KR100959009B1 - 박막 형성 장치 및 그 방법 - Google Patents
박막 형성 장치 및 그 방법 Download PDFInfo
- Publication number
- KR100959009B1 KR100959009B1 KR20077008800A KR20077008800A KR100959009B1 KR 100959009 B1 KR100959009 B1 KR 100959009B1 KR 20077008800 A KR20077008800 A KR 20077008800A KR 20077008800 A KR20077008800 A KR 20077008800A KR 100959009 B1 KR100959009 B1 KR 100959009B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- board
- substrate tray
- thin film
- film forming
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims abstract description 191
- 239000010408 film Substances 0.000 claims abstract description 53
- 239000013077 target material Substances 0.000 claims abstract description 47
- 238000004544 sputter deposition Methods 0.000 claims abstract description 31
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 25
- 230000007723 transport mechanism Effects 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 41
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 238000000605 extraction Methods 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008676 import Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- -1 Au and Ag Chemical class 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/32779—Continuous moving of batches of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2004-00308047 | 2004-10-22 | ||
JP2004308047A JP4665155B2 (ja) | 2004-10-22 | 2004-10-22 | 薄膜形成装置及びその方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070067147A KR20070067147A (ko) | 2007-06-27 |
KR100959009B1 true KR100959009B1 (ko) | 2010-05-20 |
Family
ID=36202769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20077008800A KR100959009B1 (ko) | 2004-10-22 | 2005-01-24 | 박막 형성 장치 및 그 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4665155B2 (ja) |
KR (1) | KR100959009B1 (ja) |
CN (1) | CN101044260B (ja) |
WO (1) | WO2006043343A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100100958A (ko) * | 2007-12-27 | 2010-09-15 | 엑사테크 엘.엘.씨. | 멀티-패스 진공 코팅 시스템 |
CN101931024B (zh) * | 2009-06-18 | 2012-11-07 | 亚洲太阳科技有限公司 | 用于薄膜太阳能电池制造的溅射机及溅射方法 |
JP2011096393A (ja) * | 2009-10-27 | 2011-05-12 | Hitachi High-Technologies Corp | 有機elデバイス製造装置及びその製造方法並びに成膜装置及び成膜方法 |
JP2011193288A (ja) * | 2010-03-15 | 2011-09-29 | Seiko Instruments Inc | パターン形成方法、パターン形成装置、圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計 |
JP5524349B2 (ja) * | 2010-11-15 | 2014-06-18 | 株式会社アルバック | 成膜装置 |
JP5816189B2 (ja) * | 2011-08-30 | 2015-11-18 | 新明和工業株式会社 | 真空成膜装置 |
TW201330156A (zh) * | 2011-12-29 | 2013-07-16 | Ardenne Anlagentech Gmbh | 分批處理中基板處理裝置及方法 |
JP5939817B2 (ja) * | 2012-01-30 | 2016-06-22 | 株式会社アルバック | 成膜装置 |
JP2014028999A (ja) * | 2012-07-31 | 2014-02-13 | Ulvac Japan Ltd | 成膜装置 |
JP2014078601A (ja) * | 2012-10-10 | 2014-05-01 | Sumitomo Heavy Ind Ltd | 成膜装置用基板搬送トレイ、及び外部開閉駆動装置 |
JP6088964B2 (ja) | 2013-12-13 | 2017-03-01 | 株式会社東芝 | 半導体製造装置 |
JP6451030B2 (ja) * | 2015-01-26 | 2019-01-16 | 株式会社昭和真空 | 成膜装置 |
JP7052995B2 (ja) * | 2017-11-13 | 2022-04-12 | Necエンベデッドプロダクツ株式会社 | 搬送システム、制御装置、制御方法及びプログラム |
JP6947396B2 (ja) * | 2017-11-13 | 2021-10-13 | Necエンベデッドプロダクツ株式会社 | 搬送装置及び搬送方法 |
JP2019187143A (ja) * | 2018-04-12 | 2019-10-24 | 豊田合成株式会社 | 積層型誘電アクチュエータの製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08232062A (ja) * | 1995-01-14 | 1996-09-10 | Leybold Ag | コーティングするための装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2603209B2 (ja) * | 1983-04-12 | 1997-04-23 | キヤノン株式会社 | 情報処理装置 |
JPH0649639A (ja) * | 1992-07-31 | 1994-02-22 | Shimadzu Corp | マグネトロンスパッタ装置 |
JPH06108241A (ja) * | 1992-09-30 | 1994-04-19 | Shibaura Eng Works Co Ltd | スパッタリング装置 |
JP2603209Y2 (ja) * | 1993-06-16 | 2000-03-06 | アネルバ株式会社 | 基板搬送装置 |
JPH0754284A (ja) * | 1993-08-16 | 1995-02-28 | Yoshimoto Insatsushiya:Kk | プリント用積層体 |
JP2911797B2 (ja) * | 1995-11-28 | 1999-06-23 | ホーヤ株式会社 | 磁気記録媒体及びその製造方法 |
JPH10158835A (ja) * | 1996-11-29 | 1998-06-16 | Mitsubishi Heavy Ind Ltd | 搬送装置 |
JP2001057449A (ja) * | 1999-06-08 | 2001-02-27 | Matsushita Electric Ind Co Ltd | 薄板圧電素子並びにそれを用いた圧電振動子及び圧電発音体 |
-
2004
- 2004-10-22 JP JP2004308047A patent/JP4665155B2/ja active Active
-
2005
- 2005-01-24 KR KR20077008800A patent/KR100959009B1/ko not_active IP Right Cessation
- 2005-01-24 CN CN2005800361422A patent/CN101044260B/zh not_active Expired - Fee Related
- 2005-01-24 WO PCT/JP2005/000853 patent/WO2006043343A1/ja active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08232062A (ja) * | 1995-01-14 | 1996-09-10 | Leybold Ag | コーティングするための装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2006043343A1 (ja) | 2006-04-27 |
CN101044260B (zh) | 2010-05-12 |
CN101044260A (zh) | 2007-09-26 |
KR20070067147A (ko) | 2007-06-27 |
JP4665155B2 (ja) | 2011-04-06 |
JP2006118008A (ja) | 2006-05-11 |
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