KR960008513B1 - Tape feeding apparatus - Google Patents

Tape feeding apparatus Download PDF

Info

Publication number
KR960008513B1
KR960008513B1 KR92010822A KR920010822A KR960008513B1 KR 960008513 B1 KR960008513 B1 KR 960008513B1 KR 92010822 A KR92010822 A KR 92010822A KR 920010822 A KR920010822 A KR 920010822A KR 960008513 B1 KR960008513 B1 KR 960008513B1
Authority
KR
South Korea
Prior art keywords
feeding apparatus
tape feeding
tape
feeding
Prior art date
Application number
KR92010822A
Other languages
English (en)
Other versions
KR930003307A (ko
Inventor
Koji Sato
Original Assignee
Shinkawa K K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa K K filed Critical Shinkawa K K
Publication of KR930003307A publication Critical patent/KR930003307A/ko
Application granted granted Critical
Publication of KR960008513B1 publication Critical patent/KR960008513B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53961—Means to assemble or disassemble with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
KR92010822A 1991-07-15 1992-06-22 Tape feeding apparatus KR960008513B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-198197 1991-07-15
JP3198197A JP2890334B2 (ja) 1991-07-15 1991-07-15 テープ搬送装置

Publications (2)

Publication Number Publication Date
KR930003307A KR930003307A (ko) 1993-02-24
KR960008513B1 true KR960008513B1 (en) 1996-06-26

Family

ID=16387090

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92010822A KR960008513B1 (en) 1991-07-15 1992-06-22 Tape feeding apparatus

Country Status (3)

Country Link
US (1) US5272799A (ko)
JP (1) JP2890334B2 (ko)
KR (1) KR960008513B1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307553A (ja) * 1998-04-21 1999-11-05 Shinkawa Ltd 半導体ペレットの位置決め方法及びその装置
KR20040029614A (ko) * 2002-10-01 2004-04-08 일진다이아몬드(주) 액정 디스플레이 프로젝터
US8726539B2 (en) 2012-09-18 2014-05-20 Cambridge Engineering, Inc. Heater and controls for extraction of moisture and biological organisms from structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396826A (en) * 1981-08-13 1983-08-02 Ppg Industries, Inc. Lightweight heated plastic window element with unique bus bar system
US4656906A (en) * 1986-02-04 1987-04-14 Crest-Foam Corporation Supporting bed for sheet material cutting machine and method of manufacture
JPH0737186B2 (ja) * 1988-02-06 1995-04-26 株式会社サクライ 加熱転写法
JPH02273949A (ja) * 1989-04-17 1990-11-08 Shinkawa Ltd テープボンデイング装置
US5034083A (en) * 1989-10-16 1991-07-23 Xerox Corporation Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array
US5052606A (en) * 1990-06-29 1991-10-01 International Business Machines Corp. Tape automated bonding feeder
US5089321A (en) * 1991-01-10 1992-02-18 The Dow Chemical Company Multilayer polyolefinic film structures having improved heat seal characteristics

Also Published As

Publication number Publication date
JP2890334B2 (ja) 1999-05-10
US5272799A (en) 1993-12-28
JPH0521531A (ja) 1993-01-29
KR930003307A (ko) 1993-02-24

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080515

Year of fee payment: 15

LAPS Lapse due to unpaid annual fee