KR102434571B1 - 히트 싱크 - Google Patents
히트 싱크 Download PDFInfo
- Publication number
- KR102434571B1 KR102434571B1 KR1020207019646A KR20207019646A KR102434571B1 KR 102434571 B1 KR102434571 B1 KR 102434571B1 KR 1020207019646 A KR1020207019646 A KR 1020207019646A KR 20207019646 A KR20207019646 A KR 20207019646A KR 102434571 B1 KR102434571 B1 KR 102434571B1
- Authority
- KR
- South Korea
- Prior art keywords
- heat dissipation
- dissipation fin
- heat
- heat sink
- fin
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/000746 WO2019138564A1 (ja) | 2018-01-15 | 2018-01-15 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20200095542A KR20200095542A (ko) | 2020-08-10 |
KR102434571B1 true KR102434571B1 (ko) | 2022-08-19 |
Family
ID=67218536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207019646A KR102434571B1 (ko) | 2018-01-15 | 2018-01-15 | 히트 싱크 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7004746B2 (zh) |
KR (1) | KR102434571B1 (zh) |
CN (1) | CN111567155B (zh) |
TW (1) | TWI664896B (zh) |
WO (1) | WO2019138564A1 (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP2007281504A (ja) | 2007-06-04 | 2007-10-25 | Fujikura Ltd | ヒートシンクおよびフィンモジュール |
JP2017130578A (ja) | 2016-01-21 | 2017-07-27 | 株式会社Uacj | 熱交換器用ヒートシンク及び該ヒートシンクを備えた熱交換器 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621251Y2 (ja) * | 1989-01-26 | 1994-06-01 | 三菱アルミニウム株式会社 | 電気素子用放熱器 |
JPH02132993U (zh) * | 1989-04-07 | 1990-11-05 | ||
JPH09116061A (ja) * | 1995-10-13 | 1997-05-02 | Mitsubishi Materials Corp | 電子部品用冷却装置 |
JP2853618B2 (ja) * | 1995-11-15 | 1999-02-03 | 日本電気株式会社 | 電子装置の放熱構造 |
JP2000305273A (ja) | 1998-11-19 | 2000-11-02 | Applied Materials Inc | 遠紫外線ドライフォトリソグラフィー |
JP3008942B1 (ja) | 1998-11-20 | 2000-02-14 | 日本電気株式会社 | 電子装置の放熱構造 |
JP4063025B2 (ja) * | 2002-09-19 | 2008-03-19 | ティアック株式会社 | ヒートシンク |
US7408778B2 (en) * | 2006-09-11 | 2008-08-05 | International Business Machines Corporation | Heat sinks for dissipating a thermal load |
CN101325862A (zh) * | 2008-08-01 | 2008-12-17 | 北京星网锐捷网络技术有限公司 | 一种机箱、散热装置以及散热装置安装方法 |
US20120132400A1 (en) * | 2009-08-07 | 2012-05-31 | Furukawa-Sky Aluminum Corp. | Heat Sink |
JP5236772B2 (ja) * | 2011-04-18 | 2013-07-17 | 株式会社ソニー・コンピュータエンタテインメント | ヒートシンク及びヒートシンクを備える電子機器 |
US8765287B2 (en) * | 2011-08-09 | 2014-07-01 | Samsung Sdi Co., Ltd. | Battery module |
WO2015033724A1 (ja) * | 2013-09-05 | 2015-03-12 | 富士電機株式会社 | 電力用半導体モジュール |
TWM504269U (zh) * | 2014-11-19 | 2015-07-01 | Giga Byte Tech Co Ltd | 板件固定結構 |
JP6582717B2 (ja) * | 2015-08-18 | 2019-10-02 | 富士電機株式会社 | 電子電気機器 |
JP2017084883A (ja) * | 2015-10-23 | 2017-05-18 | スタンレー電気株式会社 | グラファイトを用いたヒートシンク、および、発光装置 |
TWM547822U (zh) * | 2017-05-17 | 2017-08-21 | 至良科技股份有限公司 | 散熱器固定結構及電連接器殼座組合 |
-
2018
- 2018-01-15 KR KR1020207019646A patent/KR102434571B1/ko active IP Right Grant
- 2018-01-15 JP JP2019564257A patent/JP7004746B2/ja active Active
- 2018-01-15 CN CN201880076912.3A patent/CN111567155B/zh active Active
- 2018-01-15 WO PCT/JP2018/000746 patent/WO2019138564A1/ja active Application Filing
- 2018-04-26 TW TW107114247A patent/TWI664896B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP2007281504A (ja) | 2007-06-04 | 2007-10-25 | Fujikura Ltd | ヒートシンクおよびフィンモジュール |
JP2017130578A (ja) | 2016-01-21 | 2017-07-27 | 株式会社Uacj | 熱交換器用ヒートシンク及び該ヒートシンクを備えた熱交換器 |
Also Published As
Publication number | Publication date |
---|---|
CN111567155B (zh) | 2022-11-08 |
JPWO2019138564A1 (ja) | 2020-11-26 |
KR20200095542A (ko) | 2020-08-10 |
TW201933977A (zh) | 2019-08-16 |
TWI664896B (zh) | 2019-07-01 |
CN111567155A (zh) | 2020-08-21 |
JP7004746B2 (ja) | 2022-01-21 |
WO2019138564A1 (ja) | 2019-07-18 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |