TW200419762A - Bumpless chip package - Google Patents
Bumpless chip packageInfo
- Publication number
- TW200419762A TW200419762A TW092106680A TW92106680A TW200419762A TW 200419762 A TW200419762 A TW 200419762A TW 092106680 A TW092106680 A TW 092106680A TW 92106680 A TW92106680 A TW 92106680A TW 200419762 A TW200419762 A TW 200419762A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- carrier
- terminals
- conductive layer
- chip package
- Prior art date
Links
Classifications
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092106680A TW588445B (en) | 2003-03-25 | 2003-03-25 | Bumpless chip package |
US10/704,719 US7262497B2 (en) | 2003-03-25 | 2003-11-12 | Bumpless assembly package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092106680A TW588445B (en) | 2003-03-25 | 2003-03-25 | Bumpless chip package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW588445B TW588445B (en) | 2004-05-21 |
TW200419762A true TW200419762A (en) | 2004-10-01 |
Family
ID=33414938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092106680A TW588445B (en) | 2003-03-25 | 2003-03-25 | Bumpless chip package |
Country Status (2)
Country | Link |
---|---|
US (1) | US7262497B2 (zh) |
TW (1) | TW588445B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8067831B2 (en) * | 2005-09-16 | 2011-11-29 | Stats Chippac Ltd. | Integrated circuit package system with planar interconnects |
TWI305479B (en) * | 2006-02-13 | 2009-01-11 | Advanced Semiconductor Eng | Method of fabricating substrate with embedded component therein |
JP2008085089A (ja) * | 2006-09-28 | 2008-04-10 | Matsushita Electric Ind Co Ltd | 樹脂配線基板および半導体装置 |
CN101296566B (zh) * | 2007-04-29 | 2011-06-22 | 鸿富锦精密工业(深圳)有限公司 | 电气元件载板及其制造方法 |
US20080318413A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Method for making an interconnect structure and interconnect component recovery process |
US20080313894A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Method for making an interconnect structure and low-temperature interconnect component recovery process |
US20080318055A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Recoverable electronic component |
US9610758B2 (en) * | 2007-06-21 | 2017-04-04 | General Electric Company | Method of making demountable interconnect structure |
US20080318054A1 (en) * | 2007-06-21 | 2008-12-25 | General Electric Company | Low-temperature recoverable electronic component |
US9953910B2 (en) * | 2007-06-21 | 2018-04-24 | General Electric Company | Demountable interconnect structure |
US20090028491A1 (en) | 2007-07-26 | 2009-01-29 | General Electric Company | Interconnect structure |
JP2009123736A (ja) * | 2007-11-12 | 2009-06-04 | Nec Corp | デバイスの実装構造及びデバイスの実装方法 |
US9059074B2 (en) * | 2008-03-26 | 2015-06-16 | Stats Chippac Ltd. | Integrated circuit package system with planar interconnect |
TWI453877B (zh) * | 2008-11-07 | 2014-09-21 | Advanced Semiconductor Eng | 內埋晶片封裝的結構及製程 |
US8043894B2 (en) * | 2008-08-26 | 2011-10-25 | Stats Chippac Ltd. | Integrated circuit package system with redistribution layer |
EP2184777B1 (en) * | 2008-11-07 | 2017-05-03 | General Electric Company | Interconnect structure |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
US8320134B2 (en) | 2010-02-05 | 2012-11-27 | Advanced Semiconductor Engineering, Inc. | Embedded component substrate and manufacturing methods thereof |
TWI411075B (zh) | 2010-03-22 | 2013-10-01 | Advanced Semiconductor Eng | 半導體封裝件及其製造方法 |
US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
US8487426B2 (en) | 2011-03-15 | 2013-07-16 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with embedded die and manufacturing methods thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5468994A (en) * | 1992-12-10 | 1995-11-21 | Hewlett-Packard Company | High pin count package for semiconductor device |
US5945741A (en) * | 1995-11-21 | 1999-08-31 | Sony Corporation | Semiconductor chip housing having a reinforcing plate |
WO1997020347A1 (en) * | 1995-11-28 | 1997-06-05 | Hitachi, Ltd. | Semiconductor device, process for producing the same, and packaged substrate |
US6110608A (en) * | 1996-12-10 | 2000-08-29 | The Furukawa Electric Co., Ltd. | Lead material for electronic part, lead and semiconductor device using the same |
US6452258B1 (en) * | 2000-11-06 | 2002-09-17 | Lucent Technologies Inc. | Ultra-thin composite surface finish for electronic packaging |
US6555906B2 (en) * | 2000-12-15 | 2003-04-29 | Intel Corporation | Microelectronic package having a bumpless laminated interconnection layer |
-
2003
- 2003-03-25 TW TW092106680A patent/TW588445B/zh not_active IP Right Cessation
- 2003-11-12 US US10/704,719 patent/US7262497B2/en active Active
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US20040226743A1 (en) | 2004-11-18 |
TW588445B (en) | 2004-05-21 |
US7262497B2 (en) | 2007-08-28 |
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