SE437900B - Halvledaranordning innefattande en vermeavledare eller kylkropp - Google Patents
Halvledaranordning innefattande en vermeavledare eller kylkroppInfo
- Publication number
- SE437900B SE437900B SE7711731A SE7711731A SE437900B SE 437900 B SE437900 B SE 437900B SE 7711731 A SE7711731 A SE 7711731A SE 7711731 A SE7711731 A SE 7711731A SE 437900 B SE437900 B SE 437900B
- Authority
- SE
- Sweden
- Prior art keywords
- refrigerator
- semiconductor device
- device including
- heat conductor
- conductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2234876 | 1976-10-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
SE7711731L SE7711731L (sv) | 1978-04-22 |
SE437900B true SE437900B (sv) | 1985-03-18 |
Family
ID=11195025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7711731A SE437900B (sv) | 1976-10-21 | 1977-10-18 | Halvledaranordning innefattande en vermeavledare eller kylkropp |
Country Status (5)
Country | Link |
---|---|
US (1) | US4209798A (sv) |
DE (1) | DE2747393A1 (sv) |
FR (1) | FR2368868A7 (sv) |
GB (1) | GB1581285A (sv) |
SE (1) | SE437900B (sv) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4330683A (en) * | 1980-12-03 | 1982-05-18 | Bell Telephone Laboratories, Incorporated | Encapsulation for semiconductor device |
US4642419A (en) * | 1981-04-06 | 1987-02-10 | International Rectifier Corporation | Four-leaded dual in-line package module for semiconductor devices |
CA1200619A (en) * | 1982-02-16 | 1986-02-11 | William S. Phy | Integrated circuit lead frame with improved power dissipation |
IT1213259B (it) * | 1984-12-18 | 1989-12-14 | Sgs Thomson Microelectronics | Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento. |
US4706811A (en) * | 1986-03-03 | 1987-11-17 | General Motors Corporation | Surface mount package for encapsulated tape automated bonding integrated circuit modules |
FR2615325A1 (fr) * | 1987-05-15 | 1988-11-18 | Neiman Sa | Procede pour la realisation de composants de puissance destines a l'industrie automobile |
JPH0691174B2 (ja) * | 1988-08-15 | 1994-11-14 | 株式会社日立製作所 | 半導体装置 |
US4970579A (en) * | 1988-09-21 | 1990-11-13 | International Business Machines Corp. | Integrated circuit package with improved cooling means |
US4961107A (en) * | 1989-04-03 | 1990-10-02 | Motorola Inc. | Electrically isolated heatsink for single-in-line package |
JP2816244B2 (ja) * | 1990-07-11 | 1998-10-27 | 株式会社日立製作所 | 積層型マルチチップ半導体装置およびこれに用いる半導体装置 |
JPH06177303A (ja) * | 1992-08-14 | 1994-06-24 | Texas Instr Inc <Ti> | 集積回路用のリード・フレーム及びその熱放散の最適化方法 |
US5457071A (en) * | 1993-09-03 | 1995-10-10 | International Business Machine Corp. | Stackable vertical thin package/plastic molded lead-on-chip memory cube |
EP0669651A1 (en) * | 1994-02-28 | 1995-08-30 | AT&T Corp. | Method and apparatus for cooling electronic components |
US6326687B1 (en) | 1998-09-01 | 2001-12-04 | Micron Technology, Inc. | IC package with dual heat spreaders |
US6247940B1 (en) * | 1999-08-23 | 2001-06-19 | Avaya Technology Corp. | Connector having improved high-voltage surge performance |
US6351385B1 (en) * | 2000-09-26 | 2002-02-26 | Thomson Licensing, S.A. | Heat sink for integrated circuit packages |
US20060192273A1 (en) * | 2005-02-25 | 2006-08-31 | Texas Instruments Incorporated | Integrated circuit package and method of manufacture thereof |
DE102006035876A1 (de) * | 2006-08-01 | 2008-02-07 | Infineon Technologies Ag | Chip-Modul, Verfahren zur Herstellung eines Chip-Moduls und Mehrfachchip-Modul |
US9484320B2 (en) * | 2012-04-27 | 2016-11-01 | Freescale Semiconductor, Inc. | Vertically packaged integrated circuit |
DE102014117943B4 (de) * | 2014-12-05 | 2022-12-08 | Infineon Technologies Austria Ag | Vorrichtung mit einer Leiterplatte und einem Metallwerkstück |
WO2018142864A1 (ja) * | 2017-02-06 | 2018-08-09 | 富士電機株式会社 | 半導体モジュール、電気自動車およびパワーコントロールユニット |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3391426A (en) * | 1965-10-22 | 1968-07-09 | Motorola Inc | Molding apparatus |
US3548927A (en) * | 1968-11-29 | 1970-12-22 | Intern Electronic Research Co | Heat dissipating retainer for electronic component |
US3651448A (en) * | 1970-03-20 | 1972-03-21 | Amp Inc | Power frame for integrated circuit |
US3654695A (en) * | 1970-07-29 | 1972-04-11 | Texas Instruments Inc | Method of making an electronic module |
US3670215A (en) * | 1970-09-28 | 1972-06-13 | Staver Co Inc The | Heat dissipator for integrated circuit |
GB1334173A (en) * | 1971-06-02 | 1973-10-17 | Redpoint Ltd | Twisted vane heat sink |
US3611061A (en) * | 1971-07-07 | 1971-10-05 | Motorola Inc | Multiple lead integrated circuit device and frame member for the fabrication thereof |
US3723833A (en) * | 1971-07-19 | 1973-03-27 | Rca Corp | Heat sinking of semiconductor integrated circuit devices |
US3958075A (en) * | 1974-11-11 | 1976-05-18 | Gentron Corporation | High power thick film circuit with overlapping lead frame |
US4004195A (en) * | 1975-05-12 | 1977-01-18 | Rca Corporation | Heat-sink assembly for high-power stud-mounted semiconductor device |
US4054901A (en) * | 1975-10-14 | 1977-10-18 | Thermalloy, Inc. | Index mounting unitary heat sink apparatus with apertured base |
US4093971A (en) * | 1976-12-10 | 1978-06-06 | Burroughs Corporation | D-I-P On island |
-
1977
- 1977-10-18 FR FR7731267A patent/FR2368868A7/fr not_active Expired
- 1977-10-18 SE SE7711731A patent/SE437900B/sv not_active IP Right Cessation
- 1977-10-21 DE DE19772747393 patent/DE2747393A1/de active Pending
- 1977-10-21 GB GB43965/77A patent/GB1581285A/en not_active Expired
-
1979
- 1979-03-21 US US06/022,476 patent/US4209798A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE2747393A1 (de) | 1978-04-27 |
SE7711731L (sv) | 1978-04-22 |
GB1581285A (en) | 1980-12-10 |
FR2368868A7 (fr) | 1978-05-19 |
US4209798A (en) | 1980-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE437900B (sv) | Halvledaranordning innefattande en vermeavledare eller kylkropp | |
NL7701374A (nl) | Koelinrichting. | |
SE410512B (sv) | Vermepumpanordning | |
NL176322C (nl) | Halfgeleiderinrichting met beveiligingsschakeling. | |
BR7707101A (pt) | Dispositivo sincrono atrial | |
NL7713490A (nl) | Tempeerinrichting. | |
SE7703126L (sv) | Anordning for anbringande av nitar eller liknande | |
SE7701434L (sv) | Halvledaranordning | |
SE7714576L (sv) | Kylanordning | |
NO770218L (no) | Isolasjonsanordning. | |
SE7701316L (sv) | Halvledaranordning | |
AT377386B (de) | Halbleiterbaueinheit | |
AT363282B (de) | Thermokompressor | |
SE7709146L (sv) | Halvledaranordning | |
SE7611989L (sv) | Etsningsanordning | |
SE7708723L (sv) | Halvledaranordning | |
SE411949B (sv) | Kylanordning | |
SE7709019L (sv) | Halvledaranordning | |
PL198142A1 (pl) | Urzadzenie chlodzace | |
MX143601A (es) | Aparato frigorifico | |
SE7709857L (sv) | Halvledardiodanordning | |
PL202932A1 (pl) | Urzadzenie strugowe | |
PL203303A1 (pl) | Przyrzad polprzewodnikowy | |
SE7707190L (sv) | Halvledaranordning med overgang | |
SE7706258L (sv) | Halvledaranordning |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAL | Patent in force |
Ref document number: 7711731-5 Format of ref document f/p: F |
|
NUG | Patent has lapsed |
Ref document number: 7711731-5 Format of ref document f/p: F |