SG10201800619TA - Processing method of workpiece - Google Patents

Processing method of workpiece

Info

Publication number
SG10201800619TA
SG10201800619TA SG10201800619TA SG10201800619TA SG10201800619TA SG 10201800619T A SG10201800619T A SG 10201800619TA SG 10201800619T A SG10201800619T A SG 10201800619TA SG 10201800619T A SG10201800619T A SG 10201800619TA SG 10201800619T A SG10201800619T A SG 10201800619TA
Authority
SG
Singapore
Prior art keywords
workpiece
processing
processing method
holding
alignment mark
Prior art date
Application number
SG10201800619TA
Inventor
Hanajima Satoshi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201800619TA publication Critical patent/SG10201800619TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/21—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from near infrared [NIR] radiation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/33—Transforming infrared radiation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10048—Infrared image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30204—Marker
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

PROCESSING METHOD OF WORKPIECE A processing method for processing a workpiece includes a holding step of holding the front surface side of the workpiece on which an alignment mark is formed by a holding table having a holding surface that reflects a near-infrared ray and exposing the back surface side and an imaging step of emitting the near-infrared ray toward the back surface side of the workpiece held by the holding table and imaging the workpiece by an imaging unit that has sensitivity to the near-infrared ray and faces the back surface side of the workpiece to form a captured image. The processing method also includes an alignment mark detection step of detecting the alignment mark based on the captured image and a processing step of processing the workpiece held by the holding table by a processing unit based on the detected alignment mark. (Figure 1B)
SG10201800619TA 2017-02-01 2018-01-24 Processing method of workpiece SG10201800619TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017016803A JP6791584B2 (en) 2017-02-01 2017-02-01 Processing method

Publications (1)

Publication Number Publication Date
SG10201800619TA true SG10201800619TA (en) 2018-09-27

Family

ID=62980697

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201800619TA SG10201800619TA (en) 2017-02-01 2018-01-24 Processing method of workpiece

Country Status (6)

Country Link
US (1) US10211081B2 (en)
JP (1) JP6791584B2 (en)
KR (1) KR102363110B1 (en)
CN (1) CN108376665B (en)
SG (1) SG10201800619TA (en)
TW (1) TWI745521B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382762B2 (en) * 2019-08-27 2023-11-17 株式会社ディスコ How to judge the quality of processing results of laser processing equipment
US20240079403A1 (en) * 2021-01-29 2024-03-07 Tokyo Electron Limited Method for manufacturing substrate with chips, and substrate processing device

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3760181A (en) * 1972-03-03 1973-09-18 Us Army Universal viewer for far infrared
US4758094A (en) * 1987-05-15 1988-07-19 Kla Instruments Corp. Process and apparatus for in-situ qualification of master patterns used in patterning systems
JP2617870B2 (en) 1993-10-04 1997-06-04 株式会社ディスコ Alignment method
JP3653150B2 (en) * 1995-11-21 2005-05-25 三菱電機株式会社 Semiconductor laser chip and manufacturing method thereof
JPH10247613A (en) * 1997-03-04 1998-09-14 Hitachi Ltd Substrate with identification pattern, and method and device for reading identification pattern
JP4192423B2 (en) 1997-11-20 2008-12-10 株式会社ニコン Mark detection method, position detection apparatus, exposure method and apparatus, device manufacturing method, and device
JP2937244B1 (en) * 1998-05-20 1999-08-23 株式会社東京精密 Wafer pattern imaging device
JP2001110983A (en) 1999-10-14 2001-04-20 Rohm Co Ltd Semiconductor device, semiconductor chip, and manufacturing method for semiconductor device
EP1229356A3 (en) * 2001-01-31 2004-01-21 Planar Systems, Inc. Methods and apparatus for the production of optical filters
JP4443865B2 (en) * 2002-06-24 2010-03-31 富士フイルム株式会社 Solid-state imaging device and manufacturing method thereof
EP2273555A3 (en) * 2002-09-17 2012-09-12 Anteryon B.V. Camera device
JP2004312666A (en) * 2003-03-25 2004-11-04 Fuji Photo Film Co Ltd Solid-state imaging device and method for manufacturing the same
JP2005019573A (en) * 2003-06-25 2005-01-20 Sanyo Electric Co Ltd Solid state imaging device and method of manufacturing the same
JP2005109324A (en) * 2003-10-01 2005-04-21 Tokyo Seimitsu Co Ltd Laser beam dicing device
EP1981084A3 (en) * 2003-12-18 2009-02-18 Panasonic Corporation Solid-state imaging device, its production method, camera with the solid-state imaging device and light-receiving chip
JP2005234038A (en) * 2004-02-17 2005-09-02 Seiko Epson Corp Dielectric multilayer film filter and manufacturing method therefor, and solid-state imaging device
JP2006032886A (en) * 2004-06-15 2006-02-02 Fuji Photo Film Co Ltd Solid-state imaging device, its manufacturing method, and camera module
JP2006100763A (en) * 2004-09-06 2006-04-13 Fuji Photo Film Co Ltd Manufacturing method and joining apparatus of solid-state imaging device
US7456384B2 (en) * 2004-12-10 2008-11-25 Sony Corporation Method and apparatus for acquiring physical information, method for manufacturing semiconductor device including array of plurality of unit components for detecting physical quantity distribution, light-receiving device and manufacturing method therefor, and solid-state imaging device and manufacturing method therefor
US7396704B2 (en) * 2005-02-15 2008-07-08 Sumitomo Chemical Company, Limited Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus
JP2006309151A (en) * 2005-03-28 2006-11-09 Seiko Epson Corp Optical low-pass filter
KR100809682B1 (en) * 2005-07-11 2008-03-06 삼성전자주식회사 Method of manufacturing optical device attached transparent cover and method of manufacturing optical device module using the same
US7288757B2 (en) * 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
JP4825542B2 (en) * 2006-02-23 2011-11-30 富士フイルム株式会社 Manufacturing method of solid-state imaging device
US7773300B2 (en) * 2006-05-12 2010-08-10 Semrock, Inc. Multiphoton fluorescence filters
CN101473425B (en) * 2006-06-23 2011-02-09 日立化成工业株式会社 Production method of semiconductor device and bonding film
WO2008025723A1 (en) * 2006-08-29 2008-03-06 Osram Sylvania Inc. Enhanced emission from phosphor-converted leds using interferometric filters
JP5164363B2 (en) * 2006-10-27 2013-03-21 株式会社ディスコ Manufacturing method of semiconductor wafer
JP2008109015A (en) 2006-10-27 2008-05-08 Disco Abrasive Syst Ltd Method and apparatus for dividing semiconductor wafer
JP4403424B2 (en) * 2006-11-30 2010-01-27 ソニー株式会社 Solid-state imaging device
US8013350B2 (en) * 2007-02-05 2011-09-06 Panasonic Corporation Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device
JP4380718B2 (en) * 2007-03-15 2009-12-09 ソニー株式会社 Manufacturing method of semiconductor device
JP4924141B2 (en) * 2007-03-28 2012-04-25 コニカミノルタオプト株式会社 Imaging lens, imaging device, and portable terminal
JP5082542B2 (en) * 2007-03-29 2012-11-28 ソニー株式会社 Solid-state imaging device
JP5406624B2 (en) 2009-08-10 2014-02-05 キヤノン株式会社 Detection apparatus, exposure apparatus, and device manufacturing method
JP5743958B2 (en) * 2012-05-30 2015-07-01 キヤノン株式会社 Measuring method, exposure method and apparatus

Also Published As

Publication number Publication date
US20180218932A1 (en) 2018-08-02
US10211081B2 (en) 2019-02-19
TWI745521B (en) 2021-11-11
JP6791584B2 (en) 2020-11-25
KR102363110B1 (en) 2022-02-15
JP2018125427A (en) 2018-08-09
CN108376665B (en) 2023-04-14
CN108376665A (en) 2018-08-07
TW201834049A (en) 2018-09-16
KR20200067248A (en) 2020-06-12

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