a‧‧‧面 W3a‧‧‧

W3b‧‧‧面 W3b‧‧‧

W3c‧‧‧面 W3c‧‧‧

WA‧‧‧部位 WA‧‧‧ parts

WB‧‧‧部位 WB‧‧‧ parts

WC‧‧‧部位 WC‧‧‧ parts

Ws‧‧‧側面 Ws‧‧‧ side

第1圖A、第1圖B及第1圖C係研磨對象物的研磨面之說明圖。 Fig. 1A, Fig. 1B, and Fig. 1C are explanatory views of the polishing surface of the object to be polished.

第2圖係保持具的側面圖及部分剖面圖。 Figure 2 is a side view and a partial cross-sectional view of the holder.

第3圖係表示將研磨對象物按壓在研磨墊使其接觸的狀態之剖面圖。 Fig. 3 is a cross-sectional view showing a state in which an object to be polished is pressed against a polishing pad.

第4圖A、第4圖B、第4圖C及第4圖D係用以說明研磨步驟中的研磨對象物之面向的圖式。 4A, 4B, 4C, and 4D are diagrams for explaining the surface of the object to be polished in the polishing step.

第5圖係具備旋轉機構的保持具之說明圖。 Fig. 5 is an explanatory view of a holder having a rotating mechanism.

第6圖係具備旋轉機構的保持具之說明圖。 Fig. 6 is an explanatory view of a holder having a rotating mechanism.

第7圖係保持具及間隔件的說明圖。 Figure 7 is an explanatory view of the holder and the spacer.

第8圖係具備旋轉機構的保持具及間隔件之說明圖。 Fig. 8 is an explanatory view of a holder and a spacer having a rotating mechanism.

第9圖係具備旋轉機構的保持具之說明圖。 Fig. 9 is an explanatory view of a holder having a rotating mechanism.

第10圖A、第10圖B及第10圖C係研磨對象物的研磨面之說明圖。 Fig. 10A, Fig. 10B, and Fig. 10C are explanatory views of the polishing surface of the object to be polished.

第11圖A及第11圖B係實施例的說明圖。 11A and 11B are explanatory views of the embodiment.

第12圖A係研磨方法及單面研磨裝置之說明圖。 Fig. 12A is an explanatory view of a polishing method and a single-side polishing apparatus.

第12圖B係保持具的下視圖。 Figure 12B is a bottom view of the holder.

以下，說明本發明的一實施方式。 Hereinafter, an embodiment of the present invention will be described.

首先，說明關於藉由本實施方式的研磨方法對其實施研磨的研磨對象物W。 First, an object to be polished W to be polished by the polishing method of the present embodiment will be described.

作為研磨對象物W係能夠使用：金屬、合成樹脂、陶瓷、及由上述的複合品所組成者。作為上述金屬的例子係能夠例舉：鎂、鋁、鈦、鐵、鎳、鈷、銅、鋅、錳、及以上述金屬中的至少一種為主成分之合金。作為上述合成樹脂的例子係能夠例舉：例如，酚樹脂、環氧樹脂、胺基甲酸乙酯樹脂、聚醯亞胺等的熱硬化性樹脂，或聚乙烯、聚丙烯、丙烯酸樹脂等的熱可塑性樹脂。作為上述陶瓷的例子除了例如，陶磁器、玻璃、精密陶瓷之外，係能夠例舉：矽、鋁、鋯、鈣、鋇等的氧化物、炭化物、氮化物、硫化物。 As the object to be polished W, a metal, a synthetic resin, a ceramic, and a composite product as described above can be used. As an example of the above metal Examples of the alloy include magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese, and an alloy containing at least one of the above metals as a main component. Examples of the synthetic resin include, for example, a thermosetting resin such as a phenol resin, an epoxy resin, a urethane resin, or a polyimide, or a heat of polyethylene, polypropylene, or acrylic resin. Plastic resin. Examples of the ceramics include, for example, ceramics, glass, and precision ceramics, such as oxides, carbides, nitrides, and sulfides of cerium, aluminum, zirconium, calcium, and cerium.

並未特別地限制研磨對象物W的外形形狀，亦可為三角形或四角形等的多角形狀、圓形、橢圓形、環狀等的任何形狀。 The outer shape of the object to be polished W is not particularly limited, and may be any shape such as a polygonal shape such as a triangle or a quadrangle, a circular shape, an elliptical shape, or a ring shape.

並且，研磨對象物W係具備：研磨面，作為其中一面對其實施研磨。關於該研磨面的形狀也並未特別地限定。具體而言，如第1圖A所示，研磨對象物W亦可係具有平坦狀的研磨面W1者。或者是，如第1圖B所示，研磨對象物W係具有一部分或整體形成為曲面形狀的研磨面W2者也可以。該情況下，研磨面W2亦可是朝向外側形成為凸狀的曲面形狀，朝向內側形成為凸狀的曲面形狀也可以，或是組合上述形狀而成的形狀亦可。或者是，研磨對象物W，如第1圖C所示，係具有由複數個面W3a、W3b、W3c所組成的研磨面W3者也可以。該情況下，研磨面W3亦可是朝向外側形成為凸狀的多面形狀，朝向內側形成為凸狀的多面形狀也可以，或是組合上述形狀而成的形狀亦可。另外，構成研磨面W3的面中的一個或複數個面為曲面形狀亦可。又，構成研磨面W3的面之數量亦可在2個以上。 Further, the object to be polished W is provided with a polishing surface, and is polished as one of the surfaces. The shape of the polished surface is also not particularly limited. Specifically, as shown in FIG. 1A, the object to be polished W may be a flat polishing surface W1. Alternatively, as shown in FIG. 1B, the object to be polished W may have a polishing surface W2 which is partially or entirely formed into a curved shape. In this case, the polishing surface W2 may have a curved shape that is convex toward the outside, and may have a curved shape that is convex toward the inside, or may have a shape in which the shape is combined. Alternatively, as shown in FIG. 1C, the object to be polished W may have a polishing surface W3 composed of a plurality of faces W3a, W3b, and W3c. In this case, the polishing surface W3 may have a multi-faceted shape that is formed in a convex shape toward the outside, and may have a multi-faceted shape that is formed in a convex shape toward the inside, or may have a shape in which the above-described shapes are combined. In addition, one of the faces constituting the polishing surface W3 Or a plurality of faces may be curved shapes. Moreover, the number of the surfaces constituting the polishing surface W3 may be two or more.

其次，說明關於本實施方式的研磨方法所使用的研磨裝置。 Next, a polishing apparatus used in the polishing method of the present embodiment will be described.

本實施方式的研磨方法，係能夠使用第12圖A及第12圖B所示的習知技術之單面研磨裝置10。單面研磨裝置10係具備：定盤11，以朝垂直方向延伸的轉軸為中心進行旋轉。定盤11係與未圖示的馬達連結，而接收馬達的驅動來進行旋轉。 In the polishing method of the present embodiment, the single-sided polishing apparatus 10 of the prior art shown in FIGS. 12A and 12B can be used. The single-sided polishing apparatus 10 includes a fixed disk 11 that rotates around a rotating shaft that extends in the vertical direction. The fixed plate 11 is coupled to a motor (not shown) and receives the drive of the motor for rotation.

在該定盤11的上面貼附有研磨墊12。研磨墊12係能夠因應研磨對象物W的材質、或研磨對象物W的研磨面之形狀等，而任意地使用適合對研磨對象物W的研磨面進行研磨的種類。研磨墊12係具有能夠均一地抵接於研磨對象物W的研磨面整體之表面形狀為佳。在相同的觀點下，研磨墊12的厚度或硬度也可適當地進行設定。 A polishing pad 12 is attached to the upper surface of the platen 11. The polishing pad 12 can arbitrarily use a type suitable for polishing the polishing surface of the polishing object W in accordance with the material of the polishing object W or the shape of the polishing surface of the polishing object W. It is preferable that the polishing pad 12 has a surface shape that can uniformly abut the entire polishing surface of the object to be polished W. From the same viewpoint, the thickness or hardness of the polishing pad 12 can also be appropriately set.

作為研磨墊12的材質之具體例係例舉：例如，織物、不織布、不織布的樹脂加工品、合成皮革、合成樹脂發泡體、以及上述材質之複合品等。另外，亦可是僅由上述具體例中的一種所形成的研磨墊12，或是組合複數種而形成的研磨墊12也可以。 Specific examples of the material of the polishing pad 12 include a woven fabric, a nonwoven fabric, a non-woven resin processed product, a synthetic leather, a synthetic resin foam, and a composite of the above materials. Further, the polishing pad 12 formed of only one of the above specific examples or the polishing pad 12 formed by combining a plurality of types may be used.

雖然並無特別地限定研磨墊12的硬度，但在研磨對象物W的研磨面為非平面形狀的情況下，例如在由曲面形狀或複數個面所組成的多面形狀的情況下，研磨墊12的蕭氏A硬度係在5以上為佳。研磨墊12的蕭氏A硬度係使研磨墊12在濕度為20~60%的乾燥狀態下放置於室溫60分鐘以上之後，能夠使用日本工業規格JIS K6253為基準的橡膠硬度計(A型)來進行測量。 Although the hardness of the polishing pad 12 is not particularly limited, in the case where the polishing surface of the polishing object W is a non-planar shape, for example, in the case of a multi-faceted shape composed of a curved shape or a plurality of faces, the polishing pad 12 The Shore A hardness is preferably 5 or more. Shore A hardness of the polishing pad 12 After the polishing pad 12 is allowed to stand at room temperature for 60 minutes or more in a dry state having a humidity of 20 to 60%, it can be measured using a rubber hardness meter (type A) based on Japanese Industrial Standard JIS K6253.

在如第12圖A所示的單面研磨裝置10中，研磨墊12上配置有：複數個保持具13，其各自具備以朝垂直方向延伸的轉軸P1為中心進行旋轉的研磨頭14。研磨頭14係與未圖示的馬達連結，而接收馬達的驅動來進行旋轉。 In the single-sided polishing apparatus 10 shown in FIG. 12A, the polishing pad 12 is provided with a plurality of holders 13 each having a polishing head 14 that rotates around a rotation axis P1 extending in the vertical direction. The polishing head 14 is coupled to a motor (not shown) and receives the drive of the motor to rotate.

如第12圖B所示，在各研磨頭14的下面，將複數個研磨對象物W保持成使研磨面朝向下側(外側)的狀態。另外，雖然省略圖式，但在各研磨頭14的下面設置有：藉由能夠嵌合各研磨對象物W的凹部、或對研磨對象物W進行真空吸附的機構所構成的保持部，並且藉由上述保持部來保持研磨對象物W。又，保持在研磨頭14的下面之研磨對象物W係以研磨頭14的轉軸P1為中心而沿著圓周方向排列。 As shown in FIG. 12B, on the lower surface of each polishing head 14, a plurality of polishing objects W are held in a state in which the polishing surface faces the lower side (outer side). Further, although the drawings are omitted, a holding portion including a concave portion capable of fitting each of the polishing objects W or a mechanism for vacuum-adsorbing the polishing target W is provided on the lower surface of each of the polishing heads 14, and The object to be polished W is held by the holding portion. Moreover, the object to be polished W held under the polishing head 14 is arranged in the circumferential direction around the rotation axis P1 of the polishing head 14.

其次，說明關於本實施方式的研磨方法。在此，係說明關於對如第1圖B所示的研磨對象物W進行研磨的情況，該研磨對象物W具體而言係具有曲面形狀的研磨面W2，且具有正方形的外形形狀。 Next, the polishing method of the present embodiment will be described. Here, the case where the polishing object W shown in FIG. 1B is polished is described. Specifically, the polishing object W has a curved surface of the polishing surface W2 and has a square outer shape.

如第2圖及第12圖B所示，相對於保持具13的研磨頭14的下面，係將3個研磨對象物W保持成使研磨面W2朝向下側。之後，使保持具13朝向研磨墊12下降，將保持在研磨頭14的下面之研磨對象物W的研磨面W2按壓在研磨墊12使其接觸。 As shown in FIG. 2 and FIG. 12B, the three polishing objects W are held so that the polishing surface W2 faces the lower side with respect to the lower surface of the polishing head 14 of the holder 13. Thereafter, the holder 13 is lowered toward the polishing pad 12, and the polishing surface W2 of the polishing object W held under the polishing head 14 is pressed against the polishing pad 12 to be in contact with each other.

此時，如第3圖所示，研磨墊12會因為被曲面形狀的研磨面W2按壓而變形成順應研磨面W2的形狀。該結果，會使研磨面W2整體與研磨墊12接觸。換句話說，係施加荷重(研磨荷重)使保持具13下降直到研磨墊12變形成順應研磨面W2的形狀而與研磨面W2整體接觸為止。又，在第2圖及第3圖中係省略定盤11。 At this time, as shown in FIG. 3, the polishing pad 12 is deformed into a shape conforming to the polishing surface W2 by being pressed by the curved surface W2. As a result, the entire polishing surface W2 is brought into contact with the polishing pad 12. In other words, the load (grinding load) is applied to lower the holder 13 until the polishing pad 12 is deformed into a shape conforming to the polishing surface W2 to be in overall contact with the polishing surface W2. Further, in the second and third figures, the fixed disk 11 is omitted.

接著，如第12圖A所示，藉由一邊將研磨用組成物15供給至研磨墊12上，一邊使定盤11及保持具13的研磨頭14各別以預定的旋轉次數進行旋轉。藉此，藉由在使貼附在定盤11上的研磨墊12、及保持在保持具13的研磨頭14的研磨對象物W相互地呈密合的狀態下進行相對旋轉，來利用研磨墊12及研磨用組成物15對研磨對象物W的研磨面W2進行研磨(研磨步驟)。 Next, as shown in FIG. 12A, the polishing head 14 and the polishing head 14 of the holder 13 are each rotated by a predetermined number of rotations while the polishing composition 15 is supplied onto the polishing pad 12. By using the polishing pad in the state in which the polishing pad 12 attached to the fixed disk 11 and the polishing target W held by the polishing head 14 of the holder 13 are in close contact with each other, the polishing pad is used. 12 and the polishing composition 15 polish the polishing surface W2 of the polishing object W (polishing step).

作為研磨用組成物15是公眾所知的研磨用組成物，具體而言係能夠使用：主要是含有研磨粒或水的拋光液(polishing fluid)、研磨液(lapping fluid)、以及切削液等的加工液體。作為研磨粒的例子係例舉：氧化鋁、矽石、氧化鈰、金剛石、碳化矽。研磨用組成物15，亦可是僅含有上述研磨粒中的一種，或是含有複數種種類的研磨粒也可以。另外，研磨用組成物15亦可含有：界面活性劑、高分子材料、pH調節劑、飛散抑制劑、增黏劑、氧化還原劑等的其他成分。 The polishing composition 15 is a polishing composition known to the public, and specifically, a polishing liquid, a lapping fluid, a cutting fluid, or the like which mainly contains abrasive grains or water can be used. Processing liquid. Examples of the abrasive grains include alumina, vermiculite, cerium oxide, diamond, and tantalum carbide. The polishing composition 15 may contain only one of the above-mentioned abrasive grains or may contain a plurality of types of abrasive grains. Further, the polishing composition 15 may contain other components such as a surfactant, a polymer material, a pH adjuster, a scattering inhibitor, a tackifier, and a redox agent.

並無特別地限制上述研磨步驟中的各種條件，而是能夠因應研磨對象物W的材質或形狀等來適當地進行設定。例如，供給至研磨墊12上的研磨用組成物15的流量係在10ml/分以上為佳。另外，定盤11及保持具13的研磨頭14之旋轉次數係使在研磨對象物W的研磨面之線速度形成在10m/分~300m/分的範圍之旋轉次數為佳。又，研磨荷重係在研磨對象物W的研磨面之每單位面積形成在0.05kg/cm²~10kg/cm²為佳。 The various conditions in the polishing step are not particularly limited, and can be appropriately set in accordance with the material or shape of the object W to be polished. For example, the flow rate of the polishing composition 15 supplied onto the polishing pad 12 is preferably 10 ml/min or more. In addition, the number of rotations of the polishing head 14 of the fixed plate 11 and the holder 13 is preferably such that the linear velocity of the polishing surface of the polishing object W is in the range of 10 m/min to 300 m/min. Further, the polishing load is preferably 0.05 kg/cm ² to 10 kg/cm ² per unit area of the polishing surface of the object to be polished W.

並且，本實施方式的研磨方法於進行研磨步驟中，在經過預先設定的預定時間之時間點時，會暫時停止一邊將研磨用組成物15供給至研磨墊12上，一邊使研磨對象物W與研磨頭14相對旋轉之操作(亦即，研磨操作)，而進行變更保持在保持具13的研磨頭14之研磨對象物W的面向之操作。 In the polishing method of the present embodiment, when the polishing step is performed, when the polishing composition 15 is temporarily stopped, the polishing composition 15 is temporarily supplied to the polishing pad 12, and the polishing object W and the polishing target W are temporarily stopped. The operation of changing the surface of the polishing object W held by the polishing head 14 of the holder 13 by the operation of rotating the polishing head 14 (that is, the polishing operation) is performed.

具體而言，如第4圖A及第4圖B所示，將研磨面W2維持在與研磨墊12呈對向的狀態下，使各研磨對象物W以與保持具13的轉軸P1呈平行的軸線P2為中心朝順時鐘方向旋轉90度。亦即，使各研磨對象物W的面向從第4圖A所示的保持狀態變更至第4圖B所示的保持狀態。又，在第4圖A~第4圖D中，為了容易理解係在各研磨對象物W的研磨面中，賦予星號於最初位在保持具13的轉軸P1側的部位來作為標記。並且，在進行變更各研磨對象物W的面向之操作係藉由下述方式實施：暫時將研磨對象物W從保持具13的研磨頭14卸下，之後再以變更面向後的狀態使研磨對象物W再次保持於研磨頭14。 Specifically, as shown in FIG. 4A and FIG. 4B, the polishing surface W2 is maintained in a state of being opposed to the polishing pad 12, and each of the polishing objects W is parallel to the rotation axis P1 of the holder 13. The axis P2 is rotated 90 degrees toward the clockwise center. In other words, the surface of each polishing object W is changed from the holding state shown in FIG. 4A to the holding state shown in FIG. 4B. In addition, in FIG. 4A to FIG. 4D, in order to make it easy to understand, in the polishing surface of each object to be polished W, a portion where the asterisk is first positioned on the rotation axis P1 side of the holder 13 is given as a mark. In addition, the operation for changing the surface of each polishing object W is performed by temporarily removing the polishing object W from the polishing head 14 of the holder 13, and then polishing the object in a state in which the surface is changed rearward. The object W is held again by the polishing head 14.

變更研磨對象物W的面向之後，係以第4圖B所示的保持狀態來進行研磨操作。之後，在進一步地經過上述預定時間的時間點，係以同樣方式使研磨對象物W的面向從第4圖B所示的保持狀態變更至第4圖C所示的保持狀態。並且，以第4圖C所示的保持狀態來進行研磨操作。之後，在進一步地經過上述預定時間的時間點，使研磨對象物W的面向從第4圖C所示的保持狀態變更至第4圖D所示的保持狀態。並且，以第4圖D所示的保持狀態來進行上述預定時間的研磨操作。因此，本實施方式中，係在使研磨對象物W的面向每次差90度所形成的4個保持狀態下，分別對研磨對象物W進行研磨。 After the surface of the object to be polished W is changed, the polishing operation is performed in the holding state shown in FIG. 4B. After that, the surface of the object to be polished W is changed from the holding state shown in FIG. 4B to the holding state shown in FIG. 4C in the same manner at the time when the predetermined time has elapsed. Further, the polishing operation is performed in the holding state shown in FIG. 4C. After that, the surface of the object to be polished W is changed from the holding state shown in FIG. 4C to the holding state shown in FIG. 4D at a time point when the predetermined time has elapsed. Then, the polishing operation for the predetermined time is performed in the holding state shown in FIG. 4D. Therefore, in the present embodiment, the object to be polished W is polished in each of four holding states in which the surface of the object to be polished W is formed by 90 degrees.

其次，說明關於本實施方式的作用。 Next, the action of the present embodiment will be described.

如第4圖A~第4圖D所示，本實施方式的研磨方法係在研磨步驟中，變更保持在保持具13的研磨頭14的各研磨對象物W之面向。並且，在使研磨對象物W的面向為相異的各保持狀態下，分別進行研磨操作。因此，在進行研磨步驟中不會有下述情事：研磨對象物W的研磨面之特定部位，一直位在被供給全新的研磨用組成物15而使得研磨量變得相對較多的位置(研磨頭14的徑向外側)。或是，一直位在被供給不是全新的研磨用組成物15而使得研磨量變得相對較少的位置(研磨頭14的徑向內側)。藉此，會抑制產生下述研磨不均：研磨對象物W的研磨面之特定部位與其他部位相比研磨量會變得較多或變得較少。 As shown in FIGS. 4A to 4D, the polishing method of the present embodiment changes the surface of each polishing object W held by the polishing head 14 of the holder 13 in the polishing step. Further, the polishing operation is performed in each of the holding states in which the surfaces of the object to be polished W are different. Therefore, in the polishing step, the specific portion of the polishing surface of the polishing object W is always positioned at a position where the polishing composition 15 is supplied with a relatively large amount of polishing (the polishing head) Radial outer side of 14). Or, it is always placed at a position where the amount of polishing is relatively small (the radially inner side of the polishing head 14) which is not a completely new polishing composition 15. As a result, it is possible to suppress the occurrence of uneven polishing in which the specific portion of the polishing surface of the object to be polished W is larger or smaller than the other portions.

其次，記載關於本實施方式的效果。 Next, the effects of the present embodiment will be described.

(1)研磨方法係具有下述研磨步驟：在將保持具13所保持的研磨對象物W之研磨面按壓在研磨墊12使其接觸的狀態下，藉由一邊將研磨用組成物15供給至研磨墊12上，一邊使保持具13及研磨墊12旋轉來對研磨對象物W的研磨面進行研磨。在進行研磨步驟中，保持具13所保持的研磨對象物W係維持在使研磨面W2與研磨墊12呈對向的狀態下進行旋轉，並且變更研磨對象物W的面向。因此，會抑制產生下述研磨不均：研磨對象物W的研磨面之特定部位與其他部位相比研磨量會變得較多或變得較少。 (1) The polishing method is a polishing step in which the polishing composition 15 is supplied while the polishing surface of the polishing object W held by the holder 13 is pressed against the polishing pad 12 to be in contact with each other. On the polishing pad 12, the polishing surface of the polishing object W is polished while rotating the holder 13 and the polishing pad 12. In the polishing step, the polishing object W held by the holder 13 is rotated while the polishing surface W2 and the polishing pad 12 are opposed to each other, and the surface of the polishing object W is changed. Therefore, it is suppressed that the unevenness of the polishing is caused by the fact that the specific portion of the polishing surface of the object to be polished W is larger or smaller than the other portions.

(2)利用旋轉使研磨對象物W的研磨面之各部位在下述位置之間進行交替來變更研磨對象物W的面向：研磨量變得相對較多的位置(研磨頭14的徑向外側)、研磨量變得相對較少的位置(研磨頭14的徑向內側)、以及上述位置的中間位置。當例舉第4圖A~第4圖D中被賦予星號的研磨對象物W之部位為例時，在第4圖A所示的狀態是相對難以進行研磨的位置，在第4圖C所示的狀態是相對容易進行研磨的位置，而第4圖B及第4圖D所示的狀態是上述位置的中間位置。 (2) The rotation of the respective portions of the polishing surface of the object to be polished W is alternated between the following positions to change the surface of the object to be polished W: a position where the amount of polishing is relatively large (outside of the radial direction of the polishing head 14), The position where the amount of polishing becomes relatively small (the radially inner side of the polishing head 14) and the intermediate position of the above position. When the portion of the object to be polished W to which the asterisk is given in FIGS. 4A to 4D is exemplified, the state shown in FIG. 4A is a position where polishing is relatively difficult, and FIG. 4C The state shown is a position where polishing is relatively easy, and the state shown in FIG. 4B and FIG. 4D is the intermediate position of the above position.

因此，與下述情況相比會變得容易均一地對研磨面整體進行研磨，該情況為：不以每次差90度而是以每次差180度使研磨對象物W旋轉，而在研磨量變得相對較少的位置、以及研磨量變得相對較多的位置之間進行交替來變更研磨對象物W的面向。該結果，會更有效地抑制研磨不均的產生。 Therefore, it is easier to uniformly polish the entire polishing surface as compared with the case where the polishing object W is not rotated by 90 degrees each time, but the polishing object W is rotated. The position where the amount becomes relatively small and the position where the amount of grinding becomes relatively large alternate The surface of the object W is further polished. As a result, the occurrence of uneven grinding is more effectively suppressed.

(3)研磨步驟係包含下述操作：在暫時停止對研磨對象物W的研磨面進行研磨之操作來變更研磨對象物W的面向之後，再次開始對研磨對象物W的研磨面進行研磨。因此，能夠直接利用既有的單面研磨裝置10。 (3) The polishing step includes an operation of polishing the polishing surface of the polishing object W to temporarily stop the surface of the polishing object W, and then polishing the polishing surface of the polishing object W again. Therefore, the existing single-sided polishing apparatus 10 can be utilized as it is.

(4)研磨對象物W係具有曲面狀的研磨面W2，並且係將研磨對象物W按壓在研磨墊12，一邊使研磨墊12變形成為順應研磨面W2之形狀，一邊對研磨面W2進行研磨。該情況下，不僅研磨墊12相對於研磨面W2的接觸面會變大，並且研磨墊12對於研磨面W2也會緊密地密合。因此，在進行研磨步驟中，進入研磨對象物W與研磨墊12之間的研磨用組成物15會變得不易流入研磨對象物W與研磨墊12之間，並且變得不易供給至研磨頭14的徑向內側。該結果會造成下述問題特別顯著地產生：相對於離研磨頭14的轉軸P1較遠側的部位B(研磨頭14的徑向外側)之研磨量，離研磨頭14的轉軸P1較近側的部位A(研磨頭14的徑向內側)之研磨量會變得較少(參照第12圖B)。 (4) The object to be polished W has a curved surface W2, and the polishing target W is pressed against the polishing pad 12, and the polishing pad 12 is deformed to conform to the shape of the polishing surface W2, and the polishing surface W2 is polished. . In this case, not only the contact surface of the polishing pad 12 with respect to the polishing surface W2 becomes large, but also the polishing pad 12 closely adheres to the polishing surface W2. Therefore, in the polishing step, the polishing composition 15 that has entered between the polishing object W and the polishing pad 12 does not easily flow between the polishing target W and the polishing pad 12, and becomes difficult to supply to the polishing head 14 Radial inside. This result causes a particularly remarkable problem that the amount of polishing relative to the portion B farther from the rotational axis P1 of the polishing head 14 (the radially outer side of the polishing head 14) is closer to the rotational axis P1 of the polishing head 14 The amount of polishing of the portion A (the radially inner side of the polishing head 14) becomes less (refer to Fig. 12B).

因此，藉由本實施方式的研磨方法所達到的抑制研磨不均的效果係在下述情況時特別大：一邊使研磨墊12變形成為順應研磨面W2之形狀，一邊對研磨面W2進行研磨。在下述情況也能獲得相同的效果：研磨對象物W係具有由複數個面所組成的研磨面W3，並且將研磨對象物 W按壓在研磨墊12，一邊使研磨墊12變形成為順應研磨面W3之形狀，一邊對研磨面W3進行研磨。 Therefore, the effect of suppressing polishing unevenness by the polishing method of the present embodiment is particularly large when the polishing pad 12 is deformed to conform to the shape of the polishing surface W2, and the polishing surface W2 is polished. The same effect can be obtained also in the case where the object to be polished W has a polishing surface W3 composed of a plurality of faces, and the object to be polished is W is pressed against the polishing pad 12, and the polishing surface W3 is polished while deforming the polishing pad 12 to conform to the shape of the polishing surface W3.

再者，本實施方式也能夠進行如下變更來予以具體化。 Furthermore, this embodiment can also be modified as follows.

‧並無特別限制各保持具13所保持的研磨對象物W之數量，也可以在2個以下，或是在4個以上亦可。另外，每個保持具13所保持的研磨對象物W之數量也可以相異。 ‧ The number of objects to be polished W held by each holder 13 is not particularly limited, and may be two or less, or four or more. Further, the number of the polishing objects W held by each of the holders 13 may be different.

‧上述實施方式中，雖然係藉由驅動馬達來使保持具13旋轉，但使保持具13進行旋轉的方法並不限定於此。例如，亦可在使研磨頭14能夠自轉的狀態下將保持具13配置在研磨墊12上來使研磨墊12旋轉。該情況下，保持具13的研磨頭14會隨著研磨墊12的旋轉而進行旋轉(自轉)。 In the above embodiment, the holder 13 is rotated by the drive motor, but the method of rotating the holder 13 is not limited thereto. For example, the holder 13 may be placed on the polishing pad 12 in a state where the polishing head 14 can be rotated, and the polishing pad 12 may be rotated. In this case, the polishing head 14 of the holder 13 rotates (rotates) as the polishing pad 12 rotates.

‧上述實施方式在研磨步驟中，雖然係使保持具13及研磨墊12一起進行旋轉，但只要是構成為使保持具13與研磨墊12會相對旋轉即可。亦即，不使研磨墊12旋轉而是僅使保持具13進行旋轉也可以，或是不使保持具13旋轉而是僅使研磨墊12進行旋轉亦可。 In the above-described embodiment, the holder 13 and the polishing pad 12 are rotated together in the polishing step, but the holder 13 and the polishing pad 12 may be relatively rotated. That is, the holder 13 may be rotated only without rotating the polishing pad 12, or only the polishing pad 12 may be rotated without rotating the holder 13.

又，即使在不使保持具13旋轉而是僅使研磨墊12進行旋轉的情況下，也會產生下述問題：因為研磨用組成物15之消耗程度的不同(亦即，研磨用組成物15是新還是舊)而引起的研磨對象物W之研磨不均。亦即，在僅使研磨墊12進行旋轉的情況下，供給至研磨墊12上的研磨用組成物15會沿著研磨墊12的旋轉方向呈圓弧狀地流動在保持具13所保持的研磨對象物W與研磨墊12之間。 Moreover, even if only the polishing pad 12 is rotated without rotating the holder 13, there is a problem in that the degree of consumption of the polishing composition 15 is different (that is, the polishing composition 15) It is a new or old one that causes uneven grinding of the object to be polished W. That is, the polishing supplied to the polishing pad 12 is performed only when the polishing pad 12 is rotated. The composition 15 flows in an arc shape along the rotation direction of the polishing pad 12 between the polishing object W held by the holder 13 and the polishing pad 12.

在此，第12圖B所示的例子係假設研磨用組成物15會從紙面的上側朝向下側呈圓弧狀地流動。此時，對於位在上側的研磨對象物W之部位B會進行利用全新的研磨用組成物15之研磨，而對於部位A則會進行利用不是全新的研磨用組成物15之研磨。該不是全新的研磨用組成物15係用於部位B的研磨而造成研磨粒等產生消耗。 Here, in the example shown in FIG. 12B, it is assumed that the polishing composition 15 flows in an arc shape from the upper side toward the lower side of the paper surface. At this time, the polishing of the new polishing composition 15 is performed on the portion B of the polishing object W located on the upper side, and the polishing of the polishing composition 15 which is not completely new is performed for the portion A. This is not a completely new polishing composition 15 for polishing the portion B, which causes consumption of abrasive grains and the like.

相反地，假設研磨用組成物15會從紙面的下側朝向上側呈圓弧狀地流動。此時，對於位在上側的研磨對象物W之部位A會進行利用全新的研磨用組成物15之研磨，而對於部位B則會進行利用不是全新的研磨用組成物15之研磨。該不是全新的研磨用組成物15係用於部位A的研磨而造成研磨粒等產生消耗。 On the contrary, it is assumed that the polishing composition 15 flows in an arc shape from the lower side toward the upper side of the paper surface. At this time, the polishing of the polishing composition 15 is performed on the portion A of the polishing object W positioned on the upper side, and the polishing composition 15 is not used for the portion B. This is not a completely new polishing composition 15 which is used for polishing the portion A to cause consumption of abrasive grains or the like.

如上所述，即使在不使保持具13旋轉而是僅使研磨墊12進行旋轉的情況下，用於對研磨對象物W的各部位進行研磨的研磨用組成物15之消耗程度還是會產生相異。然後，會因為上述情事而造成研磨對象物W產生研磨不均。即使是上述在僅使研磨墊12進行旋轉的情況所產生的研磨不均，也能夠藉由在研磨步驟中進行變更研磨對象物W的面向之操作來抑制產生上述情事。 As described above, even when the polishing pad 12 is rotated only without rotating the holder 13, the degree of consumption of the polishing composition 15 for polishing the respective portions of the polishing object W is still generated. different. Then, the polishing object W may be unevenly polished due to the above-described circumstances. Even in the above-described polishing unevenness caused by the fact that only the polishing pad 12 is rotated, it is possible to suppress the occurrence of the above-described case by changing the surface of the polishing target W in the polishing step.

‧上述實施方式在研磨步驟中，雖然以每次差90度來變更研磨對象物W的面向3次，但並未限制變更一次研磨對象物W的面向之角度為90度，並且也未限制變更研磨對象物W的面向之次數為3次。例如，亦可以每次差120度來變更研磨對象物W的面向2次，或是以每次差180度來變更研磨對象物W的面向1次也可以。 In the above-described embodiment, the surface of the object to be polished W is changed three times with a difference of 90 degrees, but the angle of the surface of the object to be polished W is not limited to 90 degrees, and the change is not restricted. The number of times the object to be polished W faces is three times. For example, the surface of the object to be polished W may be changed twice by 120 degrees each time, or the surface of the object to be polished W may be changed once by 180 degrees.

另外，變更一次的研磨對象物W之面向的角度S與變更研磨對象物W之面向的次數T係滿足下述關係為佳：「S(T+1)=360」。該情況下，能夠更有效地抑制研磨不均的產生。並且，亦可在每次進行變更研磨對象物W的面向之操作時，使變更研磨對象物W的面向之角度相異。 In addition, it is preferable that the angle S of the surface of the polishing object W to be changed once and the number T of the surface of the polishing object W are changed to satisfy the following relationship: "S(T+1) = 360". In this case, the occurrence of polishing unevenness can be more effectively suppressed. Further, the angle of the surface of the object to be polished W may be changed different each time the operation of changing the surface of the object to be polished W is performed.

‧在上述實施方式中，雖然係將研磨對象物W按壓在研磨墊12，一邊使研磨墊12變形成為順應研磨面之形狀，一邊對研磨面進行研磨，但亦可在不使研磨墊12變形的程度將研磨對象物W按壓在研磨墊12的狀態下對研磨面進行研磨。例如，是在具有如第1圖A所示的平坦狀的研磨面W1之研磨對象物W的情況下，會適用上述研磨方法。 In the above-described embodiment, the polishing target 12 is pressed against the polishing pad 12, and the polishing pad 12 is deformed to conform to the shape of the polishing surface, and the polishing surface is polished. However, the polishing pad 12 may not be deformed. To the extent that the polishing object W is pressed against the polishing pad 12, the polishing surface is polished. For example, in the case of the object W to be polished having the flat polishing surface W1 as shown in FIG. 1A, the above polishing method is applied.

‧在上述實施方式中，雖然係暫時將研磨對象物W從保持具13的研磨頭14卸下，之後再藉由以變更面向後的狀態使研磨對象物W再次保持在研磨頭14來變更研磨對象物W的面向，但亦可藉由其他方法來變更研磨對象物W的面向。例如，亦可如第5圖及第6圖所示，使用具備有用以變更研磨對象物W的面向之旋轉機構的保持具13，藉由使該旋轉機構作動來變更研磨對象物W的面向。 In the above-described embodiment, the polishing target W is temporarily removed from the polishing head 14 of the holder 13, and then the polishing target W is held in the polishing head 14 again by changing the rearward facing state to change the polishing. The surface of the object W is changed, but the surface of the object W to be polished may be changed by another method. For example, as shown in FIGS. 5 and 6 , a holder 13 having a rotating mechanism for changing the surface of the object to be polished W may be used, and the surface of the object W to be polished may be changed by operating the rotating mechanism.

在第5圖所示的例子中，保持具13的研磨頭14形成有朝上下貫穿的插通孔21，並且在研磨頭14的下面形成有以插通孔21的開口為中心而形成的圓形之收容凹部22。插通孔21貫穿有轉軸23。將收容在收容凹部22內的圓板狀之旋轉台24固定在朝收容凹部22突出的轉軸23的下端部，並且將操作構件25固定在朝研磨頭14的上面側突出的轉軸23的上端部。該情況下，係藉由轉軸23、旋轉台24、及操作構件25來構成旋轉機構。 In the example shown in FIG. 5, the polishing head 14 of the holder 13 is formed with an insertion hole 21 penetrating upward and downward, and a circle formed by the opening of the insertion hole 21 is formed on the lower surface of the polishing head 14. The receiving recess 22 is shaped. The insertion hole 21 has a rotation shaft 23 penetrating therethrough. The disk-shaped rotary table 24 housed in the housing recess 22 is fixed to the lower end portion of the rotary shaft 23 that protrudes toward the housing recess 22, and the operation member 25 is fixed to the upper end portion of the rotary shaft 23 that protrudes toward the upper surface side of the polishing head 14. . In this case, the rotating mechanism is configured by the rotating shaft 23, the rotating table 24, and the operating member 25.

在第5圖的構造中，係將研磨對象物W保持在旋轉台24的下面。並且，在變更研磨對象物W的面向時，作業員係旋轉操作構件25。藉此，旋轉台24及保持在旋轉台24的研磨對象物W會通過轉軸23而一體地進行旋轉，來變更研磨對象物W的面向。依據上述構造，在進行變更研磨對象物W的面向時，不需將研磨對象物W從保持具13的研磨頭14卸下，而能夠容易地進行變更研磨對象物W的面向之操作。 In the configuration of Fig. 5, the object to be polished W is held under the rotary table 24. Further, when the surface of the polishing object W is changed, the operator rotates the operation member 25. Thereby, the rotating table 24 and the polishing target W held by the rotating table 24 are integrally rotated by the rotating shaft 23, and the surface of the polishing object W is changed. According to the above configuration, when the surface of the polishing object W is changed, the polishing object W is not required to be detached from the polishing head 14 of the holder 13, and the operation of changing the surface of the polishing object W can be easily performed.

在第6圖所示的例子中，係在研磨頭14的下面形成有圓形之收容凹部22，並且將圓板狀的旋轉台24收容在收容凹部22內。在旋轉台24係固定有安裝在研磨頭14內的馬達26之轉軸。另外，在保持具13設置有用以控制馬達26的旋轉之控制部(省略圖式)。該情況下，係藉由旋轉台24、馬達26、及控制部來構成旋轉機構。 In the example shown in FIG. 6, a circular accommodation recess 22 is formed in the lower surface of the polishing head 14, and the disk-shaped rotary table 24 is accommodated in the accommodation recess 22. A rotating shaft of the motor 26 mounted in the polishing head 14 is fixed to the rotary table 24. Further, a control unit (omitted from the drawing) for controlling the rotation of the motor 26 is provided in the holder 13. In this case, the rotating mechanism is configured by the rotating table 24, the motor 26, and the control unit.

在第6圖的構造中，係將研磨對象物W保持在旋轉台24的下面。並且，在變更研磨對象物W的面向時，控制部會使馬達26進行旋轉。藉此，旋轉台24及保持在旋轉台24的研磨對象物W會進行旋轉，來變更研磨對象物W的面向。 In the configuration of Fig. 6, the object to be polished W is held under the rotary table 24. Further, when changing the orientation of the object to be polished W, The part causes the motor 26 to rotate. Thereby, the rotating table 24 and the polishing target W held by the rotating table 24 are rotated to change the surface of the polishing target W.

依據第6圖的構造，在進行變更研磨對象物W的面向時，能夠一邊進行研磨操作一邊變更研磨對象物W的面向。因此，不需要暫時地停止研磨操作，而能夠縮短研磨步驟所需的時間。 According to the structure of Fig. 6, when the surface of the object to be polished W is changed, the surface of the object to be polished W can be changed while performing the polishing operation. Therefore, it is not necessary to temporarily stop the grinding operation, and the time required for the grinding step can be shortened.

‧如第7圖所示，亦可在使間隔件30配置在保持具13的研磨頭14與研磨對象物W之間的狀態下，來進行研磨操作。亦即，也可以在經由間隔件30將研磨對象物W保持在研磨頭14的狀態下，來進行研磨操作。該情況下，藉由存在間隔件30會形成為使研磨對象物W大幅度地朝研磨墊12突出之狀態。因此，即使在對由複數個面所組成的研磨面W3或作成為曲面狀的研磨面W2(參照第1圖B)進行研磨時，研磨對象物W的厚度形成為較薄的情況下，也會變得容易將研磨對象物W按壓在研磨墊12，而變得容易使研磨墊12變形成為順應研磨面之形狀。 ‧ As shown in Fig. 7, the polishing operation can be performed in a state where the spacer 30 is disposed between the polishing head 14 of the holder 13 and the object to be polished W. In other words, the polishing operation may be performed in a state where the polishing object W is held by the polishing head 14 via the spacer 30. In this case, the spacer 30 is formed so that the polishing target W largely protrudes toward the polishing pad 12. Therefore, even when the polishing surface W3 composed of a plurality of surfaces or the polishing surface W2 (see FIG. 1B) having a curved surface is polished, when the thickness of the polishing object W is thin, It is easy to press the polishing object W against the polishing pad 12, and it is easy to deform the polishing pad 12 into a shape conforming to the polishing surface.

‧在使用具有旋轉機構的保持具13之情況下也相同，如第8圖所示，亦可在使間隔件30配置在旋轉台24與研磨對象物W之間的狀態下，來進行研磨操作。另外，如第9圖所示，即使藉由將旋轉台24安裝在從研磨頭14的下面突出的位置之保持具13來取代使用間隔件30，也能夠獲得相同的效果。 ‧ In the case of using the holder 13 having the rotation mechanism, as shown in FIG. 8, the spacer 30 may be disposed in a state where the spacer 30 is disposed between the rotary table 24 and the polishing target W. . Further, as shown in Fig. 9, even if the spacer 30 is replaced by the holder 13 in which the rotary table 24 is attached to the lower surface of the polishing head 14, the same effect can be obtained.

‧在使用雙面研磨裝置對研磨對象物W的雙面進行研磨的雙面研磨方法中，係與上述實施方式相同亦可在研磨步驟中進行變更研磨對象物W之面向的操作。 In the double-side polishing method in which both sides of the object to be polished W are polished by the double-side polishing apparatus, the operation of changing the surface of the object to be polished W may be performed in the polishing step as in the above-described embodiment.

該情況下，作為研磨對象物W係使用例如：第10圖A~第10圖C所示的在雙面具有研磨面的研磨對象物。第10圖A係表示在上下雙面具有平坦狀的研磨面W1之研磨對象物W。第10圖B係表示在上下雙面具有一部分或整體作成為曲面形狀的研磨面W2之研磨對象物W。第10圖C係表示在上下雙面具有由複數個面W3a、W3b、W3c所組成的研磨面W3之研磨對象物W。並且，在第10圖A~第10圖C所示的例子中，雖然將研磨對象物W的上下雙面作成為相同形狀，但上下雙面的形狀亦可相互地相異。 In this case, as the object to be polished W, for example, an object to be polished having a polishing surface on both sides as shown in FIGS. 10A to 10C is used. Fig. 10A shows an object to be polished W having a flat polishing surface W1 on both sides of the upper and lower sides. Fig. 10B is a view showing an object to be polished W having a polishing surface W2 which is partially or entirely curved on the upper and lower sides. Fig. 10C shows an object to be polished W having a polishing surface W3 composed of a plurality of faces W3a, W3b, and W3c on both sides of the upper and lower sides. Further, in the examples shown in FIGS. 10A to 10C, the upper and lower sides of the object to be polished W have the same shape, but the shapes of the upper and lower sides may be different from each other.

另外，作為雙面研磨裝置係能夠使用特開平7-156061號公報所揭示的為公眾所知的雙面研磨裝置。雙面研磨裝置係具備：配置成在上下呈對向的一對研磨墊、以及在上述研磨墊之間用以保持研磨對象物W的保持具。保持具係例如具有與研磨對象物W的外形相對應的形狀之保持孔的板狀構件，將研磨對象物W***至保持孔，藉由保持孔的內周面與研磨對象物W的側面Ws(參照第10圖A~第10圖C)之間的卡合等之相互作用，將研磨對象物W的兩研磨面保持成朝上側及下側突出的狀態。 Further, as the double-side polishing apparatus, a double-side polishing apparatus known from the public can be used as disclosed in Japanese Laid-Open Patent Publication No. Hei No. No. Hei. The double-side polishing apparatus includes a pair of polishing pads arranged to face each other vertically, and a holder for holding the polishing object W between the polishing pads. The holding member is, for example, a plate-like member having a holding hole having a shape corresponding to the outer shape of the object to be polished W, and the object to be polished W is inserted into the holding hole by the inner peripheral surface of the holding hole and the side surface Ws of the object W to be polished. (see FIG. 10A to FIG. 10C), the two polishing surfaces of the polishing object W are held in a state of being protruded toward the upper side and the lower side.

在雙面研磨方法中係進行下述研磨步驟：在將保持具所保持的研磨對象物W之兩研磨面按壓在上下的研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使保持具與研磨墊相對旋轉來對研磨面進行研磨。在該研磨步驟的中途，暫時將研磨對象物W從保持具的保持孔卸下，例如第4圖A~第4圖D所示般地，之後再以變更面向後的狀態使研磨對象物W***至保持孔，再次將研磨對象物W保持在保持具。然後，再次開始進行研磨操作。如上所述，雙面研磨方法中，在研磨步驟中進行使對研磨對象物W的面向變更的操作之情況下，針對研磨對象物W的兩研磨面能夠與上述實施方式相同地抑制研磨不均的產生。 In the double-side polishing method, a polishing step is performed in which the polishing surface of the polishing object W held by the holder is pressed against the upper and lower polishing pads. In the state of being brought into contact, the polishing surface is polished by rotating the holder and the polishing pad while supplying the polishing composition onto the polishing pad. In the middle of the polishing step, the object to be polished W is temporarily detached from the holding hole of the holder. For example, as shown in FIG. 4 to FIG. 4D, the object to be polished is changed to the rear. The hole is inserted into the holding hole, and the object to be polished W is held again in the holder. Then, the grinding operation is started again. As described above, in the double-side polishing method, when the operation of changing the surface of the object to be polished W is performed in the polishing step, the polishing surfaces of the object W can be suppressed in the same manner as in the above-described embodiment. The production.

其次，例舉實施例、及比較例來進一步地具體說明本發明。 Next, the present invention will be further specifically described by way of examples and comparative examples.

實施例 Example

在使用第12圖A所示的單面研磨裝置，將保持具所保持的研磨對象物之研磨面按壓在研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使保持具及研磨墊(定盤)旋轉來對研磨對象物的研磨面進行研磨。具體的研磨條件係如下記的表1所示。 When the polishing surface of the object to be polished held by the holder is pressed against the polishing pad to be in contact with the polishing pad, the polishing composition is supplied to the polishing pad by using the single-sided polishing apparatus shown in FIG. The polishing surface of the object to be polished is polished while rotating the holder and the polishing pad (fixing plate). The specific polishing conditions are shown in Table 1 below.

另外，作為研磨對象物係使用第1圖B所示的具有曲面形狀的研磨面之平板狀的玻璃板(長度56mm×寬度60mm×厚度0.86mm)。研磨對象物相對於保持具之保持狀態係如第11圖A所示。並且，利用使研磨墊變形成為順應研磨面之形狀的研磨荷重，來將研磨對象物按壓在研磨墊。 Further, as the object to be polished, a flat glass plate (length: 56 mm × width: 60 mm × thickness: 0.86 mm) having a curved surface of the polishing surface shown in Fig. 1B was used. The state in which the object to be polished is held relative to the holder is as shown in Fig. 11A. Then, the polishing target is pressed against the polishing pad by deforming the polishing pad into a polishing load that conforms to the shape of the polishing surface.

在開始進行研磨操作經過6分鐘之後，使定盤及保持具的旋轉停止，並且將保持具所保持的研磨對象物旋轉180度，使研磨對象物的面向從第11圖A所示的保持狀態變更至第11圖B所示的保持狀態。然後，再度開始進行研磨，在進一步地經過6分鐘之後結束研磨。 After 6 minutes have elapsed since the start of the polishing operation, the rotation of the fixing plate and the holder is stopped, and the object to be polished held by the holder is rotated by 180 degrees so that the surface of the object to be polished is held from the state shown in FIG. Change to the hold state shown in Fig. 11B. Then, the grinding was started again, and the polishing was finished after further 6 minutes.

其後，對第11圖A及第11圖B所示的研磨對象物之研磨面的各部位WA、WB、WC的表面粗度進行測量。部位WA係下述部位：研磨對象物W中的曲面狀的研磨面之緣部部分，在進行第1次的研磨操作時係位在保持具的徑向內側，而在進行第2次的研磨操作時係位在保持具的徑向外側。部位WB係下述部位：研磨對象物W中的曲面狀的研磨面之緣部部分，在進行第1次的研磨操作時係位在保持具的徑向外側，而在進行第2次的研磨操作時係位在保持具的徑向內側。部位WC係下述部位：研磨對象物W中的曲面狀的研磨面之中央部分，在進行第1次的研磨操作及第2次的研磨操作時都係位在保持具的徑向中央。 Thereafter, the surface roughness of each of the portions WA, WB, and WC of the polishing surface of the object to be polished shown in FIGS. 11A and 11B is measured. The portion WA is a portion in which a curved surface is polished in the object W to be polished. The edge portion of the surface is positioned radially inward of the holder during the first polishing operation, and is positioned radially outward of the holder during the second polishing operation. The portion WB is a portion where the edge portion of the curved polishing surface in the polishing target W is positioned radially outward of the holder during the first polishing operation, and is subjected to the second polishing. The operation is in the radial inner side of the holder. The portion WC is a portion in which the central portion of the curved polishing surface in the polishing target W is positioned in the center in the radial direction of the holder during the first polishing operation and the second polishing operation.

將上述各部位的表面粗度之測量結果表示於表2。並且，作為參考也將進行研磨前的各部位之表面粗度表示於表2。再者，表面粗度的測量係使用東京精密株式會社製的表面粗度測量裝置SURFCOM1500DX，並且以Standard：JIS’94，Filter Cut Off：250μm、Measurement Length：1mm的條件進行。 The measurement results of the surface roughness of each of the above portions are shown in Table 2. Further, the surface roughness of each portion before polishing was also shown in Table 2 as a reference. In addition, the surface roughness measurement was performed using the surface roughness measuring apparatus SURFCOM1500DX manufactured by Tokyo Seimitsu Co., Ltd., and was carried out under the conditions of Standard: JIS'94, Filter Cut Off: 250 μm, and Measurement Length: 1 mm.

比較例 Comparative example

使用與實施例相同的研磨對象物，並且利用與實施例相同的研磨條件進行研磨操作。但，在比較例中，不會進行變更研磨對象物的面向之操作，係在利用第11圖A所示的保持狀態來進行10分鐘研磨後結束研磨。其後，與實施例相同地對研磨對象物之研磨面的各部位WA、WB、WC的表面粗度進行測量。該結果表示於表2。 The same polishing object as in the example was used, and the polishing operation was performed using the same polishing conditions as in the examples. However, in the comparative example, the operation of changing the surface of the object to be polished was not performed, and the polishing was performed after 10 minutes of polishing in the holding state shown in FIG. 11A. Thereafter, the surface roughness of each of the portions WA, WB, and WC of the polishing surface of the object to be polished was measured in the same manner as in the examples. The results are shown in Table 2.

如表2所示，在未進行變更研磨對象物的面向之操作的比較例中，與部位WB(位在保持具的徑向外側之部位)相比，部位WA(位在保持具的徑向內側之部位)較未進行研磨，而會在部位WA與部位WB之間產生研磨不均。相對於此，在進行變更研磨對象物的面向之操作的實施例中，部位WA與部位WB的表面粗度大致相同，而不會在部位WA與部位WB之間產生研磨不均。 As shown in Table 2, in the comparative example in which the operation of changing the surface of the object to be polished was not performed, the portion WA (the position in the radial direction of the holder) was located in the radial direction of the holder WB (the portion located radially outward of the holder) The inner portion is not polished, and uneven polishing occurs between the portion WA and the portion WB. On the other hand, in the embodiment in which the operation of changing the surface of the object to be polished is performed, the surface roughness of the portion WA and the portion WB is substantially the same, and polishing unevenness does not occur between the portion WA and the portion WB.

上述說明係用以舉例並非是用以限制。例如，亦可相互地組合上述實施例(或者是其中一個或複數個態樣)來進行使用。藉由檢討上述說明，所屬技術領域中具有通常知識者等也可使用其他的實施方式。並且，在上述詳細說明中，為了簡化揭示內容也可以將各種的特徵一起予以群組化。上述內容是指：未申請的所揭示之技術特徵並非是用以解釋在任意的申請專利範圍的請求項皆為必須。反而是指：本發明的主題可能會具有比特定的所揭示之實施方式的所有的技術特徵更少的技術特徵。因此，所添附的申請專利範圍的請求項係組合成詳細之說明，並且各個請求項也能作為個別的實施方式來主張自已本身。本發明的範圍係參照所添附的申請專利範圍的請求項，而可同時確定該申請專利範圍的請求項被賦予專利之相當物的全部範圍。 The above description is for illustrative purposes and is not intended to be limiting. For example, the above embodiments (or one or a plurality of aspects) may be combined with each other for use. Other embodiments may be used by those having ordinary skill in the art by reviewing the above description. Further, in the above detailed description, various features may be grouped together in order to simplify the disclosure. The above content means that the disclosed technical features that are not applied are not intended to explain the claims in any patent application scope. Rather, it is meant that the subject matter of the present invention may have fewer technical features than all of the technical features of the particular disclosed embodiments. Therefore, the claims of the appended claims are incorporated into the detailed description, and each claim can also claim itself as an individual implementation. The scope of the present invention is determined by reference to the claims of the appended claims. The claims of the scope of the patent application are assigned to the full extent of the patent equivalents.

14‧‧‧研磨頭 14‧‧‧ polishing head

P1‧‧‧轉軸 P1‧‧‧ shaft

P2‧‧‧軸線 P2‧‧‧ axis

W‧‧‧研磨對象物 W‧‧‧ Grinding objects

Claims

一種研磨方法，具有：研磨步驟，其係在將保持具所保持的研磨對象物之研磨面按壓在研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使前述保持具與前述研磨墊相對轉動來對前述研磨對象物的研磨面進行研磨，其特徵為：在前述研磨步驟中，前述保持具所保持的前述研磨對象物係維持在使前述研磨對象物的研磨面與前述研磨墊呈對向的狀態下進行旋轉，並且變更前述研磨對象物的面向。 A polishing method comprising: a polishing step of pressing a polishing surface of a polishing object held by a holder against a polishing pad to be in contact with the polishing pad while supplying the polishing composition to the polishing pad; The holder is rotated relative to the polishing pad to polish the polishing surface of the object to be polished, wherein in the polishing step, the object to be polished held by the holder is maintained at the object to be polished The polishing surface is rotated in a state in which the polishing pad faces the polishing pad, and the surface of the object to be polished is changed.

如申請專利範圍第1項所記載之研磨方法，其中，前述研磨步驟係包含下述操作：在暫時停止對前述研磨對象物的研磨面進行研磨之操作來變更前述研磨對象物的面向之後，再次開始對前述研磨對象物的研磨面進行研磨。 The polishing method according to the first aspect of the invention, wherein the polishing step includes the operation of polishing the polishing surface of the polishing object to temporarily stop the surface of the polishing object, and then The polishing surface of the object to be polished is started to be polished.

如申請專利範圍第1項或第2項所記載之研磨方法，其中，前述研磨對象物係前述保持具所保持的複數個研磨對象物中的一個。 The polishing method according to the first or second aspect of the invention, wherein the object to be polished is one of a plurality of polishing objects held by the holder.

如申請專利範圍第1項或第2項所記載之研磨方法，其中，前述研磨對象物的研磨面形成為曲面狀，將前述研磨對象物按壓在前述研磨墊，一邊使前述研磨墊變形成為順應曲面狀的研磨面之形狀，一邊對前述研磨對象物的研磨面進行研磨。 The polishing method according to the first or second aspect of the invention, wherein the polishing surface of the object to be polished is formed into a curved shape, and the polishing pad is pressed against the polishing pad to deform the polishing pad to conform The shape of the curved polishing surface is polished while polishing the polishing target.

如申請專利範圍第4項所記載之研磨方法，其中，在前述保持具與前述研磨對象物之間配置間隔件使得前述研磨對象物的研磨面朝向前述研磨墊突出的狀態下，進行前述研磨步驟。 a grinding method as recited in claim 4, In the state in which the spacer is placed between the holder and the object to be polished so that the polishing surface of the object to be polished protrudes toward the polishing pad, the polishing step is performed.

如申請專利範圍第1項或第2項所記載之研磨方法，其中，前述研磨對象物的研磨面是由複數個面所組成，將前述研磨對象物按壓在前述研磨墊，一邊使前述研磨墊變形成為順應由前述複數個面所組成的研磨面之形狀，一邊對前述研磨對象物的研磨面進行研磨。 The polishing method according to the first or second aspect of the invention, wherein the polishing surface of the object to be polished is composed of a plurality of surfaces, and the polishing pad is pressed against the polishing pad to form the polishing pad. The deformation is performed to conform to the shape of the polishing surface composed of the plurality of surfaces, and the polishing surface of the object to be polished is polished.

如申請專利範圍第6項所記載之研磨方法，其中，在前述保持具與前述研磨對象物之間配置間隔件使得前述研磨對象物的研磨面朝向前述研磨墊突出的狀態下，進行前述研磨步驟。 The polishing method according to the sixth aspect of the invention, wherein the polishing step is performed in a state in which a spacer is disposed between the holder and the object to be polished such that a polishing surface of the object to be polished protrudes toward the polishing pad. .

一種保持具，係下述研磨方法所使用的保持具，該研磨方法係在將保持具所保持的研磨對象物之研磨面按壓在研磨墊使其接觸的狀態下，藉由一邊將研磨用組成物供給至研磨墊上，一邊使前述保持具與前述研磨墊相對轉動來對前述研磨對象物的研磨面進行研磨，其特徵為：具備：研磨頭，用以保持前述研磨對象物；以及旋轉機構，將前述研磨對象物的研磨面維持在與前述研磨墊呈對向的狀態下，使前述研磨頭所保持的前述研磨對象物進行旋轉，並且變更前述研磨對象物的面向。 A holder for use in a polishing method for forming a polishing method by pressing a polishing surface of an object to be polished held by a holder against a polishing pad to be in contact with each other. The object is supplied to the polishing pad, and the polishing surface of the polishing object is polished while rotating the holder and the polishing pad, and is characterized in that: a polishing head is provided to hold the polishing object; and a rotating mechanism is provided. In a state in which the polishing surface of the object to be polished is opposed to the polishing pad, the object to be polished held by the polishing head is rotated, and the surface of the object to be polished is changed.

如申請專利範圍第8項所記載之保持具，其中，前述旋轉機構係具備：供前述研磨對象物固定的旋轉台。 The holder according to the eighth aspect of the invention, wherein the rotation mechanism includes a rotary table to which the polishing target is fixed.

如申請專利範圍第9項所記載之保持具，其中，進一步地具備：間隔件，配置在前述旋轉台與前述研磨對象物之間，使得前述研磨對象物的研磨面朝向前述研磨墊突出。 The holder according to the ninth aspect of the invention, further comprising: a spacer disposed between the rotating table and the object to be polished, wherein a polishing surface of the object to be polished protrudes toward the polishing pad.

如申請專利範圍第9項或第10項所記載之保持具，其中，前述旋轉台係設置成：從前述研磨頭朝向前述研磨墊突出。 The holder according to claim 9 or 10, wherein the rotary table is provided to protrude from the polishing head toward the polishing pad.

如申請專利範圍第8項至第10項任一項所記載之保持具，其中，前述研磨頭係構成為：能夠保持複數個研磨對象物。 The holder according to any one of claims 8 to 10, wherein the polishing head is configured to hold a plurality of polishing objects.