KR960008513B1 - Tape feeding apparatus - Google Patents
Tape feeding apparatus Download PDFInfo
- Publication number
- KR960008513B1 KR960008513B1 KR92010822A KR920010822A KR960008513B1 KR 960008513 B1 KR960008513 B1 KR 960008513B1 KR 92010822 A KR92010822 A KR 92010822A KR 920010822 A KR920010822 A KR 920010822A KR 960008513 B1 KR960008513 B1 KR 960008513B1
- Authority
- KR
- South Korea
- Prior art keywords
- feeding apparatus
- tape feeding
- tape
- feeding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/003—Placing of components on belts holding the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53961—Means to assemble or disassemble with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP91-198197 | 1991-07-15 | ||
JP3198197A JP2890334B2 (ja) | 1991-07-15 | 1991-07-15 | テープ搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930003307A KR930003307A (ko) | 1993-02-24 |
KR960008513B1 true KR960008513B1 (en) | 1996-06-26 |
Family
ID=16387090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR92010822A KR960008513B1 (en) | 1991-07-15 | 1992-06-22 | Tape feeding apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US5272799A (ko) |
JP (1) | JP2890334B2 (ko) |
KR (1) | KR960008513B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307553A (ja) * | 1998-04-21 | 1999-11-05 | Shinkawa Ltd | 半導体ペレットの位置決め方法及びその装置 |
KR20040029614A (ko) * | 2002-10-01 | 2004-04-08 | 일진다이아몬드(주) | 액정 디스플레이 프로젝터 |
US8726539B2 (en) | 2012-09-18 | 2014-05-20 | Cambridge Engineering, Inc. | Heater and controls for extraction of moisture and biological organisms from structures |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4396826A (en) * | 1981-08-13 | 1983-08-02 | Ppg Industries, Inc. | Lightweight heated plastic window element with unique bus bar system |
US4656906A (en) * | 1986-02-04 | 1987-04-14 | Crest-Foam Corporation | Supporting bed for sheet material cutting machine and method of manufacture |
JPH0737186B2 (ja) * | 1988-02-06 | 1995-04-26 | 株式会社サクライ | 加熱転写法 |
JPH02273949A (ja) * | 1989-04-17 | 1990-11-08 | Shinkawa Ltd | テープボンデイング装置 |
US5034083A (en) * | 1989-10-16 | 1991-07-23 | Xerox Corporation | Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array |
US5052606A (en) * | 1990-06-29 | 1991-10-01 | International Business Machines Corp. | Tape automated bonding feeder |
US5089321A (en) * | 1991-01-10 | 1992-02-18 | The Dow Chemical Company | Multilayer polyolefinic film structures having improved heat seal characteristics |
-
1991
- 1991-07-15 JP JP3198197A patent/JP2890334B2/ja not_active Expired - Fee Related
-
1992
- 1992-06-22 KR KR92010822A patent/KR960008513B1/ko not_active IP Right Cessation
- 1992-07-15 US US07/913,865 patent/US5272799A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2890334B2 (ja) | 1999-05-10 |
US5272799A (en) | 1993-12-28 |
JPH0521531A (ja) | 1993-01-29 |
KR930003307A (ko) | 1993-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20080515 Year of fee payment: 15 |
|
LAPS | Lapse due to unpaid annual fee |