201110028 六、發明說明： 【發明所屬之技術領域】 本發明係關於無線射頻識別（RF ID )標籤及其通訊方 法以及無線射頻識別標籤檢測器具，尤其係關於在微波頻 帶或UHF頻帶的通訊頻率中以使用半波長天線的RFID標 籤並無法對應之適於用在被要求小型化之金屬對應之 RFID標籤利用領域的RFID標籤及其通訊方法以及RFID 標籤檢測器具。 【先前技術】 一般而言，RFID標籤係在由：在積體電路內建ID號 碼等識別資訊的1C晶片、與該1C晶片相連接的阻抗整合 電路、連接有該整合電路的天線、及一體搭載該天線的基 材所構成的引入線（inlet )，將該引入線附加保護膜或安 裝用接著劑等之用途（utility )者。經由該1C晶片、該整 合電路、該天線，由外部在與無線通訊手段之間，藉由該 1C晶片內的讀寫器（reader/writer)而將ID號碼等識別 資訊進行通訊者。201110028 VI. Description of the Invention: [Technical Field] The present invention relates to a radio frequency identification (RF ID) tag and a communication method thereof, and a radio frequency identification tag detecting device, particularly in a communication frequency in a microwave band or a UHF band An RFID tag using a half-wavelength antenna is not suitable for an RFID tag and its communication method and an RFID tag detecting device which are suitable for use in the field of RFID tag use corresponding to metal which is required to be miniaturized. [Prior Art] In general, an RFID tag is a 1C chip in which identification information such as an ID number is built in an integrated circuit, an impedance integration circuit connected to the 1C chip, an antenna to which the integrated circuit is connected, and an integrated body. An inlet formed of a substrate on which the antenna is mounted is attached to the inlet, and a utility such as a protective film or an adhesive for mounting is added. Via the 1C chip, the integrated circuit, and the antenna, the identification information such as the ID number is communicated between the external communication device and the wireless communication means by the reader/writer in the 1C chip.
該一般的RFID標籤係當黏貼於金屬物體表面而使其 進行動作時，會對進行通訊的電磁波在所安裝的金屬面產 生反射或吸收。因此會有通訊變得較爲困難的缺點。在習 知技術中，以其對策而言，阻止訊號在金屬表面或RFID 6 耗 f 消C 被體 而氧 流鐵 電的 應體 感性 或磁 流或 電脂 渦樹 爲的 成質 5 8 谊 獨 表介 扣的 別類 的之 身響 本影 籤低 標減 -5- 201110028 )內置有前述引入線的金屬面用的RFID標籤已被實用化 。此外，在要求機械強度的領域中，已被提出藉由較大的 模具來保護金屬對應的RFID標籤全體的提案。但在該等 方法中會有RFID標籤變大的缺點。 若爲微小的標籤，則安裝部位小即可。以適合於此的 標籤而言，例如在非專利文獻1中已揭示一種在同一·半導 體基板上內置有邏輯電路與天線的RFID標籤。 以其他方法而言，如專利文獻1之揭示，亦有一種在 安裝金屬表面直接施行加工而進行組裝的方法。 此外，在專利文獻1中，以與被設置在金屬面的間隙 或內部等深處的RFID標籤進行通訊的方法而言，亦已提 出一種技術係利用電磁波在媒質中、或在導波管內部、或 在同軸纜線或同軸管內部等傳送路徑作傳播的特性，在傳 送路徑之一端開口部設置RFID標籤，由另一方開口部藉 由讀寫器進行通訊。 此外，在專利文獻1中，亦已揭示出不僅將金屬平板 上的支持模具兼作爲1次捲繞的微小環路天線來作爲使用 微小環路天線的小型金屬對應標籤，而且以使1C晶片或 整合電路不會在所安裝的金屬面等短路的方式且以藉由支 持模具來作隔離的方式進行支撐之例。 此外，在專利文獻1中亦已提出一種在被安裝在金屬 面的小型金屬RFID標籤之上配置介電質間隔件’而在其 上覆蓋兼作爲保護覆蓋件之接地形共振器具之例。 在專利文獻2中所提出的小型金屬對應標籤係具有通 -0 - _________________________ 201110028 訊電磁波波長的1/10左右的直徑，且具有例如圓形金屬 板2枚包夾介電質而在周邊部的一部分作表面與背面相連 結的構造，將下面作爲接地電極，將上面作爲放射電極， 在連結部的放射電極附近，I C晶片作電性連接。 此外，在專利文獻2中，爲了提升安裝在金屬面的 RFID標籤的感度，在放射電極側隔著介電質片材配置輔 助天線，例如雙極天線，以加長通訊距離的技術內容亦已 被揭示。 在專利文獻3中係揭示藉金屬板或支持體來形成通訊 電磁波波長的1 / 1 0左右的長度的微小環路天線，藉由該 支持體以距離金屬面預定高度將1C晶片或整合電路隔離 成不會短路之例。 此外，在專利文獻4中所揭示之標籤之例係在折返金 屬板的表側、或與背側金屬板之連結部側面安裝有1C晶 片’表背面的金屬板的長邊方向的長度爲通訊電磁波波長 之1/4左右的長度時’可實現長通訊距離之作爲天線而 發揮功能。 此外’在專利文獻5中所揭示之標籤之例係在藉由金 屬板所得之帶狀的微小環路天線電性連接而搭載有晶 片，在所安裝的導體面側流通高頻電流而由搭載有1C晶 片之側進行電磁波放射。 〔先前技術文獻〕 〔專利文獻〕 (專利文獻1)日本特開2008-90813號公報 201110028 (專利文獻2)日本特開2006-333403號公報 (專利文獻3)日本特開2008-123222號公報 (專利文獻4)日本特開2005-191705號公報 (專利文獻5)日本特開2006-53833號公報 〔非專利文獻〕 (非專利文獻1 ) http://www.hitachi.co.jp/New/cnews/030902a.html ：天線 內置型「μ-Chip (註冊商標）」，2003年9月2日 【發明內容】 (發明所欲解決之課題） 習知之RFID標籤係在對於金屬面的安裝方面具有前 述缺點，亦即’由於對進行通訊的電磁波在所安裝的金屬 面中產生反射或吸收，會有通訊變得較爲困難的缺點。因 此，爲了解決不可能進行RFID通訊而所硏創出來的金屬 製RFID標籤係其尺寸爲大致半波長，所使用的通訊頻率 爲2_45GHz時，槪略尺寸爲50mm至60mm，難以安裝在 比該尺寸爲小的金屬面。 非專利文獻1所揭示的內置天線之RFID標籤係相對 於安裝面呈平行置放的構造，因此若將其設置在金屬面， 會與標籤之設置有天線的金屬面相接觸而發生短路，或是 內置天線全體會與金屬面作電容耦合，在金屬面內部平行 投影的影像的天線流通全部逆向的高頻電流而使自己的天 線與電磁感應彼此互相抵消而在外部難以進行電磁波放射 一 _____ ____— __________- 8^ -_____________ ____________ ___________________ 201110028 。因此，並無法設置在金屬表面。 此外，專利文獻1中所揭不之標観的構造係利用具有 捲繞起點與終點而呈未封閉的微小環路天線尺寸的模具， 將微小引入線內置在內側’以位於各自之起點部與終點部 附近之位置的微小引入線的天線部作電磁耦合的方式作配 置。在該微小環路天線模具之未封閉的不連續部分’亦即 開口部分的正下方’使RFID標籤的IC晶片朝電磁波放射 方向露出而作配置。該微小環路天線模具的開口部分或其 周邊的溝槽部分並未受到金屬的保護’因此對於藉由高壓 射流水等的洗淨或噴砂所進行的除銹作業’機械強度較不 佳，因此會有1C晶片容易剝離等課題。 此外，在安裝金屬表面直接施行加工而組裝的方法會 有加工負擔增大的課題。因而提高RFID標籤之小型化的 要求。 此外，專利文獻1中在傳送路之一端開口部設置 RFID標籤，由另一方開口部利用讀寫器進行通訊的技術 ，會有傳送路的設置需爲常設，或者將傳送路臨時外接在 各式各樣的讀寫器，僅在必要時予以一體化，在不需要時 則難以簡單地卸除的課題。When the general RFID tag is attached to the surface of a metal object to operate, electromagnetic waves that communicate with each other are reflected or absorbed on the metal surface to be mounted. Therefore, there is a disadvantage that communication becomes more difficult. In the conventional technology, in terms of countermeasures, the signal is prevented from being on the metal surface or the RFID 6 is consumed by the body, and the oxygen flow is ferroelectric, or the magnetic current or the electric grease vortex is used as the quality. The other side of the watch is the one that is low in the shadow of the shadow card. 5--201110028) The RFID tag for the metal surface with the aforementioned lead-in cable has been put into practical use. Further, in the field of requiring mechanical strength, proposals have been made to protect the entire RFID-compliant RFID tag by a large mold. However, in these methods, there is a disadvantage that the RFID tag becomes large. If it is a small label, the installation location is small. For the label suitable for this, for example, Non-Patent Document 1 discloses an RFID tag in which a logic circuit and an antenna are built in the same semiconductor substrate. In other methods, as disclosed in Patent Document 1, there is also a method of directly performing processing by mounting a metal surface. Further, in Patent Document 1, a method of communicating with an RFID tag disposed at a depth or a depth of a metal surface has also proposed a technique of using electromagnetic waves in a medium or inside a waveguide. Or, in a transmission path such as a coaxial cable or a coaxial tube, an RFID tag is provided at one end of the transmission path, and the other end is communicated by the reader. Further, in Patent Document 1, it has been revealed that not only a support die on a metal flat plate is used as a small loop antenna that is wound once, but also a small metal corresponding tag using a small loop antenna, and a 1C wafer or The integrated circuit does not support the short circuit of the mounted metal surface and is supported by the support mold. Further, Patent Document 1 has also proposed an example in which a dielectric spacer ’ is disposed on a small-sized metal RFID tag mounted on a metal surface, and a ground-shaped resonator device serving as a protective cover is covered thereon. The small-sized metal-compatible label proposed in Patent Document 2 has a diameter of about 1/10 of the wavelength of the electromagnetic wave of the signal -10 - _________________________ 201110028, and has, for example, a circular metal plate of two dielectric materials at the periphery. A part of the structure is connected to the back surface, and the lower surface is used as a ground electrode, and the upper surface is used as a radiation electrode, and the IC wafer is electrically connected in the vicinity of the radiation electrode of the connection portion. Further, in Patent Document 2, in order to improve the sensitivity of the RFID tag mounted on the metal surface, an auxiliary antenna such as a dipole antenna is disposed on the radiation electrode side via a dielectric sheet, and the technical content for lengthening the communication distance has also been reveal. Patent Document 3 discloses a micro loop antenna which is formed by a metal plate or a support to form a length of about 1 / 10 of a wavelength of a communication electromagnetic wave, and the support body isolates a 1C wafer or an integrated circuit by a predetermined height from a metal surface. In the case of not short circuit. Further, in the example of the label disclosed in Patent Document 4, the length in the longitudinal direction of the metal plate on the front side of the folded-back metal plate or the side surface of the connecting portion of the back side metal plate is the communication electromagnetic wave. When the length is about 1/4 of the wavelength, the long communication distance can be realized as an antenna. In the example of the label disclosed in Patent Document 5, a chip is mounted on a strip-shaped micro loop antenna obtained by a metal plate, and a high-frequency current is supplied to the surface of the conductor to be mounted. Electromagnetic wave radiation is performed on the side of the 1C wafer. [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2008-90813 (Patent Document 2) JP-A-2008-123403 (Patent Document 3) JP-A-2008-123222 (Patent Document No. 2008-123222) Japanese Patent Laid-Open Publication No. JP-A-2006-53833 (Non-Patent Document) (Non-Patent Document 1) http://www.hitachi.co.jp/New/ Cnews/030902a.html : Antenna built-in type "μ-Chip (registered trademark)", September 2, 2003 [Content of the invention] (The problem to be solved by the invention) The conventional RFID tag has a metal surface mounting. The above disadvantages, that is, 'there is a disadvantage that communication becomes difficult due to reflection or absorption of electromagnetic waves that are communicated in the mounted metal surface. Therefore, in order to solve the problem that it is impossible to carry out RFID communication, the metal RFID tag has a size of approximately half wavelength, and when the communication frequency used is 2_45 GHz, the approximate size is 50 mm to 60 mm, which is difficult to mount in this size. For small metal faces. The RFID tag with the built-in antenna disclosed in Non-Patent Document 1 is placed in parallel with respect to the mounting surface. Therefore, if it is placed on the metal surface, it will be short-circuited by contact with the metal surface of the tag provided with the antenna, or The built-in antenna is capacitively coupled to the metal surface, and the antenna of the image projected in parallel on the metal surface flows through all the reverse high-frequency currents, so that the antenna and the electromagnetic induction cancel each other out, and it is difficult to perform electromagnetic wave radiation outside. _____ ____ — __________- 8^ -_____________ ____________ ___________________ 201110028 . Therefore, it cannot be set on the metal surface. Further, the structure of the standard disclosed in Patent Document 1 utilizes a mold having an unclosed micro loop antenna size having a winding start point and an end point, and the micro lead-in wires are built in the inner side to be located at the respective starting points. The antenna portion of the minute lead-in wire at the position near the end portion is electromagnetically coupled. The IC chip of the RFID tag is exposed in the direction of electromagnetic wave radiation in the unclosed discontinuous portion ′ of the micro loop antenna mold, i.e., directly below the opening portion. The opening portion of the micro loop antenna mold or the groove portion around it is not protected by metal. Therefore, the rust removing operation by washing or sand blasting of high-pressure jet water or the like is inferior in mechanical strength. There is a problem that the 1C wafer is easily peeled off. Further, the method of directly assembling and mounting the metal surface on the metal surface has a problem that the processing load is increased. Therefore, the requirements for miniaturization of RFID tags are increased. Further, in Patent Document 1, a technique in which an RFID tag is provided at one end of a transmission path and a communication is performed by a reader/writer by the other opening portion is required to be permanently set in the transmission path or to temporarily connect the transmission path to various types. The various readers are integrated only when necessary, and it is difficult to simply remove them when they are not needed.
此外，專利文獻1中以支持模具予以隔離的方法係難 以實現縮小至支持模具尺寸以下之金屬對應標籤。另一方 面，爲了識別小型標籤’將環路狀的探針與同軸纜線與雙 極天線的各元件予以一體化而成的器具除了使器具全體規 模較大以外’另外會有使器具的元件間損失增加而使感度〖S -9- 201110028 降低的課題。 專利文獻2所揭示之將下面作爲接地電極、上面作爲 放射電極的金屬對應標籤則難以製作比放射電極尺寸更爲 小型的標籤。此外，會有在放射電極因靜電或突波電流等 來自外部的電性衝擊而使1C晶片受到破壞之虞。此外， 專利文獻2中在放射電極側隔著介電質片材配置輔助天線 而加長通訊距離的方法，則有在安裝金屬面的設置場所爲 輔助天線的尺寸以下的情形下會有難以適用的課題。 此外，專利文獻2所揭示的RFID標籤雖然亦有被設 置在電磁波放射方向的1C晶片部由樹脂等保護層加以覆 蓋之例，但是由於高壓射流水等的洗淨作業等而容易露出 於外部，因此在電性、機械強度方面存有課題。 此外，專利文獻3所揭示的方式係難以實現形成微小 環路天線之支持模具尺寸以下的小型金屬對應標籤。此外 ，由於在微小環路天線電性連接有1C晶片或阻抗整合電 路，因此會有因靜電或突波電流等來自外部的電性衝擊而 使1C晶片受到破壞之虞。此外，雖然亦有被設置在電磁 波放射方向的I c晶片部由樹脂等加以覆蓋之例，但是由 於高壓射流水等之洗淨作業等而容易露出於外部，因此在 電性、機械強度方面存有課題。 此外，專利文獻4所揭示之天線構造係難以實現天線 尺寸以下的小型標籤。此外，由於在天線安裝1C晶片， 因此會有因靜電或突波電流等來自外部的電性衝擊而使1C 晶片受到破壞之虞。此外’即使被設置在電磁波放射方向 二丄〇: 201110028 的1C晶片部由樹脂等加以覆蓋，亦由於高壓射流水等之 洗淨作業等而容易露出於外部，因此在電性、機械強度方 面存有課題。 此外，專利文獻5所揭示之進行電磁波放射的標籤係 構成爲：1C晶片的平面及與其作電性連接的帶狀微小環路 天線的平面與所安裝的導體面呈平行。換言之，帶狀微小 環路天線的寬幅係大於1C晶片的平面尺寸。在如上所示 之構成中，係有無法安裝在比IC晶片的寬幅或微小環路 天線的寬幅更爲狹窄的薄金屬板的端部的課題。因此，難 以實現捲繞在介電質或磁性體等基材的微小環路天線的尺 寸以下的金屬對應標籤。此外由於將1C晶片與微小環路 天線作電性連接，因此會有因靜電或突波電流等來自外部 的電性衝擊而使1C晶片受到破壞之虞。此外，雖然亦有 被設置在電磁波放射方向的I C晶片部由樹脂等加以覆蓋 之例，但是由於高壓射流水等之洗淨作業等而容易露出於 外部，因此在電性、機械強度方面存有課題。 如上所示，在專利文獻2至5之例中，RFID標籤的 1C晶片部被設置在電磁波放射方向，由於未進行藉由金屬 板等所爲之保護，因此當作爲RFID標籤而安裝在金屬面 時，會有在附著砂土、異物去除或除銹等高壓射流洗淨或 噴砂作業中，在1C晶片部的保護強度方面較爲不佳的課 題。 此外，小型的RFID標籤會有被設置在螺絲頭的陰影 、角落、段差部等通訊電磁波不易到達的地方、或難以接 -11 - 201110028 近讀寫器的場所的情形。 本發明之目的在提供一種即使爲狹窄範圍亦可安裝之 金屬對應的小型RFID標籤及其通訊方法。換言之，本發 明之目的在提供一種以前述之習知技術並無法對應之小型 且寬幅狹窄的RFID標籤的實現方法。 此外’本發明之其他目的在提供一種一面確保對於狹 窄部位或薄金屬板的端部等的安裝、及彎曲或藉由高壓射 流水等之洗淨或噴砂所進行的除銹作業等的撞擊等機械性 耐力，一面亦可維持對突波電流、靜電等電性衝擊之耐力 的小型可金屬對應的R FID標籤。 此外’本發明之其他目的在提供一種對於不易進行通 訊的地方的標籤’無須提升一般讀寫器的通訊電磁波強度 ’而且無須改造讀寫器的內部天線，即可透過非接觸的附 接式檢測器具而由遠離的地點進行通訊的延長檢測器具及 其通訊方法。 (解決課題之手段） 若顯示本發明之代表性構成之一例，則如以下所示。 亦即’本發明之無線射頻識別標籤，其特徵爲具備有：包 含1 c晶片及與該IC晶片相連接的微小環路天線的無線射 頻識別（RFID )標籤本體；隔著絕緣層覆蓋前述1C晶片 的臂部；及用以使前述微小環路天線的環路面與安裝金屬 面呈實質垂直’而將前述RFID標籤本體安裝在金屬構件 的安裝面’前述微小環路天線係作爲包含位於電磁波放射 -12- 201110028 方向之前述1C晶片的至少捲繞1次的環路所形成’前述 臂部係與前述微小環路天線相連接’並且以相當於至少則 述環路之大致半捲的長度朝該環路的捲繞方向延伸而覆蓋 則述1C晶片。 根據本發明之其他特徵，無線射頻識別（R F1D )標籤 之特徵爲具備有：包含微小環路天線及與該微小環路天線 相連接的1C晶片的無線射頻識別（RFID)標籟本體；用 以將前述RF I D標籤本體配置在內側的模具；及用以使前 述微小環路天線的環路面與安裝金屬面呈實質垂直’而將 前述RFID標籤本體安裝在金屬構件的安裝面，前述微小 環路天線係作爲包含前述1 c晶片的至少捲繞1次的環路 所形成，前述模具係具有以覆蓋位於電磁波放射方向之前 述環路上的前述1C晶片的方式’朝前述環路的捲繞方向 延伸而覆蓋前述1C晶片的臂部’在前述微小環路天線的 前述環路的內側、及前述模具與前述環路之間形成有介電 質或磁性體的塡充層。 根據本發明之其他特徵，RFID標籤具備有：將由連 接有1C晶片之呈“L”字或“T”字等形狀之縫隙狀整合電路 、及搭載有該電路之金屬板或箔製雙極天線所構成之 RFID引入線中的雙極天線部分，以殘留1C晶片與整合電 路的方式作切除所成形狀的標籤本體；及將高頻電流由以 跨越前述縫隙狀整合電路的方式所連接之前述1C晶片的1 個電極在前述縫隙狀整合電路作巡回，且以進入至另1個 電極的方式流入，使縫隙狀整合電路兼作爲微小環路天線[ -13- 201110028 ’兼作爲整合電路的微小環路天線的環路面與安裝金屬面 實質上呈直立豎立的直立保持部。 根據本發明之其他特徵，係具備有：包含形成在基材 之上之兼作整合電路的平面狀微小環路天線、及與該微小 環路天線相連接的1C晶片的無線射頻識別（RFID )標籤 本體；及將前述微小環路天線的環路面大致直立在金屬的 安裝面來保持前述RFID標籤本體的直立保持部》 根據本發明之其他特徵，RFID標籤係具有：在1C晶 片上’兼作整合電路的微小環路天線以與無線射頻識別（ RFID )之邏輯電路相同的半導體—體形成的無線射頻識別 (RFID)標籤本體；及以前述1C晶片上的環路面大致垂 直豎立在安裝金屬面的方式形成在前述RFID標籤本體之 表面的直立座部。 根據本發明之其他特徵，由於使前述任一 RFID標籤 實質上垂直豎立在金屬面，因此在金屬面上之RFID標籤 內的微小環路天線流通的高頻電流、及流至投影在金屬面 下所形成之影像的微小環路天線的高頻電流，在金屬面的 交界在呈平行的部分因影像之故，會彼此反向流動而互相 抵消，在垂直部分則係彼此以相同方向流通，藉此等效形 成爲2倍環路面積的微小環路天線，而更加提升被置放於 自由空間及非金屬面之微小環路天線的感度爲其特徵。 根據本發明之其他特徵，前述任一 RFID標籤與安裝 金屬面係直接結合或利用接著材等作間接性電磁耦合，而 在金屬面流通高頻電流。藉此，高頻電流係形成爲以通訊 -14 - 201110028 頻率的波長爲周期的行進波而在金屬面傳播， 在位於傳播方向之不連續部所返回之反射波之 即波高較高的腹部與波高較低的節部、且腹部 部與節部的間隔爲半波長之整數倍之周期的干 與節部明確的駐波來放射電磁波，可在所安裝 籤的正上方或遠離正上方的場所進行通訊。 根據本發明之其他特徵，對於被設置在不 的場所的RFID標籤，係可在讀寫器使用非接 接式檢測器具來進行通訊。該檢測器具係將接 檢測部DT、與其相連接的傳送部T、及接近 將電磁波再放射的再放射部TR —體化設置。 本發明之其他特徵係在用以實施發明之形 明。 (發明之效果） 藉由本發明，可提供一種可設置在金屬物 型的RFID標籤及其通訊方法。亦即，藉由本 通訊電磁波的波長設爲λ時，可實現由λ/43 寸之尺寸的RFID標籤。 此外，藉由本發明，可實現可一面確保機 面亦維持對突波電流、靜電等電性衝擊的耐力 應金屬之構造的RFID標籤。 此外’本發明之RFID標籤係微小環路天 與安裝金屬面呈實質垂直而予以保持。或者呈 使具有平涉 波的波動亦 與腹部或節 渉波或腹部 的 RFID標 易進行通訊 觸的外接附 近標籤側的 讀寫器側而 態中詳加說 上之極爲小 發明，當將 [1C晶片尺 械耐力，一 之小型可對 線的環路面 “L”字或 “T’: -15- 201110028 字等形狀的縫隙狀整合電路兼作爲微小環路天線。因此， 微小環路天線之環路面或形成有縫隙的環路面在所安裝的 金屬面上以90度直立的方式作設置時，投影在金屬面下 的影像的環路面，亦即在前述微小環路天線會流通影像的 高頻電流，但是在金屬面的交界呈平行的部分係以彼此相 抵消的方式流通，在垂直於金屬面上與金屬面下的部分係 彼此以同方向流通，而等效形成爲自由空間2倍之環路面 積的微小環路天線。 此外，藉由使用非接觸的外接附接式檢測器具，即使 RFID標籤因埋設或狹窄部設置之故而呈低感度狀態，亦 可進行通訊。 本發明之其他效果係在用以實施發明的形態中詳加說 明。 【實施方式】 本發明之代表性實施例之RFID標籤係將與朝電磁波 放射方向所設置的微小環路天線相連接的1C晶片部設置 在金屬箔或金屬板等之金屬製臂部正下方，在微小環路天 線之環路的內側、及金屬製臂部與環路之間’形成介電質 或磁性體的塡充層而加以保護強化者。微小環路天線的環 路面係與安裝金屬面實質上呈垂直而予以保持。當將 RFID標籤本體的通訊頻率的波長設爲λ時’則微小環路 天線的環路直徑或長度爲λ/ 10程度以下’或環路面積爲 λ2/100以下。因此，亦可依通訊所使用的電波的頻率或 -16 - 201110028 波長’來改變微小環路天線的形成方法。 例如以微小環路天線之形成方法之第1例而言，在以 具有數km或數十m波長的長波或短波等較低頻率所使用 之使用者在作業時等適於抓取或捏取的尺寸的rFID標籤 中’所需之微小環路天線的尺寸與波長相比既已極小，因 此線圈狀的RFID引入線本身即形成爲微小環路天線。 以形成方法的桌2例而言，在以具有數十cm或十數 cm波長的UHF或微波頻帶的較高頻率所使用之使用者在 作業時等適於抓取或捏取的尺寸的RFID標籤的用途中， 所需之微小環路天線的形成方法係可將以雙極天線爲主之 帶狀RFID引入線捲成環路狀而形成。例如切取帶狀引入 線之中央的1C晶片部所連接之雙極天線之至少其中一方 的一部分，將該帶狀RFID引入線以包含1C晶片部的方式 繞圓成微小環路天線的尺寸，亦即，繞圓成直徑或長度爲 λ/lO左右以下、或環路面積爲λ2/1〇〇以下，藉此形成 捲繞1次的環路。 以形成方法的第3例而言，作爲捲繞1次環路之不同 的形成方法，亦可將UHF或微波的帶狀引入線的ic晶片 部所連接的縫隙形狀整合電路領域當作爲微小環路天線， 切出I C晶片部與整合電路領域，作爲兼作整合電路之捲 繞1次的微小環路天線而形成。 此外，由以如上所示之方法所形成的捲繞1次環路， 在與位於電磁波放射方向之環路上的I C部之間隔著間隔 件等絕緣層，將環路另外連續地延長大致半捲，藉此形成[ -17- 201110028 附有臂部的RFID標籤。使該臂部部分具有用以將IC晶片 部由靜電或突波電流予以遮蔽的電性耐力。藉由將作爲臂 部的延長部分形成爲大致半捲’或形成爲堅固的金屬製臂 部，亦使機械強度同時提升。其中，在本發明中的金屬包 含合金，絕緣層係作直流式絕緣的層，自不待言。 以上所述之各微小環路天線形成方法係分別具有以下 所示之特徵。首先’若爲第1手法，由於已經具有線圈狀 的引入線，因此重新製作的部分較少。此時，將線圏面亦 即環路面大致直立設置在安裝金屬面，可簡單實現以前述 臂部遮蓋來保護內部。 若爲第2手法，具有可藉由在作爲環路核心的芯材（ 介電質或磁性體等媒質或塡充材）纏繞帶狀引入線來簡單 實現，可連續形成如前所述的臂部的特徵。此外，亦具有 在纏繞環路的工程中可自由變更環路尺寸的優點。 相對於第2手法具有將帶狀引入線繞圓的工程，第3 手法係可以按每個連接有1C晶片部的整合電路部進行切 出的方式形成微小環路天線，具有適於可期待大幅降低成 本的大量生產的特徵。 例如在以具有數km或數十m波長的長波或短波等較 低頻率所使用之使用者在作業時等適於抓取或捏取的尺寸 的RFID標籤中，所需之微小環路天線的尺寸與波長相比 既已極小，因此線圈狀的RFID引入線本身即形成爲微小 環路天線。 另一方面，在以具有數十cm或十數cm波長的λ/10 -18- 201110028 左右以下、或環路面積爲λ2/100以下的UHF或微波頻帶 的較高頻率所使用之使用者在作業時等適於抓取或捏取的 尺寸的RFID標籤的用途中，所需之微小環路天線的形成 方法係可將以雙極天線爲主的帶狀RFID引入線捲繞成環 路狀而形成。例如切取帶狀引入線之中央的1C晶片部所 連接之雙極天線之至少其中一方的一部分，將該帶狀 RFID引入線以包含1C晶片部的方式繞圓成微小環路天線 的尺寸，藉此形成直徑或長度爲λ/10左右以下、或環路 面積爲λ2/100以下之捲繞1次的環路。 以捲繞1次環路的不同形成方法而言，亦可將UHF 或微波的帶狀引入線的1C晶片部所連接的縫隙形狀整合 電路領域當作爲微小環路天線，切出1C晶片部與整合電 路領域，作爲兼作整合電路之捲繞1次的微小環路天線而 形成。 此外，由以如上所示之方法所形成的捲繞1次環路， 在與位於電磁波放射方向之環路上的I C部之間隔著間隔 件等絕緣層，將環路另外連續地延長大致半捲，藉此形成 附有臂部的RFID標籤。使該臂部部分具有用以將1C晶片 部由靜電或突波電流予以遮蔽的電性耐力。藉由將作爲臂 部的延長部分形成爲大致半捲，或形成爲堅固的金屬製臂 部’亦使機械強度同時提升。其中，在本發明中的金屬包 含合金，絕緣層係作直流式絕緣的層，自不待言。 以下參照圖示，詳加說明本發明之實施形態之R F ID 標籤及其通訊方法。 -19- 201110028 〔實施例1〕 以本發明第1實施形態而言，針對RFID標籤之 及其動作加以說明。本實施例之RFID標籤係適於設 導體面或金屬面（以下稱爲金屬面或金屬物）而使其 動作的用途。 第1圖係顯示將本發明第1實施形態之RFID標 置在金屬物上之例的斜視圖。 第1實施形態的RFID標籤70係由標籤本體60 立保持部50所構成。標籤本體60係由：在基材5之 由導電材料（例如金屬板或金屬箔等）所形成之平面 微小環路天線7 1 ;及隔著一對電極3 1 a、3 1 b連接在 小環路天線的1C晶片3 0所構成。在微小環路天線’ 內側係形成有縫隙形狀整合電路20，其在與天線平面 交的方向形成開口，且具有1C晶片3 0與微小環路天 之阻抗整合功能。1C晶片30係具備有包含整流部或 理器的積體電路。縫隙形狀整合電路20係在基材（ 層疊膜）設有開口者。如上所示，在本實施形態中， 環路天線71形成爲兼作爲整合電路20的兼作整合電 微小環路天線。 若將通訊頻率的波長設爲λ時，微小環路天線] 環路直徑或環路長度（長邊）以λ/10左右以下、或 面積爲λ2 / 100以下爲宜。微小環路天線極薄， 20μιη左右的厚度，藉由基材5來確保標籤本體60的 構造 置在 進行 籤設 與直 上藉 狀的 該微 的 呈正 線間 微處 例如 微小 路的 1的 環路 例如 機械 -20- 201110028 強度。 直立保持部5 0係使如上所示之薄膜的天線平面（ 路面）與金屬面8實質上呈垂直而將微小環路天線71 置在金屬面8，藉此具有使整合電路20不會以高頻短路 功能。其中，直立保持部50係具有由與微小環路天線 爲相同的材料所構成的平坦座面51(51A、51B、51C) 例如與除了形成爲矩形狀微小環路天線7 1時之4個邊 搭載有1C晶片3 0的邊以外之剩餘3個邊的任一邊呈正 而形成有3處。但是，並非必須設在該等3個邊的所有 ’只要至少形成1處即可。此外，在第1圖中，安裝 AG爲90度，亦即，微小環路天線之環路面垂直豎立在 安裝的金屬面8，但是亦可稍微傾斜。亦即，直立保持 5 0的座面5 1成爲微小環路天線7 1的角度A G係如後所 般，若爲90度±3〇度的範圍（大致直角）即可。 其中，微小環路天線71的材料並非限定爲金屬， 可爲由碳等非金屬材料所構成的導體、或半導體。此外 RFID標籤70的縫隙形狀並非限定爲標籤本體60與直 保持部5 0被組合成L字形的形狀。例如，縫隙形狀可 T字形，或者全體外形可爲直方體狀，若爲達成IC晶 3 〇與微小環路天線71之阻抗整合電路之作用的形狀， 更加適合。 接著，使用第2圖（第2A圖、第2B圖），說明使 RFID之引入線6來製造本發明第1實施形態之RFID標 7 0之例。 環 設 的 7 1 中 交 邊 角 所 部 述 亦 爲 片 即 用 籤 -21 - 201110028 第2A圖係說明由適於製作本發明之實施形! 標籤70之雙極天線I所構成的RF1D引入線 RFID引入線6係在基材5之上藉由鋁等金屬板 形成有厚度爲例如1〇μπι至20μπι左右之雙極天 在第2Α圖係顯示連接有1C晶片30之電極3 la、 隙狀整合電路20的位置關係。由大致1 / 2波;f 引入線6切出以虛線表示的整合電路領域4。 接著，如第2B圖所示，在以虛線B-B表示 路領域4所切出之RFID引入線6的位置中，與 面8作電性接觸時，導電材料之面係位於外側， 屬面8隔著絕緣性基材而以電磁性相接時，導電 則位於內側，分別彎曲成大致直角，設置標籤本 以垂直保持該標籤本體60的直立保持部50。標 係當安裝在金屬面8的安裝角AG爲大致直角時 ，當微小環路天線71的安裝角 AG爲大致直角 作爲金屬對應之RFID標籤70的功能。亦即，藉 持標籤本體60，當被設置在金屬面8時，不會使 20以高頻短路即可。換言之，座部51的表面係 路天線爲相同的導電材料的面，並不需要以絕緣 構成座部5 1。 直立保持部50若標籤本體60的安裝角AG 角，則即使與金屬面8相接觸安裝亦可。 接著，以第3圖（第3 A圖、第3 B圖）說明 1實施形態中之RFID標籤60的縫隙狀整合電路 態之RFID 6的圖。 :或金屬箔 線1者。 3 1 b及縫 I 的 RFID 在整合電 安裝金屬 在安裝金 材料之面 體60、及 鐵本體60 ，換言之 時，具有 由垂直保 整合電路 與微小環 用構件來 爲大致直 本發明第 2〇。該縫 -22 - ___ 201110028 隙狀整合電路20的形狀有各式各樣，例如，若以切 611切斷如第3A圖所示之RFID引入線6中之“T”字 縫隙形狀整合電路2 0 T時’可形成具有“ τ ”字形縫隙 之整合電路的標籤本體60。 此外’若以切出線6 1 1切斷如第3 Β圖所示之 引入線6中呈“ L ”字形的縫隙形狀整合電路2 〇 L的部 ’則可形成具有呈“L”字形縫隙形狀之整合電路的標 體60。 如上所示，分別由RFID引入線6切出整合電路 4而形成標籤本體60，並且將該整合電路領域的下部 成容易在金屬面直立的直立保持部50，藉此獲得如第 (第4A、4B圖）所示之RF1D標籤70。第4A圖之 具有“T”字形縫隙形狀整合電路20T，第4B圖之例係 “L”字形縫隙形狀整合電路20L。 本實施例之RFID標籤70係將呈“L”字或“T”字等 之整合電路兼作爲微小環路天線71 (兼作爲整合電路 小環路天線）而設，將RFID引入線6的縫隙所形成 路面設置成在所安裝的金屬面上以大致90度直立。 第5圖（第5A圖、第5B圖）係說明具備有捲繞 1次之微小環路天線7 1之本實施例的RFID標籤70 用、效果的圖。第5A圖係將附有捲繞數爲1次之微 路天線的RFID標籤70設置在金屬面時的影像RFID 7 0M的關係，亦即實像與虛像之加算的說明圖。在被 於金屬面8之上的RFID標籤7〇及其投影所形成的 出線 形的 形狀 RFID 分時 籤本 領域 加工 4圖 例係 具有 形狀 的微 的環 數爲 的作 小環 標籤 置放 影像[ -23- 201110028 RFID標籤70M中，在流至各個的高頻電流i在交界面相 抵消的方向，在金屬面8的垂直部分以同方向流動。 第5B圖係顯示環路捲繞數爲1次時之第5A圖的 RFID標籤70的環路面積係在以金屬面8作爲交界的部分 ，高頻電流i相抵消所形成的2倍環路面積，亦即與具有 環路面A1與影像環路面AM之合計面積的微小環路天線 等效電路7 1 E爲等效。 第6圖（第6A圖、第6B圖）係說明具備有捲繞數爲 2次之微小環路天線72之本實施例的RFID標籤70的作 用、效果的圖。第6A圖係顯示若爲2次捲繞微小環路天 線72的情形，被置放於金屬面8之上的RFID標籤70及 其投影所形成的影像RFID標籤70M的關係，且顯示在流 至各個的高頻電流i在交界面相抵消的方向，在金屬面8 的垂直部分以同方向流動的情形。 第6B圖係說明環路捲繞數爲2次時之RFID標籤7〇 的環路面積係在以金屬面8作爲交界的部分，高頻電流i 相抵消所形成的2倍環路面積，亦即與具有環路面A1與 AM之合計面積的2次捲繞微小環路天線等效電路72E爲 等效的情形。 如上所示，本實施例之RFID標籤70由於將RFID標 籤大致垂直地豎立在金屬面，因此在金屬面上之RFID標 籤內的微小環路天線流動的高頻電流、與流至投影在金屬 面下所形成之影像的微小環路天線的高頻電流，會在金屬 面的交界呈平行的部分，由於影像，而彼此朝相反方向流 -24- ________ — — 一 201110028 動而相抵消，在垂直部分則係彼此朝同方向流動。因此， 等效上成爲2倍環路面積的微小環路天線，可更加提升被 置放於自由空間及非金屬面之微小環路天線的感度。 第6圖之例雖顯示捲繞數爲2次的情形，但可爲1 · 5 ，亦可爲3等好幾種。在第6圖中係以2次捲繞爲代表。 一般而言，頻率愈高，愈減少捲繞數，而愈減少高頻損失 。UHF或微波中，捲繞數爲1次左右。 在此，將來自微小環路天線的放射電力設爲P、通訊 電磁波的波長設爲λ、微小環路天線的捲繞數設爲N、微 小環路天線的面積設爲A、流至環路的高頻電流設爲i ' 圓周率設爲π，根據下述非專利文獻2「解說 天線的基 礎」P.42 ，以 P = {20 · (2π/λ)4 · (Ν · A)2} · i2 (W) 予以表示。 . 可知P係與捲繞數N與面積A之積的平方成正比。 因此，當N=1時，若A爲2倍，P即爲4倍’使1次 捲繞的微小環路天線的感度’相較於被置放於自由空間或 非導體面，置放於導體面或金屬面時’使用其影像反射’ 具有特別提升的效果。 非專利文獻2 : 「解說 天線的基礎」’作者：岩井 陸路，發行處：東京電氣大學出版局，昭和42年（1967 年）1 1月2 5日初版 作爲前述4倍感度效果的驗證’備妥採用具有微小環 路天線之RFID引入線的取樣標籤。 丨 -25- 201110028 引入線係設爲日立製作所製的RKT102型，在以其爲 基材之厚度4 m m的發泡苯乙燒材，以短邊5mm、長邊 10mm的長方形環路作1次捲繞。此時，將1C晶片部配置 在長邊側l〇mm的中央部。藉此實現具備有短邊爲通訊頻 率之波長的大致1/20波長、長邊爲1/10波長之微小環 路天線的驗證用取樣標籤。 讀取器係爲Sekonic公司製R001M型，以該讀取器進 行飛距離測定。 驗證係藉由求出在作爲金屬板之邊長爲200mm的正 方形且厚度〇.5mm的鋁板中央設有取樣標籤時的飛距離， 爲在作爲非金屬板之邊長爲200mm的正方形且厚度8mm 的橡膠板中央置放取樣標籤時的飛距離的幾倍來進行。 首先，取得將取樣標籤置放於鋁板時的飛距離2 2mm 〇 接著，取得將取樣標籤置放於橡膠板時的飛距離6mm 。（測定例1 ) 因此，飛距離比約爲3.7倍，取得接近理論値4倍的 數値。 在測定時，在取樣標籤爲直線偏波、讀取器爲圓偏波 者的標籤附近，依取樣標籤的設置方向會產生較大的感度 差。因此，將取樣標籤的方向設置在屬於水平偏波與垂直 偏波之中間的45度的方向。 爲了在此便於說明起見，對於水平或垂直偏波設置’ 將讀取器之天線面的縱邊作爲直立偏波、橫邊作爲水平偏 -26 - ___________________ 201110028 波加以定義。 此外，確認出微小環路天線的環路面對金屬面呈90 度的角度時會成爲最大的飛距離。 以確認方法而言，首先，取樣標籤係使用與上述測定 例1的情形爲相同的RFID引入線，以成爲沿著以其爲基 材之尺寸爲寬幅2 mm的厚度、邊長爲10mm之正方形的發 泡苯乙烯材的4個1 Omm邊的正方形環路的方式作1次捲 繞，而製作取樣標籤。 接著，將該取樣標籤使用與測定例1之情形爲相同的 金屬板及讀取器，在金屬板進行環路面的交叉角度別的飛 距離測定。偏波面係以讀取器感度較高者來作飛距離測定 (測定例2 )。 與取樣標籤的角度爲0時，此係相當於平置時，但是 確認此時標籤並未響應，亦即不會作爲金屬對應的標籤而 進行動作，與取樣標籤的角度爲3 0或1 5 0度時，飛距離 爲10mm，與取樣標籤的角度爲60或120度時爲30mm， 與取樣標籤的角度爲90度時爲4 0 mm，此即確認出在金屬 面呈直立，此時即成爲最大的飛距離。 彙整上述測定結果，亦即，將安裝角AG與飛距離的 關係顯示於第7圖。由第7圖可知，峰値感度的8成在以 9〇度爲中心之±30度的範圍內。亦即，直立保持部50的 座面5 1與微小環路天線7丨所成角度AG係以成爲90度土 3〇度的範圍（大致直角）爲宜。 此外，確認出取代在測定例1中所使用的發泡苯乙稀i -27- 201110028 材，而構成取代成藉由橡膠磁石所得之取樣標籤厚度3mm 、寬幅4mm、長度6mm的小型的微小環路天線，可實現 金屬對應的RFID標籤。確認出即使在更加縮短長度的 3mm長的情形下，亦可實現可藉由一般的讀寫器例如 Sekonic公司製R001M型讀取器來進行通訊之金屬對應的 RFID標籤。確認出以該取樣標籤，在厚度0.4mm、寬幅 4mm、長度1 Omm程度下亦進行動作（測定例3 )。 該等係與根據表不前述放射電力之式，並不會與環路 面的形狀相依，而只要面積非爲0，即會進行放射的暗示 相一致。 本實施例之RFID標籤係可與安裝金屬面直接結合， 或者藉接著材等間接作電磁耦合來使用。 第8圖（第8A圖、第8B圖）係將本實施例之rfid 標籤70直接分別以橫長或縱長安裝在金屬面8之事例的 說明圖。 使本實施例之RFID標籤，例如第8圖所示藉由直接 結合’而與安裝金屬面8作電性連接，或者隔著絕緣體藉 由間接結合而與金屬面8作電容式電磁耦合，藉此可由所 安裝的RFID標籤70的正上方或偏離正上方的場所進行通 訊。 亦即，如第9圖所示’由安裝在金屬面8的RFID標 籤70 ’高頻電流i在金屬面8之上流動，行進波WF朝左 右流動’在端部所發生的反射波WR與行進波wf會發生 干涉，產生每1/2波長即產生波動的半波長周期的 201110028 干渉波W。 在第9圖中係顯不金屬面8以1/2波長之整數倍形 成有明確的節部WV與腹部WP的情形，但是若爲1/2 波長以上之任意長度時，即成爲節部WV及腹部WP會變 得不明確的干渉波W »此時朝向空中的電磁放射亦會減少 。如上所示之任意長度之干渉波W的狀況並未加以圖示 〇 如上所示’若使R F 1D標籤與金屬面作電磁耦合，在 金屬面流通高頻電流’高頻電流係形成爲以通訊頻率波長 爲周期的行進波而在金屬面傳播，由具有干涉在位於傳播 方向之不連續部所返回之反射波的波的波動亦即波高較高 的腹部與波高較低的節部’且腹部與腹部或節部與節部的 間隔爲半波長之整數倍之周期的干渉波或腹部與節部明確 的駐波放射出電磁波’可在所安裝的RFID標籤的正上方 或偏離正上方的場所進行通訊。 藉由本發明，以直立保持部大致直立保持極薄之兼作 爲整合電路的微小環路天線的環路面而構成RFID標籤， 因此可提供可設置在金屬物上之極爲小型的RFID標籤。 亦即，藉由本發明，當將通訊電磁波的波長設爲λ時’可 由λ/ 4實現1C晶片尺寸、例如〇.3mm以下之尺寸的 RFID標籤。 (實施例2 ) 接著，說明本發明之第2實施形態。本發明之RF1 D: -29 - 201110028 標籤的形狀及製造方法並非限定於實施例1所示之構成、 方法。在本實施形態中，以RFID標籤70之製法而言，其 特徵爲將兼作爲微小環路天線的整合電路集積在1C晶片 上，而以半導體予以一體化。 亦即，如第1 〇圖所示，亦可全部以半導體來形成金 屬對應的標籤。此時，微小環路天線圖案71S與整合電路 2 〇 S係爲兼用。 亦即，在與ID等1C邏輯電路31的圖案直接連接的 同一半導體基材上，藉由半導體製造製程，可形成爲半導 體晶片等級的RFID標籤70 ’其形成有：形成有兼作爲微 小環路天線之整合電路的圖案等的大致直方體狀的RFID 標籤本體60;及作爲以前述1C晶片上的環路面大致垂直 豎立在安裝金屬面8的方式形成在前述RFID標籤本體表 面的直立支持部50的側面、亦即直立座部5 1 (在圖中爲 3面，51A、51B、51C)。藉由本實施例，當將通訊電磁 波的波長設爲λ時，可由λ/ 4實現1C晶片尺寸之尺寸的 RFID標籤。其中，直立支持部50藉由例如加厚半導體基 板亦即基材5的厚度，可確保作爲直立座部所需面積及機 械強度。 藉由本實施例，僅以半導體製造製程，即可提供可設 置在金屬物上的小型RFID。 本實施例的RFID標籤亦使整合電路20S兼作爲微小 環路天線71S。若將該RFID標籤70以其環路面在所安裝 的金屬面上以90度直立的方式作設置時，雖在投影在金 _____ ____ -30- ____________________________ 201110028 屬面下的影像的環路面、亦即前述微小環路天線流适 的高頻電流，但是在金屬面的交界呈平行的部分係t 互相抵消的方式流通’在金屬面上與金屬面下呈垂请 分係彼此以同方向流通’在等效上成爲自由空間之2 路面積的微小環路天線。 (實施例3 ) 接著’以本發明之第3實施形態而言，在第11 說明有關易於安裝在金屬面的RFID標籤70。 在本實施形態中，爲了對於來自外部的衝撞或壓 保護1C晶片或整合電路’或者爲了提升安裝的方便 係將R F ID標籤7 0，利用高頻且損失少且堅固的介電 磁性體、或該等混合材的樹脂、陶瓷或絕緣性接著劑 以被覆’而易於處理或安裝而且作機械性強化者。在 施形態中，RFID標籤70亦可與安裝金屬面直接結合 藉由接著材等間接地作電磁耦合來使用。 亦即’如第1 1圖所示，藉由介電質或磁性體製 材7〇C來被覆RFID標籤70而變得較爲堅固，而且 藉由螺絲等固著具70B而安裝在金屬面8的RFID標 。此時’固著具可爲金屬製螺絲，亦可爲絕緣性樹脂 爲金屬螺絲’由於可期待作爲引入高頻電流i的感應 電容性導桿（P〇St )的作用’因此若調節長度或位置 改善感度。 在第12圖之例中’係在金屬面8之段差部等使 影像 彼此 的部 倍環 圖中 力而 性， 質或 等加 本實 或者 塡充 易於 籤70 。若 性或 ，可 .用接 -31 - 201110028 著劑70D等簡單地安裝RFID標籤7〇。高頻電流i在段差 部表面流通，通過位於路徑中途的RFID標籤70的IC晶 片30而使其進行動作。 第13圖之例係顯示埋設在金屬的凹處81或螺孔等的 安裝方法。亦即，可進行埋設標籤本體60，以接著劑70D 等予以固定，而不會由金屬面8表面突出的安裝。 如上所示，本發明之RFID標籤由於小型’故可退避 至金屬板之段差部、凹處、角隅部或螺絲頭等凸部之陰影 等堅固的隱藏處而以接著劑程度予以安裝，因此具有可省 略特別的保護模具，或者可省略安裝用之凹部切削作業等 的優點，而減輕安裝作業的負擔。 (實施例4 ) 接著，以本發明之第4實施形態而言，針對藉由 RFID標籤的保護模具而使微小環路天線的機械強度提升 的RFID標籤70加以說明。其中，在本實施形態中，關於 RFID標籤本體60的微小環路天線，將環路面大致直立保 持在金屬的安裝面。 在本實施形態中以形成微小環路天線的方法而言，如 實施例1、2中所述，列舉有切出RFID引入線6之整合電 路20的領域，且使其大致直立在安裝金屬面8者。此時 ，整合電路的縫隙係負責微小環路天線的功能，擔負兼作 2個功能的任務。形成微小環路天線的其他方法係取代切 出前述整合電路20，而將RFID引入線切成包含1C晶片 -32- 201110028 的預定長度，將其至少捲繞1次而重新製作微小環路天線 ，使其大致直立在安裝金屬面8者。關於由該RFID引入 線重新製作微小環路天線的方法，容後詳加說明。在以任 何手段予以形成時’微小環路天線若爲單獨並不能說機械 強度爲充分，因此如以下所述，以採用將該微小環路天線 保持在內部的方式爲宜。 本實施例的RFID標籤係在對來自外部的靜電或突波 電流等電性衝擊而保護1C晶片的目的下，配置在貝構造 、折返構造或折返端子構造等遮蔽構造之模具的內側，藉 由以至少1C晶片30或整合電路20不會短路的方式隔著 絕緣作用的間隔件而作電磁耦合的保護模具而對電性衝擊 予以遮蔽者。間隔件6 1 S可爲空氣，亦可爲介電質或磁性 體的塡充劑7〇C。通常以由介電質或磁性體所構成之同一 材料一體構成間隔件61S與塡充劑70C較爲適合。 在第4實施形態中，RFID標籤70的保護模具的形狀 係有第MA圖的貝構造保護模具70SD1、第14B圖的折返 構造保護模具70 SD2、第14C圖的折返端子構造保護模具 70SD3、第14D圖的端子構造保護模具70SD4之例，分別 可使機械強度提升。其中，在各圖中，間隔件6 1 S係用以 阻止以介電質或磁性體等所形成之標籤本體60的整合電 路與保護模具發生短路的隔離材。 第ME圖係將RFID標籤70的保護模具70A與微小 環路天線一體形成之RFID標籤70之構造的說明圖。該例 係適於使用UHF或微波頻帶之頻率之用途的rFID標籤。 -33- 201110028 第HE圖的（a)係斜視圖、（b)係將ic晶片30的附近加以 放大的圖’在此係將縫隙狀整合電路20與金屬面8呈平 行作配置。（c)係（a)的縱剖面圖。 首先，該例之RFID標籤70的縫隙形狀整合電路20 係隔著所安裝的金屬面8或間隔件61S而與保護模具70A 呈平行’因此無法具有微小環路天線的功能。因此，將包 含1C晶片30的帶狀RFID引入線6至少捲繞1次而作爲 微小環路天線7 1發揮功能，藉由將該微小環路天線7 1之 環路面的一部分，亦即配置有1C晶片3 0之側之相反側的 環路的邊緣（側邊）設爲座部或安裝面51，以大致直立在 所安裝的金屬面8的方式所構成。70C係介電質或磁性體 塡充材。該例之RFID標籤70係將帶狀RFID引入線6利 用以例如UHF或微波頻帶的雙極天線爲主的RFID引入線 切成包含1C部30的預定長度，將該經切剪的引入線以塡 充劑70C爲芯材而繞圓成微小環路天線7 1的尺寸而形成 捲繞1次的環路。 在該例中，RFID標籤70的微小環路天線與保護模具 (臂部）70A —體形成。例如，使用如第2A圖所示之具 備有連接1C晶片30的電極31a、31b及縫隙狀整合電路 20者作爲RFID引入線6。但是，不同於第2A圖之兼作 爲整合電路的微小環路天線，未將RFID引入線6的兩端 切出而直接折曲而形成捲繞1次之環路狀微小環路天線71 。此時，相對於所安裝的金屬面8，整合電路20係呈大致 平行，微小環路天線71係呈大致直立。整合電路2 0係形 ―― ~ — ~~ — — —· — 一 ———._. ^ „ 国 — —' — - - 一 — . · · - - — -34- 201110028 成爲呈“L”字或“T”字等形狀的縫隙狀。亦即，將 RFID引入線6以在微小環路天線71的尺寸包含1C 3〇的方式形成捲繞1次，另外一體形成保護模具。此 在相當於微小環路天線7 1之1個環路的捲繞1次份 點與終點相連的連接地點領域72C中，利用直接連接 接連接之電磁耦合的任一者相連接。此外，形成爲在 電波放射方向的環路上的1C部30的上側，一面隔著 件部分61S等進行絕緣，一面將RFID引入線由連接 領域72C另外連續延長半捲的保護模具亦即附有臂部 的RFID標籤。例如，藉由將RFID引入線6的一端 連續延長大致半捲左右，形成覆蓋標籤本體60的 70A而形成爲RFID標籤70。在該例之RFID標籤70 以將與環路之捲繞1次份中之微小環路天線7 1的金屬 呈平行的部分的長度設爲λ/ 1 0左右、或將捲繞1次 環路內側的面積設爲λ2/ 1〇〇以下爲宜。另一方面， 尺寸的下限値係依該環路所包含的1C晶片30的尺寸 定。臂部70 Α的長度亦可延長至λ/ 4。藉由設置 70Α，使RFID標籤70具有對靜電或突波電流的耐力 電遮蔽），可提高感度。此外，藉由將臂部70A形成 固的金屬製材料，亦可同時使機械強度提升。 第HF圖係具備有保護模具之其他例之RFID標童 的構造說明圖。該例之RFID標籤70係與第14E圖之 樣地，以將帶狀RFID引入線6至少捲繞1次而作爲 環路天線發揮功能的方式作捲繞的環路面構成爲大致Further, in Patent Document 1, it is difficult to achieve a method of supporting the mold to be isolated to a metal-compatible label which is reduced to a size below the support mold size. On the other hand, in order to identify the small tag, the device that integrates the loop-shaped probe and the coaxial cable and the components of the dipole antenna has a larger scale. The problem that the sensitivity is increased and the sensitivity is reduced to S -9- 201110028. According to Patent Document 2, it is difficult to form a label having a smaller size than the radiation electrode, with the metal-corresponding label as the ground electrode and the upper surface as the radiation electrode. In addition, the 1C wafer may be damaged by an electrical impact from the outside due to static electricity or a surge current. Further, in Patent Document 2, the method of arranging the auxiliary antenna via the dielectric sheet to lengthen the communication distance is difficult to apply when the installation location of the metal surface is equal to or less than the size of the auxiliary antenna. Question. In the case of the RFID tag disclosed in Patent Document 2, the 1C wafer portion provided in the electromagnetic wave radiation direction is covered with a protective layer such as a resin. However, the RFID tag is easily exposed to the outside due to a cleaning operation such as high-pressure jet water. Therefore, there are problems in terms of electrical and mechanical strength. Further, in the method disclosed in Patent Document 3, it is difficult to realize a small-sized metal-compatible label having a support die size smaller than that of a micro loop antenna. Further, since the 1C chip or the impedance integrating circuit is electrically connected to the small loop antenna, the 1C wafer is damaged by an external electrical shock such as static electricity or a surge current. In addition, although the I c chip portion which is provided in the direction of the electromagnetic wave radiation is covered with a resin or the like, it is easily exposed to the outside due to a cleaning operation such as high-pressure jet water, and therefore, it is stored in electrical and mechanical strength. There are problems. Further, the antenna structure disclosed in Patent Document 4 is difficult to realize a small tag having an antenna size or less. Further, since the 1C wafer is mounted on the antenna, the 1C wafer is damaged by an external electrical shock such as static electricity or a surge current. In addition, the 1C wafer portion which is disposed in the direction of the electromagnetic wave radiation is covered with a resin or the like, and is easily exposed to the outside due to cleaning work such as high-pressure jet water. Therefore, it is stored in electrical and mechanical strength. There are problems. Further, the label for electromagnetic wave radiation disclosed in Patent Document 5 is configured such that the plane of the 1C wafer and the plane of the strip-shaped micro loop antenna electrically connected thereto are parallel to the mounted conductor surface. In other words, the wide width of the strip-shaped micro loop antenna is larger than the planar size of the 1C wafer. In the configuration as described above, there is a problem that the end portion of the thin metal plate which is smaller than the width of the wide or small loop antenna of the IC chip cannot be mounted. Therefore, it is difficult to realize a metal-corresponding label which is wound around a small loop antenna of a substrate such as a dielectric or a magnetic material. Further, since the 1C chip is electrically connected to the micro loop antenna, the 1C wafer is damaged by an external electrical shock such as static electricity or a surge current. In addition, although the IC chip portion provided in the electromagnetic wave radiation direction is covered with a resin or the like, it is easily exposed to the outside due to washing work such as high-pressure jet water, and therefore, electrical and mechanical strength are present. Question. As described above, in the examples of Patent Documents 2 to 5, the 1C chip portion of the RFID tag is disposed in the electromagnetic wave radiation direction, and since it is not protected by a metal plate or the like, it is mounted on the metal surface as an RFID tag. In the case of high-pressure jet cleaning or sand blasting, such as adhering sand, foreign matter removal, or rust removal, there is a problem that the protection strength of the 1C wafer portion is relatively poor. In addition, small RFID tags may be placed in places where communication electromagnetic waves such as shadows, corners, and stepped parts of the screw head are difficult to reach, or where it is difficult to access a near-reader. SUMMARY OF THE INVENTION An object of the present invention is to provide a small-sized RFID tag corresponding to a metal that can be mounted even in a narrow range and a communication method therefor. In other words, the object of the present invention is to provide a method for realizing a small and narrow RFID tag which is not compatible with the prior art. In addition, the other object of the present invention is to provide an impact such as attachment to a narrow portion or an end portion of a thin metal plate, bending, or a rust removing operation by washing or sand blasting of high-pressure jet water or the like. A small metal-corresponding R FID tag that maintains endurance against electrical shock such as surge current or static electricity while maintaining mechanical endurance. In addition, the other object of the present invention is to provide a label for a place where communication is difficult to perform, without increasing the communication electromagnetic wave strength of the general reader and without changing the internal antenna of the reader, and then through non-contact attachment detection. An extended detection device for communication and communication from a remote location and a communication method thereof. (Means for Solving the Problem) An example of a representative configuration of the present invention is shown below. That is, the radio frequency identification tag of the present invention is characterized by comprising: a radio frequency identification (RFID) tag body including a 1 c chip and a micro loop antenna connected to the IC chip; covering the aforementioned 1C via an insulating layer The arm portion of the wafer; and the mounting surface of the metal tag member to mount the RFID tag body to the mounting surface of the metal frame is substantially perpendicular to the mounting surface of the micro loop antenna. -12- 201110028 The loop of at least one winding of the aforementioned 1C wafer in the direction is formed by 'the arm portion is connected to the micro loop antenna' and is oriented at a length corresponding to at least a half of the loop of the loop The winding direction of the loop extends to cover the 1C wafer. According to still another feature of the present invention, a radio frequency identification (R F1D ) tag is characterized by: a radio frequency identification (RFID) tag body including a micro loop antenna and a 1 C chip connected to the micro loop antenna; The RFID tag body is mounted on a mounting surface of the metal member, the micro ring is configured such that the RF ID tag body is disposed inside the mold; and the loop surface of the micro loop antenna is substantially perpendicular to the mounting metal surface The road antenna is formed as a loop including at least one winding of the 1 c wafer, and the mold has a winding direction toward the loop in such a manner as to cover the 1 C wafer on the loop in the electromagnetic radiation direction. An arm portion that extends over the 1C wafer has a dielectric layer or a magnetic layer formed on the inner side of the loop of the micro loop antenna and between the mold and the loop. According to another feature of the present invention, the RFID tag includes: a slit-shaped integrated circuit having a shape of an "L" or "T" shape to which a 1C chip is connected, and a metal plate or a foil bipolar antenna on which the circuit is mounted The dipole antenna portion of the formed RFID inlet line is formed by cutting the formed label body in a manner of leaving the 1C wafer and the integrated circuit; and connecting the high-frequency current by the manner of crossing the slit-shaped integrated circuit One electrode of the 1C wafer is patrolled in the slit-shaped integrated circuit, and flows into the other electrode, so that the slit-shaped integrated circuit also serves as a small loop antenna [-13-201110028' The loop surface of the loop antenna and the mounting metal surface are substantially upright and upright. According to still another feature of the present invention, there is provided a radio frequency identification (RFID) tag including a planar micro loop antenna which is formed as an integrated circuit formed on a substrate, and a 1C chip connected to the micro loop antenna. And the body of the micro loop antenna is substantially erected on the mounting surface of the metal to maintain the upright holding portion of the RFID tag body. According to other features of the present invention, the RFID tag has a dual-integrated circuit on the 1C chip. The micro-loop antenna is a semiconductor-formed radio frequency identification (RFID) tag body formed by the same radio frequency identification (RFID) logic circuit; and the manner in which the metal surface is substantially vertically erected on the loop surface of the aforementioned 1C wafer An upright seat formed on a surface of the aforementioned RFID tag body. According to another feature of the present invention, since any one of the RFID tags is vertically erected on the metal surface, the high-frequency current flowing through the micro-loop antenna in the RFID tag on the metal surface flows to the metal surface. The high-frequency current of the tiny loop antenna of the formed image, in the parallel part of the intersection of the metal surfaces, flows back in the opposite direction due to the image, and cancels each other in the opposite direction, and flows in the same direction in the vertical portion. This equivalent is formed as a small loop antenna with twice the loop area, and is characterized by a higher sensitivity of the small loop antenna placed in the free space and the non-metallic surface. According to still another feature of the present invention, any one of the RFID tags is directly coupled to the mounting metal surface or indirectly electromagnetically coupled by a bonding material or the like, and a high-frequency current flows through the metal surface. Thereby, the high-frequency current is formed so as to propagate on the metal surface by the traveling wave having the wavelength of the frequency of the communication-14 - 201110028, and the reflected wave which is returned from the discontinuous portion in the propagation direction, that is, the abdomen having a high wave height The node having a low wave height and the interval between the abdomen and the node is a period of an integral multiple of a half wavelength, and the stationary standing wave of the node emits electromagnetic waves, and can be placed directly above or away from the installed mark. Communicate. According to still another feature of the present invention, for an RFID tag that is placed in a location that is not in use, the reader/writer can communicate using a non-contact detecting device. The detecting device is provided by connecting the detecting portion DT, the transmitting portion T connected thereto, and the re-radiating portion TR close to the electromagnetic wave. Other features of the invention are those which are embodied in the invention. (Effect of the Invention) According to the present invention, an RFID tag which can be set in a metal form and a communication method thereof can be provided. That is, when the wavelength of the electromagnetic wave of the communication is set to λ, an RFID tag having a size of λ/43 inch can be realized. Further, according to the present invention, it is possible to realize an RFID tag having a structure capable of ensuring that the surface of the machine can maintain an electrical impact against surge current or static electricity. Further, the RFID tag of the present invention is held in a substantially vertical direction perpendicular to the mounting metal surface. Or in the case of a reader with a symmetry wave that is also in communication with the abdomen or thrifty or an abdomen of the RFID tag, the reader is on the side of the tag near the side of the tag. 1C wafer mechanical endurance, a small loopable loop surface "L" or "T": -15-201110028 word shape slit-like integrated circuit also acts as a small loop antenna. Therefore, the tiny loop antenna When the loop surface or the loop surface formed with the slit is arranged at an angle of 90 degrees on the mounted metal surface, the loop surface of the image projected under the metal surface, that is, the high image of the micro loop antenna is circulated The frequency current, but the parallel portions at the interface of the metal surfaces circulate in a manner that cancels each other, and the portions perpendicular to the metal surface and the metal surface circulate in the same direction, and are equivalently formed twice as free space. A small loop antenna with a loop area. In addition, by using a non-contact externally attached detecting device, even if the RFID tag is in a low-sensitivity state due to the embedding or the narrow portion, it can be advanced. The other effects of the present invention are described in detail in the embodiment for carrying out the invention. [Embodiment] The RFID tag of the representative embodiment of the present invention is connected to a small loop antenna provided in the direction of electromagnetic wave radiation. The 1C chip portion is disposed directly under the metal arm portion such as a metal foil or a metal plate, and forms a dielectric or magnetic body between the inside of the loop of the small loop antenna and between the metal arm portion and the loop. The layer of the micro loop antenna is protected and strengthened. The loop surface of the micro loop antenna is substantially perpendicular to the mounting metal surface. When the wavelength of the communication frequency of the RFID tag body is set to λ, the micro loop antenna is The diameter or length of the loop is less than or equal to λ/10 or the loop area is λ2/100 or less. Therefore, the method of forming the micro loop antenna can be changed according to the frequency of the radio wave used for communication or the wavelength of -16 - 201110028. For example, in the first example of the method of forming a small loop antenna, a user who is used at a lower frequency such as a long wave or a short wave having a wavelength of several km or several tens of m is suitable for operation at work or the like. In the rFID tag of the size taken or pinched, the size of the required small loop antenna is extremely small compared to the wavelength, so the coil-shaped RFID inlet itself is formed as a small loop antenna. For example, in the use of an RFID tag of a size suitable for grasping or pinching at a higher frequency of a UHF or microwave band having a wavelength of tens of centimeters or tens of cm, at the time of operation, The method for forming a small loop antenna is formed by winding a strip-shaped RFID lead wire mainly composed of a dipole antenna into a loop shape, for example, a dipole antenna connected to a 1C chip portion in the center of a strip-shaped lead-in line. A part of at least one of the strip-shaped RFID inlet wires is rounded to a size of a small loop antenna so as to include a 1C chip portion, that is, a diameter or a length of about λ/lO or less, or a loop area Λ2/1〇〇 or less, thereby forming a loop that is wound once. In the third example of the forming method, as a different forming method of the winding primary loop, the gap shape integrating circuit in which the ic chip portion of the UHF or microwave strip-shaped lead-in wire is connected may be used as a micro ring. The path antenna is formed by cutting out the IC chip portion and the integrated circuit field, and is formed as a small loop antenna that is also used for winding the integrated circuit once. Further, by the winding primary loop formed by the above-described method, an insulating layer such as a spacer is interposed between the IC portion on the loop in the direction in which the electromagnetic wave is radiated, and the loop is continuously extended by approximately half a volume. Thereby forming an RFID tag with an arm attached to [ -17- 201110028. The arm portion is provided with electrical endurance for shielding the IC wafer portion from static electricity or surge current. The mechanical strength is also simultaneously increased by forming the elongated portion as the arm portion to be substantially half-rolled or formed as a strong metal arm portion. Among them, the metal in the present invention contains an alloy, and the insulating layer is used as a layer of direct current insulation, and it goes without saying. Each of the micro loop antenna forming methods described above has the following features. First, if it is the first method, since there is already a coil-shaped lead-in wire, there are fewer parts to be reworked. At this time, the wire surface, that is, the loop surface, is substantially erected on the metal surface of the mounting surface, and the inner portion can be easily protected by covering the arm portion. If it is the second method, it can be easily realized by winding a ribbon-shaped lead-in wire in a core material (medium or a dielectric material such as a dielectric or a magnetic material) as a loop core, and the arm as described above can be continuously formed. Characteristics of the department. In addition, it has the advantage that the loop size can be freely changed in the process of winding the loop. In the second method, the strip-shaped lead-in wire is wound around the circle, and the third method can form a small loop antenna so that the integrated circuit portion to which the 1C chip portion is connected can be cut out. The feature of mass production that reduces costs. For example, in a RFID tag of a size suitable for grasping or pinching at a lower frequency such as a long wave or a short wave having a wavelength of several km or several tens of m, a small loop antenna is required. The size is extremely small compared to the wavelength, so the coiled RFID inlet itself is formed as a tiny loop antenna. On the other hand, a user who uses a higher frequency of UHF or microwave band having a wavelength of tens/10 cm or tens of cm below λ/10 -18-201110028 or a loop area of λ2/100 or less is In the use of an RFID tag of a size suitable for grasping or pinching during operation, the required method of forming a small loop antenna can be used to wind a strip-shaped RFID lead wire mainly composed of a dipole antenna into a loop shape. And formed. For example, a part of at least one of the dipole antennas connected to the 1C chip portion at the center of the strip-shaped lead-in wire is cut out, and the strip-shaped RFID inlet wire is wound into a size of a small loop antenna so as to include a 1 C chip portion. A loop having a diameter or a length of about λ/10 or less or a loop area of λ2/100 or less is formed. In the different forming method of the winding one-time loop, the gap shape integrating circuit field connected to the 1C chip portion of the UHF or microwave strip-shaped lead-in wire can also be used as a small loop antenna to cut out the 1C chip portion and In the field of integrated circuits, it is formed as a small loop antenna that doubles as a winding of an integrated circuit. Further, by the winding primary loop formed by the above-described method, an insulating layer such as a spacer is interposed between the IC portion on the loop in the direction in which the electromagnetic wave is radiated, and the loop is continuously extended by approximately half a volume. Thereby, an RFID tag with an arm attached thereto is formed. The arm portion is provided with electrical endurance for shielding the 1C wafer portion from static electricity or surge current. The mechanical strength is simultaneously increased by forming the elongated portion as the arm portion to be substantially half-rolled or formed into a strong metal arm portion'. Among them, the metal in the present invention contains an alloy, and the insulating layer is used as a layer of direct current insulation, and it goes without saying. Hereinafter, the R F ID tag and the communication method thereof according to the embodiment of the present invention will be described in detail with reference to the drawings. -19-201110028 [Embodiment 1] In the first embodiment of the present invention, an RFID tag and its operation will be described. The RFID tag of the present embodiment is suitable for use in which a conductor surface or a metal surface (hereinafter referred to as a metal surface or a metal object) is provided to operate. Fig. 1 is a perspective view showing an example in which the RFID of the first embodiment of the present invention is placed on a metal object. The RFID tag 70 of the first embodiment is constituted by the tag main body 60 standing portion 50. The label body 60 is composed of a planar micro loop antenna 7 1 formed of a conductive material (for example, a metal plate or a metal foil) on the substrate 5; and a small interposed electrode 3 1 a, 3 1 b The 1C chip 30 of the loop antenna is constructed. A slit shape integrating circuit 20 is formed inside the micro loop antenna', which forms an opening in a direction intersecting the plane of the antenna, and has an impedance integration function of the 1C wafer 30 and the micro loop day. The 1C wafer 30 is provided with an integrated circuit including a rectifying unit or a processor. The slit shape integrating circuit 20 is provided with an opening in a substrate (laminated film). As described above, in the present embodiment, the loop antenna 71 is also formed as an integrated electric micro loop antenna which also serves as the integrated circuit 20. When the wavelength of the communication frequency is λ, the loop diameter or loop length (long side) of the small loop antenna is preferably about λ/10 or less, or the area is λ2 / 100 or less. The micro-loop antenna is extremely thin, and has a thickness of about 20 μm. The substrate 5 ensures that the structure of the tag body 60 is placed in the loop of the micro-line between the sign and the straight line, such as the micro path 1 . For example, Machinery-20- 201110028 Strength. The upright holding portion 50 is such that the antenna plane (road surface) of the film as described above is substantially perpendicular to the metal surface 8 and the micro loop antenna 71 is placed on the metal surface 8, whereby the integrated circuit 20 is not made high. Frequency short circuit function. Here, the upright holding portion 50 has a flat seating surface 51 (51A, 51B, 51C) composed of the same material as the micro loop antenna, for example, four sides except for the rectangular loop antenna 7 1 formed in a rectangular shape. One of the remaining three sides other than the side on which the 1C wafer 30 is mounted is formed in three directions. However, it is not necessary to provide all of the three sides of the three sides as long as at least one place is formed. Further, in Fig. 1, the mounting AG is 90 degrees, that is, the loop face of the micro loop antenna is vertically erected on the mounted metal face 8, but may be slightly inclined. That is, the angle A G of the seat surface 51 which is uprightly held 50 is the range of the angle A G of the small loop antenna 7 1 as long as it is 90 degrees ± 3 〇 (substantially right angle). The material of the micro loop antenna 71 is not limited to a metal, and may be a conductor made of a non-metal material such as carbon or a semiconductor. Further, the slit shape of the RFID tag 70 is not limited to the shape in which the label main body 60 and the straight holding portion 50 are combined into an L shape. For example, the slit shape may be T-shaped, or the entire shape may be a rectangular parallelepiped shape, and is more suitable if it is a shape that achieves an impedance integration circuit of the IC crystal 3 and the micro loop antenna 71. Next, an example in which the RFID inlet 16 is used to manufacture the RFID tag according to the first embodiment of the present invention will be described with reference to Fig. 2 (Fig. 2A and Fig. 2B). The ringing angle of the 7 1 middle corner of the ring is also a slice ready-to-use sign-21 - 201110028. Figure 2A illustrates the RF1D lead-in line formed by the dipole antenna I suitable for making the embodiment of the present invention! The RFID inlet 6 is formed on the substrate 5 by a metal plate such as aluminum to form a bipolar day having a thickness of, for example, about 1 μm to 20 μm. In the second drawing, the electrode 3 la, which is connected to the 1C wafer 30, is shown. The positional relationship of the integrated circuit 20 is integrated. From the approximately 1/2 wave; f lead-in line 6 cuts out the integrated circuit field 4 indicated by the dashed line. Next, as shown in FIG. 2B, in the position where the RFID inlet 6 cut by the road area 4 is indicated by a broken line BB, when electrically contacting the surface 8, the surface of the conductive material is located outside, and the surface of the conductive material is 8 When the insulating base material is electromagnetically connected, the conductive material is located on the inner side and bent at a substantially right angle, and the label is placed to vertically hold the upright holding portion 50 of the label main body 60. When the mounting angle AG of the metal surface 8 is mounted at a substantially right angle, the mounting angle AG of the micro loop antenna 71 is substantially right angle as a function of the metal-compatible RFID tag 70. That is, with the label body 60, when it is placed on the metal surface 8, it is not necessary to short-circuit 20 at a high frequency. In other words, the surface pedestal of the seat portion 51 is the same surface of the conductive material, and it is not necessary to form the seat portion 51 by insulation. The upright holding portion 50 can be attached to the metal surface 8 even if the mounting angle AG of the label main body 60 is at an angle. Next, a diagram of the RFID 6 of the slit-like integrated circuit state of the RFID tag 60 in the first embodiment will be described with reference to Fig. 3 (Fig. 3A and Fig. 3B). : or metal foil line 1 person. The RFID of the 3 1 b and the slit I is integrated with the metal mounting body 60 and the iron body 60 of the metal material, in other words, the vertical securing integrated circuit and the micro ring member are substantially straight to the second invention. . The slot -22 - ___ 201110028 has a variety of shapes of the slot integrated circuit 20, for example, if the "T" slot shape integration circuit 2 in the RFID inlet 6 as shown in FIG. 3A is cut by the cut 611 At 0 T', a tag body 60 can be formed which has an integrated circuit having a "τ" shaped slot. Further, if the slit portion of the slit-shaped integrated circuit 2 〇L in the "L" shape in the lead-in line 6 as shown in Fig. 3 is cut by the cut-out line 6 1 1 , an "L"-shaped slit can be formed. The body 60 of the integrated circuit of the shape. As described above, the tag main body 60 is cut out by the RFID lead-in wire 6 to form the tag main body 60, and the lower portion of the integrated circuit field is formed into the upright holding portion 50 which is easy to stand up on the metal surface, thereby obtaining the first (4A, 4B) shows the RF1D tag 70. The Fig. 4A has a "T" shaped slit shape integrating circuit 20T, and the example of Fig. 4B is an "L" shaped slit shape integrating circuit 20L. The RFID tag 70 of the present embodiment is provided with an integrated circuit of an "L" or "T" character as a micro loop antenna 71 (also as an integrated circuit small loop antenna), and the RFID is introduced into the gap of the line 6. The formed road surface is arranged to stand upright at approximately 90 degrees on the mounted metal surface. Fig. 5 (Fig. 5A and Fig. 5B) is a view for explaining the effect of the RFID tag 70 of the present embodiment including the micro loop antenna 7 1 that has been wound once. Fig. 5A is a view showing the relationship between the image RFID 70M when the RFID tag 70 having the micro-antenna of the number of windings is placed on the metal surface, that is, the addition of the real image and the virtual image. The RFID tag 7〇 and its projection formed on the metal surface 8 form a shape of the RFID. -23- 201110028 In the RFID tag 70M, the high-frequency current i flowing to each of them flows in the same direction in the vertical direction of the metal surface 8 in the direction in which the interface cancels. Fig. 5B is a view showing that the loop area of the RFID tag 70 of Fig. 5A when the number of loop windings is one is a portion of the portion where the metal surface 8 is a boundary, and the high-frequency current i cancels the two-fold loop. The area, that is, the small loop antenna equivalent circuit 7 1 E having the total area of the loop surface A1 and the image loop surface AM is equivalent. Fig. 6 (Fig. 6A and Fig. 6B) is a view for explaining the effect and effect of the RFID tag 70 of the present embodiment including the small loop antenna 72 having two windings. Fig. 6A shows the relationship between the RFID tag 70 placed on the metal surface 8 and the image RFID tag 70M formed by the projection if the micro loop antenna 72 is wound twice, and is displayed in the flow to Each of the high-frequency currents i flows in the same direction in the vertical direction of the metal surface 8 in the direction in which the interface cancels. Fig. 6B is a view showing that the loop area of the RFID tag 7〇 when the number of loop windings is two is the portion where the metal surface 8 is the boundary, and the high-frequency current i cancels the double loop area formed. That is, the case where the secondary winding micro-loop antenna equivalent circuit 72E having the total area of the loop faces A1 and AM is equivalent. As shown above, the RFID tag 70 of the present embodiment has a high-frequency current flowing through the micro-loop antenna in the RFID tag on the metal surface, and the flow is projected onto the metal surface because the RFID tag is vertically erected on the metal surface. The high-frequency current of the tiny loop antenna formed by the image formed below will be parallel in the intersection of the metal faces, and will flow in opposite directions due to the image - 24 - ________ - 201110028 Some of them flow in the same direction. Therefore, a small loop antenna equivalent to twice the loop area can further improve the sensitivity of the small loop antenna placed in the free space and the non-metal surface. Although the example of Fig. 6 shows the case where the number of windings is two, it may be 1 · 5 or 3 or the like. In Fig. 6, it is represented by two windings. In general, the higher the frequency, the smaller the number of windings, and the lower the high frequency loss. In UHF or microwave, the number of windings is about one time. Here, the radiation power from the micro loop antenna is P, the wavelength of the communication electromagnetic wave is λ, the number of windings of the micro loop antenna is N, the area of the small loop antenna is A, and the flow is to the loop. The high-frequency current is set to i 'the pi is π, and according to the following Non-Patent Document 2, "Basic explanation of the antenna" P. 42, expressed as P = {20 · (2π/λ)4 · (Ν · A)2} · i2 (W). . It can be seen that the P system is proportional to the square of the product of the number of windings N and the area A. Therefore, when N=1, if A is 2 times, P is 4 times 'the sensitivity of the micro-loop antenna that is wound once is compared to being placed on the free space or non-conductor surface, and placed on When using a conductor surface or a metal surface, 'using its image reflection' has a particularly improved effect. Non-Patent Document 2: "Commentary antenna base '' Author: Iwai land, issuing office: Tokyo Denki University Press, 1967 (1967) November 25 the first edition as a validation of the preceding 4 feel of the effect of 'equipment A sampling tag with an RFID inlet with a small loop antenna is used.丨-25- 201110028 The introduction line is set to RKT102 type manufactured by Hitachi, Ltd., and the foamed styrene-baked material with a thickness of 4 mm as the base material is made up of a rectangular loop with a short side of 5 mm and a long side of 10 mm. Winding. At this time, the 1C wafer portion is placed at the center portion of the long side l〇mm. Thereby, a sampling tag for verification having a micro loop antenna having a short side of a wavelength of a communication frequency of approximately 1/20 wavelength and a long side of 1/10 wavelength is realized. The reader was a model R001M manufactured by Sekonic, Inc., and the reader was used for flying distance measurement. The verification is performed by finding a square with a length of 200 mm on the side of the metal plate and a thickness of 〇. The flying distance at the center of the 5 mm aluminum plate with the sampling label is several times the flying distance when the sampling label is placed in the center of the rubber sheet having a square length of 200 mm and a thickness of 8 mm as the non-metal plate. First, the flying distance when the sampling label was placed on the aluminum plate was 2 2 mm. Next, the flying distance when the sampling label was placed on the rubber sheet was 6 mm. (Measurement Example 1) Therefore, the flying distance ratio is about 3. 7 times, get a number close to the theoretical 値 4 times. In the measurement, in the vicinity of the label where the sampling label is a linear depolarization and the reader is a circularly polarized wave, a large sensitivity difference occurs depending on the direction in which the sampling label is set. Therefore, the direction of the sampling label is set to a direction of 45 degrees which is between the horizontal depolarization wave and the vertical depolarization wave. For the sake of convenience of explanation, for the horizontal or vertical polarization setting, the longitudinal side of the antenna surface of the reader is defined as an upright bias wave and the horizontal side as a horizontal offset -26 - ___________________ 201110028 wave. In addition, it is confirmed that the loop of the micro loop antenna becomes the maximum flying distance when the loop faces the metal surface at an angle of 90 degrees. For the confirmation method, first, the sampling label was the same as the RFID inlet of the above-described measurement example 1, so as to have a thickness of 2 mm in width and a side length of 10 mm along the substrate. A square loop of four 1 Omm sides of a square foamed styrene material was wound once to prepare a sampling label. Next, using the same metal plate and reader as in the case of Measurement Example 1 for the sampling label, the flying distance of the cross-angle of the loop surface was measured on the metal plate. The polarization surface was measured by flying distance using a reader with a higher sensitivity (measurement example 2). When the angle with the sampling label is 0, this is equivalent to flat setting, but it is confirmed that the label does not respond at this time, that is, it does not act as a metal-compatible label, and the angle of the sampling label is 3 0 or 15 At 0 degrees, the flying distance is 10mm, 30mm when the angle of the sampling label is 60 or 120 degrees, and 40 mm when the angle of the sampling label is 90 degrees. This confirms that the metal surface is upright, at this time Become the biggest flying distance. The above measurement results are summarized, that is, the relationship between the mounting angle AG and the flying distance is shown in Fig. 7. As can be seen from Fig. 7, 80% of the peak sensitivity is in the range of ±30 degrees centered on 9 〇. In other words, it is preferable that the seating surface 51 of the upright holding portion 50 and the angle of the small loop antenna 7 are at a range of 90 degrees of soil (a substantially right angle). In addition, it was confirmed that the foamed styrene i -27- 201110028 material used in the measurement example 1 was replaced, and the sampled label obtained by the rubber magnet was replaced by a small micrometer having a thickness of 3 mm, a width of 4 mm, and a length of 6 mm. A loop antenna that implements a metal-compatible RFID tag. It has been confirmed that even in the case of a shorter length of 3 mm, a metal-compatible RFID tag that can be communicated by a general reader such as a R001M type reader manufactured by Sekonic can be realized. Confirm the sampling label with a thickness of 0. The operation was also performed at a level of 4 mm, a width of 4 mm, and a length of 1 Omm (measurement example 3). These equations do not depend on the shape of the loop surface according to the formula for the above-mentioned radiation power, and the implication of radiation is the same as long as the area is not zero. The RFID tag of this embodiment can be directly combined with the mounting metal surface, or can be used by indirect electromagnetic coupling by a material or the like. Fig. 8 (Fig. 8A and Fig. 8B) is an explanatory view showing an example in which the rfid tag 70 of the present embodiment is directly attached to the metal surface 8 in a horizontally long or vertical length. The RFID tag of the present embodiment is electrically connected to the mounting metal surface 8 by direct bonding, for example, as shown in FIG. 8, or capacitively electromagnetically coupled to the metal surface 8 by indirect bonding via an insulator. This can be communicated by the location directly above or offset from the installed RFID tag 70. That is, as shown in Fig. 9, 'the RFID tag 70' mounted on the metal surface 8 'the high-frequency current i flows over the metal surface 8, and the traveling wave WF flows toward the left and right'. The reflected wave WR at the end portion is The traveling wave wf interferes, producing a 201110028 dry W wave W that generates a fluctuating half-wavelength period every 1/2 wavelength. In the ninth figure, the non-metallic surface 8 is formed with a clear segment portion WV and the abdomen WP at an integral multiple of 1/2 wavelength. However, if it is an arbitrary length of 1/2 wavelength or more, it becomes a node portion WV. And the abdomen WP will become unclear dry waves W » At this time, the electromagnetic radiation toward the air will also decrease. The state of the dry chopping W of any length as shown above is not shown. As shown above, 'If the RF 1D tag is electromagnetically coupled to the metal surface, a high-frequency current flows through the metal surface. 'The high-frequency current system is formed to communicate. The frequency wave is a traveling wave of a period and propagates on the metal surface, and the wave having the reflected wave which is returned by the discontinuous portion located in the propagation direction, that is, the abdomen with a high wave height and the node portion having a low wave height and the abdomen The dry wave or the abdomen and the node-defined standing wave radiating electromagnetic waves from the abdomen or the nodes and the nodes at intervals of an integral multiple of half a wavelength can be placed directly above or directly above the mounted RFID tag. Communicate. According to the present invention, the RFID tag is constructed by the upright holding portion which is substantially erected and kept extremely thin as the loop surface of the micro loop antenna of the integrated circuit. Therefore, it is possible to provide an extremely small RFID tag which can be placed on a metal object. That is, with the present invention, when the wavelength of the communication electromagnetic wave is set to λ, the 1C wafer size can be realized by λ/4, for example, 〇. RFID tags of sizes below 3mm. (Embodiment 2) Next, a second embodiment of the present invention will be described. The RF1 D: -29 - 201110028 of the present invention is not limited to the configuration and method shown in the first embodiment. In the present embodiment, the method of manufacturing the RFID tag 70 is characterized in that an integrated circuit which also serves as a micro loop antenna is integrated on a 1C wafer, and is integrated by a semiconductor. That is, as shown in Fig. 1, all of the metals may be formed by a semiconductor. At this time, the small loop antenna pattern 71S and the integrated circuit 2 〇 S system are used together. That is, on the same semiconductor substrate directly connected to the pattern of the 1C logic circuit 31 such as ID, the semiconductor wafer manufacturing process can be formed into a semiconductor wafer grade RFID tag 70' which is formed with a micro loop a substantially rectangular parallelepiped RFID tag body 60 such as a pattern of an integrated circuit of an antenna; and an upright support portion 50 formed on the surface of the RFID tag body so as to be vertically perpendicular to the mounting metal surface 8 on the loop surface of the 1C wafer The side faces, that is, the upright seats 5 1 (three faces in the figure, 51A, 51B, 51C). With the present embodiment, when the wavelength of the communication electromagnetic wave is λ, the RFID tag of the size of the 1C wafer size can be realized by λ/4. Among them, the upright support portion 50 can secure the required area and mechanical strength as an upright seat portion by, for example, thickening the thickness of the semiconductor substrate, i.e., the substrate 5. With the present embodiment, a small-sized RFID that can be placed on a metal object can be provided only by a semiconductor manufacturing process. The RFID tag of this embodiment also causes the integrated circuit 20S to function as the micro loop antenna 71S. If the RFID tag 70 is placed at an angle of 90 degrees on the metal surface to be mounted with its loop surface, although it is projected on the loop surface of the image under the surface of the gold _________ -30- ____________________________ 201110028, In other words, the micro-loop antenna has a high-frequency current, but the portion in which the parallel portions of the metal surfaces are in a mutually offset manner t circulates, 'the metal surface is perpendicular to the metal surface, and the branches are circulated in the same direction.' A small loop antenna that is equivalent to a 2-way area of free space. (Embodiment 3) Next, in the third embodiment of the present invention, an RFID tag 70 which is easily attached to a metal surface will be described in the eleventh embodiment. In the present embodiment, in order to protect the 1C wafer or the integrated circuit from the external impact or pressure protection, or to facilitate the mounting of the RF ID tag 70, a high-frequency and low-loss and strong dielectric electromagnetic body, or The resin, ceramic or insulating adhesive of the mixed materials is coated, and is easy to handle or install and mechanically strengthened. In the embodiment, the RFID tag 70 can also be used in direct contact with the mounting metal surface for indirect electromagnetic coupling by a bonding material or the like. That is, as shown in Fig. 1, the RFID tag 70 is covered by the dielectric material or the magnetic material 7C, which is relatively strong, and is attached to the metal surface 8 by a fixing device 70B such as a screw. RFID tag. In this case, the 'fixing tool can be a metal screw or an insulating resin can be a metal screw' because it can be expected to function as an inductive capacitive guide (P〇St) that introduces a high-frequency current i. Position improvement sensitivity. In the example of Fig. 12, the difference between the portions of the metal surface 8 and the like is such that the images are plucked into each other, and the quality or the equivalent is easily added or easily 70. If sex is or can be. Simply attach the RFID tag 7〇 to the 70D, etc. using the -31 - 201110028. The high-frequency current i flows through the surface of the step portion, and is operated by the IC wafer 30 of the RFID tag 70 located in the middle of the path. The example of Fig. 13 shows a mounting method of embedding in a recess 81 or a screw hole of a metal. That is, the label body 60 can be embedded and fixed by the adhesive 70D or the like without being protruded from the surface of the metal surface 8. As described above, since the RFID tag of the present invention can be retracted to a strong hidden portion such as a shadow of a metal plate, a recess, a corner portion, or a convex portion such as a screw head, the RFID tag is mounted at an adhesive level. It is possible to omit the special protective mold, or to omit the advantage of the cutting work for the recess for mounting, and to reduce the burden of the mounting work. (Embodiment 4) Next, in the fourth embodiment of the present invention, an RFID tag 70 in which the mechanical strength of the micro loop antenna is improved by the protective mold of the RFID tag will be described. In the present embodiment, the loop surface of the micro-loop antenna of the RFID tag main body 60 is substantially erected and held on the metal mounting surface. In the present embodiment, in the method of forming the micro loop antenna, as described in Embodiments 1 and 2, the field of the integrated circuit 20 in which the RFID inlet 6 is cut out is exemplified, and is substantially erected on the mounting metal surface. 8 people. At this time, the slot of the integrated circuit is responsible for the function of the small loop antenna, and is responsible for both functions. Another method of forming a small loop antenna is to cut out the aforementioned integrated circuit 20, and cut the RFID inlet into a predetermined length including 1C wafer-32-201110028, and re-create the micro loop antenna by winding it at least once. Make it stand upright on the metal surface 8 . A method for recreating a small loop antenna from the RFID inlet is described in detail later. When the microcircuit antenna is formed by any means, it is not necessary to say that the mechanical strength is sufficient. Therefore, as described below, it is preferable to use the micro loop antenna in the inside. The RFID tag of the present embodiment is disposed inside the mold of the shielding structure such as the shell structure, the folded-back structure, or the folded-back terminal structure for the purpose of protecting the 1C wafer by an electrical shock such as static electricity or a surge current from the outside. The electrical impact is shielded by a protective mold that is electromagnetically coupled via a spacer that is insulated by at least 1 C wafer 30 or integrated circuit 20 without short-circuiting. The spacer 6 1 S may be air or a dielectric or magnetic charge 〇C. Generally, the spacer 61S and the squeezing agent 70C are integrally formed of the same material composed of a dielectric or a magnetic material. In the fourth embodiment, the shape of the protective mold of the RFID tag 70 is the shell structure protection mold 70SD1 of the MA map, the fold structure protection mold 70 SD2 of the 14th diagram, and the foldback terminal structure protection mold 70SD3 of the 14Cth diagram. The terminal structure of the 14D diagram protects the mold 70SD4, and the mechanical strength can be improved. Here, in each of the figures, the spacer 6 1 S is a spacer for preventing a short circuit between the integrated circuit of the label main body 60 formed of a dielectric material or a magnetic body and the protective mold. The ME map is an explanatory diagram of the structure of the RFID tag 70 in which the protective mold 70A of the RFID tag 70 is integrally formed with the micro loop antenna. This example is an rFID tag suitable for use with the frequency of UHF or microwave bands. -33- 201110028 (a) is a perspective view and (b) is an enlarged view of the vicinity of the ic wafer 30. Here, the slit-like integrated circuit 20 and the metal surface 8 are arranged in parallel. (c) A longitudinal section of the system (a). First, the slit shape integrating circuit 20 of the RFID tag 70 of this example is parallel to the protective mold 70A via the mounted metal surface 8 or the spacer 61S. Therefore, it cannot function as a small loop antenna. Therefore, the strip-shaped RFID inlet 6 including the 1C wafer 30 is wound at least once to function as the micro loop antenna 7 1 , and a part of the loop surface of the micro loop antenna 7 1 is disposed. The edge (side) of the loop on the opposite side of the side of the 1C wafer 30 is defined as a seat portion or mounting surface 51 so as to be substantially erected on the metal surface 8 to be mounted. 70C is a dielectric or magnetic enthalpy. The RFID tag 70 of this example cuts the strip-shaped RFID inlet 6 into a predetermined length including the 1C portion 30 by using an RFID inlet line mainly composed of a dipole antenna such as UHF or a microwave band, and the cut-in lead-in line is The squeezing agent 70C is a core material and is wound into a loop of the small loop antenna 71 to form a loop that is wound once. In this example, the micro loop antenna of the RFID tag 70 is formed integrally with the protective mold (arm portion) 70A. For example, as the RFID inlet 6 as shown in Fig. 2A, the electrodes 31a and 31b and the slit-like integrated circuit 20 having the 1C wafer 30 are connected. However, unlike the small loop antenna which is also an integrated circuit in Fig. 2A, the both ends of the RFID inlet 6 are not cut out and directly bent to form a loop-shaped micro loop antenna 71 that is wound once. At this time, the integrated circuit 20 is substantially parallel with respect to the mounted metal surface 8, and the micro loop antenna 71 is substantially erect. Integrated circuit 2 0 - ——~~~ — — — — — — — — — — — — — — — — — — _. ^ „ Country — — — — — — — — — — — — — — — — — — — — — — · · - - - -34- 201110028 A slit shape in the shape of "L" or "T". That is, the RFID inlet 6 is formed to be wound once in such a manner that the size of the micro loop antenna 71 includes 1 C 3 , and the protective mold is integrally formed. In the connection point area 72C, which is connected to the end point of the winding of one loop of the small loop antenna 71, any one of the electromagnetic couplings of the direct connection is connected. In addition, the protective lead is attached to the upper side of the 1C portion 30 on the loop in the radio wave direction, and the arm is insulated by the member portion 61S, and the arm is further extended by the connection region 72C. Ministry of RFID tags. For example, the RFID tag 70 is formed by continuously extending one end of the RFID inlet 6 by approximately half a roll to form a 70A covering the tag body 60. In the RFID tag 70 of this example, the length of the portion parallel to the metal of the small loop antenna 7 1 in the winding of the loop is set to about λ/1 0 or the winding is once looped. The area of the inner side is preferably λ2 / 1 〇〇 or less. On the other hand, the lower limit of the size is determined by the size of the 1C wafer 30 included in the loop. The length of the arm portion 70 can also be extended to λ/4. By setting 70 Α so that the RFID tag 70 has electrical resistance to static electricity or surge current, the sensitivity can be improved. Further, by forming the arm portion 70A into a solid metal material, the mechanical strength can be simultaneously improved. The HF diagram is a structural explanatory diagram of an RFID child with another example of protecting the mold. In the RFID tag 70 of this example, the loop surface of the package in which the strip-shaped RFID inlet 6 is wound at least once and functions as a loop antenna is formed in a rough manner as in the case of Fig. 14E.
帶狀 晶片 時， 的起 或間 位於 間隔 地點 70A 另外 臂部 中， 面8 份的 環路 而決 臂部 (靜 爲堅 I 70 例同 微小 直立（S -35- 201110028 在安裝金屬面8。在第ME圖之例中，臂部70A與標籤本 體60利用一列帶狀RFID引入線所構成，相對於此，第 MF圖之例係使具備有微小環路天線71的標籤本體6〇的 部分、亦即環路捲繞數1次的部分形成爲與保護模具亦即 臂部70A作分離獨立的構造。第MF圖的（a)係斜視圖， (b)係（a)之標籤本體60的放大圖，（c)係（a)的縱剖面圖。 金屬製臂部70A係作爲折返構造保護模具70SD2而發揮 功能。包夾標籤本體60而將折返構造保護模具70SD2之 金屬製臂部7〇A的相反側設爲座部或安裝面51，藉此構 成爲環路面大致直立在安裝金屬面8。在該例中，亦使 RFID標籤70具有對靜電或突波電流的耐力（靜電遮蔽） ’不僅可提高感度，藉由將臂部70A形成爲堅固的金屬製 材料，亦可同時使機械強度提升。 在該例之RFID標籤70中，由前述非專利文獻2中所 示之放射電力與捲繞數N與微小環路天線之面積A的關 係式、及後述之第16A圖、第16B圖可知，標籤本體60 係相當於當作爲將在本發明中所說明之縫隙形狀整合電路 切出所導出的微小環路天線的標籤本體60。因此，與在第 5B圖中所說明的等效電路爲相同，相對於第1圖等之例 ，視爲在電磁波上無法區別的等效物。因此，關於第14E 圖、第14F圖之例，亦可進行與內裝於第14A圖〜第14D 圖所示之貝構造保護模具70SD1、折返構造保護模具 70SD2、折返端子構造保護模具70SD3、端子構造保護模 具70S D4等各種保護模具時爲同等的動作，而獲得同等效 201110028 果。以下關於所述之各實施例，亦藉由採用第ME圖、第 1 4F圖所示之帶狀微小環路天線而獲得同等效果。 藉由第15圖，說明第4實施形態的作用、效果。在 第4實施形態之各例中，保護模具將突波電流•熔接電流 •靜電放電電流I等放電至金屬面8，藉此保護標籤本體 60內部的1C晶片30免於受到電性衝擊的影響。第1 5圖 係藉由折返構造保護模具來保護RFID標籲70SD2之例。 如上所示，本實施例之RFID標籤係在對來自外部的 靜電或突波電流等電性衝擊，而保護1C晶片的目的下， 配置在貝構造、折返構造或折返端子構造等遮蔽構造之模 具的內側，不僅可實現藉由以至少整合電路不會短路的方 式隔著間隔件而作電磁耦合的保護模具，對電性衝擊予以 遮蔽的RF ID標籤，亦在保護模具設置螺孔，而有助於防 止脫落》 此外’以對於靜電的高電壓或突波電流的大電流的耐 力驗證而言’確認出將因壓電元件所造成之著火器具所發 出的高電壓’直接在以遮蔽構造所被保護的折返端子構造 的RFID標籤作空中放電，而進行正常動作。 此外’確認出以大電流而言，藉由電熔接機，即使以 1 00A程度的電流熔接在以遮蔽構造所被保護的折返端子 構造的RFID標籤亦進行正常動作。 此外’以本實施形態之其他例而言，RFID標籤的保 護模具係因所被保護的RFID標籤的微小環路天線的天線 導體具有寬幅’使實質的微小環路天線面積成爲除了天線 -37- 201110028 導體部分以外的環路面積，但是由於保護模具位於微小環 路天線的外部，由外側略大地將高頻磁通感應至環路’藉 此使實質的微小環路天線面積放大至保護模具所包圍的位 置而使感度提升，而且，貝構造、折返構造或折返端子構 造等遮蔽構造會提升機械強度以及使得對電性衝擊的耐力 提升。 亦即，在第16圖（第16A圖、第16B圖）之例中’ 藉由保護模具，放大實質上微小環路天線71的面積而改 善感度。 首先，第16A圖係附有保護模具的RFID標籤的斜視 圖，將第16A圖的保護模具部分的剖面S-S’顯示在第16B 圖的（B)，將僅有無保護模具的標籤本體60之情形下的剖 面顯示於第16B圖的（A)。說明由於位於各自之微小環路 天線7 1之外部，高頻磁通略大地感應至環路的情形。在 此，第16B圖的（A)係在無保護模具的高頻磁通①I對應 無保護模具的環路面縱尺寸A0。說明若將其以第16B圖 的（B)的保護模具70SD2加以保護時，會形成爲略大之有 保護模具的高頻磁通Φ2，結果藉由保護模具而形成爲放 大環路面縱尺寸AS，因此放大實質微小環路天線71的面 積而改善感度。 如上所示，本實施例之金屬對應RFID標籤由於所被 保護的RFID標籤的微小環路天線的天線導體具有寬幅’ 而使實質微小環路天線面積成爲除了天線導體部分以外的1 環路面積，但是由於保護模具位於微小環路天線的外部’ ___________ ________ _______________： 3 8_-___________________— 201110028 由外側略大地將高頻磁通感應至與環路爲等效的縫隙，藉 此將實質的微小環路天線面積放大至保護模具所包圍的位 置而使感度提升，而且貝構造、折返構造或折返端子構造 等遮蔽構造可實現機械強度的提升以及使得對電氣衝擊的 耐力提升的RFID標籤。 此外，以本實施形態之其他例而言，在第1 7圖（第 17A圖、第17B圖、第17C圖、第17D圖、第17E圖、 第17F圖、第17G圖）中說明藉單極天線長的模具使感度 提升的事例。在該等例中，將保護模具以通訊電磁波之媒 質中之1/4波長之長度之單極天線長的尺寸構成保護模 具而積極地助長共振，以在非金屬面上或在金屬面上均可 進行通訊的方式使感度提升。 亦即，第1 7圖之各例係分別將遮蔽構造的模具，亦 即第17A圖爲貝構造的保護模具70SD1、第17B圖爲折返 構造保護模具70SD2、第17C圖爲折返端子構造70SD3、 第17D圖爲端子構造保護模具70SD4形成爲媒質中之單 極天線長大約Xg/ 4的模具而使感度提升時之RFID標籤 7 0的事例。模具係使用例如不銹鋼。In the case of a strip wafer, the starting or spacing is located in the other 70% of the arm, and the loop is 8 parts of the arm and the arm is fixed (the static is 70) and the small erect (S-35-201110028 is mounted on the metal surface 8). In the example of the ME map, the arm portion 70A and the tag main body 60 are constituted by a row of strip-shaped RFID lead-in wires. In contrast, the MF map is an example of a portion of the tag main body 6 having the micro loop antenna 71. That is, the portion where the number of loops is wound once is formed separately from the arm portion 70A which is a protective mold. (a) is a perspective view of the MF diagram, and (b) is the label body 60 of the (a). (c) is a longitudinal cross-sectional view of (a). The metal arm portion 70A functions as a folding structure protection mold 70SD2. The metal arm portion 7 of the folding structure protection mold 70SD2 is sandwiched by the label main body 60. The opposite side of the crucible A is a seat portion or a mounting surface 51, whereby the loop surface is substantially erected on the mounting metal surface 8. In this example, the RFID tag 70 is also made to have an endurance against static electricity or surge current (electrostatic shielding) 'not only improves the sensitivity, but also forms the arm 70A as strong In the RFID tag 70 of this example, the relationship between the radiation power and the number N of windings and the area A of the micro loop antenna shown in the above Non-Patent Document 2, As will be described later with reference to FIGS. 16A and 16B, the tag main body 60 corresponds to the tag main body 60 which is a small loop antenna derived by cutting out the slit shape integrating circuit described in the present invention. The equivalent circuit described in FIG. 5B is the same, and it is regarded as an equivalent that cannot be distinguished from electromagnetic waves with respect to the example of Fig. 1 and the like. Therefore, the examples of the 14Eth and 14Fth drawings can also be performed. The same applies to the various types of protection molds, such as the shell structure protection mold 70SD1, the folding structure protection mold 70SD2, the return terminal structure protection mold 70SD3, and the terminal structure protection mold 70S D4, which are shown in Figs. 14A to 14D. The same as the above-mentioned embodiments, the same effect is obtained by using the strip-shaped micro loop antenna shown in the ME map and the 14F, and the fourth effect is illustrated by the fifteenth figure. In the respective examples of the fourth embodiment, the protective mold discharges the surge current, the welding current, the electrostatic discharge current I, and the like to the metal surface 8, thereby protecting the 1C wafer 30 inside the label main body 60 from the inside. It is affected by the electrical impact. Figure 15 is an example of protecting the RFID standard by using the folded structure to protect the mold. As shown above, the RFID tag of this embodiment is electrically connected to the external static electricity or surge current. For the purpose of protecting the 1C wafer, it is disposed inside the mold of the shielding structure such as the shell structure, the folded-back structure, or the folded-back terminal structure, and it is possible to realize not only the spacer but also the spacer without being short-circuited by at least the integrated circuit. The electromagnetically coupled protection mold, the RF ID tag that shields the electrical impact, also protects the mold from setting screw holes, which helps prevent the dropout. In addition, the 'endurance verification with high current or high current for static electricity In the case of 'recognizing that the high voltage emitted by the ignition device caused by the piezoelectric element' is directly on the RFID tag constructed with the folded-back terminal protected by the shielding structure Discharge in the air and perform normal movements. Further, it has been confirmed that, with a large current, an RFID tag having a structure of a turn-back terminal protected by a shield structure with a current of about 100 A is normally operated by an electric fusion machine. Further, in another example of the present embodiment, the protection mold of the RFID tag is wide in the antenna conductor of the micro loop antenna of the protected RFID tag, so that the substantial micro-loop antenna area becomes the antenna-37. - 201110028 The loop area outside the conductor part, but since the protective mold is located outside the tiny loop antenna, the high frequency flux is slightly induced from the outside to the loop', thereby amplifying the substantial micro loop antenna area to the protective mold The surrounding position enhances the sensitivity, and the shielding structure such as the shell structure, the folded-back structure, or the folded-back terminal structure enhances the mechanical strength and improves the endurance against electrical shock. That is, in the example of Fig. 16 (Fig. 16A, Fig. 16B), the sensitivity is improved by amplifying the area of the substantially small loop antenna 71 by protecting the mold. First, Fig. 16A is a perspective view of the RFID tag with the protective mold attached, and the section S-S' of the protective mold portion of Fig. 16A is shown in (B) of Fig. 16B, and the label body 60 having only the unprotected mold is provided. The cross section in the case of the case is shown in (A) of Fig. 16B. It is explained that the high-frequency magnetic flux is slightly induced to the loop due to being located outside the respective small loop antennas 71. Here, (A) of Fig. 16B corresponds to the high-frequency magnetic flux 1I of the unprotected mold corresponding to the longitudinal dimension A0 of the loop surface of the unprotected mold. It is to be noted that if it is protected by the protective mold 70SD2 of (B) of Fig. 16B, a high-frequency magnetic flux Φ2 of a slightly larger protective mold is formed, and as a result, the longitudinal direction of the enlarged loop surface is formed by protecting the mold. Therefore, the area of the substantially small loop antenna 71 is amplified to improve the sensitivity. As described above, the metal-corresponding RFID tag of the present embodiment has a substantially small loop antenna area as a loop area other than the antenna conductor portion because the antenna conductor of the micro loop antenna of the protected RFID tag has a wide width ' , but because the protective mold is located outside the tiny loop antenna '___________ ________ _______________: 3 8_-___________________ - 201110028 The high-frequency flux is slightly induced from the outside to the gap equivalent to the loop, thereby taking the substantial microring The area of the antenna of the road is enlarged to a position surrounded by the protective mold to improve the sensitivity, and the shielding structure such as the shell structure, the folded-back structure or the folded-back terminal structure can realize an improvement in mechanical strength and an RFID tag which improves the endurance against electrical shock. Further, in another example of the present embodiment, the borrowing list is described in the seventh embodiment (17A, 17B, 17C, 17D, 17E, 17F, 17G). An example in which the long antenna of the pole antenna enhances the sensitivity. In these examples, the protection mold is configured to protect the mold by the size of the monopole antenna length of the length of the 1/4 wavelength in the medium of the communication electromagnetic wave to actively promote the resonance to be on the non-metallic surface or the metal surface. The way to communicate is to increase the sensitivity. In other words, in the respective examples of the seventh embodiment, the molds for the shielding structure, that is, the protective molds 70SD1 and 17B in Fig. 17A are the folded structure protective molds 70SD2, and the 17C is the folded-back terminal structure 70SD3. Fig. 17D is an example of the RFID tag 70 when the terminal structure protection mold 70SD4 is formed as a mold having a monopole antenna length of about Xg/4 in the medium and the sensitivity is improved. The mold is made of, for example, stainless steel.
此外，第1 7E圖之例係形成爲將第1 4E圖的微小環路 天線7 1的金屬製臂部70A由連接地點領域72C另外以E =Xg/ 4或接近於此的長度（大約λ§// 4 )朝水平方向連 續延長而由上方覆蓋1C晶片30之附有臂部70Α的形狀。 構成爲：包夾標籤本體60而將金屬製臂部70Α之相反側 設爲座部或安裝面51，藉此使環路面大致直立在安裝金屬ES -39- 201110028 面8。 此外’第1 7F圖之例係形成爲將第丨4F圖的微小環路 天線71的上下金屬製臂部70A由連接地點領域72C另外 以E=kg/4或接近於此的長度（大約lg/4)朝水平方 向連續延長而覆蓋1C晶片30之附有臂部70A之貝構造的 保護模具70SD1 。 此外，第1 7G圖之例係顯示具備有表面模樣爲C型平 面保護模具70SD5的RFID標籤70。在第17G圖中，（a) 爲RFID標籤70的斜視圖，（b)爲（a)的a-a’剖面圖。第 1 7B圖之例爲具有凸形的突起部，相對於此，在第1 7G圖 之例中，則在模具70SD5以同一平面形成安裝孔78、及 主要以媒質中的單極天線長使其共振的構造的金屬製臂部 70A，形成爲將突起部予以平滑化的構造的RFID標籤70 。金屬製臂部70A係以Xg/ 4或接近於此的長度（大約 λ§/ 4)朝水平方向連續延長而由上方覆蓋1C晶片30。在 金屬製臂部70Α的周圍有C字模樣或U字形的間隙79。 在臂部70Α的正下方（最適位置並非限於臂部的根部位置 ，若取整合時，會有從根部稍微偏移的情形），隔著間隔 件61S內裝有標籤本體60，1C晶片30被配置在保護模具 的內側。在該例中，標籤本體6 0係形成爲如第1 4 F圖之 (c)所示之剖面構成。 另外在第17G圖之例中，當將模具70SD5的全長形 成爲以半波長共振的長度時，在自由空間或非金屬上亦可 實現更高的感度。 -40 - 201110028 如上所示，爲了提升RFID標籤70的感度，除了貝構 造 '折返構造或折返端子構造等遮蔽構造所代表的保護模 具以外，以通訊電磁波之媒質中之1/4波長之長度之單 極天線長的尺寸構成保護模具而積極地助長共振，可實現 以在非金屬面上或在金屬面上均可進行通訊的方式使感度 提升的RFID標籤。 本發明之RFID標籤70係不僅在金屬面上，連設置在 非金屬面上亦可以高感度來進行通訊。例如構成將標籤本 體60，以在以通訊電磁波的1/2波長共振之長度的金屬 板中央控入凹處等而配置在雙極天線之供電點的方式作設 置、或者在可連接例如1/4波長之長度之單極天線長的 尺寸的保護模具2個而形成之大致半波長之長度的天線的 供電點配置標籤本體60而形成的雙極天線尺寸的保護模 具，藉此可實現積極地助長共振，無論在非金屬面上或在 金屬面上均可以高感度進行通訊的RFID標籤。 第1 8 A圖之例係顯示藉由以半波長共振的雙極天線長 λ/2來構成保護模具的尺寸，而使感度提升之rfid標籤 7 〇之事例圖。 第18B圖之例係具備有Η形平面保護模具70SD6之 RFID標籤70之例。第18Β圖的（a)係RFID標籤70的斜 視圖’（b)係（a)的 a-a’剖面圖。第17G圖之例中的金屬製 臂部70A爲1個，相對於此，在第1 8B圖之例中係具有使 2個金屬製臂部70A相對向，設置間隙79而使兩臂部的 前端不相接觸而配置的構造。亦即在雙極天線模具77的 -41 - 201110028 表面形成有因間隙79所造成之“Η”字形的模樣。在任一方 臂部70Α的正下方（最適位置係爲了取得電磁波模式之臂 部的整合而由中央稍微偏移而決定），隔著間隔件61S內 裝有標籤本體60，1C晶片30被配置在保護模具的內側。 因此，標籤本體60形成爲受到電性機械強化的構造。另 外由於模具70S D6的全長爲半波長的尺寸，因此即使在包 含自由空間的非金屬面上，亦在安裝在金屬面上時，亦可 實現可以高感度來進行通訊的RFID標籤70。 第1 8C圖之例係使用一對兼作發生電磁波模式的保護 模具70SD7的RFID標籤70。第18C圖的（a)爲斜視圖、 (b)爲（a)的a-a’剖面圖。在該例中，2枚大致圓形的金屬板 (兼作發生電磁波模式的保護模具）70SD7在其大致中央 (最適位置係爲了取得電磁波模式的整合而由中央稍微偏 移而決定），隔著間隔件6 1 S來夾持標籤本體60，利用 介電質或磁性體塡充材70C予以固定。將該rfid標籤70 設置在安裝金屬面8，若由上方進行通訊時，在上面的金 屬板70SD7的外部表面及內側表面流通由微波理論而知的 高頻電流，以電磁波模式而言，會分布圓形共振板之TM 基本模式的電流iTM。該電流的最佳共振條件若將70c內 部的波長亦即媒質中的波長設爲Xg、將圓周率設爲π、將 金屬板的外形尺寸設爲Di時，則以Di = (1.841/7t)Xg予以 供予。在此，1.84〗係微分形式的第—種貝塞爾函數（ Bessel function)的最小根的有效數値4位數。 在該例中’以TM基本模式進行共振的高頻電流隔著 201110028 間隔件6 1 S而與標籤本體60作電磁耦合，作爲與兼作發 生電磁波模式的保護模具70SD7 —體化的RFID標籤70 而發揮功能。 在第18C圖的（a)中，停止置換成高頻電流分布之交 替的一瞬狀態而以箭號標記。順帶一提，箭號的起點爲+ 的最大電位部分、箭號去處終點爲-的最大電位部分、箭 號中央爲〇電位（圖中的〇電位線），此係同時使電流成 爲最大値。〇電位部分即使貫穿較小的安裝孔78或螺絲， 對共振狀態所造成的影響亦較少。 透過第1 8 C圖之例的試作，確認出無論金屬板的平面 形狀爲圓形或正方形，在構成RFID標籤時，以至多1波 長程度的飛距離感度，並不易發現形狀的差與感度的差異 。以1個試作例而言，將金屬板以1邊爲1 6mm的大致正 方形加以置換，將塡充樹脂設爲相對介電係數20的材料 ，將頻率設爲2.45GHz，標籤本體60係由日立製作所製 的μ晶片引入線（RKT102 )所形成。當將該試作RFID標 籤，在0電位部分通過直徑爲3mm的2個螺絲而設置在 十分寬廣的金屬面時，以Sekonic公司製讀取器R001M測 定飛距離而得約1 〇〇mm的飛距離。此外，以其他試作例 而言，無須以直徑71.5mm螺止金屬圓板，將塡充物設爲 相對介電係數1的空氣，以與前述之例爲相同的標籤本體 、與前述之例爲相同的讀取器R001M來測定飛距離而得 1 8 0mm的飛距離。如上所示，發明人係藉由試作例來確認 TM基本模式的共振與0電位的影響❶ -43- 201110028 其中，在第18C圖之例中，雖使用2枚大致圓形的金 屬板（在該圖中，金屬板作爲兼作發生電磁波模式的保護 模具70SD7 )，但如第18D圖之例所示，由於安裝金屬面 側係在安裝時重覆金屬面，因此下側之金屬板係將其省略 ，僅作爲1枚兼作發生電磁波模式的保護模具70SD8亦可 。此外，如第18D圖所示，在自由空間中容易以半波長共 振，因此亦可以成爲“H”字形的方式，以2個臂部70A的 前端不會相接觸的方式使其相對向，在其中一方臂部正下 方（若取電磁波模式的整合，最適位置係臂部正下方的任 何地點），將標籤本體60隔著間隔件61S藉由介電質或 磁性體塡充材70C或接著劑7〇D加以固定。亦即，第i8D 圖之例係將兼作發生半波長共振/電磁波模式的保護模具 70SD8與標籤本體60 —體化的RFID標籤70。 該例之標籤的特徵不僅可將全體厚度減薄金屬板1枚 份，在金屬面以外之例如自由空間中亦可進行動作。此外 ，與第18C圖之例相同地，可在0電位線上設置安裝孔 7 8或螺絲等。此由於金屬板爲1枚，在被置放在安裝金屬 面時，會分布出TM基本模式的電流iTM，但是在自由空 間，TM基本模式會難以共振，取而代之，由於金屬板外 形尺寸Di接近半波長共振尺寸，因此雖然大槪半波長共 振電流ID並非爲最大電流，但是作爲具實用性且充分感 度的RFID標籤70而發揮功能。 TM基本模式的金屬板外形尺寸Di若將通訊波長設爲 122mm、媒質設爲空氣、圓周率設爲 π時，由 Di = -44- 201110028 (1·841/τ〇·122而成爲 71.5mm。另一方面，空氣中的一般 半波長共振尺寸由122/2而爲61mm。亦即，該等（金屬 板外形尺寸Di與一般半波長共振尺寸）的差異爲17%。 若爲至多1波長程度的飛距離感度，將Di由最初設 爲該等之中間的尺寸（此時的中間値爲66mm，差異9% ) ，可實現由金屬面至非金屬面呈安定的感度、而且薄型之 適用範圍寬廣的RFID標籤70。 此外，藉由採用雙極天線模具77，感度會提升，但另 一方面，尺寸成爲約爲2倍的長度。 第1 9圖係爲了提升感度，例如使單極天線75的模具 以2個背對背相連結的構造，可形成全長具有爲空氣中之 半波長之尺寸的雙極天線模具77，感度提升爲與雙極天線 一般，另一方面，尺寸爲約2倍的長度。 亦即，若使感度爲優先時，雖然尺寸會變大，但是依 本實施例，構成以在以通訊電磁波的1 / 2波長共振之長 度的金屬板中央掘入凹處等而配置在雙極天線的供電點的 方式作設置，或在將1/4波長之長度之單極天線長之尺 寸的保護模具2個折返而在連接部分以背對背連接而成之 大致半波長之長度之天線之供電點配置R FID標籤而成的 雙極天線尺寸的保護模具，積極地助長共振，可實現以在 非金屬面上或在金屬面上均可進行通訊的方式使感度提升 的RFID標籤。 (實施例5) -45- 201110028 接著，以本發明之第5實施形態而言，針對將本發明 的RFID標籤使用在由遠離的部位進行通訊之例，在第20 圖（第2〇A圖、第2〇B圖）中加以說明。 在本實施形態中，將上述任一實施例的RFID標籤， 以在與通訊電磁波之波長相比爲較長的金屬絲狀金屬棒表 面，RFID標籤的長邊方向與金屬絲呈平行，RFID標籤內 部的縫隙面大致直立在金屬絲表面的方式作設置（第2 0 A 圖），或者以在金屬棒的端部延長RFID標籤的方式藉由 直接連結或電磁耦合而相連接（第20B圖），在金屬棒表 面流通高頻電流，高頻電流係形成爲以通訊頻率的波長爲 周期的行進波而在金屬面傳播，由具有干涉在位於傳播方 向之不連續部所返回之反射波的波的波動亦即波高較高的 腹部與波高較低的節部，且腹部與腹部或節部與節部的間 隔爲半波長之整數倍之周期的干渉波或腹部與節部明確的 駐波來放射電磁波，可在所安裝的RFID標籤的正上方或 遠離正上方的場所中進行通訊之與金屬棒一體化後之形狀 的RFID標籤及其通訊方法爲特徵。 如第20A圖所示，將標籤本體60以標籤本體的長邊 方向與金屬棒呈平行的方式安裝在金屬絲狀金屬棒9的表 面，使高頻電流i的干渉波在金屬絲狀金屬棒9的表面產 生而放射電磁波，藉此可藉由讀寫器R/W，在安裝有標 籤本體60的正上方或遠離正上方的部位進行通訊。 此外，如第20B圖所示，將RFID引入線6安裝在金 屬絲狀金屬棒9的端部，使得在金屬絲狀金屬棒9表面產 __________ 201110028 生高頻電流i的干渉波而放射電磁波，藉此可藉由讀寫器 R/ W，由安裝有RFID引入線6的正上方或遠離正上方的 部位進行通訊。 其中，在第20 A、20B圖中用以使感度提升的安裝位 置係以設置在距離金屬棒端部爲1 / 4波長的地點或者以 該處爲起點之1/2波長周期之地點爲較爲合適。 若欲在遠離已安裝有RFID標籤之場所的地方進行通 訊時，在將RFID標籤與通訊電磁波波長相比爲較長之金 屬絲狀的金屬棒表面，RFID標籤的長邊方向與金屬絲呈 平行，R F I D標籤內部的縫隙面以大致直立在金屬絲的方 式作設置，或以在金屬棒的端部以延長RFID標籤的方式 直接連結或以電磁耦合相連接而在金屬棒表面流通高頻電 流，高頻電流係形成爲以通訊頻率波長爲周期的行進波而 在金屬面傳播，由具有干涉在位於傳播方向之不連續部所 返回之反射波的波的波動亦即波高較高的腹部和波高較低 的節部，且腹部與腹部或節部與節部的間隔爲半波長之整 數倍之周期的干渉波或腹部與節部明確的駐波來放射電磁 波，可提供與可在所安裝的RFID標籤的正上方或遠離正 上方的場所中進行通訊的金屬棒一體化的形狀的RFID標 籤及其通訊方法。 此外，將上述實施形態之金屬棒透過絕緣以非接觸內 揷在金屬管，使屬於在同軸纜線或同軸管（自由彎曲的同 軸纜線亦在以下稱之爲同軸管）內作傳播之波之一種的同 軸模式波發生，在同軸管的兩端部或單端部的開口部，將[ -47- 201110028 金屬棒由1/10波長之微小雙極天線的尺寸程度延伸至1 /4波長之單極天線的尺寸程度，而在同軸管的外部表面 流通高頻電流。藉此可提供一種高頻電流係形成爲以通訊 頻率的波長爲周期的行進波而在金屬面傳播，使由具有干 涉在位於傳播方向之不連續部所返回之反射波的波的波動 亦即波高較高的腹部和波高較低的節部，且腹部與腹部或 節部與節部的間隔爲半波長之整數倍之周期的干渉波或腹 部與節部明確的駐波發生，可藉由來自在同軸管之外部表 面傳播的干渉波或駐波的電磁波放射來進行通訊之與同軸 管一體化的同軸管形狀的RFID標籤及其通訊方法。 此外，如第21圖（第21A圖、第21B圖）所示，在 同軸纜線或同軸管C的內部導體設置標籤本體60，RFID 標籤可在外部之導體表面的各處進行通訊。 第21A圖係顯示在同軸纜線或同軸管C的內部導體設 置標籤本體60，藉由使流至同軸內部導體的高頻電流i直 接連結在同軸端部的單極天線或微小雙極天線76等天線 •，在同軸內部及外部導體表面流通高頻電流，在外部導體 表面到處均可與讀寫器R/ W進行通訊。 第21B圖係顯示在同軸纜線或同軸管C的兩端部設置 天線部，易於積極地流通流至內部與外部導體之高頻電流 i的情形。 其中，同軸內部的電磁場分布係分布有不具遮斷頻率 的同軸模式（TEM )，但並未特別圖示。 此外’同軸纜線或同軸管C的天線部C1係可形成爲 -48- 201110028 圓柱狀、錐狀、環路狀等各種形狀。天線部的尺寸係在1 /10波長左右的長度的微小雙極天線76至1/4波長的長 度的單極天線長λ/4的範圍內，可設置在同軸端部的兩 端，亦可設置在單側。 此外，在本實施例中，係將上述實施形態的金屬棒透 過絕緣而以非接觸內揷在金屬管，使得屬於在同軸纜線或 同軸管（自由彎曲的同軸纜線在以下亦稱爲同軸管）內作 傳播之波之一種的同軸模式波發生，在同軸管的兩端部或 單端部的開口部，將金屬棒由1 / 4波長的單極天線的尺 寸延長爲微小雙極天線的尺寸程度，可在同軸管的外部表 面流通高頻電流。藉此可提供一種高頻電流係形成爲以通 訊頻率波長爲周期的行進波而在金屬面傳播，使具有平涉 在位於傳播方向之不連續部所返回之反射波的波的波動亦 即波高較高的腹部與波高較低的節部，且腹部與腹部或節 部與節部的間隔爲半波長之整數倍之周期的干渉波或腹部 與節部明確的駐波發生，藉由來自在同軸管的外部表面所 傳播的干渉波或駐波的電磁波放射可進行通訊之與同軸管 —體化的同軸管形狀的RFID標籤的實現及其通訊方法。 前述實施形態3至5中的標籤本體60，第1圖中的標 籤本體60與第14F圖中的標籤本體60在第5B圖中所說 明的等效電路爲相同，爲可交換。因此，除了圖示之例以 外，雖然形式不同’但可爲各種電磁波上爲同等之標籤本 體的組合。 此外’前述實施形態3至5中的標籤本體60係與第 -49- 201110028 14E圖之大致半捲延長的金屬臂部70A消失時之標籤本體 爲等效’在第5B圖中所說明的等效電路成爲相同而爲可 交換。因此’除了圖示之例以外，雖然形式不同，但可爲 電磁波上爲同等的標籤本體的全部組合。 (實施例6 ) 以本發明第6實施形態而言，如第22圖（第22 A圖 、第22B圖）所示’亦可在金屬面8的深處部位設置 RFID標籤70，與附接式檢測器具D進行通訊來加以使用 〇 在本實施形態中，係使用內置有外接於讀寫器之天線 面的雙極天線的附接式檢測器具，且爲雙極天線由該讀寫 器的天線面平行地被安裝在0至通訊電磁波之大致10波 長程度，最好爲I/4波長的位置的器具。藉此可提供一 種對於被設置在彼此密集或無法接近讀寫器的狹窄部位的 前述各實施例的RFID標籤，安裝在讀寫器的該器具的雙 極天線的中央部爲高頻電流的最大區域，因此使該部分接 近目的RFID標籤至電磁感應範圍，可進行I對1之通訊 的外接附接式檢測器具及其通訊方法。 第22A圖係說明與被設置在深處部位而難以響應的 RFID標籤70進行通訊的方法的圖。被安裝在讀寫器R/ W的附接式檢測器具D係由雙極天線棒D2與絕緣性支持 體D 1所構成。附接式檢測器具D將讀寫器R/ W的天線 面DA至D2在隔著0至1/2波長左右的安裝位置h被平 __________________________________^50-___________ 201110028 行設置，使雙極天線棒D2的中心部接近被設在金屬凹處 81的標籤本體60的附近，活用在D2之尤其中央部被感 應的高頻電流i與共通貫穿標籤本體60的高頻磁通φ的 電磁感應而進行通訊。 此外’藉由本實施例，形成爲內置有外接於讀寫器之 天線面的雙極天線的附接式檢測器具，且爲雙極天線由該 讀寫器的天線面平行地被安裝在〇至通訊電磁波之大致1 〇 波長程度’最好爲1 / 4波長的位置的器具。藉此可提供 一種對於被設置在彼此密集或無法接近讀寫器的狹窄部位 的前述各實施例的RFID標籤，安裝在讀寫器的該器具的 雙極天線的中央部爲高頻電流的最大區域，因此使該部分 接近目的RFID標籤至電磁感應範圍，可進行1對1之通 訊的外接非接觸的附接式檢測器具及其通訊方法。 此外’第22B圖係顯示將密集的RFID標籤70，指示 附接式檢測器具D之雙極天線棒D2之感度較高的中央部 爲目的的RFID標籤70，以1對1確實進行通訊的方法。 藉由該通訊方法，確認出與通訊電磁波的波長相比爲 更寬，例如在縱200mm、橫200mm的鋁板上，使外形尺 寸爲厚度3mm、寬幅4mm、長度6mm的小型RFID標籤 以間隙1 m m左右平行密集時，將直徑2 m m、長度52mm 之該雙極天線棒的中央部接近於RFID標籤而可作1對1 之識別。 其中，RFID標籤係使用日立製作所製的引入線（ RKT102 )，讀取器係使用Sekonic公司的R001M。 -51 - 201110028 (實施例7) 以本發明第7實施形態而言，針對本發明之r F丨〇標 籤 '或一般的RFID標籤係通過將電磁波作反射吸收的障 礙物而設置’通過通訊電磁波未直接到達時之障礙物而進 行檢測的檢測器具與其通訊法，在第23圖至第26圖中加 以說明。 以作爲本實施例之對象的通訊電磁波的障礙物GND 而言’有混凝土、瀝青、砂土、水、海水 '金屬物等， RFID標籤爲通過該等而設置者。在本實施例中，藉由延 長檢測器具DTR來進行通訊。延長檢測器具係由：與 RFID標籤進行直接通訊的檢測部DT、傳邊該訊號的傳送 部、接近讀寫器側的再放射部TR、及將其相連接的傳送 部T所構成。檢測部係具有與RFID標籤直接通訊的作用 ，由微小環路 '單極、雙極或陶瓷天線等任何種類的1個 天線所構成。傳送部係具有將進行通訊的電磁波傳送至另 一端的作用’利用同軸線、平衡線、帶線（s t r i p 1 i n e )、 導波管、介電質棒等任何種類的1個天線所構成。再放射 部係具有與附接於此的讀寫器作電磁耦合的作用，可利用 微小環路、單極、雙極、陶瓷、貼片天線（patch antenna )或電磁號角等任何種類的1個天線所構成。最佳的組合 雖依通訊電磁波而異，但若將通訊電磁波設爲LF/HF頻 帶，檢測部與再放射部係以微小環路天線爲較適。若爲 UHF/微波頻帶，檢測部由微小環路、單極、雙極、陶瓷 -52- 201110028 等的天線進行選擇，再放射部係以雙極、陶瓷、貼片天線 等的天線爲較適，傳送部在任何電磁波頻帶域均以同軸線 爲較適。 第23圖之例係LF/HF頻帶之情形下之最佳延長檢 測器具DTR的構成圖。檢測部DTL以微小環路天線所形 成，爲了使感度更加提升，亦可以調諧電容器TCC來調 節共振。再放射部TRL由微小環路天線所形成，使其接近 可與讀寫器R/W進行通訊的位置，爲了使感度更加提升 ，亦可以調諧電容器TCC取共振。傳送部TCX係形成爲 同軸線。其中，DTL及TRL若將各自所接近的微小環路 天線直徑設爲大致相同的尺寸與捲繞數，則易於提升通訊 感度。 第24圖之例係UHF/微波頻帶之情形下之延長檢測 器具DTR，檢測部DTC由陶瓷天線所形成。通訊對象的 RFID標籤70位於狹窄之處時極爲有效。再放射部TRD係 由以雙極天線爲代表的線狀天線所形成，使其接近可與讀 寫器R/W進行通訊的位置。將DTC與TRD相連的傳送 部TCX係形成爲同軸線。 第25圖之例係將第24圖之例中的檢測部DT設爲與 再放射部TRD的雙極天線爲相同構造的檢測部DTD。將 DTD與TRD相連的傳送部TCX係形成爲同軸線。該例係 具有當與被埋設於金屬平面等級的RFID標籤70進行通訊 時，可得充分通訊感度的特徵。Further, the example of Fig. 7E is formed such that the metal arm portion 70A of the micro loop antenna 7 1 of Fig. 4E is additionally made of the connection point region 72C by E = Xg / 4 or a length close thereto (about λ). §// 4) The shape is continuously extended in the horizontal direction and covered with the arm portion 70A of the 1C wafer 30 from above. The label body 60 is sandwiched, and the opposite side of the metal arm portion 70 is defined as a seat portion or a mounting surface 51, whereby the loop surface is substantially erected on the surface of the mounting metal ES-39-201110028. Further, the example of the 1st 7F is formed such that the upper and lower metal arm portions 70A of the micro loop antenna 71 of the fourth embodiment are formed by the connection point area 72C by E=kg/4 or a length close thereto (about lg). /4) The protective mold 70SD1 having the shell structure of the arm portion 70A attached to the 1C wafer 30 is continuously extended in the horizontal direction. Further, the example of Fig. 7G shows an RFID tag 70 having a surface pattern of a C-type planar protection mold 70SD5. In Fig. 17G, (a) is a perspective view of the RFID tag 70, and (b) is a cross-sectional view of a-a' of (a). In the example of the first 7G, the projections have a convex shape. In the example of the first 7G, the mounting holes 78 are formed in the same plane on the mold 70SD5, and the monopole length in the medium is mainly used. The metal arm portion 70A having the resonant structure is formed as an RFID tag 70 having a structure in which the protrusion portion is smoothed. The metal arm portion 70A is continuously extended in the horizontal direction by Xg / 4 or a length (about λ § / 4) close thereto to cover the 1C wafer 30 from above. A C-shaped or U-shaped gap 79 is formed around the metal arm portion 70A. Immediately below the arm portion 70 (the optimum position is not limited to the root portion of the arm portion, if it is integrated, there is a slight offset from the root portion), and the label body 60 is placed in the spacer 61S, and the 1C wafer 30 is It is placed inside the protective mold. In this example, the label body 60 is formed into a cross-sectional configuration as shown in (c) of Fig. 4F. Further, in the example of Fig. 17G, when the entire length of the mold 70SD5 is formed to have a half-wavelength resonance length, a higher sensitivity can be realized in a free space or a non-metal. -40 - 201110028 As described above, in order to increase the sensitivity of the RFID tag 70, in addition to the protective mold represented by the shielding structure such as the folded structure or the folded-back terminal structure, the length of the 1/4 wavelength in the medium for communicating electromagnetic waves is The long dimension of the monopole antenna constitutes a protective mold to actively promote resonance, and an RFID tag that enhances sensitivity by means of communication on a non-metallic surface or a metal surface can be realized. The RFID tag 70 of the present invention can communicate with high sensitivity not only on a metal surface but also on a non-metallic surface. For example, the label main body 60 is disposed so as to be disposed at a feeding point of the dipole antenna at a center of a metal plate that resonates at a half wavelength of a communication electromagnetic wave, or is connected to, for example, 1/ A protective mold of a dipole antenna size formed by arranging the tag body 60 at a power supply point of an antenna having a length of four wavelengths and a length of a single-pole antenna having a length of four wavelengths, thereby forming a substantially half-wavelength length of the antenna Promotes resonance, an RFID tag that communicates with high sensitivity on both non-metallic surfaces and on metal surfaces. The example of Fig. 18A shows an example of the rfid tag 7 〇 which is configured to increase the size of the protective mold by the half-wavelength resonant bipolar antenna length λ/2. The example of Fig. 18B is an example of an RFID tag 70 having a dome-shaped planar protection mold 70SD6. Fig. 18(a) is a perspective view of the oblique view '(b) of the RFID tag 70 taken along line a-a' of (a). In the example of Fig. 17G, the metal arm portion 70A is one. In the example of Fig. 8B, the two metal arm portions 70A are opposed to each other, and the gap 79 is provided to provide the two arm portions. A configuration in which the front end is not in contact with each other. That is, a pattern of "Η" shape due to the gap 79 is formed on the surface of the -41 - 201110028 of the dipole antenna mold 77. Immediately below any one of the arm portions 70A (the optimum position is determined by slightly offsetting the center in order to obtain the integration of the arm portions in the electromagnetic wave mode), the tag body 60 is placed in the spacer 61S, and the 1C wafer 30 is placed in protection. The inside of the mold. Therefore, the label body 60 is formed to be electrically mechanically strengthened. Further, since the entire length of the mold 70S D6 is a half-wavelength, the RFID tag 70 capable of high-sensitivity communication can be realized even when mounted on a metal surface on a non-metallic surface including a free space. In the case of Fig. 18C, a pair of RFID tags 70 which also serve as a protective mold 70SD7 for generating an electromagnetic wave mode are used. (a) of Fig. 18C is a perspective view, and (b) is a cross-sectional view of a-a' of (a). In this example, two substantially circular metal plates (also serving as a protective mold for generating an electromagnetic wave mode) 70SD7 are substantially at the center (the optimum position is determined by a slight shift in the center in order to obtain integration of the electromagnetic wave mode), and the interval is separated. The member 6 1 S holds the label body 60 and is fixed by a dielectric or magnetic entangled material 70C. The rfid tag 70 is placed on the mounting metal surface 8. When the communication is performed from above, a high-frequency current known by microwave theory is distributed on the outer surface and the inner surface of the upper metal plate 70SD7, and is distributed in the electromagnetic wave mode. The current iTM of the TM mode of the circular resonator plate. For the optimum resonance condition of the current, if the wavelength inside 70c, that is, the wavelength in the medium is Xg, the pi is π, and the outer dimension of the metal plate is Di, then Di = (1.841/7t) Xg. Provided. Here, 1.84 is the effective number 値4 digits of the minimum root of the Bessel function of the differential form. In this example, the high-frequency current that resonates in the TM basic mode is electromagnetically coupled to the tag body 60 via the 201110028 spacer 6 1 S as the RFID tag 70 that is also integrated with the protective mold 70SD7 that also functions as the electromagnetic wave mode. Play the function. In (a) of Fig. 18C, the transient state in which the replacement with the high-frequency current distribution is stopped is marked with an arrow. Incidentally, the starting point of the arrow is the maximum potential part of +, the maximum potential part of the arrow where the end point is -, and the center of the arrow is the zeta potential (the zeta potential line in the figure), which simultaneously makes the current become the maximum 値. Even if the zeta potential portion penetrates the small mounting hole 78 or the screw, the effect on the resonance state is less. In the test of the example of Fig. 18C, it was confirmed that the planar shape of the metal plate is circular or square, and the flying distance sensitivity of at most one wavelength is formed when the RFID tag is formed, and the difference and sensitivity of the shape are hardly found. difference. In one test example, the metal plate was replaced with a substantially square shape having one side of 16 mm, and the charge resin was a material having a relative dielectric constant of 20, and the frequency was set to 2.45 GHz, and the label main body 60 was made of Hitachi. The μ wafer lead-in wire (RKT102) produced by the fabrication process was formed. When the test RFID tag was placed on a very wide metal surface by a two-diameter screw having a diameter of 3 mm at a potential portion of 0, a flying distance of about 1 〇〇mm was measured using a reader R001M manufactured by Sekonic Corporation. . In addition, in other test examples, it is not necessary to use a screw having a diameter of 71.5 mm to stop the metal disk and to set the enthalpy as the air having a relative dielectric constant of 1, the same as the above-described example, and the above example. The same reader R001M measures the flying distance to obtain a flying distance of 180 mm. As described above, the inventors confirmed the resonance of the TM basic mode and the influence of the zero potential by a trial example. -43-201110028 In the example of Fig. 18C, two substantially circular metal plates are used. In the figure, the metal plate serves as a protective mold 70SD7 which also serves as an electromagnetic wave mode. However, as shown in the example of Fig. 18D, since the metal surface side of the mounting is repeated at the time of mounting, the metal plate on the lower side is It is also possible to omit only one protective mold 70SD8 which also serves as an electromagnetic wave mode. Further, as shown in Fig. 18D, since it is easy to resonate at a half wavelength in a free space, it may be in the form of an "H" shape, and the front ends of the two arm portions 70A may be opposed to each other without being in contact with each other. Immediately below one of the arms (if the electromagnetic wave mode is integrated, the optimum position is any position directly below the arm), the label body 60 is filled with the dielectric member 61C or the adhesive via the spacer 61S via the dielectric or magnetic body. 7〇D is fixed. That is, the example of the i8D figure will double as the RFID tag 70 in which the protective mold 70SD8 in which the half-wavelength resonance/electromagnetic wave mode is generated and the tag body 60 are integrated. The label of this example is characterized in that not only the entire thickness of the metal sheet can be reduced by one, but also in a free space other than the metal surface. Further, similarly to the example of Fig. 18C, a mounting hole 78 or a screw or the like can be provided on the zero potential line. Since the metal plate is one piece, when the metal surface is placed on the mounting metal surface, the current iTM of the TM basic mode is distributed, but in the free space, the basic mode of the TM is difficult to resonate, and instead, the outer dimension of the metal plate is close to half. Since the wavelength resonance is large, the half-wavelength resonance current ID is not the maximum current, but functions as a practical and sufficient sensitivity of the RFID tag 70. The outer dimensions of the metal plate of the TM basic mode are set to 122 mm for the communication wavelength, air for the medium, and π for the pi, which is 71.5 mm for Di = -44- 201110028 (1·841/τ〇·122. On the one hand, the general half-wavelength resonance size in air is from 122/2 to 61 mm. That is, the difference between the metal plate outer dimensions Di and the general half-wavelength resonance size is 17%. If it is at most 1 wavelength Flying distance sensitivity, Di is originally set to the middle of the size (the middle 此时 at this time is 66mm, the difference is 9%), can achieve a stable sensitivity from the metal surface to the non-metallic surface, and the thin range is applicable to a wide range. In addition, by using the dipole antenna mold 77, the sensitivity is improved, but on the other hand, the size is about twice the length. The nineteenth figure is for improving the sensitivity, for example, the monopole antenna 75 The mold is formed in a structure in which two back-to-back phases are coupled to each other to form a dipole antenna mold 77 having a full length of half a wavelength in air, and the sensitivity is improved to be the same as that of the dipole antenna, and on the other hand, the size is about 2 times. That is, if the sensitivity is In order to give priority to the power supply point of the dipole antenna, it is configured to be placed in a recess or the like at the center of the metal plate having a length of 1/2 wavelength resonance of the communication electromagnetic wave. The R FID tag is disposed in the power supply point of the antenna in which the length of the 1/4 wavelength length of the monopole antenna is folded back and the connection portion is connected to the antenna at a half wavelength of the length of the half-wavelength. The protective mold of the dipole antenna size actively promotes resonance, and realizes an RFID tag with improved sensitivity by means of communication on a non-metallic surface or a metal surface. (Embodiment 5) -45- 201110028 Next, in the fifth embodiment of the present invention, an example in which the RFID tag of the present invention is used for communication from a distant portion is shown in FIG. 20 (FIG. 2A and FIG. 2B). In the present embodiment, the RFID tag of any of the above embodiments has a long side of the RFID tag parallel to the wire, in a surface of the wire-shaped metal bar which is longer than the wavelength of the communication electromagnetic wave. RFI The slit surface inside the D-tag is arranged to be substantially erected on the surface of the wire (Fig. 20A), or connected by direct connection or electromagnetic coupling by extending the RFID tag at the end of the metal bar (20B) (Fig.), a high-frequency current flows through the surface of the metal rod, and the high-frequency current is formed so as to propagate on the metal surface with a traveling wave having a wavelength of a communication frequency as a period, and the reflected wave returned by the discontinuous portion located in the propagation direction with interference The fluctuation of the wave is the abdomen with a high wave height and the node with a low wave height, and the interval between the abdomen and the abdomen or the node and the node is a half of the wavelength of the half-wavelength of the dry wave or the abdomen and the node are clearly resident. An RFID tag and a communication method thereof that radiate electromagnetic waves in a shape in which communication with a metal bar is integrated in a place directly above or away from the mounted RFID tag. As shown in FIG. 20A, the label body 60 is mounted on the surface of the wire-like metal rod 9 in such a manner that the longitudinal direction of the label body is parallel to the metal rod, so that the high-frequency current i is dry-waved in the metal-like metal rod. The surface of 9 is generated to emit electromagnetic waves, whereby communication can be performed by the reader/writer R/W at a portion directly above or away from the tag body 60. Further, as shown in Fig. 20B, the RFID inlet 6 is attached to the end of the wire-like metal rod 9, so that a dry wave of the high-frequency current i is generated on the surface of the wire-like metal rod 9 to emit electromagnetic waves. Thereby, communication can be performed by the reader/writer R/W from a portion directly above or away from the RFID inlet 6 . Wherein, in the 20th and 20thth drawings, the mounting position for improving the sensitivity is set at a position which is 1/4 wavelength from the end of the metal rod or a 1/2 wavelength period from which the starting point is 1/2 wavelength period. As appropriate. If the communication is to be carried away from a place where the RFID tag is installed, the length of the RFID tag is parallel to the wire when the RFID tag is compared with the wavelength of the communication electromagnetic wave to a longer metal wire rod surface. The slit surface inside the RFID tag is arranged to be substantially erected on the wire, or directly connected to the end of the metal bar by extending the RFID tag or connected by electromagnetic coupling to circulate a high-frequency current on the surface of the metal bar. The high-frequency current is formed so as to propagate on the metal surface with a traveling wave having a communication frequency wavelength as a period, and the fluctuation of the wave having the reflected wave returned by the discontinuous portion located in the propagation direction, that is, the abdomen and the wave height having a high wave height. The lower section, and the interval between the abdomen and the abdomen or the node and the node is a half of the wavelength of the dry wave or the abdomen and the node are clearly standing waves to radiate electromagnetic waves, which can be provided and installed. A RFID tag integrated with a metal bar that communicates directly above or away from the RFID tag and a communication method thereof. Further, the metal rod of the above embodiment is permeable to the metal tube by non-contact infiltration, so that the wave which propagates in the coaxial cable or the coaxial tube (the freely bent coaxial cable is also referred to as a coaxial tube hereinafter) One type of coaxial mode wave occurs. At the end portions of the coaxial tube or the opening portion of the single end portion, the [-47-201110028 metal rod is extended from the size of the 1/10 wavelength micro dipole antenna to the 1/4 wavelength. The size of the monopole antenna is high, and the high frequency current flows through the outer surface of the coaxial tube. Thereby, it is possible to provide a high-frequency current system which is formed so as to propagate on the metal surface with a traveling wave having a wavelength of a communication frequency as a period, so that the wave having the interference reflected by the discontinuous portion located in the propagation direction interferes with the fluctuation of the wave. A high-abundance abdomen and a node with a low wave height, and the interval between the abdomen and the abdomen or the segment and the segment is a multiple of a half-wavelength of the dry wave or the abdomen and the node-defined standing wave can be generated by A coaxial tube-shaped RFID tag integrated with a coaxial tube that communicates with dry waves or standing waves propagating on the outer surface of the coaxial tube and a communication method thereof. Further, as shown in Fig. 21 (Fig. 21A, Fig. 21B), the tag body 60 is provided on the inner conductor of the coaxial cable or the coaxial tube C, and the RFID tag can communicate with each other on the outer conductor surface. Fig. 21A shows a label body 60 which is provided on the inner conductor of the coaxial cable or the coaxial tube C, and the monopole antenna or the micro dipole antenna 76 which is directly coupled to the coaxial end by the high-frequency current i flowing to the coaxial inner conductor. The antenna is • The high-frequency current flows through the coaxial inner and outer conductor surfaces, and the reader/writer R/W can communicate with the external conductor surface everywhere. Fig. 21B shows a case where an antenna portion is provided at both ends of the coaxial cable or the coaxial tube C, and it is easy to actively flow a high-frequency current i flowing to the inner and outer conductors. Among them, the electromagnetic field distribution inside the coaxial system is distributed in a coaxial mode (TEM) without a blocking frequency, but is not particularly illustrated. Further, the antenna portion C1 of the coaxial cable or the coaxial tube C can be formed into various shapes such as a cylindrical shape, a tapered shape, and a loop shape from -48 to 201110028. The size of the antenna portion is in the range of a short dipole antenna having a length of about 1/10 wavelength and a length of λ/4 of a length of 1/4 wavelength of the 1/4 wavelength, and may be provided at both ends of the coaxial end portion. Set on one side. In addition, in the present embodiment, the metal rod of the above embodiment is insulated and non-contacted in the metal tube so as to belong to the coaxial cable or the coaxial tube (the freely bent coaxial cable is also referred to as coaxial below). A coaxial mode wave in which one of the waves propagated in the tube is generated, and the metal rod is extended from the 1/4 wavelength monopole antenna to the minute dipole antenna at both end portions of the coaxial tube or the opening portion of the single end portion. The size of the size allows high-frequency current to flow through the outer surface of the coaxial tube. Thereby, it is possible to provide a high-frequency current system which is formed to propagate on a metal surface with a traveling wave having a period of a communication frequency wavelength, so that a wave having a reflected wave which is returned by a discontinuous portion located in the propagation direction, that is, a wave height, that is, a wave height a higher abdomen and a node with a lower wave height, and the interval between the abdomen and the abdomen or the node and the node is a multiple of a half-wavelength of the period of the dry wave or the abdomen and the node-defined standing wave, by The electromagnetic wave emission of the dry wave or the standing wave propagated on the outer surface of the coaxial tube can realize the communication and the coaxial tube-shaped coaxial tube-shaped RFID tag and the communication method thereof. In the label main body 60 of the above-described Embodiments 3 to 5, the label main body 60 in Fig. 1 and the label main body 60 in Fig. 14F are the same in the equivalent circuit shown in Fig. 5B, and are interchangeable. Therefore, in addition to the examples shown in the drawings, although the form is different, it may be a combination of the same label bodies on various electromagnetic waves. In addition, the label main body 60 in the above-described Embodiments 3 to 5 is equivalent to the label body when the substantially half-length extended metal arm portion 70A of FIG. 49-201110028 14E disappears, as described in FIG. 5B. The circuit is identical and interchangeable. Therefore, in addition to the examples shown in the drawings, although the forms are different, they may be all combinations of the label bodies which are equivalent in electromagnetic waves. (Embodiment 6) According to the sixth embodiment of the present invention, as shown in Fig. 22 (Fig. 22A and Fig. 22B), an RFID tag 70 may be provided at a deep portion of the metal surface 8, and attached. The type detecting device D is used for communication. In the present embodiment, an attachment type detecting device incorporating a dipole antenna externally attached to the antenna surface of the reader/writer is used, and the dipole antenna is used by the reader/writer. The antenna faces are mounted in parallel at a position of 0 to approximately 10 wavelengths of the communication electromagnetic wave, preferably at a position of 1/4 wavelength. Thereby, it is possible to provide an RFID tag of the foregoing embodiments which are disposed in a narrow portion which is densely spaced from each other or inaccessible to the reader/writer, and the center portion of the dipole antenna mounted on the reader/writer is the maximum of the high-frequency current. The area, thus the part is close to the target RFID tag to the electromagnetic induction range, and the externally attached detecting device capable of I-to-1 communication and its communication method. Fig. 22A is a view for explaining a method of communicating with the RFID tag 70 which is placed in a deep portion and which is difficult to respond. The attached type detecting device D mounted on the reader/writer R/W is composed of a dipole antenna rod D2 and an insulating support D1. The attached detecting device D sets the antenna faces DA to D2 of the reader/writer R/W at a mounting position h of about 0 to 1/2 wavelength, __________________________________^50-___________ 201110028 to make the dipole antenna rod The center portion of D2 is close to the vicinity of the label main body 60 provided in the metal recess 81, and is utilized by electromagnetic induction of the high-frequency current i induced in the center portion of D2 and the high-frequency magnetic flux φ passing through the label main body 60. communication. Further, in the present embodiment, an attachment type detecting instrument having a dipole antenna externally connected to the antenna surface of the reader/writer is formed, and the dipole antenna is mounted in parallel by the antenna surface of the reader/writer to The communication electromagnetic wave is approximately 1 〇 wavelength degree 'preferably the position of the 1/4 wavelength position. Thereby, it is possible to provide an RFID tag of the foregoing embodiments which are disposed in a narrow portion which is densely spaced from each other or inaccessible to the reader/writer, and the center portion of the dipole antenna mounted on the reader/writer is the maximum of the high-frequency current. The area, thus the part that is close to the target RFID tag to the electromagnetic induction range, can be used for the one-to-one communication of the external non-contact attached detection device and its communication method. In addition, the '22B' shows a method in which the dense RFID tag 70 is used to indicate the central portion of the dipole antenna rod D2 of the attached detecting instrument D, which is highly sensitive, and the communication is performed in a one-to-one manner. . According to the communication method, it is confirmed that the wavelength is wider than that of the communication electromagnetic wave. For example, on an aluminum plate having a length of 200 mm and a width of 200 mm, a small-sized RFID tag having a thickness of 3 mm, a width of 4 mm, and a length of 6 mm is used as a gap 1 When the mm is parallel and dense, the center of the dipole antenna rod having a diameter of 2 mm and a length of 52 mm is close to the RFID tag and can be recognized as one-to-one. Among them, the RFID tag uses a lead-in cable (RKT102) manufactured by Hitachi, Ltd., and the reader uses R001M from Sekonic. -51 - 201110028 (Embodiment 7) In the seventh embodiment of the present invention, the r F丨〇 tag ' or the general RFID tag of the present invention is provided with an electromagnetic wave transmitted through the electromagnetic wave as an obstacle for reflection absorption. A detecting instrument and a communication method for detecting an obstacle that is not directly reached are described in Figs. 23 to 26 . In the case of the obstacle GND of the communication electromagnetic wave which is the object of the present embodiment, there are concrete, asphalt, sand, water, seawater, metal, etc., and the RFID tag is provided by the above. In the present embodiment, communication is performed by extending the detecting means DTR. The extension detecting device is composed of a detecting unit DT that directly communicates with the RFID tag, a transmitting unit that transmits the signal, a re-radiation unit TR that is close to the reader/writer side, and a transmitting unit T that connects the same. The detection unit has a function of directly communicating with the RFID tag, and is composed of a single loop of any type of antenna such as a monopole, a bipolar or a ceramic antenna. The transmission unit has an action of transmitting electromagnetic waves for communication to the other end, and is constituted by any one of any type of antenna such as a coaxial line, a balanced line, a strip line (s t r i p 1 i n e ), a waveguide, or a dielectric rod. The re-radiation unit has an electromagnetic coupling function with the reader/writer attached thereto, and can use any type of one such as a micro loop, a monopole, a bipolar, a ceramic, a patch antenna, or an electromagnetic horn. The antenna is composed of. The optimum combination varies depending on the communication electromagnetic wave. However, if the communication electromagnetic wave is set to the LF/HF band, the detection unit and the re-radiation unit are suitable for the small loop antenna. In the UHF/microwave band, the detection unit is selected by an antenna such as a micro-loop, a single-pole, a bipolar, or a ceramic-52-201110028. The radiation unit is preferably an antenna such as a bipolar, ceramic, or patch antenna. The transmission unit is suitable for coaxial lines in any electromagnetic wave band domain. The example of Fig. 23 is a configuration diagram of the optimum extension detecting device DTR in the case of the LF/HF band. The detecting unit DTL is formed by a small loop antenna, and in order to improve the sensitivity, the capacitor TCC can be tuned to adjust the resonance. The re-radiation portion TRL is formed by a small loop antenna so as to be close to a position where it can communicate with the reader/writer R/W. In order to improve the sensitivity, the tuning capacitor TCC can also take resonance. The conveying portion TCX is formed in the same axis. Among them, DTL and TRL are easy to improve the communication sensitivity if the diameters of the small loop antennas that are close to each other are set to be substantially the same size and the number of windings. The example of Fig. 24 is an extension detecting device DTR in the case of the UHF/microwave band, and the detecting portion DTC is formed by a ceramic antenna. The RFID tag 70 of the communication object is extremely effective when it is located in a narrow place. The re-radiation portion TRD is formed by a linear antenna typified by a dipole antenna so as to be close to a position where communication with the reader/writer R/W is possible. The transmission portion TCX that connects the DTC to the TRD is formed as a coaxial line. In the example of Fig. 25, the detecting unit DT in the example of Fig. 24 is a detecting unit DTD having the same structure as the dipole antenna of the re-radiation unit TRD. The transmission unit TCX that connects the DTD to the TRD is formed as a coaxial line. This example has a feature that sufficient communication sensitivity can be obtained when communicating with the RFID tag 70 embedded in the metal plane level.
第26圖之例係具備有將第24圖之例中的檢測部DTC -53- 201110028 設爲1/4波長之長度之單極天線的檢測部DTM，使將該 DTM與TRD相連的傳送部TCX形成爲同軸線。該例係可 將安裝在金屬管之內壁面或底部的RFID標籤70由管的開 口部***檢測部DTM來進行通訊。 如上所示’本實施例之延長式RFID標籤檢測器具係 當通訊電磁波爲LF/HF頻帶時，將前述檢測部與前述再 放射部設爲微小環路天線，前述傳送部係設爲同軸線。此 外，若通訊電磁波爲UHF/微波頻帶，在前述檢測部選擇 微小環路、單極、雙極、陶瓷等任何1個天線，前述再放 射部係選擇雙極、陶瓷、貼片天線等任何種類的1個天線 ，前述傳送部係一體構成爲同軸線。 以第23圖至第26圖之例所示之延長檢測器具之其他 活用而言，一般的RFID標籤及藉由本發明所得之充分小 型化的標籤本體60亦可應用在手不易到達、或通訊電磁 波不易到達的部位的情形。例如，要接近除了頂棚、壁面 、路面、人孔下部以外，還有危險區域等時若較耗費勞力 時，藉由使用以非接觸附接於既存讀寫器的天線部的本實 施例的延長檢測器具，可活用減輕作業負擔的遠隔通訊。 發明人在第23圖至第26圖之例中確認，將傳送部τ 設爲同軸線（1.5D2V)而其長度均爲5m左右充分而進行 動作。其中，在確認時所使用的讀取器，HF頻帶爲大成 Lamick公司製多讀取器模組STL920B、微波爲Sekonic公 司製便利讀取器R 〇 〇 1 Μ。 -54- 201110028 【圖式簡單說明】 第1圖係顯示將本發明第1實施形態之RFID標籤設 置在金屬物上之例的斜視圖。 第2圖係說明使用RFID的引入線來製造本發明第1 實施形態之RFID標籤之例圖。 第3 A圖係說明本發明第1實施形態之RFID標籤之 “T”字形縫隙狀整合電路之製法例圖。 第3B圖係說明本發明第1實施形態之RFID標籤之 “L”字形縫隙狀整合電路之製法例圖。 第4A圖係說明本發明第1實施形態之RFID標籤之 構造之一例的斜視圖。 第4B圖係說明本發明第1實施形態之RFID標籤之 構造之其他例的斜視圖。 第5 A圖係顯示將本發明第1實施形態之附有捲繞數 爲1次之微小環路天線Ή之RF ID標籤設置在金屬面時之 影像RFID標籤70M的關係圖。 第5B圖係說明與第5A圖相對應之微小環路天線等效 電路71E的圖。 第6A圖係顯示將本發明第1實施形態之附有捲繞數 爲2次之微小環路天線72之標籤設置在金屬面時之影像 RFID標籤70M的關係圖。 第6B圖係說明與第6A圖相對應之2次捲繞微小環路 天線等效電路72E的圖。 第7圖係針對本發明第1實施形態之RFID標籤的安 -55- 201110028 裝角AG加以說明的圖。 第8Α圖係將RFID標籤70以橫長安裝在金屬面8之 事例的說明圖。 第8B圖係將RFID標籤70以縱長安裝在金屬面8之 事例的說明圖。 第9圖係說明將本發明第1實施形態之RFID標籤設 置在金屬面8時由RFID標籤70流通行進波WF，反射波 WR與行進波WF相干渉而產生干渉波W的說明圖。 第1 〇圖係說明本發明第2實施形態之以半導體製造 製程所構成之全半導體製金屬對應之RFID標籤70的斜視 圖。 第1 1圖係說明以本發明第3實施形態而言，易於安 裝在金屬面之RFID標籤70的說明圖。 第12圖係顯示將本發明第3實施形態之RFID標籤 70安裝在金屬之段差部等之狀態的斜視圖。 第1 3圖係顯示將本發明第3實施形態之RFID標籤 70埋設在金屬的凹處81或螺孔等之方法的說明圖。 第1 4 A圖係以本發明第4實施形態而言，使機械強度 提升之RFID標籤70的說明圖。 第1 4B圖係以本發明第4實施形態而言，使機械強度 提升之RFID標籤70的說明圖。 第1 4C圖係以本發明第4實施形態而言，使機械強度 提升之RFID標籤70的說明圖。 第1 4D圖係以本發明第4實施形態而言，使機械強度 ------------------- ---------* j5_6_ ______ 201110028 提升之RFID標籤70的說明圖。 第1 4E圖係以本發明第4實施形態而言，藉由由帶狀 引入線所形成之微小環路天線而使電性機械強度提升之 RFID標籤70之構成的說明圖。 第1 4F圖係以本發明第4實施形態而言，藉由由帶狀 引入線所形成之微小環路天線而使電性機械強度提升之 RFID標籤70之構成的說明圖。 第1 5圖係以第4實施形態之作用、效果而言，藉由 保護模具保護1C晶片3 0免於受到突波電流•熔接電流· 靜電放電電流I等影響的說明圖。 第1 6 A圖係說明第4實施形態中藉由保護模具，放大 實質微小環路天線7 1的面積而改善感度的斜視圖。 第1 6B圖係說明第4實施形態中藉由保護模具，放大 實質微小環路天線71的面積而改善感度的剖面圖。 第1 7 A圖係第4實施形態中以單極天線長的模具使感 度提升的事例圖。 第1 7 B圖係第4實施形態中以單極天線長的模具使感 度提升的事例的說明圖。 第1 7 C圖係第4實施形態中以單極天線長的模具使感 度提升的事例的說明圖。 第1 7 D圖係第4實施形態中以單極天線長的模具使感 度提升的事例的說明圖。 第1 7 E圖係第4實施形態中以單極天線長的模具使感 度提升的事例的說明圖。 -57- 201110028 第1 7F圖係第4實施形態中以單極天線長的模具使感 度提升的事例的說明圖。 第1 7G圖係第4實施形態中藉由以單極天線長共振的 模具表面構造，使感度提升的平面模具的事例圖。 第1 8 A圖係第4實施形態中利用以半波長共振的雙極 天線長λ/ 2的模具使感度提升的事例的說明圖。 第1 8Β圖係第4實施形態中利用以半波長共振的雙極 天線長λ/ 2的模具使感度提升的事例的說明圖。 第1 8C圖係第4實施形態中使用一對兼作發生電磁波 模式的保護模具70SD7的RFID標籤的說明圖。 第18D圖係第4實施形態中使用一枚兼作發生半波長 共振/電磁波模式的保護模具70SD8的RFID標籤的說明 圖。 第1 9圖係說明第4實施形態中利用雙極天線模具7 7 使感度提升，而且尺寸成爲約2倍之長度的圖。 第20A圖係以本發明之第5實施形態而言，說明 RFID標籤可由遠離的部位進行通訊的圖。 第2 0B圖係以第5實施形態而言，說明RFID標籤可 由遠離的部位進行通訊的圖。 第2 1 A圖係以第5實施形態而言，說明在同軸纜線或 同軸管C的內部導體設置標籤本體60，RFID標籤在外部 導體表面到處均可進行通訊的情形的圖。 第2 1 B圖係以第5實施形態而言，說明易於積極性地 流通高頻電流i至同軸纜線或同軸管C之內部與外部導體 -58- 201110028 的情形的圖。 第22A圖係以本發明第6實施形態而言，附接式檢測 器具D與深處部位的RFID標籤70進行通訊之使用事例 圖。 第22B圖係以第6實施形態而言，附接式檢測器具D 與密集的RFID標籤70作1對1通訊之使用事例圖。 第23圖係以第6實施形態而言，附接式延長檢測器 具DTR之LF/ HF頻帶域中之具體使用事例圖。 第2 4圖係以第6實施形態而言，附接式延長檢測器 具DTR之UHF/微波頻帶域中之具體使用事例圖。 第25圖係以第6實施形態而言，附接式延長檢測器 具DTR之UHF/微波頻帶域中之其他具體使用事例圖。 第26圖係以第6實施形態而言，附接式延長檢測器 具DTR之UHF/微波頻帶域中之其他具體使用事例圖。 【主要元件符號說明】 1 :雙極天線 20 :縫隙形狀整合電路 2〇T : “T”字形縫隙形狀整合電路 20L : “L”字形縫隙形狀整合電路 20S :半導體晶片上整合電路 3 0 · IC晶片 31 : 1C邏輯電路 3 1 a :電極 -59- 201110028 3 1 b :電極 4 :整合電路領域（將整合電路的領域切出的部分 5 :基材 5 0 :直立保持部 5 1 :座部或安裝面 51 A :座部或安裝面 51B :座部或安裝面 51C :座部或安裝面 6 : R F ID引入線 6 0 :標籤本體 6 1 1 :切出線 6 1 S :間隔件 70 : RFID 標籤 70A :金屬製臂部 70B :固著具 70C :介電質或磁性體塡充材 7 〇 D :接著劑 70M :影像RFID標籤 70SD1 :貝構造保護模具 70SD2 :折返構造保護模具 70SD3 :折返端子構造保護模具 70SD4 :端子構造保護模具 70SD5 : C形平面保護模具 70SD6 : Η形平面保護模具 -60- 201110028 70SD7 ：兼作發生電磁波模式的保護模具 70SD8 :兼作發生半波長共振/電磁波模式的保護模 7 1 :微小環路天線 7 1 E :微小環路天線等效電路 7 1 S :微小環路天線圖案 72 : 2次捲繞微小環路天線 72C :環路的起點與終點的連接地點領域 72E : 2次捲繞微小環路天線等效電路 7 5 :單極天線 76 :微小雙極天線 7 7 :雙極天線 7 8 :安裝孔 79 :間隙 8 :金屬面 8 1 :金屬面凹處 9 :金屬絲狀金屬棒 R/ WA :讀寫器內部的天線 GND :通訊電磁波的障礙物 DTR :延長檢測器具 DT :檢測部 DTL :檢測部的微小環路天線 DTM :檢測部的單極天線 DTD :檢測部的雙極天線 -61 - 201110028 DTS :檢測部的陶瓷天線 T :傳送部 TCX :同軸線 TR :再放射部 TRL :再放射部的微小環路天線 TCC:調諧電容器 TRD :再放射部的雙極天線 AG :安裝角 I :突波電流•熔接電流·靜電放電電流 Q :靜電 i :局頻電流 i T M : T Μ基本模式電流 ID :半波長共振電流 EM :外形尺寸 A 1 :環路面 AM :影像環路面 AS:放大環路面縱尺寸 AO:無保護模具的環路面縱尺寸 W :干渉波 WF :行進波 WR :反射波 WP :腹部 W V :節部 W L :半波長周期 -62- 201110028 φ :局頻fe通 Φ 1 :無保護模具的高頻磁通 Φ 2 :有保護模具的高頻磁通In the example of Fig. 26, a detection unit DTM having a monopole antenna having a length of 1/4 wavelength in the detection unit DTC-53-201110028 in the example of Fig. 24 is provided, and a transmission unit for connecting the DTM to the TRD is provided. The TCX is formed as a coaxial line. In this example, the RFID tag 70 attached to the inner wall surface or the bottom of the metal pipe can be inserted into the detecting portion DTM from the opening portion of the pipe to communicate. As described above, in the extended RFID tag detecting device of the present embodiment, when the communication electromagnetic wave is in the LF/HF band, the detecting unit and the re-radiation unit are referred to as a small loop antenna, and the transmitting unit is a coaxial line. Further, when the communication electromagnetic wave is in the UHF/microwave band, any one of a small loop, a monopole, a bipolar, and a ceramic is selected in the detecting unit, and the re-radiation unit selects any type such as a bipolar, a ceramic, or a patch antenna. One of the antennas is integrally formed as a coaxial line. The general RFID tag and the sufficiently miniaturized tag body 60 obtained by the present invention can be applied to the hand, or the communication electromagnetic wave, in the other applications of the extended detecting device shown in the examples of FIGS. 23 to 26. The situation of parts that are difficult to reach. For example, when it is more labor intensive to access a ceiling, a wall surface, a road surface, a lower portion of a manhole, a dangerous area, etc., by using an antenna portion that is non-contactly attached to an antenna portion of an existing reader/writer, the extension of this embodiment The detection device can utilize remote communication to reduce the workload. In the examples of Figs. 23 to 26, the inventors confirmed that the transmission unit τ is a coaxial line (1.5D2V) and its length is approximately 5 m. Among them, the reader used in the confirmation, the HF band is Dacheng Lamick's multi-reader module STL920B, and the microwave is a Sekonic company-made convenience reader R 〇 〇 1 Μ. -54-201110028 [Brief Description of the Drawings] Fig. 1 is a perspective view showing an example in which an RFID tag according to a first embodiment of the present invention is placed on a metal object. Fig. 2 is a view showing an example of manufacturing an RFID tag according to a first embodiment of the present invention by using an inlet of RFID. Fig. 3A is a view showing an example of a method of manufacturing a "T"-shaped slit-like integrated circuit of the RFID tag according to the first embodiment of the present invention. Fig. 3B is a view showing an example of a method of manufacturing an "L"-shaped slit-like integrated circuit of the RFID tag according to the first embodiment of the present invention. Fig. 4A is a perspective view showing an example of the structure of the RFID tag according to the first embodiment of the present invention. Fig. 4B is a perspective view showing another example of the structure of the RFID tag according to the first embodiment of the present invention. Fig. 5A is a diagram showing the relationship between the image RFID tag 70M in the case where the RF ID tag having the number of winding loop antennas of the first embodiment of the present invention is placed on the metal surface. Fig. 5B is a view showing a micro loop antenna equivalent circuit 71E corresponding to Fig. 5A. Fig. 6A is a diagram showing the relationship between the image RFID tag 70M when the label of the micro loop antenna 72 having the number of windings of the second embodiment of the present invention is placed on the metal surface. Fig. 6B is a view for explaining the secondary winding microcircuit antenna equivalent circuit 72E corresponding to Fig. 6A. Fig. 7 is a view for explaining an angle AG of an RFID tag according to a first embodiment of the present invention. Fig. 8 is an explanatory view showing an example in which the RFID tag 70 is attached to the metal surface 8 in a horizontal length. Fig. 8B is an explanatory view showing an example in which the RFID tag 70 is attached to the metal surface 8 in the longitudinal direction. In the ninth embodiment, when the RFID tag according to the first embodiment of the present invention is placed on the metal surface 8, the traveling wave WF is distributed by the RFID tag 70, and the reflected wave WR and the traveling wave WF are coherent to generate a dry wave W. Fig. 1 is a perspective view showing an RFID tag 70 corresponding to a semiconductor-made metal formed by a semiconductor manufacturing process according to a second embodiment of the present invention. Fig. 1 is an explanatory view showing an RFID tag 70 which is easy to mount on a metal surface according to a third embodiment of the present invention. Fig. 12 is a perspective view showing a state in which the RFID tag 70 according to the third embodiment of the present invention is attached to a step portion of a metal or the like. Fig. 1 is an explanatory view showing a method of embedding the RFID tag 70 of the third embodiment of the present invention in a recess 81 or a screw hole of a metal. Fig. 14A is an explanatory view of the RFID tag 70 which improves the mechanical strength in the fourth embodiment of the present invention. Fig. 14B is an explanatory view of the RFID tag 70 which improves the mechanical strength according to the fourth embodiment of the present invention. Fig. 14C is an explanatory view of the RFID tag 70 which improves the mechanical strength in the fourth embodiment of the present invention. The first 4D diagram is based on the fourth embodiment of the present invention, and the mechanical strength is ------------------- ---------* j5_6_ ______ 201110028 An illustration of the elevated RFID tag 70. In the fourth embodiment of the present invention, the configuration of the RFID tag 70 in which the electrical mechanical strength is improved by the micro loop antenna formed by the strip-shaped lead-in wire is described. Fig. 4F is an explanatory view showing the configuration of the RFID tag 70 in which the electrical mechanical strength is improved by the micro loop antenna formed by the strip-shaped lead-in wire according to the fourth embodiment of the present invention. In the fifth embodiment, the 1C wafer 30 is protected from the surge current, the welding current, the electrostatic discharge current I, and the like by the protective mold. Fig. 6A is a perspective view showing the improvement of the sensitivity by amplifying the area of the substantial micro loop antenna 71 by protecting the mold in the fourth embodiment. Fig. 6B is a cross-sectional view showing the improvement of the sensitivity by enlarging the area of the substantial micro loop antenna 71 by protecting the mold in the fourth embodiment. Fig. 7A is a diagram showing an example in which the sensitivity is improved by a mold having a long monopole antenna in the fourth embodiment. Fig. 7B is an explanatory view showing an example in which the sensitivity is improved by a mold having a long monopole antenna in the fourth embodiment. In the fourth embodiment, an example in which the sensitivity is improved by a mold having a long monopole antenna is shown in the fourth embodiment. Fig. 7D is an explanatory view showing an example in which the sensitivity is improved by a mold having a long monopole antenna in the fourth embodiment. In the fourth embodiment, an example in which the sensitivity is improved by a mold having a long monopole antenna is shown in the fourth embodiment. -57-201110028 The first 7F is an explanatory diagram of an example in which the sensitivity is improved by a mold having a long monopole antenna in the fourth embodiment. Fig. 7G is a diagram showing an example of a planar mold in which the sensitivity is improved by a mold surface structure in which a monopole antenna is resonated in the fourth embodiment. In the fourth embodiment, an example in which the sensitivity is improved by a mold having a half-wavelength resonant bipolar antenna length λ/2 is used in the fourth embodiment. In the fourth embodiment, an example in which the sensitivity is improved by a mold having a bipolar antenna length λ/2 of a half-wavelength resonance is used. In the fourth embodiment, a pair of RFID tags which also serve as a protective mold 70SD7 for generating an electromagnetic wave mode are used. In the fourth embodiment, an illustration of an RFID tag which also serves as a protective mold 70SD8 for generating a half-wavelength resonance/electromagnetic wave mode is used. Fig. 19 is a view for explaining the sensitivity of the dipole antenna mold 7 7 in the fourth embodiment, and the size is about twice as long. Fig. 20A is a view showing the communication of the RFID tag from a distant portion in the fifth embodiment of the present invention. Fig. 20B shows a diagram in which the RFID tag can be communicated from a distant portion in the fifth embodiment. In the fifth embodiment, the label main body 60 is provided on the inner conductor of the coaxial cable or the coaxial tube C, and the RFID tag can communicate with the external conductor surface. In the fifth embodiment, a description will be given of a case where the high-frequency current i is easily circulated to the inside of the coaxial cable or the coaxial tube C and the external conductor -58 to 201110028. Fig. 22A is a view showing an example of the use of the attachment-type detecting instrument D to communicate with the RFID tag 70 in the deep portion in the sixth embodiment of the present invention. Fig. 22B is a view showing an example of the use of the one-to-one communication between the attached type detecting instrument D and the dense RFID tag 70 in the sixth embodiment. Fig. 23 is a view showing a specific use case of the LF/HF band in the DTR of the attached extension detector in the sixth embodiment. Fig. 24 is a diagram showing a specific use case of the UHF/microwave band in the DTR of the attached extension detector in the sixth embodiment. Fig. 25 is a view showing another specific use case of the UHF/microwave band in the DTR of the attached extension detector in the sixth embodiment. Fig. 26 is a diagram showing another specific use case of the UHF/microwave band in the DTR of the attached extension detector in the sixth embodiment. [Main component symbol description] 1 : Dipole antenna 20: Slit shape integration circuit 2〇T: "T" shaped slot shape integration circuit 20L: "L" shaped slot shape integration circuit 20S: Integrated circuit on semiconductor wafer 3 0 · IC Wafer 31: 1C logic circuit 3 1 a : Electrode - 59 - 201110028 3 1 b : Electrode 4 : Integrated circuit field (Part 5 in which the field of integrated circuit is cut out: Substrate 50: Upright holding portion 5 1 : Seat portion Or mounting surface 51 A : seat or mounting surface 51B : seat or mounting surface 51C : seat or mounting surface 6 : RF ID lead-in 6 0 : label body 6 1 1 : cut-out line 6 1 S : spacer 70 : RFID tag 70A : Metal arm 70B : Fixing device 70C : Dielectric or magnetic material 7 D : Adhesive 70M : Image RFID tag 70SD1 : Shell structure protection mold 70SD2 : Folding structure protection mold 70SD3 : Foldback terminal construction protection mold 70SD4: Terminal structure protection mold 70SD5: C-shaped plane protection mold 70SD6: Η-shaped plane protection mold-60- 201110028 70SD7: Double protection mold 70SD8 for electromagnetic wave mode: double protection for half-wavelength resonance/electromagnetic wave mode Mode 7 1 : Small loop antenna 7 1 E : Small loop antenna equivalent circuit 7 1 S : Small loop antenna pattern 72 : 2 winding small loop antenna 72C : Connection point of the start point and end point of the loop Field 72E : 2nd winding small loop antenna equivalent circuit 7 5 : Monopole antenna 76 : Tiny dipole antenna 7 7 : Dipole antenna 7 8 : Mounting hole 79 : Gap 8 : Metal surface 8 1 : Metal surface recess 9 : Wire-shaped metal rod R/WA: Antenna GND inside the reader/writer: Obstruction of communication electromagnetic wave DTR: Extension detecting device DT: Detection unit DTL: Small loop antenna DTM of detection unit: Monopole antenna DTD of detection unit: Bipolar antenna of the detection unit -61 - 201110028 DTS : Ceramic antenna T of the detection unit: Transmission unit TCX : Coaxial line TR : Re-radiation unit TRL : Small loop antenna of re-radiation unit TCC : Tuning capacitor TRD : Re-radiation unit Bipolar antenna AG: Mounting angle I: Surge current • Splicing current • Electrostatic discharge current Q: Static current i: Local frequency current i TM : T Μ Basic mode Current ID: Half-wavelength resonant current EM: Dimensions A 1 : Loop surface AM: image loop surface AS: enlargement loop surface longitudinal dimension AO: unprotected mold Loop face longitudinal dimension W: dry wave WF: travel wave WR: reflected wave WP: belly WV: section WL: half-wavelength period -62- 201110028 φ: local frequency fe pass Φ 1 : high-frequency flux Φ without protection mold 2: High-frequency flux with protective mold
Xg :媒質中的波長Xg: wavelength in the medium
Xg/ 4 :媒質中的單極天線長 λ/ 4 :單極天線長 λ/ 2 :雙極天線長 R / W :讀寫器 C:同軸纜線或同軸管 C 1 :同軸纜線或同軸管的天線 D :附接式檢測器具 D1 :支持體 D 2 :雙極天線棒 DA :讀寫器的天線面 h :安裝位置 B-B :彎曲線 a-a’ ：剖面 S - S ’ ：剖面 -63-Xg/ 4 : Monopole antenna length in medium λ/ 4 : Monopole antenna length λ / 2 : Dipole antenna length R / W : Reader C: Coaxial cable or coaxial tube C 1 : Coaxial cable or coaxial Tube antenna D: Attached test instrument D1: Support D 2 : Dipole antenna bar DA: Antenna face of reader/writer h: Mounting position BB: Bending line a-a': Section S - S ' : Section - 63-