TW200634127A - An electrically conductive adhesive, electrical part and electrical part module were made of it - Google Patents
An electrically conductive adhesive, electrical part and electrical part module were made of itInfo
- Publication number
- TW200634127A TW200634127A TW094144365A TW94144365A TW200634127A TW 200634127 A TW200634127 A TW 200634127A TW 094144365 A TW094144365 A TW 094144365A TW 94144365 A TW94144365 A TW 94144365A TW 200634127 A TW200634127 A TW 200634127A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrically conductive
- electrical part
- adhesive
- conductive adhesive
- base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004362572 | 2004-12-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200634127A true TW200634127A (en) | 2006-10-01 |
Family
ID=36587904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094144365A TW200634127A (en) | 2004-12-15 | 2005-12-14 | An electrically conductive adhesive, electrical part and electrical part module were made of it |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200634127A (ja) |
WO (1) | WO2006064849A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102737752A (zh) * | 2011-03-30 | 2012-10-17 | 株式会社田村制作所 | 各向异性导电糊以及使用该导电糊的电子部件的连接方法 |
CN113695782A (zh) * | 2021-09-18 | 2021-11-26 | 江苏芯德半导体科技有限公司 | 一种用于超小间距元件焊接的焊料及制备方法、焊接方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5052857B2 (ja) * | 2006-10-13 | 2012-10-17 | 株式会社フジクラ | 導電性組成物およびこれを用いた導電体、導電回路の形成方法 |
WO2009001448A1 (ja) * | 2007-06-27 | 2008-12-31 | Panasonic Electric Works Co., Ltd. | 熱硬化性樹脂組成物及びその製造方法 |
CN107118707A (zh) * | 2011-01-27 | 2017-09-01 | 日立化成株式会社 | 导电性粘接剂组合物、连接体、太阳能电池模块及制造方法 |
KR101579712B1 (ko) * | 2013-05-23 | 2015-12-22 | 세키스이가가쿠 고교가부시키가이샤 | 도전 재료 및 접속 구조체 |
JP5952849B2 (ja) * | 2014-03-25 | 2016-07-13 | 岡村製油株式会社 | フラックス及びソルダペースト |
CN110853794B (zh) * | 2019-10-30 | 2021-12-03 | 上海润势科技有限公司 | 一种导电浆料 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
JP3254981B2 (ja) * | 1995-09-11 | 2002-02-12 | 日立エーアイシー株式会社 | 電解コンデンサ用電解液 |
JP2000309773A (ja) * | 1998-11-30 | 2000-11-07 | Nippon Handa Kk | 導電性接着剤およびそれを使用した接着方法 |
JP2001143529A (ja) * | 1999-11-12 | 2001-05-25 | Nippon Handa Kk | クリームハンダ配合による導電性接合剤およびそれを使用した接合方法 |
JP2003163139A (ja) * | 2001-11-26 | 2003-06-06 | Daicel Chem Ind Ltd | 電解コンデンサ用電解液 |
JP2005194306A (ja) * | 2003-12-26 | 2005-07-21 | Togo Seisakusho Corp | 通電接着剤とそれを用いた窓用板状部材 |
-
2005
- 2005-12-14 WO PCT/JP2005/022964 patent/WO2006064849A1/ja active Application Filing
- 2005-12-14 TW TW094144365A patent/TW200634127A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102737752A (zh) * | 2011-03-30 | 2012-10-17 | 株式会社田村制作所 | 各向异性导电糊以及使用该导电糊的电子部件的连接方法 |
CN102737752B (zh) * | 2011-03-30 | 2016-06-29 | 株式会社田村制作所 | 各向异性导电糊以及使用该导电糊的电子部件的连接方法 |
CN113695782A (zh) * | 2021-09-18 | 2021-11-26 | 江苏芯德半导体科技有限公司 | 一种用于超小间距元件焊接的焊料及制备方法、焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006064849A1 (ja) | 2006-06-22 |
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