TW200601390A - Chamber based dispatch method - Google Patents
Chamber based dispatch methodInfo
- Publication number
- TW200601390A TW200601390A TW093118115A TW93118115A TW200601390A TW 200601390 A TW200601390 A TW 200601390A TW 093118115 A TW093118115 A TW 093118115A TW 93118115 A TW93118115 A TW 93118115A TW 200601390 A TW200601390 A TW 200601390A
- Authority
- TW
- Taiwan
- Prior art keywords
- chambers
- wafers
- equipment
- chamber based
- dispatch method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Factory Administration (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093118115A TWI231526B (en) | 2004-06-23 | 2004-06-23 | Chamber based dispatch method |
US10/904,568 US20050288817A1 (en) | 2004-06-23 | 2004-11-16 | Chamber based dispatch method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093118115A TWI231526B (en) | 2004-06-23 | 2004-06-23 | Chamber based dispatch method |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI231526B TWI231526B (en) | 2005-04-21 |
TW200601390A true TW200601390A (en) | 2006-01-01 |
Family
ID=35507089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093118115A TWI231526B (en) | 2004-06-23 | 2004-06-23 | Chamber based dispatch method |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050288817A1 (zh) |
TW (1) | TWI231526B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009046751A1 (de) * | 2008-12-31 | 2010-09-09 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Synchronisieren der Prozesskammerabschaltzeiten durch Steuern der Transportreihenfolge in eine Prozessanlage |
CN105446281B (zh) * | 2014-09-01 | 2019-04-26 | 中芯国际集成电路制造(上海)有限公司 | 工艺腔室的派货方法和*** |
KR20220050047A (ko) * | 2020-10-15 | 2022-04-22 | 에이에스엠 아이피 홀딩 비.브이. | 예측 유지보수 방법 및 예측 유지보수 장치 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5975740A (en) * | 1996-05-28 | 1999-11-02 | Applied Materials, Inc. | Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme |
US5928389A (en) * | 1996-10-21 | 1999-07-27 | Applied Materials, Inc. | Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool |
US6201999B1 (en) * | 1997-06-09 | 2001-03-13 | Applied Materials, Inc. | Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool |
US6122566A (en) * | 1998-03-03 | 2000-09-19 | Applied Materials Inc. | Method and apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system |
JP2001189363A (ja) * | 2000-01-04 | 2001-07-10 | Mitsubishi Electric Corp | 半導体装置製造設備およびその制御方法 |
JP2001345241A (ja) * | 2000-05-31 | 2001-12-14 | Tokyo Electron Ltd | 基板処理システム及び基板処理方法 |
-
2004
- 2004-06-23 TW TW093118115A patent/TWI231526B/zh not_active IP Right Cessation
- 2004-11-16 US US10/904,568 patent/US20050288817A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20050288817A1 (en) | 2005-12-29 |
TWI231526B (en) | 2005-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |