MY197424A - Tape sticking apparatus - Google Patents

Tape sticking apparatus

Info

Publication number
MY197424A
MY197424A MYPI2019006727A MYPI2019006727A MY197424A MY 197424 A MY197424 A MY 197424A MY PI2019006727 A MYPI2019006727 A MY PI2019006727A MY PI2019006727 A MYPI2019006727 A MY PI2019006727A MY 197424 A MY197424 A MY 197424A
Authority
MY
Malaysia
Prior art keywords
wafer
ring
shaped frame
tape sticking
support table
Prior art date
Application number
MYPI2019006727A
Other languages
English (en)
Inventor
Chye YEW Leng
Maji Ryogo
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY197424A publication Critical patent/MY197424A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
MYPI2019006727A 2018-11-30 2019-11-18 Tape sticking apparatus MY197424A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018225369A JP2020088334A (ja) 2018-11-30 2018-11-30 テープ貼り装置

Publications (1)

Publication Number Publication Date
MY197424A true MY197424A (en) 2023-06-16

Family

ID=70908934

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019006727A MY197424A (en) 2018-11-30 2019-11-18 Tape sticking apparatus

Country Status (5)

Country Link
JP (1) JP2020088334A (ja)
CN (1) CN111261546A (ja)
MY (1) MY197424A (ja)
SG (1) SG10201910879SA (ja)
TW (1) TW202022978A (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3232575B2 (ja) * 1990-10-16 2001-11-26 ソニー株式会社 半導体処理装置
JP3250160B2 (ja) * 1992-12-01 2002-01-28 株式会社ディスコ テープ貼り機及びその使用方法
JP3464596B2 (ja) * 1996-09-13 2003-11-10 富士通株式会社 半導体装置の製造方法および製造装置
JP4741332B2 (ja) * 2005-09-30 2011-08-03 株式会社ディスコ ウエーハの加工方法
JP4769560B2 (ja) * 2005-12-06 2011-09-07 株式会社ディスコ ウエーハの分割方法
JP5111938B2 (ja) * 2007-05-25 2013-01-09 日東電工株式会社 半導体ウエハの保持方法
JP5992803B2 (ja) * 2012-11-07 2016-09-14 リンテック株式会社 シート貼付装置及び貼付方法
JP6475076B2 (ja) * 2015-05-11 2019-02-27 株式会社ディスコ チャックテーブル
JP2017112162A (ja) * 2015-12-15 2017-06-22 株式会社ディスコ 紫外線照射方法

Also Published As

Publication number Publication date
TW202022978A (zh) 2020-06-16
JP2020088334A (ja) 2020-06-04
CN111261546A (zh) 2020-06-09
SG10201910879SA (en) 2020-06-29

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