KR100827688B1 - Solder mask for surface mounting - Google Patents

Solder mask for surface mounting Download PDF

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Publication number
KR100827688B1
KR100827688B1 KR1020040026217A KR20040026217A KR100827688B1 KR 100827688 B1 KR100827688 B1 KR 100827688B1 KR 1020040026217 A KR1020040026217 A KR 1020040026217A KR 20040026217 A KR20040026217 A KR 20040026217A KR 100827688 B1 KR100827688 B1 KR 100827688B1
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South Korea
Prior art keywords
solder
mask
circuit board
printed circuit
pad
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KR1020040026217A
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Korean (ko)
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KR20050100975A (en
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변영준
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주식회사 만도
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 표면실장(surface mounting)을 위한 솔더마스크(solder mask)에 관한 것이다.The present invention relates to a solder mask for surface mounting.

본 발명은, 인쇄회로기판상의 솔더패드의 형상에 대응되는 개구부를 갖되, 상기 개구부는 상기 솔더패드의 면적보다 적은 면적을 갖는 것을 특징으로 한다.The present invention has an opening corresponding to the shape of the solder pad on the printed circuit board, wherein the opening has an area smaller than that of the solder pad.

따라서, 인쇄회로기판상의 솔더패드상에 회로부품을 틀어짐없이 정확하게 장착할 수 있게 되어, 불량발생율을 저감시키고, 성능신뢰성을 확보할 수 있는 효과가 있다.Therefore, it is possible to accurately mount the circuit components on the solder pads on the printed circuit board without distortion, thereby reducing the defect occurrence rate and securing performance reliability.

인쇄회로기판, 솔더마스크, 솔더크림, 표면실장Printed Circuit Board, Solder Mask, Solder Cream, Surface Mount

Description

표면실장을 위한 솔더마스크{SOLDER MASK FOR SURFACE MOUNTING}Solder Mask for Surface Mounting {SOLDER MASK FOR SURFACE MOUNTING}

도 1은 통상적인 복수개의 솔더패드가 형성된 인쇄회로기판에 대한 개략 설명도,1 is a schematic explanatory diagram of a printed circuit board having a plurality of conventional solder pads;

도 2는 도 1의 솔더패드상에 솔더크림을 인쇄하기 위해 사용되는 종래의 솔더마스크에 대한 개략 설명도,FIG. 2 is a schematic illustration of a conventional solder mask used for printing solder cream on the solder pad of FIG. 1;

도 3은 본 발명에 따른 솔더마스크에 대한 개략 설명도이다.3 is a schematic explanatory diagram of a solder mask according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10 : 인쇄회로기판 15 : 솔더패드10: printed circuit board 15: solder pad

20, 200 : 솔더마스크 22, 220 : 개구부20, 200: solder mask 22, 220: opening

220a : 마스크부220a: mask portion

본 발명은 표면실장(surface mounting)을 위한 솔더마스크(solder mask)에 관한 것으로서, 더욱 상세하게는 인쇄회로기판상의 솔더패드의 일정면적에는 솔더크림이 인쇄되지 않도록 하여 인쇄된 솔더크림상에 회로부품을 탑재하는 경우 회로부품이 틀어지는 것을 방지할 수 있는 표면실장을 위한 솔더마스크에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder mask for surface mounting, and more particularly to a circuit component on a printed solder cream by preventing solder cream from being printed on a predetermined area of a solder pad on a printed circuit board. In the case of mounting, it relates to a solder mask for surface mounting that can prevent the circuit components from twisting.                         

일반적으로, 자동차에는 핵심부품으로서 차량의 전반적인 동작을 제어하는 전자제어유닛(ECU)과 관련된 회로부품들이 인쇄회로기판(PCB : Printed Circuit Board)상에 장착되어 있으며, 그 장착에는 표면실장방식(SMT : Surface Mount Technology)이 이용되고 있다.Generally, circuit parts related to an electronic control unit (ECU) which controls the overall operation of the vehicle as a core part are mounted on a printed circuit board (PCB), and the surface mount method (SMT) Surface Mount Technology) is used.

익히 주지된 바와 같이, 표면실장방식은 인쇄회로기판상에 회로부품들이 실장되는 복수개의 솔더패드(solder pad)가 형성되어 있고, 이 인쇄회로기판상의 솔더패드의 영역에 점착성이 있는 액체 납의 일종인 솔더크림(solder cream)을 인쇄한 후, 인쇄된 솔더크림 위에 회로부품을 얹어 놓은 후에 열을 가하여 회로부품을 인쇄회로기판상에 장착시키게 된다.As is well known, the surface mount method is a type of liquid lead that has a plurality of solder pads on which a circuit component is mounted on a printed circuit board, and which is tacky in the solder pad area on the printed circuit board. After the solder cream is printed, the circuit components are placed on the printed solder cream and heat is applied to the circuit components to be mounted on the printed circuit board.

이 과정에서 인쇄회로기판상의 복수개의 솔더패드에 솔더크림을 인쇄하기 위해 솔더패드에 대응하는 복수개의 개구부를 갖는 솔더마스크(solder mask)가 이용되게 된다.In this process, a solder mask having a plurality of openings corresponding to the solder pads is used to print the solder cream on the plurality of solder pads on the printed circuit board.

도 1은 복수개의 솔더패드가 형성된 인쇄회로기판을 개략적으로 나타내며, 도 2는 도 1의 인쇄회로기판상의 솔더패드에 솔더크림을 인쇄하기 위해 사용되는 솔더마스크를 나타낸다.FIG. 1 schematically shows a printed circuit board on which a plurality of solder pads are formed, and FIG. 2 shows a solder mask used for printing solder cream on the solder pads on the printed circuit board of FIG. 1.

도시한 바와 같이, 인쇄회로기판(10)상에 형성된 복수개의 솔더패드(15)상에 솔더크림을 인쇄하기 위한 솔더마스크(20)는 단지 인쇄회로기판(10)상의 솔더패드(15)의 형상에 그대로 대응되는 개구부(22)를 갖는 형태의 것이 사용되었다.As shown, the solder mask 20 for printing the solder cream on the plurality of solder pads 15 formed on the printed circuit board 10 is merely the shape of the solder pads 15 on the printed circuit board 10. The thing of the form which has the opening part 22 corresponding to is used as it is.

따라서, 이러한 솔더마스크(20)를 이용하여 솔더패드(15)의 전면을 걸쳐 솔 더크림을 인쇄한 후, 솔더마스크(20)를 치우고 솔더크림이 전면적으로 인쇄된 솔더패드(15)상에 회로부품을 얹어 놓으면, 회로부품이 솔더패드(15)상에서 틀어지는 현상이 자주 발생되고 있다.Therefore, after printing the solder cream over the entire surface of the solder pad 15 by using the solder mask 20, the solder mask 20 is removed and the circuit is printed on the solder pad 15 on which the solder cream is printed on the entire surface. When the components are placed, a phenomenon in which the circuit components are distorted on the solder pad 15 is frequently generated.

본 발명은 상기와 같은 제반 문제점을 해결하기 위하여 창안된 것으로서, 솔더패드의 일정면적에는 솔더크림이 인쇄되지 않도록 하여 솔더크림상에 회로부품을 탑재하는 경우 회로부품이 틀어지는 정도가 저하되도록 하는 표면실장을 위한 솔더마스크를 제공하는데 그 목적이 있다.The present invention was devised to solve the above problems, and the surface mount to reduce the degree of distortion of the circuit components when mounting the circuit components on the solder cream so that the solder cream is not printed on a predetermined area of the solder pad. The purpose is to provide a solder mask for the purpose.

상술한 목적을 달성하기 위한 본 발명은, 인쇄회로기판 상의 솔더패드의 형상에 대응되는 개구부를 갖는 솔더마스크에 있어서, 상기 개구부(220)는, 상기 솔더패드와 대응되는 형상으로부터 마스크부(220a)에 의해 일측이 함몰된 형상으로 되어, 상기 솔더패드보다 작은 면적을 갖는다.
바람직하게는, 상기 솔더패드는 사각형이되, 상기 개구부(220)는 상기 솔더패드의 사각형으로부터 상기 마스크부(220a)의 사각형이 제외된 "ㄷ"자 형을 갖는다.The present invention for achieving the above object, in the solder mask having an opening corresponding to the shape of the solder pad on the printed circuit board, the opening 220, the mask portion 220a from the shape corresponding to the solder pad One side is recessed by the shape, and has an area smaller than the said solder pad.
Preferably, the solder pad is rectangular, and the opening 220 has a "-" shape in which the rectangle of the mask part 220a is excluded from the rectangle of the solder pad.

본 발명의 상기 목적과 여러가지 장점은 이 기술분야에 숙련된 사람들에 의해 첨부된 도면을 참조하여 아래에 기술되는 발명의 바람직한 실시예로부터 더욱 명확하게 될 것이다.The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the invention described below with reference to the accompanying drawings by those skilled in the art.

이하, 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 솔더마스크에 대한 개략 설명도이다.3 is a schematic explanatory diagram of a solder mask according to the present invention.

본 발명에 따른 솔더마스크(200)는 인쇄회로기판(10)상의 솔더패드(15)의 형상에 대응되는 개구부(220)를 갖되, 그 개구부(220)의 일부에는 마스크부(220a)가 일체로 형성되어 있어, 이 마스크부(220a)에 해당하는 솔더패드(15)상에는 솔더크림이 인쇄되지 않도록 한다.Solder mask 200 according to the present invention has an opening 220 corresponding to the shape of the solder pad 15 on the printed circuit board 10, the mask portion 220a is integrally formed in a part of the opening 220 The solder cream is formed on the solder pad 15 corresponding to the mask portion 220a.

즉, 솔더마스크(200)에 인쇄회로기판(10)상의 솔더패드(15)의 형상에 완전히 대응되는 개구부(220)를 형성하는 것이 아니고, 일부 마스크부(220a)를 갖는 개구부(220)를 형성된다.That is, instead of forming the opening 220 corresponding to the shape of the solder pad 15 on the printed circuit board 10 in the solder mask 200, the opening 220 having some mask portions 220a is formed. do.

도면을 참조하면, 예시한 인쇄회로기판(10)상의 솔더패드(15)의 형상은 사각형이므로, 종래에는 솔더마스크(20)의 개구부(22)를 대응되는 사각형으로 하였으나, 본 발명에서는 "ㄷ"자 형상의 다각형으로 할 수 있다.Referring to the drawings, since the shape of the solder pad 15 on the printed circuit board 10 is a quadrangular shape, the opening 22 of the solder mask 20 is conventionally formed as a corresponding quadrangle. It can be made into a polygonal polygon.

이로써, 본 발명에 따른 솔더마스크(200)를 이용하여 솔더패드(15)상에 솔더크림을 인쇄하면, 마스크부(220a)에 해당하는 솔더패드(15)의 일정면적에는 솔더크림이 인쇄되지 않은 상태로 되어 회로부품을 얹어 놓아도 상대적으로 적은 면적의 솔더크림에 의해 탑재된 회로부품이 틀어지는 정도가 저하되게 됨으로써, 회로부품을 정확하게 장착할 수 있도록 한다.Thus, when the solder cream is printed on the solder pad 15 using the solder mask 200 according to the present invention, the solder cream is not printed on a predetermined area of the solder pad 15 corresponding to the mask portion 220a. Even if the circuit components are placed in the state, the degree of distortion of the mounted circuit components is reduced by the solder cream of a relatively small area, so that the circuit components can be correctly mounted.

삭제delete

이상, 상기 내용은 본 발명의 바람직한 일 실시예를 단지 예시한 것으로 본 발명의 당업자는 본 발명의 요지를 변경시킴이 없이 본 발명에 대한 수정과 변경을 가할 수 있음을 인지해야 한다.In the foregoing description, it should be understood that those skilled in the art can make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.

본 발명에 따르면, 인쇄회로기판상의 솔더패드상에 회로부품을 틀어짐없이 정확하게 장착할 수 있게 되어, 불량발생율을 저감시키고, 성능신뢰성을 확보할 수 있는 효과가 달성될 수 있다. According to the present invention, it is possible to accurately mount the circuit components on the solder pads on the printed circuit board without distortion, so that the effect of reducing the failure rate and securing the performance reliability can be achieved.

Claims (2)

인쇄회로기판 상의 솔더패드의 형상에 대응되는 개구부를 갖는 솔더마스크에 있어서,In the solder mask having an opening corresponding to the shape of the solder pad on the printed circuit board, 상기 개구부(220)는, 상기 솔더패드와 대응되는 형상으로부터 마스크부(220a)에 의해 일측이 함몰된 형상으로 되어, 상기 솔더패드보다 작은 면적을 갖는 것을 특징으로 하는 표면실장을 위한 솔더마스크.The opening 220 has a shape in which one side is recessed by a mask part 220a from a shape corresponding to the solder pad, and has a smaller area than the solder pad. 청구항 1에 있어서, 상기 솔더패드는 사각형이되, 상기 개구부(220)는 상기 솔더패드의 사각형으로부터 상기 마스크부(220a)의 사각형이 제외된 "ㄷ"자 형을 갖는 것을 특징으로 하는 표면실장을 위한 솔더마스크.The surface mount of claim 1, wherein the solder pad has a quadrangle, and the opening 220 has a “c” shape in which the quadrangle of the mask portion 220a is excluded from the quadrangle of the solder pad. Solder mask.
KR1020040026217A 2004-04-16 2004-04-16 Solder mask for surface mounting KR100827688B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9099630B2 (en) 2013-02-05 2015-08-04 Samsung Electronics Co., Ltd. Electronic apparatus

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KR100968972B1 (en) * 2008-05-15 2010-07-14 삼성전기주식회사 The method of fabricating circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236914A (en) * 1995-01-19 1996-09-13 Digital Equip Corp <Dec> Solder mask for bonding pad on surface of printed wiring board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236914A (en) * 1995-01-19 1996-09-13 Digital Equip Corp <Dec> Solder mask for bonding pad on surface of printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9099630B2 (en) 2013-02-05 2015-08-04 Samsung Electronics Co., Ltd. Electronic apparatus

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