TW200625557A - System and method for mounting electrical devices - Google Patents

System and method for mounting electrical devices

Info

Publication number
TW200625557A
TW200625557A TW094125590A TW94125590A TW200625557A TW 200625557 A TW200625557 A TW 200625557A TW 094125590 A TW094125590 A TW 094125590A TW 94125590 A TW94125590 A TW 94125590A TW 200625557 A TW200625557 A TW 200625557A
Authority
TW
Taiwan
Prior art keywords
electrical devices
attached
mounting electrical
cover
substrate
Prior art date
Application number
TW094125590A
Other languages
English (en)
Other versions
TWI383474B (zh
Inventor
Sai-Mun Lee
Gurbir Singh
Piang-Joon Seow
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200625557A publication Critical patent/TW200625557A/zh
Application granted granted Critical
Publication of TWI383474B publication Critical patent/TWI383474B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Selective Calling Equipment (AREA)
TW094125590A 2005-01-06 2005-07-28 用以安裝電子元件的系統與方法 TWI383474B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/030,022 US7262493B2 (en) 2005-01-06 2005-01-06 System and method for mounting electrical devices

Publications (2)

Publication Number Publication Date
TW200625557A true TW200625557A (en) 2006-07-16
TWI383474B TWI383474B (zh) 2013-01-21

Family

ID=36639369

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125590A TWI383474B (zh) 2005-01-06 2005-07-28 用以安裝電子元件的系統與方法

Country Status (3)

Country Link
US (1) US7262493B2 (zh)
CN (1) CN1802086B (zh)
TW (1) TWI383474B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120146165A1 (en) * 2010-12-09 2012-06-14 Udo Ausserlechner Magnetic field current sensors
CN110113928B (zh) * 2019-05-06 2020-12-29 大唐长春热力有限责任公司 一种电子元件组装用电容引脚切脚机

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5380988A (en) * 1976-12-27 1978-07-17 Nippon Telegr & Teleph Corp <Ntt> Light emitting diode
JPH09222372A (ja) * 1996-02-19 1997-08-26 Mitsubishi Electric Corp 半導体式センサ
DE19755734A1 (de) * 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
US6037655A (en) * 1998-01-12 2000-03-14 Eastman Kodak Company Linear image sensor package assembly
JP2001148594A (ja) * 1999-11-19 2001-05-29 Murata Mfg Co Ltd シールドケース付き電子部品
WO2001091193A2 (en) * 2000-05-23 2001-11-29 Atmel Corporation Integrated ic chip package for electronic image sensor die
JP3798620B2 (ja) * 2000-12-04 2006-07-19 富士通株式会社 半導体装置の製造方法
US6798031B2 (en) * 2001-02-28 2004-09-28 Fujitsu Limited Semiconductor device and method for making the same
JP2003021647A (ja) * 2001-07-06 2003-01-24 Denso Corp 電子装置
DE10137184B4 (de) * 2001-07-31 2007-09-06 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauteils mit einem Kuststoffgehäuse und elektronisches Bauteil
CN2523026Y (zh) * 2001-11-23 2002-11-27 深圳市宝安区西乡镇臣田唐锋电器厂 摄像传感器
US6768196B2 (en) * 2002-09-04 2004-07-27 Analog Devices, Inc. Packaged microchip with isolation
TW561636B (en) * 2002-10-11 2003-11-11 Highlink Technology Corp Optoelectronic device

Also Published As

Publication number Publication date
TWI383474B (zh) 2013-01-21
CN1802086B (zh) 2011-07-27
US7262493B2 (en) 2007-08-28
CN1802086A (zh) 2006-07-12
US20060145178A1 (en) 2006-07-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees