KR100847325B1 - 전자 부품의 실장 방법 - Google Patents
전자 부품의 실장 방법 Download PDFInfo
- Publication number
- KR100847325B1 KR100847325B1 KR1020067022621A KR20067022621A KR100847325B1 KR 100847325 B1 KR100847325 B1 KR 100847325B1 KR 1020067022621 A KR1020067022621 A KR 1020067022621A KR 20067022621 A KR20067022621 A KR 20067022621A KR 100847325 B1 KR100847325 B1 KR 100847325B1
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- South Korea
- Prior art keywords
- solder
- electronic component
- substrate
- resin
- electrode
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (3)
- 측면에 단자를 갖는 전자 부품을 기판의 전극에 땜납 접합에 의해 실장하는 전자 부품의 실장 방법으로서,열경화형 플럭스에 땜납 입자를 혼입한 땜납 페이스트를 기판의 전극에 도포하는 땜납 페이스트 도포 공정과, 상기 전자 부품의 단자를 상기 전극에 도포된 땜납 페이스트에 접촉시키고 동시에 상기 전자 부품의 일부와 대향하는 상기 기판 사이에 극간을 설치한 상태로 상기 전자 부품을 상기 기판에 탑재하는 전자 부품 탑재 공정과, 상기 기판을 가열하여 상기 땜납 페이스트의 땜납을 용융시키고, 상기 땜납 페이스트의 열경화형 플럭스를 유동화시켜 상기 극간에 침입시킨 후 열경화시키는 가열 공정을 포함하는 것을 특징으로 하는 전자 부품의 실장 방법.
- 제 1항에 있어서,상기 가열 공정에 있어서, 유동화한 열경화형 플럭스가 상기 전극의 표면이면서 용융한 땜납으로 덮여 있지 않은 개소를 덮는 것을 특징으로 하는 전자 부품의 실장 방법.
- 제 1항에 있어서,상기 땜납 페이스트는 상온에서 고체이고 가열에 의해 액상으로 변화하는 성질을 갖는 고형 수지를 포함하는 것을 특징으로 하는 전자 부품의 실장 방법.
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PCT/JP2005/018743 WO2006041068A1 (ja) | 2004-10-12 | 2005-10-12 | 電子部品の実装方法 |
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JP2006303335A (ja) * | 2005-04-25 | 2006-11-02 | Sony Corp | 電子部品搭載用基板及びそれを用いた電子装置 |
JP4757070B2 (ja) * | 2006-03-27 | 2011-08-24 | 富士通株式会社 | 半田付け用フラックス及び半導体素子の接合方法 |
JP4591399B2 (ja) | 2006-04-03 | 2010-12-01 | パナソニック株式会社 | 部品接合方法ならびに部品接合構造 |
JP4882570B2 (ja) * | 2006-07-20 | 2012-02-22 | パナソニック株式会社 | モジュールの製造方法と、それにより製造したモジュール |
EP1914798A3 (en) * | 2006-10-18 | 2009-07-29 | Panasonic Corporation | Semiconductor Mounting Substrate and Method for Manufacturing the Same |
JP4674710B2 (ja) * | 2007-05-14 | 2011-04-20 | 立山科学工業株式会社 | 無線icタグの製造方法 |
CN101321433B (zh) * | 2007-06-04 | 2010-12-29 | 英华达(上海)科技有限公司 | 组件固着印刷电路板上的结构及其固着方法 |
US20090096076A1 (en) * | 2007-10-16 | 2009-04-16 | Jung Young Hy | Stacked semiconductor package without reduction in stata storage capacity and method for manufacturing the same |
WO2009104693A1 (ja) * | 2008-02-22 | 2009-08-27 | ハリマ化成株式会社 | はんだ接合構造およびはんだ付け用フラックス |
US20110068483A1 (en) * | 2008-06-05 | 2011-03-24 | Sumitomo Bakelite Co. Ltd | Method of manufacturing a semiconductor device and semiconductor device |
JP5533199B2 (ja) * | 2010-04-28 | 2014-06-25 | ソニー株式会社 | 素子の基板実装方法、および、その基板実装構造 |
JP5482605B2 (ja) * | 2010-09-27 | 2014-05-07 | パナソニック株式会社 | 電子部品実装方法 |
WO2013047137A1 (ja) * | 2011-09-30 | 2013-04-04 | 株式会社村田製作所 | 電子装置、及び接合材料、並びに電子装置の製造方法 |
US9653205B2 (en) * | 2014-04-30 | 2017-05-16 | Cyntec Co., Ltd. | Electrode structure and the corresponding electrical component using the same and the fabrication method thereof |
JP6476871B2 (ja) * | 2014-05-22 | 2019-03-06 | 株式会社村田製作所 | 回路基板、蓄電装置、電池パックおよび電子機器 |
US20170200556A1 (en) * | 2016-01-11 | 2017-07-13 | E I Du Pont De Nemours And Company | Electric component |
KR20180014903A (ko) * | 2016-08-01 | 2018-02-12 | 삼성디스플레이 주식회사 | 전자 소자, 이의 실장 방법 및 이를 포함하는 표시 장치의 제조 방법 |
US10160066B2 (en) * | 2016-11-01 | 2018-12-25 | GM Global Technology Operations LLC | Methods and systems for reinforced adhesive bonding using solder elements and flux |
JP7022285B2 (ja) * | 2019-07-02 | 2022-02-18 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
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WO2006041068A1 (ja) | 2006-04-20 |
CN1947480A (zh) | 2007-04-11 |
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EP1734801A4 (en) | 2009-11-11 |
JP4356581B2 (ja) | 2009-11-04 |
TW200626036A (en) | 2006-07-16 |
JP2006114542A (ja) | 2006-04-27 |
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