KR102206395B1 - 개별파티션을 구비한 도금장치 - Google Patents

개별파티션을 구비한 도금장치 Download PDF

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Publication number
KR102206395B1
KR102206395B1 KR1020200080189A KR20200080189A KR102206395B1 KR 102206395 B1 KR102206395 B1 KR 102206395B1 KR 1020200080189 A KR1020200080189 A KR 1020200080189A KR 20200080189 A KR20200080189 A KR 20200080189A KR 102206395 B1 KR102206395 B1 KR 102206395B1
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KR
South Korea
Prior art keywords
plating
individual
substrate
anode
plating line
Prior art date
Application number
KR1020200080189A
Other languages
English (en)
Korean (ko)
Other versions
KR102206395B9 (ko
Inventor
배민수
Original Assignee
(주)네오피엠씨
배민수
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)네오피엠씨, 배민수 filed Critical (주)네오피엠씨
Priority to KR1020200080189A priority Critical patent/KR102206395B1/ko
Priority to TW109146732A priority patent/TWI769643B/zh
Priority to CN202011613416.2A priority patent/CN113943968A/zh
Application granted granted Critical
Publication of KR102206395B1 publication Critical patent/KR102206395B1/ko
Publication of KR102206395B9 publication Critical patent/KR102206395B9/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020200080189A 2020-06-30 2020-06-30 개별파티션을 구비한 도금장치 KR102206395B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020200080189A KR102206395B1 (ko) 2020-06-30 2020-06-30 개별파티션을 구비한 도금장치
TW109146732A TWI769643B (zh) 2020-06-30 2020-12-29 具備個別分區的電鍍裝置
CN202011613416.2A CN113943968A (zh) 2020-06-30 2020-12-30 具备个别分区的电镀装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200080189A KR102206395B1 (ko) 2020-06-30 2020-06-30 개별파티션을 구비한 도금장치

Publications (2)

Publication Number Publication Date
KR102206395B1 true KR102206395B1 (ko) 2021-01-25
KR102206395B9 KR102206395B9 (ko) 2022-04-11

Family

ID=74237948

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200080189A KR102206395B1 (ko) 2020-06-30 2020-06-30 개별파티션을 구비한 도금장치

Country Status (3)

Country Link
KR (1) KR102206395B1 (zh)
CN (1) CN113943968A (zh)
TW (1) TWI769643B (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254799A (ja) * 1988-08-19 1990-02-23 Chuo Seisakusho Ltd メッキ処理槽における給電装置
KR20010085638A (ko) * 2000-02-28 2001-09-07 다카노 야스아키 도금 장치
JP2006037134A (ja) * 2004-07-23 2006-02-09 Chuo Seisakusho Ltd 連続搬送式めっき装置の電流制御方法
KR20090049957A (ko) * 2007-11-14 2009-05-19 삼성전기주식회사 도금장치
KR20130035201A (ko) * 2011-09-29 2013-04-08 아루멕쿠스 피이 가부시키가이샤 연속 도금 장치
KR20130071861A (ko) 2011-12-21 2013-07-01 삼성전기주식회사 기판 도금 장치 및 그 제어 방법
KR101859395B1 (ko) 2017-10-18 2018-05-18 (주)네오피엠씨 기판 도금장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204982125U (zh) * 2015-08-24 2016-01-20 黄海 一种用于pcb垂直连续电镀生产线的阴极电流分段调节机构

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254799A (ja) * 1988-08-19 1990-02-23 Chuo Seisakusho Ltd メッキ処理槽における給電装置
KR20010085638A (ko) * 2000-02-28 2001-09-07 다카노 야스아키 도금 장치
JP2006037134A (ja) * 2004-07-23 2006-02-09 Chuo Seisakusho Ltd 連続搬送式めっき装置の電流制御方法
KR20090049957A (ko) * 2007-11-14 2009-05-19 삼성전기주식회사 도금장치
KR20130035201A (ko) * 2011-09-29 2013-04-08 아루멕쿠스 피이 가부시키가이샤 연속 도금 장치
KR20130071861A (ko) 2011-12-21 2013-07-01 삼성전기주식회사 기판 도금 장치 및 그 제어 방법
KR101859395B1 (ko) 2017-10-18 2018-05-18 (주)네오피엠씨 기판 도금장치

Also Published As

Publication number Publication date
CN113943968A (zh) 2022-01-18
KR102206395B9 (ko) 2022-04-11
TWI769643B (zh) 2022-07-01
TW202202664A (zh) 2022-01-16

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