TW200608860A - Auxiliary supporting structure of circuit board and assembling method for the same - Google Patents
Auxiliary supporting structure of circuit board and assembling method for the sameInfo
- Publication number
- TW200608860A TW200608860A TW093125637A TW93125637A TW200608860A TW 200608860 A TW200608860 A TW 200608860A TW 093125637 A TW093125637 A TW 093125637A TW 93125637 A TW93125637 A TW 93125637A TW 200608860 A TW200608860 A TW 200608860A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- supporting structure
- auxiliary supporting
- assembling method
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093125637A TWI255684B (en) | 2004-08-26 | 2004-08-26 | Auxiliary supporting structure of circuit board and assembling method for the same |
US11/208,610 US7352586B2 (en) | 2004-08-26 | 2005-08-23 | Auxiliary supporting structure of circuit board and assembling method for the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093125637A TWI255684B (en) | 2004-08-26 | 2004-08-26 | Auxiliary supporting structure of circuit board and assembling method for the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200608860A true TW200608860A (en) | 2006-03-01 |
TWI255684B TWI255684B (en) | 2006-05-21 |
Family
ID=35942740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093125637A TWI255684B (en) | 2004-08-26 | 2004-08-26 | Auxiliary supporting structure of circuit board and assembling method for the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US7352586B2 (zh) |
TW (1) | TWI255684B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7609525B2 (en) * | 2006-12-09 | 2009-10-27 | Hon Hai Precision Industry Co., Ltd. | Computer system |
US7903419B2 (en) * | 2007-08-27 | 2011-03-08 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a back plate unit |
US7708579B2 (en) * | 2008-03-03 | 2010-05-04 | Hon Hai Precision Ind. Co., Ltd. | Socket assembly with backplane |
CN101727152A (zh) * | 2008-10-16 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 电脑主板 |
JP5163543B2 (ja) * | 2009-03-03 | 2013-03-13 | 富士通株式会社 | プリント基板ユニット |
CN102117111A (zh) * | 2010-01-04 | 2011-07-06 | 鸿富锦精密工业(深圳)有限公司 | 主板散热模组 |
US8619420B2 (en) * | 2011-06-30 | 2013-12-31 | Apple Inc. | Consolidated thermal module |
US9379037B2 (en) | 2014-03-14 | 2016-06-28 | Apple Inc. | Thermal module accounting for increased board/die size in a portable computer |
US10522443B2 (en) * | 2017-06-05 | 2019-12-31 | Microsemi Corporation | Lid cover spring design |
CN110137720B (zh) * | 2018-02-09 | 2022-07-26 | 富士康(昆山)电脑接插件有限公司 | 一种用来固定散热器的固定装置及其抵压装置 |
CN110364884A (zh) * | 2018-04-09 | 2019-10-22 | 泰科电子(上海)有限公司 | 插座连接器和插头连接器 |
CN112004372B (zh) * | 2019-05-27 | 2023-03-17 | 酷码科技股份有限公司 | 散热装置 |
US11195779B2 (en) | 2019-08-09 | 2021-12-07 | Raytheon Company | Electronic module for motherboard |
JP6986607B1 (ja) * | 2020-09-10 | 2021-12-22 | レノボ・シンガポール・プライベート・リミテッド | 電子機器および構造体 |
CN113473786B (zh) * | 2021-06-08 | 2022-09-13 | 合肥磐芯电子有限公司 | 一种单片机抗震自保存防护一体化结构 |
US20230004200A1 (en) * | 2021-07-01 | 2023-01-05 | Portwell Inc. | Board device of single board computer |
WO2023065177A1 (zh) * | 2021-10-20 | 2023-04-27 | 华为技术有限公司 | 一种电路板组件、电子设备以及托架 |
CN114025579A (zh) * | 2021-11-16 | 2022-02-08 | 北京卫星制造厂有限公司 | 一种压紧散热装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5607538A (en) * | 1995-09-07 | 1997-03-04 | Ford Motor Company | Method of manufacturing a circuit assembly |
US5999402A (en) * | 1997-10-28 | 1999-12-07 | Dell Usa, L.P. | Heat sink fastener retention apparatus and method for computer systems |
KR100521339B1 (ko) * | 1998-10-17 | 2005-12-21 | 삼성전자주식회사 | 컴퓨터 시스템의 반도체 장치 모듈 장착 구조 |
US20040161741A1 (en) * | 2001-06-30 | 2004-08-19 | Elazar Rabani | Novel compositions and processes for analyte detection, quantification and amplification |
TW547702U (en) * | 2001-07-11 | 2003-08-11 | Quanta Comp Inc | Heat dissipating module and its fixing device |
US6549410B1 (en) * | 2001-11-20 | 2003-04-15 | Hewlett-Packard Company | Heatsink mounting system |
TW532714U (en) * | 2002-06-28 | 2003-05-11 | Hon Hai Prec Ind Co Ltd | Position-adjusting device |
US7042727B2 (en) * | 2003-09-26 | 2006-05-09 | Intel Corporation | Heat sink mounting and interface mechanism and method of assembling same |
US20050068741A1 (en) * | 2003-09-29 | 2005-03-31 | Bailey Douglas A. | System and method for mounting processor and heat transfer mechanism |
US7120027B2 (en) * | 2004-07-08 | 2006-10-10 | Cray Inc. | Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures |
-
2004
- 2004-08-26 TW TW093125637A patent/TWI255684B/zh active
-
2005
- 2005-08-23 US US11/208,610 patent/US7352586B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20060044764A1 (en) | 2006-03-02 |
TWI255684B (en) | 2006-05-21 |
US7352586B2 (en) | 2008-04-01 |
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