KR100866171B1 - 레이저 가공 방법 - Google Patents
레이저 가공 방법 Download PDFInfo
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- KR100866171B1 KR100866171B1 KR1020077024260A KR20077024260A KR100866171B1 KR 100866171 B1 KR100866171 B1 KR 100866171B1 KR 1020077024260 A KR1020077024260 A KR 1020077024260A KR 20077024260 A KR20077024260 A KR 20077024260A KR 100866171 B1 KR100866171 B1 KR 100866171B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mining & Mineral Resources (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Led Devices (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Semiconductor Lasers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (5)
- 간격이 설치되도록 접착된 복수의 기판을 가지는 가공대상물에 있어서, 상기 기판 중 한 기판 내부에 집광점을 맞추어 레이저 광을 조사함으로써 상기 한 기판의 내부에 개질영역을 형성함과 동시에, 상기 기판 중 다른 기판 내부에 집광점을 맞추어 레이저 광을 조사함으로써 상기 다른 기판 내부에 개질영역을 형성하며, 이 개질영역들에 의해 상기 가공대상물의 절단예정라인에 따라 상기 가공대상물의 레이저 광 입사면으로부터 내측에 절단기점영역을 형성하는 공정과,상기 가공대상물에 대하여 응력을 인가함으로써 상기 절단기점영역을 절단의 기점으로 하여 상기 절단예정라인에 따라 상기 가공대상물을 절단하고, 간격이 설치되도록 접착된 복수의 기판을 가지는 기능소자를 복수 얻는 공정을 포함하고,상기 기판 중 적어도 하나는 실리콘 기판인 것을 특징으로 하는 레이저 가공방법.
- 청구항 1에 있어서,상기 다른 기판의 내부에 집광점을 맞추어 레이저 광을 조사함으로써 이 다른 기판의 내부에 개질영역을 형성하는 경우에, 상기 한 기판 측으로부터 레이저광을 조사하는 것을 특징으로 하는 레이저 가공방법.
- 청구항 1 또는 청구항 2에 있어서,상기 가공대상물에 대하여 응력을 인가함으로써 상기 절단기점영역을 절단의 기점으로 하여 상기 절단예정라인에 따라 상기 가공대상물을 절단하는 경우에, 상기 가공대상물의 표면 또는 이면에 나이프 에지를 눌러서 상기 가공대상물에 대하여 응력을 인가하는 것을 특징으로 하는 레이저 가공방법.
- 청구항 1 또는 청구항 2에 있어서,상기 기판 중 적어도 하나는 유리 기판인 것을 특징으로 하는 레이저 가공방법.
- 간격이 설치되도록 접착된 실리콘 기판과 유리 기판, 및 이 간격에 들어간 액정을 가지는 가공대상물에 있어서, 상기 실리콘 기판의 내부에 집광점을 맞추어 레이저 광을 조사함으로써 이 실리콘 기판의 내부에 개질영역을 형성함과 동시에, 상기 유리 기판의 내부에 집광점을 맞추어 레이저 광을 조사함으로써 이 유리 기판의 내부에 개질영역을 형성하고, 이 개질영역들에 의해 상기 가공대상물의 절단예정라인에 따라 상기 가공대상물의 레이저 광 입사면으로부터 내측에 절단기점영역을 형성하는 공정과,상기 가공대상물에 대하여 응력을 인가함으로써 상기 절단기점영역을 절단의 기점으로 하여 상기절단예정라인에 따라 상기 가공대상물을 절단하고, 간격이 설치되도록 접착된 실리콘 기판과 유리 기판, 및 이 간격에 들어간 액정을 가지는 반사형 액정표시장치를 복수 얻는 공정을 포함하는 것을 특징으로 하는 반사형 액정표시장치의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2002-00067372 | 2002-03-12 | ||
JP2002067372 | 2002-03-12 |
Related Parent Applications (1)
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KR1020047014282A Division KR100832941B1 (ko) | 2002-03-12 | 2003-03-12 | 레이저 가공 방법 |
Publications (2)
Publication Number | Publication Date |
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KR20070114398A KR20070114398A (ko) | 2007-12-03 |
KR100866171B1 true KR100866171B1 (ko) | 2008-10-30 |
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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KR1020047014372A KR100749972B1 (ko) | 2002-03-12 | 2003-03-11 | 가공 대상물 절단 방법 |
KR1020077024260A KR100866171B1 (ko) | 2002-03-12 | 2003-03-12 | 레이저 가공 방법 |
KR1020047014282A KR100832941B1 (ko) | 2002-03-12 | 2003-03-12 | 레이저 가공 방법 |
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KR1020047014372A KR100749972B1 (ko) | 2002-03-12 | 2003-03-11 | 가공 대상물 절단 방법 |
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KR1020047014282A KR100832941B1 (ko) | 2002-03-12 | 2003-03-12 | 레이저 가공 방법 |
Country Status (11)
Country | Link |
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US (7) | US7749867B2 (ko) |
EP (9) | EP1498216B1 (ko) |
JP (9) | JP4606741B2 (ko) |
KR (3) | KR100749972B1 (ko) |
CN (3) | CN1328002C (ko) |
AT (2) | ATE493226T1 (ko) |
AU (2) | AU2003211581A1 (ko) |
DE (1) | DE60335538D1 (ko) |
ES (3) | ES2356817T3 (ko) |
TW (2) | TWI296218B (ko) |
WO (2) | WO2003076119A1 (ko) |
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