TW200741819A - Semiconductor substrate, semiconductor device manufacturing method thereof, and method for designing semiconductor substrate - Google Patents

Semiconductor substrate, semiconductor device manufacturing method thereof, and method for designing semiconductor substrate

Info

Publication number
TW200741819A
TW200741819A TW095126769A TW95126769A TW200741819A TW 200741819 A TW200741819 A TW 200741819A TW 095126769 A TW095126769 A TW 095126769A TW 95126769 A TW95126769 A TW 95126769A TW 200741819 A TW200741819 A TW 200741819A
Authority
TW
Taiwan
Prior art keywords
semiconductor substrate
semiconductor
device manufacturing
designing
disposed
Prior art date
Application number
TW095126769A
Other languages
English (en)
Inventor
Kei Kanemoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200741819A publication Critical patent/TW200741819A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/66772Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/78654Monocrystalline silicon transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
TW095126769A 2005-07-22 2006-07-21 Semiconductor substrate, semiconductor device manufacturing method thereof, and method for designing semiconductor substrate TW200741819A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005212748A JP2007035702A (ja) 2005-07-22 2005-07-22 半導体基板及び半導体装置、並びにこれらの製造方法、半導体基板の設計方法

Publications (1)

Publication Number Publication Date
TW200741819A true TW200741819A (en) 2007-11-01

Family

ID=37657016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126769A TW200741819A (en) 2005-07-22 2006-07-21 Semiconductor substrate, semiconductor device manufacturing method thereof, and method for designing semiconductor substrate

Country Status (5)

Country Link
US (1) US20070045657A1 (zh)
JP (1) JP2007035702A (zh)
KR (1) KR100798826B1 (zh)
CN (1) CN1901207A (zh)
TW (1) TW200741819A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9029949B2 (en) 2013-09-25 2015-05-12 International Business Machines Corporation Semiconductor-on-insulator (SOI) structures with local heat dissipater(s) and methods

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05299437A (ja) * 1992-04-24 1993-11-12 Sanyo Electric Co Ltd Soi型mosfetとその製造方法
JPH06216376A (ja) * 1993-01-18 1994-08-05 Hitachi Ltd 電界効果型半導体装置
JP3980670B2 (ja) * 1994-09-09 2007-09-26 株式会社ルネサステクノロジ 半導体装置
KR100201779B1 (ko) * 1996-06-29 1999-06-15 김주용 반도체 장치 및 그 제조방법
EP0993053A1 (en) * 1998-10-09 2000-04-12 STMicroelectronics S.r.l. Infrared detector integrated with a waveguide and method of manufacturing
US6596570B2 (en) * 2001-06-06 2003-07-22 International Business Machines Corporation SOI device with reduced junction capacitance
CN1620728A (zh) * 2002-01-21 2005-05-25 松下电器产业株式会社 半导体装置
US20070090456A1 (en) * 2005-08-29 2007-04-26 Jin-Yuan Lee Soi device and method for fabricating the same

Also Published As

Publication number Publication date
US20070045657A1 (en) 2007-03-01
KR100798826B1 (ko) 2008-01-28
CN1901207A (zh) 2007-01-24
KR20070012231A (ko) 2007-01-25
JP2007035702A (ja) 2007-02-08

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