TW200634127A - An electrically conductive adhesive, electrical part and electrical part module were made of it - Google Patents

An electrically conductive adhesive, electrical part and electrical part module were made of it

Info

Publication number
TW200634127A
TW200634127A TW094144365A TW94144365A TW200634127A TW 200634127 A TW200634127 A TW 200634127A TW 094144365 A TW094144365 A TW 094144365A TW 94144365 A TW94144365 A TW 94144365A TW 200634127 A TW200634127 A TW 200634127A
Authority
TW
Taiwan
Prior art keywords
electrically conductive
electrical part
adhesive
conductive adhesive
base
Prior art date
Application number
TW094144365A
Other languages
English (en)
Chinese (zh)
Inventor
Takao Ono
Yoshiyuki Takahashi
Shuji Ito
Yukihiro Isogai
Original Assignee
Tamurakaken Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamurakaken Corp filed Critical Tamurakaken Corp
Publication of TW200634127A publication Critical patent/TW200634127A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
TW094144365A 2004-12-15 2005-12-14 An electrically conductive adhesive, electrical part and electrical part module were made of it TW200634127A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004362572 2004-12-15

Publications (1)

Publication Number Publication Date
TW200634127A true TW200634127A (en) 2006-10-01

Family

ID=36587904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144365A TW200634127A (en) 2004-12-15 2005-12-14 An electrically conductive adhesive, electrical part and electrical part module were made of it

Country Status (2)

Country Link
TW (1) TW200634127A (ja)
WO (1) WO2006064849A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102737752A (zh) * 2011-03-30 2012-10-17 株式会社田村制作所 各向异性导电糊以及使用该导电糊的电子部件的连接方法
CN113695782A (zh) * 2021-09-18 2021-11-26 江苏芯德半导体科技有限公司 一种用于超小间距元件焊接的焊料及制备方法、焊接方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5052857B2 (ja) * 2006-10-13 2012-10-17 株式会社フジクラ 導電性組成物およびこれを用いた導電体、導電回路の形成方法
WO2009001448A1 (ja) * 2007-06-27 2008-12-31 Panasonic Electric Works Co., Ltd. 熱硬化性樹脂組成物及びその製造方法
CN107118707A (zh) * 2011-01-27 2017-09-01 日立化成株式会社 导电性粘接剂组合物、连接体、太阳能电池模块及制造方法
KR101579712B1 (ko) * 2013-05-23 2015-12-22 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
JP5952849B2 (ja) * 2014-03-25 2016-07-13 岡村製油株式会社 フラックス及びソルダペースト
CN110853794B (zh) * 2019-10-30 2021-12-03 上海润势科技有限公司 一种导电浆料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
JP3254981B2 (ja) * 1995-09-11 2002-02-12 日立エーアイシー株式会社 電解コンデンサ用電解液
JP2000309773A (ja) * 1998-11-30 2000-11-07 Nippon Handa Kk 導電性接着剤およびそれを使用した接着方法
JP2001143529A (ja) * 1999-11-12 2001-05-25 Nippon Handa Kk クリームハンダ配合による導電性接合剤およびそれを使用した接合方法
JP2003163139A (ja) * 2001-11-26 2003-06-06 Daicel Chem Ind Ltd 電解コンデンサ用電解液
JP2005194306A (ja) * 2003-12-26 2005-07-21 Togo Seisakusho Corp 通電接着剤とそれを用いた窓用板状部材

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102737752A (zh) * 2011-03-30 2012-10-17 株式会社田村制作所 各向异性导电糊以及使用该导电糊的电子部件的连接方法
CN102737752B (zh) * 2011-03-30 2016-06-29 株式会社田村制作所 各向异性导电糊以及使用该导电糊的电子部件的连接方法
CN113695782A (zh) * 2021-09-18 2021-11-26 江苏芯德半导体科技有限公司 一种用于超小间距元件焊接的焊料及制备方法、焊接方法

Also Published As

Publication number Publication date
WO2006064849A1 (ja) 2006-06-22

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