PH12015501209A1 - Liqiud epoxy resin composition - Google Patents
Liqiud epoxy resin compositionInfo
- Publication number
- PH12015501209A1 PH12015501209A1 PH12015501209A PH12015501209A PH12015501209A1 PH 12015501209 A1 PH12015501209 A1 PH 12015501209A1 PH 12015501209 A PH12015501209 A PH 12015501209A PH 12015501209 A PH12015501209 A PH 12015501209A PH 12015501209 A1 PH12015501209 A1 PH 12015501209A1
- Authority
- PH
- Philippines
- Prior art keywords
- epoxy resin
- resin composition
- liquid epoxy
- mass
- component
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 239000003822 epoxy resin Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 5
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- -1 amine compound Chemical class 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- NHDIQVFFNDKAQU-UHFFFAOYSA-N tripropan-2-yl borate Chemical compound CC(C)OB(OC(C)C)OC(C)C NHDIQVFFNDKAQU-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012286122A JP6013906B2 (ja) | 2012-12-27 | 2012-12-27 | 液状エポキシ樹脂組成物 |
PCT/JP2013/080870 WO2014103552A1 (ja) | 2012-12-27 | 2013-11-15 | 液状エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12015501209A1 true PH12015501209A1 (en) | 2015-08-10 |
PH12015501209B1 PH12015501209B1 (en) | 2015-08-10 |
Family
ID=51020647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12015501209A PH12015501209B1 (en) | 2012-12-27 | 2015-05-29 | Liqiud epoxy resin composition |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6013906B2 (zh) |
KR (1) | KR102072259B1 (zh) |
CN (1) | CN104684957B (zh) |
PH (1) | PH12015501209B1 (zh) |
TW (1) | TWI602874B (zh) |
WO (1) | WO2014103552A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6872944B2 (ja) | 2017-03-27 | 2021-05-19 | セメダイン株式会社 | 低温加熱硬化型構造用接着剤組成物 |
MY177304A (en) * | 2017-03-31 | 2020-09-11 | Hitachi Chemical Co Ltd | Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device |
JP2020166108A (ja) * | 2019-03-29 | 2020-10-08 | 日東電工株式会社 | 光電気複合伝送モジュール |
JPWO2021117582A1 (zh) * | 2019-12-12 | 2021-06-17 | ||
CN114806473A (zh) * | 2022-04-21 | 2022-07-29 | 广东施奈仕实业有限公司 | 一种耐冷热低吸湿环氧底部填充胶及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11302507A (ja) * | 1998-02-17 | 1999-11-02 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用中間基材および繊維強化複合材料 |
JP2003289123A (ja) | 2000-09-25 | 2003-10-10 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料の使用 |
JP2007246713A (ja) * | 2006-03-16 | 2007-09-27 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物 |
JP2009084384A (ja) * | 2007-09-28 | 2009-04-23 | Sumitomo Bakelite Co Ltd | 一液型エポキシ樹脂組成物 |
JP5069725B2 (ja) * | 2009-07-10 | 2012-11-07 | パナソニック株式会社 | 熱硬化性樹脂組成物及び回路基板 |
JP2011246545A (ja) | 2010-05-25 | 2011-12-08 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP4965715B1 (ja) * | 2011-02-03 | 2012-07-04 | ナミックス株式会社 | エポキシ樹脂組成物およびそれを用いた半導体封止材 |
-
2012
- 2012-12-27 JP JP2012286122A patent/JP6013906B2/ja active Active
-
2013
- 2013-11-15 CN CN201380051978.4A patent/CN104684957B/zh active Active
- 2013-11-15 WO PCT/JP2013/080870 patent/WO2014103552A1/ja active Application Filing
- 2013-11-15 KR KR1020157007533A patent/KR102072259B1/ko active IP Right Grant
- 2013-11-25 TW TW102142788A patent/TWI602874B/zh active
-
2015
- 2015-05-29 PH PH12015501209A patent/PH12015501209B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014125631A (ja) | 2014-07-07 |
CN104684957B (zh) | 2017-02-22 |
PH12015501209B1 (en) | 2015-08-10 |
WO2014103552A1 (ja) | 2014-07-03 |
TW201430043A (zh) | 2014-08-01 |
CN104684957A (zh) | 2015-06-03 |
TWI602874B (zh) | 2017-10-21 |
KR20150100609A (ko) | 2015-09-02 |
JP6013906B2 (ja) | 2016-10-25 |
KR102072259B1 (ko) | 2020-01-31 |
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