TW200801803A - Negative photosensitive resin composition, method of forming pattern and electronic part - Google Patents

Negative photosensitive resin composition, method of forming pattern and electronic part

Info

Publication number
TW200801803A
TW200801803A TW95121989A TW95121989A TW200801803A TW 200801803 A TW200801803 A TW 200801803A TW 95121989 A TW95121989 A TW 95121989A TW 95121989 A TW95121989 A TW 95121989A TW 200801803 A TW200801803 A TW 200801803A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
negative photosensitive
electronic part
forming pattern
Prior art date
Application number
TW95121989A
Other languages
English (en)
Other versions
TWI477906B (zh
Inventor
Tomonori Minegishi
Original Assignee
Hitachi Chem Dupont Microsys
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chem Dupont Microsys filed Critical Hitachi Chem Dupont Microsys
Priority to TW095121989A priority Critical patent/TWI477906B/zh
Publication of TW200801803A publication Critical patent/TW200801803A/zh
Application granted granted Critical
Publication of TWI477906B publication Critical patent/TWI477906B/zh

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW095121989A 2006-06-20 2006-06-20 負片型感光性樹脂組成物、圖案的製造方法以及電子零件 TWI477906B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095121989A TWI477906B (zh) 2006-06-20 2006-06-20 負片型感光性樹脂組成物、圖案的製造方法以及電子零件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095121989A TWI477906B (zh) 2006-06-20 2006-06-20 負片型感光性樹脂組成物、圖案的製造方法以及電子零件

Publications (2)

Publication Number Publication Date
TW200801803A true TW200801803A (en) 2008-01-01
TWI477906B TWI477906B (zh) 2015-03-21

Family

ID=44765198

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121989A TWI477906B (zh) 2006-06-20 2006-06-20 負片型感光性樹脂組成物、圖案的製造方法以及電子零件

Country Status (1)

Country Link
TW (1) TWI477906B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111217999A (zh) * 2020-02-20 2020-06-02 哈尔滨工程大学 柔性聚酰亚胺隔热泡沫的环保型制备方法及产品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002169286A (ja) * 2000-11-30 2002-06-14 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物、パターンの製造法及び電子部品
JP2003121998A (ja) * 2001-10-11 2003-04-23 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物及びパターン製造法及び電子部品
JP4464396B2 (ja) * 2003-06-06 2010-05-19 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物
TWI407255B (zh) * 2005-09-22 2013-09-01 Hitachi Chem Dupont Microsys 負片型感光性樹脂組成物、圖案形成方法以及電子零件

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111217999A (zh) * 2020-02-20 2020-06-02 哈尔滨工程大学 柔性聚酰亚胺隔热泡沫的环保型制备方法及产品
CN111217999B (zh) * 2020-02-20 2022-07-26 哈尔滨工程大学 柔性聚酰亚胺隔热泡沫的环保型制备方法及产品

Also Published As

Publication number Publication date
TWI477906B (zh) 2015-03-21

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