TW200723363A - Manufacturing method of display device and mold therefor - Google Patents
Manufacturing method of display device and mold thereforInfo
- Publication number
- TW200723363A TW200723363A TW095140610A TW95140610A TW200723363A TW 200723363 A TW200723363 A TW 200723363A TW 095140610 A TW095140610 A TW 095140610A TW 95140610 A TW95140610 A TW 95140610A TW 200723363 A TW200723363 A TW 200723363A
- Authority
- TW
- Taiwan
- Prior art keywords
- display device
- manufacturing
- master layer
- base substrate
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 3
- 239000003153 chemical reaction reagent Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Liquid Crystal (AREA)
- Optics & Photonics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050104511A KR101171190B1 (ko) | 2005-11-02 | 2005-11-02 | 표시장치의 제조방법과 이에 사용되는 몰드 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200723363A true TW200723363A (en) | 2007-06-16 |
TWI344673B TWI344673B (en) | 2011-07-01 |
Family
ID=37996924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095140610A TWI344673B (en) | 2005-11-02 | 2006-11-02 | Manufacturing method of display device and mold therefor |
Country Status (5)
Country | Link |
---|---|
US (2) | US8043550B2 (zh) |
JP (1) | JP4602309B2 (zh) |
KR (1) | KR101171190B1 (zh) |
CN (2) | CN101320203A (zh) |
TW (1) | TWI344673B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100811768B1 (ko) * | 2007-04-23 | 2008-03-07 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
KR101457528B1 (ko) | 2008-05-15 | 2014-11-04 | 삼성디스플레이 주식회사 | 임프린트 기판의 제조방법 및 임프린팅 방법 |
GB2467316B (en) * | 2009-01-28 | 2014-04-09 | Pragmatic Printing Ltd | Electronic devices, circuits and their manufacture |
KR101492071B1 (ko) * | 2008-09-19 | 2015-02-10 | 삼성전자 주식회사 | 나노 임프린트를 이용한 패턴 성형방법과 패턴 성형을 위한몰드 제작방법 |
WO2010048988A1 (en) * | 2008-10-28 | 2010-05-06 | Hewlett-Packard Development Company, L.P. | Composite stamp for embossing |
FR2960658B1 (fr) | 2010-05-28 | 2013-05-24 | Commissariat Energie Atomique | Lithographie par impression nanometrique |
US9168679B2 (en) * | 2010-07-16 | 2015-10-27 | Northwestern University | Programmable soft lithography: solvent-assisted nanoscale embossing |
CN102385083B (zh) * | 2010-09-03 | 2014-09-03 | 株式会社Lg化学 | 毯及其制造方法、和滤色器衬底及其制造装置和方法 |
WO2017131497A1 (ko) | 2016-01-27 | 2017-08-03 | 주식회사 엘지화학 | 필름 마스크, 이의 제조방법 및 이를 이용한 패턴 형성 방법 |
WO2017131499A1 (ko) * | 2016-01-27 | 2017-08-03 | 주식회사 엘지화학 | 필름 마스크, 이의 제조방법, 이를 이용한 패턴 형성 방법 및 이를 이용하여 형성된 패턴 |
KR102138960B1 (ko) | 2016-01-27 | 2020-07-28 | 주식회사 엘지화학 | 필름 마스크, 이의 제조방법, 이를 이용한 패턴 형성 방법 및 이를 이용하여 형성된 패턴 |
JP6812119B2 (ja) * | 2016-03-23 | 2021-01-13 | 旭化成株式会社 | 電位測定デバイス |
TWI677765B (zh) * | 2017-02-28 | 2019-11-21 | 日商東芝機械股份有限公司 | 轉印方法及轉印裝置 |
JP2018140576A (ja) * | 2017-02-28 | 2018-09-13 | 東芝機械株式会社 | 転写方法およびモールド |
FR3122523B1 (fr) * | 2021-04-30 | 2023-06-09 | Commissariat Energie Atomique | Procede de structuration de surface hybride par gravure plasma |
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US4877697A (en) | 1988-05-26 | 1989-10-31 | Hoechst Aktiengesellschaft | Color filter array for liquid crystal display device |
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JP3832518B2 (ja) * | 1995-09-28 | 2006-10-11 | セイコーエプソン株式会社 | カラーフィルタの製造方法 |
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JP3907504B2 (ja) | 2002-03-14 | 2007-04-18 | 三菱電機株式会社 | 半導体装置の製造方法および半導体装置製造用モールド |
US6783717B2 (en) * | 2002-04-22 | 2004-08-31 | International Business Machines Corporation | Process of fabricating a precision microcontact printing stamp |
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US20050121782A1 (en) | 2003-12-05 | 2005-06-09 | Koichiro Nakamura | Selectively adherent substrate and method for producing the same |
KR101010431B1 (ko) | 2003-12-27 | 2011-01-21 | 엘지디스플레이 주식회사 | 평판표시소자의 제조방법 및 장치 |
KR101010476B1 (ko) | 2003-12-27 | 2011-01-21 | 엘지디스플레이 주식회사 | 평판표시소자의 제조방법 및 장치 |
KR101117437B1 (ko) | 2003-12-27 | 2012-02-29 | 엘지디스플레이 주식회사 | 평판표시소자의 제조방법 및 장치 |
KR100566700B1 (ko) * | 2004-01-15 | 2006-04-03 | 삼성전자주식회사 | 반도체 공정에서 포토레지스트 패턴 형성 방법,포토레지스트 패턴 형성용 템플레이트 및 이의 제조 방법. |
KR20050075580A (ko) | 2004-01-16 | 2005-07-21 | 엘지전자 주식회사 | 나노 임프린트 리쏘그라피를 이용한 대면적 스탬프 제작방법 |
KR20050075581A (ko) | 2004-01-16 | 2005-07-21 | 엘지전자 주식회사 | 나노 임프린트용 쿼츠 스템프 제작 방법 |
KR100531039B1 (ko) | 2004-02-04 | 2005-11-28 | 한국과학기술원 | 나노 트랜스퍼 몰딩 및 마스터 기판을 이용한리소그래피의 방법과 나노 트랜스퍼 몰드 제조 방법 |
KR101166278B1 (ko) * | 2004-05-07 | 2012-07-17 | 오브듀캇 아베 | 일정한 온도에서의 임프린트 리소그라피를 위한 방법 |
TWI236559B (en) | 2004-07-19 | 2005-07-21 | Quanta Display Inc | Liquid crystal display |
EP1828824A1 (en) * | 2004-12-23 | 2007-09-05 | Pirelli & C. S.p.A. | Method for manufacturing optical devices |
KR101222946B1 (ko) * | 2005-06-24 | 2013-01-17 | 엘지디스플레이 주식회사 | 백 프레인이 부착된 소프트 몰드의 제조방법 |
-
2005
- 2005-11-02 KR KR1020050104511A patent/KR101171190B1/ko active IP Right Grant
-
2006
- 2006-10-31 JP JP2006296394A patent/JP4602309B2/ja active Active
- 2006-11-02 TW TW095140610A patent/TWI344673B/zh active
- 2006-11-02 CN CNA2008101305181A patent/CN101320203A/zh active Pending
- 2006-11-02 US US11/592,062 patent/US8043550B2/en active Active
- 2006-11-02 CN CNB2006101718984A patent/CN100552518C/zh active Active
-
2011
- 2011-09-23 US US13/244,025 patent/US20120021139A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1983003A (zh) | 2007-06-20 |
TWI344673B (en) | 2011-07-01 |
US20120021139A1 (en) | 2012-01-26 |
KR101171190B1 (ko) | 2012-08-06 |
CN100552518C (zh) | 2009-10-21 |
KR20070047610A (ko) | 2007-05-07 |
CN101320203A (zh) | 2008-12-10 |
US20070099323A1 (en) | 2007-05-03 |
JP4602309B2 (ja) | 2010-12-22 |
JP2007128083A (ja) | 2007-05-24 |
US8043550B2 (en) | 2011-10-25 |
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