KR101872764B1 - Display LED Chip Arrangement Method and LED Chip Picking and Arrangement Device - Google Patents

Display LED Chip Arrangement Method and LED Chip Picking and Arrangement Device Download PDF

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Publication number
KR101872764B1
KR101872764B1 KR1020170026879A KR20170026879A KR101872764B1 KR 101872764 B1 KR101872764 B1 KR 101872764B1 KR 1020170026879 A KR1020170026879 A KR 1020170026879A KR 20170026879 A KR20170026879 A KR 20170026879A KR 101872764 B1 KR101872764 B1 KR 101872764B1
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South Korea
Prior art keywords
vacuum
led chip
pickup
pick
display
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KR1020170026879A
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Korean (ko)
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황선오
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주식회사 코엠에스
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Publication of KR101872764B1 publication Critical patent/KR101872764B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a method for arranging a display LED chip, which comprises: an LED chip group providing step (10); a picking-arrangement apparatus providing step (S20); a first adsorption-grinding step (S30); a first arrangement step (S40); a second adsorption-grinding step (S50); and a second arrangement step (S60). Accordingly, when transferring and arranging an LED chip, the present invention can simultaneously transfer a plurality of LED chips to arrange the same on a display, thereby maximizing working process efficiency.

Description

TECHNICAL FIELD [0001] The present invention relates to an LED chip picking and arranging device,

The present invention relates to a display LED chip arrangement method and an LED chip picking and arraying apparatus.

A multi-picker apparatus for feeding an LED chip includes: a place part having a rotary actuator and a rotary plate rotated by the rotary actuator; And a plurality of vertically arranged actuators, a picker arm, and a plurality of adjacently arranged pluralities for picking up the LED chips, the plurality of pickers being fixed to the ends of the picker arms, Wherein tips of each of the plurality of pickers are formed on the same circumference around the rotation axis so as to pick down the LED chips on the same circumference, And a plurality of LED chips are arranged on the same plane.

A conventional LED chip arrangement method and an LED chip picking and arranging apparatus

A plurality of LED chips are repeatedly arranged on the display in order to move the LED chip thereon, and the apparatus for moving and attaching the LED chip has a large moving distance per chip, and the apparatus for transferring and attaching the LED chip having a small size has a large and complicated configuration There was a problem.

The present invention relates to a display LED chip arrangement method capable of maximizing a work process efficiency by transferring a plurality of LED chips simultaneously by transferring and arranging LED chips on a display, .

In the present invention, a plurality of LED chips can be simultaneously transported and arranged on a display to arrange the LED chips on the display, thereby reducing the average distance traveled by the devices per unit chip, facilitating the gripping and arranging of LED chips And to provide a display LED chip arrangement device capable of maximizing the work process efficiency.

According to the present invention,

The first horizontal spacing L1 is a horizontal spacing between adjacent columns based on the center of the LED chip C and the first vertical spacing H1 is a vertical spacing between adjacent rows Row (S10) of providing a group of LED chips arranged (wafer chip, 1);

(10, 10a, 10b, 10c, 10d) arranged in an M ij matrix shape having at least two rows and at least two rows and at least j columns,

The third lateral spacing L3, which is the lateral distance L3 of the adjacent pickup tools 10,

Third lateral spacing L3 = first lateral spacing L1, natural number B1 (where natural number B1 = 2, 3, 4 ... 100)

The third kind interval H3, which is the vertical distance L3 of the adjacent pick-up tools 10,

A third kind interval (H3) = a first kind interval (H1) x a natural number B2 (where a natural number B2 = 2, 3, 4 ... 200)

A picking array device providing step (S20) of providing a picking array device (100);

The picking arrangement device 100 is moved to an upper portion of the LED chip group so that the first picked-up fingers 10a, 10b, 10c, 10d, Step S30;

The picking arrangement device 100 is a device for positioning and holding the gripped LED chips on the display 5 at desired positions 6a, 6b, 6c and 6d without mutual movement between the pick- 1 placement step S40;

The picking array device 100 moves again to the upper side of the group of LED chips (wafer chip 1) and simultaneously picks up at least four or more LED chips 3a, 3b, 3c and 3d using the pick- (S50) of gripping the first and second suction cups;

The picking arrangement device 100 simultaneously moves the LED chips held in the second attraction holding step S50 to the other desired positions 7a, 7b, 7c and 7d on the display 5 at the same time, A second disposing step (S60) for disposing and releasing the disposable disposable diaper;

And a control unit.

According to the present invention, a plurality of LED chips can be simultaneously transported and arranged on a display so as to be arranged on a display, thereby reducing an average transfer distance of a device per unit chip, thereby maximizing a work process efficiency. A chip alignment method is provided.

According to the present invention, when the LED chip is transferred and arranged on the display, a plurality of LED chips can be simultaneously transferred and arranged on the display, so that the average distance of the device per unit chip can be reduced, There is provided a display LED chip arraying apparatus capable of maximizing the efficiency of the work process.

1 (a) and (b) are explanatory views of a method of arranging LED chips according to an embodiment of the present invention.
2 (a) and (b) are explanatory views of a method of arranging LED chips according to an embodiment of the present invention.
3 is a block diagram of an LED chip picking array device for a display according to an embodiment of the present invention.
4 is an enlarged view of a main part of an LED chip picking array apparatus for a display according to an embodiment of the present invention.
5 is an enlarged view of a grip portion and a pickup tool of the present invention.
6 is a flowchart of a method of arranging a LED chip for a display according to the present invention.

Hereinafter, a method of arranging a LED chip for display and an LED chip picking and arranging device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 2 (a) and 2 (b) are explanatory diagrams of a method of arranging LED chips according to an embodiment of the present invention. FIG. 3 is an enlarged view of an LED chip picking array device for a display according to an embodiment of the present invention, FIG. 4 is an enlarged view of a main part of an LED chip picking array device for a display according to an embodiment of the present invention, And an enlarged view of the grip portion and the pickup tool. 6 is a flowchart of a method of arranging an LED chip for a display according to the present invention.

As shown in FIGS. 1 to 5 and 6, a method of arranging an LED chip for a display according to an embodiment of the present invention includes a step of providing an LED chip group (S10), a step of providing a picking array device (S20) A holding step S30 and a first placing step S40; A second adsorption holding step (S50) and a second placing step (S60).

First, in the LED chip group providing step S10, the horizontal interval between adjacent columns based on the center of the LED chip C is the first horizontal interval L1, and the vertical interval between adjacent rows (Wafer chip, 1) arranged in a matrix form so as to be spaced apart from each other at an interval (H1). The LED chip is a conventional display LED chip (R, G, B) which is processed into a wafer or grown on a wafer.

The picking array apparatus 100 is provided in the picking array apparatus providing step S20. The picking arrangement 100 comprises pick-up tools 10, 10a, 10b, 10c, 10d arranged in an M ij matrix with at least two rows of i rows and at least two columns j columns ). The third lateral spacing L3 which is the lateral distance L3 of the adjacent pickup tools 10 is equal to the third lateral spacing L3 = the first lateral spacing L1 and the natural number B1 Third interval H3 which is the vertical distance H3 of the adjacent pickup tools 10 is equal to the first type interval H1 and the natural number B2 (Where the natural number B2 = 2, 3, 4 ... 200).

1 (a) and 2 (b), the display LED chips R, G and B have a width of 50 to 80 micrometers (0.05 to 0.08 mm) and a vertical size of 20 micrometers (0.02 mm) size level. The adjacent transverse length L1 between the centers of the LED chips (R, G, B) is 70 micrometers (0.07 mm). The adjacent vertical length H1 between the centers of the LED chips (R, G, B) is 60 micrometers (0.06 mm).

In the embodiment, the third lateral spacing L3 = the first lateral spacing L1, the natural number B1 (here, the natural number B1 = 4), which is the lateral distance L3 of the pickup tools 10. That is, the third lateral spacing L3 is the first lateral spacing L1. For example, the horizontal dimension is 280 micrometers (0.28 mm).

In the first attraction holding step S30, the picking arrangement device 100 is moved above the LED chip group and at least four or more LED chips 2a, 2b, 2c, 2d are simultaneously And grips it.

Next, in the first arrangement step S40, the picking arrangement device 100 simultaneously holds the LED chips held by the picking arrangement device 100 between the pick-up tools 10 at desired positions 6a, 6b, 6c, 6d on the display 5 Place without relocation and release. The picking arrangement 100 is again moved over the group of LED chips 1 (wafer chip 1) and the pickup tools 10 are used to move at least four or more LED chips 3a, 3b , 3c, and 3d at the same time.

Next, in the second arrangement step S60, the picking arrangement device 100 moves the LED chips held in the second attraction holding step S50 to the other desired positions 7a, 7b, 7c, 7d ) Without mutual movement of the pick-up tools 10 at the same time.

1 to 5, in the LED chip arrangement method for display according to the embodiment of the present invention, the pick-up tool 10 arranged in the form of an M ij matrix has i rows (i = Row) and j columns in the range of 10 to 5,000.

In one embodiment of the present invention, when the horizontal spacing L3 = the first horizontal spacing L1 and the horizontal dimension is 280 micrometers (0.28 mm), the M ij matrix is assumed to be a 1,000 × 1,000 matrix The horizontal size of the area where the pick-up tool 10 is formed on the pickup 20 is 1,000 x 0.28 = 280 mm.

1 to 5, an LED chip picking and arranging apparatus according to an embodiment of the present invention includes a plurality of LED chips C, (Wafer chip 1) of LED chips arranged in a matrix form such that vertical intervals between adjacent rows Rl and L1 are arranged in a matrix form on the display 5, Positioning them to positions 6a, 6b, 6c, 6d without mutual movement of the pick-up tools 10 at the same time and then releasing them.

As shown in FIGS. 3 to 5, an LED chip picking and arranging apparatus according to an embodiment of the present invention includes pickup tools 10, 10a, 10b, 10c, and 10d, a pickup 20, Means 30, a body block 40 and a transfer frame 70. The pick-up tools 10, 10a, 10b, 10c and 10d are arranged in the form of a matrix of {M ij } having rows i of at least two rows and j rows of at least two columns .

Pick-up unit 20 pick-up tool (10, 10a, 10b, 10c , 10d) are formed at the lower front end of each pick-up tools, vacuum forming holes (25) for creating a vacuum for each adsorbed to (M ij) it has a plurality of . The vacuum forming means 30 communicates with the vacuum forming holes 25 at the upper portion of the pickup portion 20 to form a vacuum. The vacuum forming means 30 includes a porous ventilation support portion 31 which is closed by the upper surface of the pickup portion 20 and communicates with the vacuum forming hole 25 and a vacuum ventilation support portion 31 whose lower portion is in communication with the porous ventilation support portion 31. [ (35), and a vacuum source (37) connected to the upper portion of the vacuum tube (35). Here, the porous vent support 31 refers to a porous, breathable object that prevents local formation of vacuum. The porous vent support 31 may be replaced with a vacuum chamber which is hollow in this portion. That is, it can be replaced by a space that communicates with the vacuum forming means without placing the porous object.

The body block 40 has the pickup 20 attached thereto at its lower portion and the vacuum forming means 30 is integrally mounted. The transfer frame 70 grips the body block 40 and transfers the pick-up portion 20 to a desired position. The transfer means (not shown) transfers the transfer frame 70. And may be a two-degree-of-freedom transfer robot that moves along a normal rail moving in the horizontal direction and the vertical direction. The transfer frame 70 may be moved in the X, Y, Axis conveying means.

The body block 40 is slidable up and down along an elevation guide 50 fixed to the horizontal conveying block 70 and a supporting shaft 60 moving integrally with the conveying frame 70 A restoring body 80 is provided between the body block 40 and the supporting shaft 60 so that the supporting shaft 60 can be fixed to the body block 40 by the restoring force of the restoring body 80, 40) (the restoring force of the restorative object and the weight of the combined object are balanced in a static load state). The pickup tools 10, 10a, 10b, 10c, and 10d contact the upper surface of the LED chip C when the body block 40 on which the pickup tools 10, 10a, 10b, 10c, So that the force applied to the upper surface of the LED chip C is not excessively increased so as to prevent the LED chip C from being damaged.

As shown in the figure, each pick-up tool 10 arranged in a matrix of {M ij } has a vacuum adsorption protrusion 12 of a shape surrounding the lower end 25a of the vacuum forming hole 25, And a vacuum chamber 15 surrounded by the vacuum suction projection 12 and communicating with the lower end 25a of the vacuum forming hole 25 to generate a vacuum attraction force.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but on the contrary, ≪ RTI ID = 0.0 > and / or < / RTI >

It is to be understood that the appended claims are intended to supplement the understanding of the invention and should not be construed as limiting the scope of the appended claims.

10, 10a, 10b, 10c, and 10d: pickup tool 12: projection for vacuum suction
15: Vacuum dissipation 20: Pickup section
25: Vacuum forming hole 30: Vacuum forming means
31: Porous ventilation support part 35: Vacuum clearance
37: Vacuum source 40: Body block
50: lift-up guide 60: support shaft
70: horizontal transfer block 80: resilient object

Claims (6)

delete delete delete In an LED chip picking arrangement for display,
The column pitches are arranged in a matrix such that a horizontal interval between adjacent columns based on the center of the LED chip C is a first lateral interval L1 and a vertical interval between adjacent rows is a first type interval H1 (Wafer chip 1) of LED chips are placed on the display 5 at desired positions 6a, 6b, 6c, 6d arranged in a matrix form without simultaneous mutual movement of the pick-up tools 10 And is configured to perform a function of releasing,
(10, 10a, 10b, 10c, 10d) arranged in a matrix of {M ij } having rows i of at least two rows and row j of at least two columns, and,
Wherein a plurality of vacuum forming holes 25 are formed on the lower tip of the pick-up tool 10, 10a, 10b, 10c, 10d and each pickup tool M ij forms a vacuum for adsorption, 20);
A vacuum forming means (30) for forming a vacuum in the vacuum forming holes (25) at an upper portion of the pick-up portion (20);
A body block 40 to which the pickup unit 20 is attached and the vacuum forming unit 30 is integrally mounted;
A transfer frame (70) for holding the body block (40) and transferring the pickup part (20) to a desired position;
And conveying means (not shown) for conveying the conveying frame 70,

The body block 40 is slidable up and down along an elevation guide 50 fixed to the horizontal conveying block 70,
A support shaft 60, which moves integrally with the transfer frame 70, grips the body block 40,
A restoring body 80 is provided between the body block 40 and the supporting shaft 60 so that the supporting shaft 60 grasps the body block 40 with a restoring force of the restoring body 80 The restoring force of the restorable object and the weight of the combined object are balanced)
The pickup tools 10, 10a, 10b, 10c, and 10d contact the upper surface of the LED chip C when the body block 40 on which the pickup tools 10, 10a, 10b, 10c, So that the force applied to the upper surface of the LED chip (C) is not excessively increased so as to prevent breakage of the LED chip (C). In an LED chip picking arrangement for display,
The column pitches are arranged in a matrix such that a horizontal interval between adjacent columns based on the center of the LED chip C is a first lateral interval L1 and a vertical interval between adjacent rows is a first type interval H1 (Wafer chip 1) of LED chips are placed on the display 5 at desired positions 6a, 6b, 6c, 6d arranged in a matrix form without simultaneous mutual movement of the pick-up tools 10 And is configured to perform a function of releasing,
(10, 10a, 10b, 10c, 10d) arranged in a matrix of {M ij } having rows i of at least two rows and row j of at least two columns, and,
Wherein a plurality of vacuum forming holes 25 are formed on the lower tip of the pick-up tool 10, 10a, 10b, 10c, 10d and each pickup tool M ij forms a vacuum for adsorption, 20);
A vacuum forming means (30) for forming a vacuum in the vacuum forming holes (25) at an upper portion of the pick-up portion (20);
A body block 40 to which the pickup unit 20 is attached and the vacuum forming unit 30 is integrally mounted;
A transfer frame (70) for holding the body block (40) and transferring the pickup part (20) to a desired position;
And conveying means (not shown) for conveying the conveying frame 70,

Each of the pick-up tools 10 arranged in the {M ij }
A vacuum adsorption protrusion 12 having a shape surrounding the lower end 25a of the vacuum forming hole 25
A vacuum chamber 15 surrounded by the vacuum adsorption protrusion 12 and communicating with the lower end 25a of the vacuum forming hole 25 to generate a vacuum attraction force,
And an LED chip picking-up device for a display.
6. The method of claim 5,
The vacuum forming means (30)
A porous ventilation support 31 closed by the upper surface of the pickup 20 and communicating with the vacuum formation hole 25,
A vacuum through-pipe 35 whose lower portion is in communication with the porous vent supporting portion 31,
A vacuum source 37 connected to the upper portion of the vacuum tube 14,
And a light emitting diode (LED) chip.
KR1020170026879A 2017-03-02 2017-03-02 Display LED Chip Arrangement Method and LED Chip Picking and Arrangement Device KR101872764B1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004034441A2 (en) * 2002-10-10 2004-04-22 Ofer Avineri Apparatus and method for assembling arrays of functional elements to substrates
EP1911336A2 (en) * 2005-07-21 2008-04-16 Fico B.V. Method and device for displacing a group of components ordered in a matrix structure
KR100874610B1 (en) * 2007-10-23 2008-12-17 한국기계연구원 Semiconductor pick up apparatus and method of using the same
KR100976401B1 (en) * 2008-02-28 2010-08-17 주식회사 에스에프에이 Apparatus for transferring semiconductor
JP4919240B2 (en) * 2010-04-13 2012-04-18 パイオニア株式会社 Parts transfer apparatus and method
KR101627336B1 (en) * 2015-04-01 2016-06-08 한미반도체 주식회사 Aligning Apparatus of Semiconductor Package and Method of Aligning of Semiconductor Package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004034441A2 (en) * 2002-10-10 2004-04-22 Ofer Avineri Apparatus and method for assembling arrays of functional elements to substrates
EP1911336A2 (en) * 2005-07-21 2008-04-16 Fico B.V. Method and device for displacing a group of components ordered in a matrix structure
KR100874610B1 (en) * 2007-10-23 2008-12-17 한국기계연구원 Semiconductor pick up apparatus and method of using the same
KR100976401B1 (en) * 2008-02-28 2010-08-17 주식회사 에스에프에이 Apparatus for transferring semiconductor
JP4919240B2 (en) * 2010-04-13 2012-04-18 パイオニア株式会社 Parts transfer apparatus and method
KR101627336B1 (en) * 2015-04-01 2016-06-08 한미반도체 주식회사 Aligning Apparatus of Semiconductor Package and Method of Aligning of Semiconductor Package

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