TW200608860A - Auxiliary supporting structure of circuit board and assembling method for the same - Google Patents

Auxiliary supporting structure of circuit board and assembling method for the same

Info

Publication number
TW200608860A
TW200608860A TW093125637A TW93125637A TW200608860A TW 200608860 A TW200608860 A TW 200608860A TW 093125637 A TW093125637 A TW 093125637A TW 93125637 A TW93125637 A TW 93125637A TW 200608860 A TW200608860 A TW 200608860A
Authority
TW
Taiwan
Prior art keywords
circuit board
supporting structure
auxiliary supporting
assembling method
same
Prior art date
Application number
TW093125637A
Other languages
English (en)
Other versions
TWI255684B (en
Inventor
Yen Kuang
Yang-Tzung Lien
Original Assignee
Asustek Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asustek Comp Inc filed Critical Asustek Comp Inc
Priority to TW093125637A priority Critical patent/TWI255684B/zh
Priority to US11/208,610 priority patent/US7352586B2/en
Publication of TW200608860A publication Critical patent/TW200608860A/zh
Application granted granted Critical
Publication of TWI255684B publication Critical patent/TWI255684B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW093125637A 2004-08-26 2004-08-26 Auxiliary supporting structure of circuit board and assembling method for the same TWI255684B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093125637A TWI255684B (en) 2004-08-26 2004-08-26 Auxiliary supporting structure of circuit board and assembling method for the same
US11/208,610 US7352586B2 (en) 2004-08-26 2005-08-23 Auxiliary supporting structure of circuit board and assembling method for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093125637A TWI255684B (en) 2004-08-26 2004-08-26 Auxiliary supporting structure of circuit board and assembling method for the same

Publications (2)

Publication Number Publication Date
TW200608860A true TW200608860A (en) 2006-03-01
TWI255684B TWI255684B (en) 2006-05-21

Family

ID=35942740

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125637A TWI255684B (en) 2004-08-26 2004-08-26 Auxiliary supporting structure of circuit board and assembling method for the same

Country Status (2)

Country Link
US (1) US7352586B2 (zh)
TW (1) TWI255684B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7609525B2 (en) * 2006-12-09 2009-10-27 Hon Hai Precision Industry Co., Ltd. Computer system
US7903419B2 (en) * 2007-08-27 2011-03-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a back plate unit
US7708579B2 (en) * 2008-03-03 2010-05-04 Hon Hai Precision Ind. Co., Ltd. Socket assembly with backplane
CN101727152A (zh) * 2008-10-16 2010-06-09 鸿富锦精密工业（深圳）有限公司 电脑主板
JP5163543B2 (ja) * 2009-03-03 2013-03-13 富士通株式会社 プリント基板ユニット
CN102117111A (zh) * 2010-01-04 2011-07-06 鸿富锦精密工业（深圳）有限公司 主板散热模组
US8619420B2 (en) * 2011-06-30 2013-12-31 Apple Inc. Consolidated thermal module
US9379037B2 (en) 2014-03-14 2016-06-28 Apple Inc. Thermal module accounting for increased board/die size in a portable computer
US10522443B2 (en) * 2017-06-05 2019-12-31 Microsemi Corporation Lid cover spring design
CN110137720B (zh) * 2018-02-09 2022-07-26 富士康(昆山)电脑接插件有限公司 一种用来固定散热器的固定装置及其抵压装置
CN110364884A (zh) * 2018-04-09 2019-10-22 泰科电子(上海)有限公司 插座连接器和插头连接器
CN112004372B (zh) * 2019-05-27 2023-03-17 酷码科技股份有限公司 散热装置
US11195779B2 (en) 2019-08-09 2021-12-07 Raytheon Company Electronic module for motherboard
JP6986607B1 (ja) * 2020-09-10 2021-12-22 レノボ・シンガポール・プライベート・リミテッド 電子機器および構造体
CN113473786B (zh) * 2021-06-08 2022-09-13 合肥磐芯电子有限公司 一种单片机抗震自保存防护一体化结构
US20230004200A1 (en) * 2021-07-01 2023-01-05 Portwell Inc. Board device of single board computer
WO2023065177A1 (zh) * 2021-10-20 2023-04-27 华为技术有限公司 一种电路板组件、电子设备以及托架
CN114025579A (zh) * 2021-11-16 2022-02-08 北京卫星制造厂有限公司 一种压紧散热装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607538A (en) * 1995-09-07 1997-03-04 Ford Motor Company Method of manufacturing a circuit assembly
US5999402A (en) * 1997-10-28 1999-12-07 Dell Usa, L.P. Heat sink fastener retention apparatus and method for computer systems
KR100521339B1 (ko) * 1998-10-17 2005-12-21 삼성전자주식회사 컴퓨터 시스템의 반도체 장치 모듈 장착 구조
US20040161741A1 (en) * 2001-06-30 2004-08-19 Elazar Rabani Novel compositions and processes for analyte detection, quantification and amplification
TW547702U (en) * 2001-07-11 2003-08-11 Quanta Comp Inc Heat dissipating module and its fixing device
US6549410B1 (en) * 2001-11-20 2003-04-15 Hewlett-Packard Company Heatsink mounting system
TW532714U (en) * 2002-06-28 2003-05-11 Hon Hai Prec Ind Co Ltd Position-adjusting device
US7042727B2 (en) * 2003-09-26 2006-05-09 Intel Corporation Heat sink mounting and interface mechanism and method of assembling same
US20050068741A1 (en) * 2003-09-29 2005-03-31 Bailey Douglas A. System and method for mounting processor and heat transfer mechanism
US7120027B2 (en) * 2004-07-08 2006-10-10 Cray Inc. Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures

Also Published As

Publication number Publication date
US20060044764A1 (en) 2006-03-02
TWI255684B (en) 2006-05-21
US7352586B2 (en) 2008-04-01

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