KR100959009B1 - 박막 형성 장치 및 그 방법 - Google Patents

박막 형성 장치 및 그 방법 Download PDF

Info

Publication number: KR100959009B1
Authority: KR; South Korea
Prior art keywords: substrate; board; substrate tray; thin film; film forming
Prior art date: 2004-10-22

Application number

KR20077008800A

Other languages

English (en)

Korean (ko)

Other versions

KR20070067147A (ko

Inventor

타카유키 후지와라

카즈요시 나가이

Original Assignee

가부시키가이샤 쇼와 신쿠

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-10-22

Filing date

2005-01-24

Publication date

2010-05-20

2005-01-24 Application filed by 가부시키가이샤 쇼와 신쿠 filed Critical 가부시키가이샤 쇼와 신쿠

2007-06-27 Publication of KR20070067147A publication Critical patent/KR20070067147A/ko

2010-05-20 Application granted granted Critical

2010-05-20 Publication of KR100959009B1 publication Critical patent/KR100959009B1/ko

Links

239000010409 thin film Substances 0.000 title claims abstract description 31
238000000034 method Methods 0.000 title claims description 24
239000000758 substrate Substances 0.000 claims abstract description 191
239000010408 film Substances 0.000 claims abstract description 53
239000013077 target material Substances 0.000 claims abstract description 47
238000004544 sputter deposition Methods 0.000 claims abstract description 31
230000015572 biosynthetic process Effects 0.000 claims abstract description 25
230000007723 transport mechanism Effects 0.000 claims abstract description 5
230000007246 mechanism Effects 0.000 claims description 41
238000002347 injection Methods 0.000 claims description 18
239000007924 injection Substances 0.000 claims description 18
238000000605 extraction Methods 0.000 claims description 16
229910052737 gold Inorganic materials 0.000 claims description 4
229910052709 silver Inorganic materials 0.000 claims description 4
238000012423 maintenance Methods 0.000 abstract description 5
239000013078 crystal Substances 0.000 description 10
230000008569 process Effects 0.000 description 6
238000000151 deposition Methods 0.000 description 5
230000008021 deposition Effects 0.000 description 5
230000006872 improvement Effects 0.000 description 4
238000012545 processing Methods 0.000 description 4
230000000694 effects Effects 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000002184 metal Substances 0.000 description 3
239000007769 metal material Substances 0.000 description 3
238000003825 pressing Methods 0.000 description 3
239000010453 quartz Substances 0.000 description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
230000008676 import Effects 0.000 description 2
230000001965 increasing effect Effects 0.000 description 2
239000010410 layer Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
230000009467 reduction Effects 0.000 description 2
239000002699 waste material Substances 0.000 description 2
-1 Au and Ag Chemical class 0.000 description 1
241001122767 Theaceae Species 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
239000007772 electrode material Substances 0.000 description 1
230000003028 elevating effect Effects 0.000 description 1
230000004907 flux Effects 0.000 description 1
238000003780 insertion Methods 0.000 description 1
230000037431 insertion Effects 0.000 description 1
238000009434 installation Methods 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000005259 measurement Methods 0.000 description 1
239000012528 membrane Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
238000007789 sealing Methods 0.000 description 1
238000004904 shortening Methods 0.000 description 1
239000002356 single layer Substances 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/32779—Continuous moving of batches of workpieces
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Plasma & Fusion (AREA)
Analytical Chemistry (AREA)
Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Physical Vapour Deposition (AREA)
Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

KR20077008800A 2004-10-22 2005-01-24 박막 형성 장치 및 그 방법 KR100959009B1 (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2004-00308047		2004-10-22
JP2004308047A JP4665155B2 (ja)	2004-10-22	2004-10-22	薄膜形成装置及びその方法

Publications (2)

Publication Number	Publication Date
KR20070067147A KR20070067147A (ko)	2007-06-27
KR100959009B1 true KR100959009B1 (ko)	2010-05-20

Family

ID=36202769

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR20077008800A KR100959009B1 (ko)	2004-10-22	2005-01-24	박막 형성 장치 및 그 방법

Country Status (4)

Country	Link
JP (1)	JP4665155B2 (ja)
KR (1)	KR100959009B1 (ja)
CN (1)	CN101044260B (ja)
WO (1)	WO2006043343A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20100100958A (ko) *	2007-12-27	2010-09-15	엑사테크 엘.엘.씨.	멀티-패스 진공 코팅 시스템
CN101931024B (zh) *	2009-06-18	2012-11-07	亚洲太阳科技有限公司	用于薄膜太阳能电池制造的溅射机及溅射方法
JP2011096393A (ja) *	2009-10-27	2011-05-12	Hitachi High-Technologies Corp	有機ｅｌデバイス製造装置及びその製造方法並びに成膜装置及び成膜方法
JP2011193288A (ja) *	2010-03-15	2011-09-29	Seiko Instruments Inc	パターン形成方法、パターン形成装置、圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計
JP5524349B2 (ja) *	2010-11-15	2014-06-18	株式会社アルバック	成膜装置
JP5816189B2 (ja) *	2011-08-30	2015-11-18	新明和工業株式会社	真空成膜装置
TW201330156A (zh) *	2011-12-29	2013-07-16	Ardenne Anlagentech Gmbh	分批處理中基板處理裝置及方法
JP5939817B2 (ja) *	2012-01-30	2016-06-22	株式会社アルバック	成膜装置
JP2014028999A (ja) *	2012-07-31	2014-02-13	Ulvac Japan Ltd	成膜装置
JP2014078601A (ja) *	2012-10-10	2014-05-01	Sumitomo Heavy Ind Ltd	成膜装置用基板搬送トレイ、及び外部開閉駆動装置
JP6088964B2 (ja)	2013-12-13	2017-03-01	株式会社東芝	半導体製造装置
JP6451030B2 (ja) *	2015-01-26	2019-01-16	株式会社昭和真空	成膜装置
JP7052995B2 (ja) *	2017-11-13	2022-04-12	Ｎｅｃエンベデッドプロダクツ株式会社	搬送システム、制御装置、制御方法及びプログラム
JP6947396B2 (ja) *	2017-11-13	2021-10-13	Ｎｅｃエンベデッドプロダクツ株式会社	搬送装置及び搬送方法
JP2019187143A (ja) *	2018-04-12	2019-10-24	豊田合成株式会社	積層型誘電アクチュエータの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08232062A (ja) *	1995-01-14	1996-09-10	Leybold Ag	コーティングするための装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
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JP2603209B2 (ja) *	1983-04-12	1997-04-23	キヤノン株式会社	情報処理装置
JPH0649639A (ja) *	1992-07-31	1994-02-22	Shimadzu Corp	マグネトロンスパッタ装置
JPH06108241A (ja) *	1992-09-30	1994-04-19	Shibaura Eng Works Co Ltd	スパッタリング装置
JP2603209Y2 (ja) *	1993-06-16	2000-03-06	アネルバ株式会社	基板搬送装置
JPH0754284A (ja) *	1993-08-16	1995-02-28	Yoshimoto Insatsushiya:Kk	プリント用積層体
JP2911797B2 (ja) *	1995-11-28	1999-06-23	ホーヤ株式会社	磁気記録媒体及びその製造方法
JPH10158835A (ja) *	1996-11-29	1998-06-16	Mitsubishi Heavy Ind Ltd	搬送装置
JP2001057449A (ja) *	1999-06-08	2001-02-27	Matsushita Electric Ind Co Ltd	薄板圧電素子並びにそれを用いた圧電振動子及び圧電発音体

2004
- 2004-10-22 JP JP2004308047A patent/JP4665155B2/ja active Active
2005
- 2005-01-24 KR KR20077008800A patent/KR100959009B1/ko not_active IP Right Cessation
- 2005-01-24 CN CN2005800361422A patent/CN101044260B/zh not_active Expired - Fee Related
- 2005-01-24 WO PCT/JP2005/000853 patent/WO2006043343A1/ja active Application Filing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH08232062A (ja) *	1995-01-14	1996-09-10	Leybold Ag	コーティングするための装置

Also Published As

Publication number	Publication date
WO2006043343A1 (ja)	2006-04-27
CN101044260B (zh)	2010-05-12
CN101044260A (zh)	2007-09-26
KR20070067147A (ko)	2007-06-27
JP4665155B2 (ja)	2011-04-06
JP2006118008A (ja)	2006-05-11

Legal Events

Date	Code	Title	Description
2008-01-10	A201	Request for examination
2009-11-11	E902	Notification of reason for refusal
2010-04-28	E701	Decision to grant or registration of patent right
2010-05-12	GRNT	Written decision to grant
2013-05-03	FPAY	Annual fee payment	Payment date: 20130503 Year of fee payment: 4
2014-05-07	FPAY	Annual fee payment	Payment date: 20140507 Year of fee payment: 5
2015-05-06	FPAY	Annual fee payment	Payment date: 20150506 Year of fee payment: 6
2017-05-08	FPAY	Annual fee payment	Payment date: 20170508 Year of fee payment: 8
2018-05-13	LAPS	Lapse due to unpaid annual fee

Publication	Publication Date	Title
KR100959009B1 (ko)	2010-05-20	박막 형성 장치 및 그 방법
US8715417B2 (en)	2014-05-06	Film forming apparatus
CN102686764B (zh)	2014-06-04	成膜装置以及成膜方法
JP5173699B2 (ja)	2013-04-03	有機ｅｌデバイス製造装置
KR0182772B1 (ko)	1999-04-01	스퍼터장치 및 타겟 교환장치 및 그 방법
CN211005607U (zh)	2020-07-14	用于在真空中沉积薄膜涂层的直列式涂布机
JP6811760B2 (ja)	2021-01-13	成膜装置及び成膜方法
JP2001135704A (ja)	2001-05-18	基板処理装置及び基板搬送用トレイの搬送制御方法
WO2018084286A1 (ja)	2018-05-11	成膜装置
WO2007099929A1 (ja)	2007-09-07	有機薄膜蒸着方法及び有機薄膜蒸着装置
JP2006118008A5 (ja)	2007-11-29
JPH11293459A (ja)	1999-10-26	多層成膜装置
KR102359244B1 (ko)	2022-02-08	막 증착 방법
CN208240622U (zh)	2018-12-14	用于装载及卸载基板的负载锁定腔室和直列基板处理***
JPH09111453A (ja)	1997-04-28	真空基板搬送装置及び真空基板搬送方法
JPS6324632A (ja)	1988-02-02	基板搬送装置
JPH088213A (ja)	1996-01-12	スパッタ法およびその装置
JPS6123270B2 (ja)	1986-06-05
JP4429748B2 (ja)	2010-03-10	サークルライン型真空成膜装置
KR100375078B1 (ko)	2003-03-07	대면적 유기반도체 기판의 기판반송기구를 갖는 증착처리장치 및 방법
JP2759028B2 (ja)	1998-05-28	磁性膜形成装置およびインライン成膜装置
KR101204779B1 (ko)	2012-11-26	금속증착장치
KR101229669B1 (ko)	2013-02-04	대면적 유기소자 기판의 자동로딩 및 언로딩장치
KR20060128496A (ko)	2006-12-14	스퍼터 시스템
CN114574815A (zh)	2022-06-03	成膜装置