TW201514479A - 缺陷觀察裝置及其方法 - Google Patents
缺陷觀察裝置及其方法 Download PDFInfo
- Publication number
- TW201514479A TW201514479A TW103121221A TW103121221A TW201514479A TW 201514479 A TW201514479 A TW 201514479A TW 103121221 A TW103121221 A TW 103121221A TW 103121221 A TW103121221 A TW 103121221A TW 201514479 A TW201514479 A TW 201514479A
- Authority
- TW
- Taiwan
- Prior art keywords
- defect
- spatial
- polarization
- spatial filter
- filter
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8848—Polarisation of light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/40—Imaging
- G01N2223/418—Imaging electron microscope
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/646—Specific applications or type of materials flaws, defects
- G01N2223/6462—Specific applications or type of materials flaws, defects microdefects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013192532A JP2015059776A (ja) | 2013-09-18 | 2013-09-18 | 欠陥観察装置およびその方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201514479A true TW201514479A (zh) | 2015-04-16 |
Family
ID=52688557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103121221A TW201514479A (zh) | 2013-09-18 | 2014-06-19 | 缺陷觀察裝置及其方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2015059776A (ja) |
TW (1) | TW201514479A (ja) |
WO (1) | WO2015040894A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106933050B (zh) * | 2015-12-30 | 2019-05-31 | 上海微电子装备(集团)股份有限公司 | 一种光刻机同步控制***及方法 |
US11802841B2 (en) | 2018-02-27 | 2023-10-31 | Hitachi High-Tech Corporation | Defect detection device, defect detection method, and defect observation device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010096554A (ja) * | 2008-10-15 | 2010-04-30 | Hitachi High-Technologies Corp | 欠陥検出方法の高感度化 |
JP5216752B2 (ja) * | 2009-11-18 | 2013-06-19 | 株式会社日立ハイテクノロジーズ | 欠陥検出方法及び欠陥検出装置並びにこれを備えた欠陥観察装置 |
JP2012026733A (ja) * | 2010-07-20 | 2012-02-09 | Hitachi High-Technologies Corp | 光学式欠陥検出装置及び方法並びにこれを備えた欠陥観察装置 |
-
2013
- 2013-09-18 JP JP2013192532A patent/JP2015059776A/ja active Pending
-
2014
- 2014-05-30 WO PCT/JP2014/064360 patent/WO2015040894A1/ja active Application Filing
- 2014-06-19 TW TW103121221A patent/TW201514479A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2015040894A1 (ja) | 2015-03-26 |
JP2015059776A (ja) | 2015-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8629979B2 (en) | Inspection system, inspection method, and program | |
CN101889197A (zh) | 检查装置和检查方法 | |
JP6640482B2 (ja) | パターン検査装置及びパターン検査方法 | |
JP2008014768A (ja) | 欠陥検査装置及び欠陥検査方法 | |
JP2007327836A (ja) | 外観検査装置及び方法 | |
WO2021135044A1 (zh) | 一种缺陷检查的装置和方法 | |
JP2007256272A (ja) | 表面検査装置 | |
US6555836B1 (en) | Method and apparatus for inspecting bumps and determining height from a regular reflection region | |
US8223328B2 (en) | Surface inspecting apparatus and surface inspecting method | |
US20130194579A1 (en) | Inspection apparatus | |
JP5178781B2 (ja) | センサ出力データの補正装置及びセンサ出力データの補正方法 | |
TW201514479A (zh) | 缺陷觀察裝置及其方法 | |
JP2007205828A (ja) | 光学画像取得装置、パターン検査装置、光学画像取得方法、及び、パターン検査方法 | |
JP4206393B2 (ja) | パターン検査方法 | |
JP2009222625A (ja) | パターン検査装置及びパターン検査方法 | |
JP2009150718A (ja) | 検査装置および検査プログラム | |
JP4554661B2 (ja) | パターン検査装置、パターン検査方法及びプログラム | |
KR101351000B1 (ko) | 복수 개의 검사 모드를 가지는 인라인 카메라 검사 장치 | |
JP2009063365A (ja) | 検査装置及び検査方法 | |
KR100971173B1 (ko) | 웨이퍼 결함을 신속하게 검출하는 온-라인 전기-광학 검출방법과 시스템 | |
JP2005077272A (ja) | 欠陥検査方法 | |
CN112838018B (zh) | 光学量测方法 | |
WO2021261302A1 (ja) | 欠陥検査装置 | |
US8797525B2 (en) | Pattern inspection apparatus and pattern inspection method | |
JP2011185715A (ja) | 検査装置及び検査方法 |