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Application filed by Hitachi Chem Dupont MicrosysfiledCriticalHitachi Chem Dupont Microsys
Priority to TW095121989ApriorityCriticalpatent/TWI477906B/zh
Publication of TW200801803ApublicationCriticalpatent/TW200801803A/zh
Application grantedgrantedCritical
Publication of TWI477906BpublicationCriticalpatent/TWI477906B/zh
Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
Organosilane polymers, hardmask compositions including the same and methods of producing semiconductor devices using organosilane hardmask compositions