KR100636610B1 - 컴포넌트를 위한 다중 전달 디바이스를 갖는 반도체 장치 - Google Patents
컴포넌트를 위한 다중 전달 디바이스를 갖는 반도체 장치 Download PDFInfo
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- KR100636610B1 KR100636610B1 KR1020040040042A KR20040040042A KR100636610B1 KR 100636610 B1 KR100636610 B1 KR 100636610B1 KR 1020040040042 A KR1020040040042 A KR 1020040040042A KR 20040040042 A KR20040040042 A KR 20040040042A KR 100636610 B1 KR100636610 B1 KR 100636610B1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 238000012546 transfer Methods 0.000 claims abstract description 62
- 238000003754 machining Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 description 36
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1097—Lamina is running length web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
- Y10T156/1707—Discrete spaced laminae on adhered carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1751—At least three articles
- Y10T156/1754—At least two applied side by side to common base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1776—Means separating articles from bulk source
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (17)
- 반도체 가공 작업 동안 컴포넌트들을 컴포넌트들 공급부 중의 픽업 위치로부터 본딩 영역의 가변 배치 위치들로 전송하는 장치에 있어서,상기 본딩 영역에서 상기 픽업 위치로부터 상기 가변 배치 위치들로 상기 컴포넌트들을 교번적으로 전달하도록 작동하는 제 1 및 제 2 전달 디바이스들로서, 상기 픽업 위치 및 상기 본딩 영역을 통해 통과하는 라인의 반대쪽들에 실질적으로 배치되는, 상기 제 1 및 제 2 전달 디바이스들과,상기 제 1 및 제 2 전달 디바이스들을 가변 이동 경로들을 따라 독립적으로 작동하도록 하는 구동 장치를 포함하는, 전송 장치.
- 삭제
- 제 1 항에 있어서,상기 전달 디바이스들은, 작동할 때 상기 픽업 위치와 상기 배치 위치 사이에서 실질적인 반대 방향들로 동시에 이동하도록 구동가능한, 전송 장치.
- 제 1 항에 있어서,상기 구동 장치는 상기 전달 디바이스들을 직교하는 x-축, y-축 및 z-축을 따라서 구동하는, 전송 장치.
- 제 4 항에 있어서,상기 구동 장치는, 상기 전달 디바이스들을 각각 x-축 및 y-축을 따라서 구동시키는 제 1 및 제 2 구동 장치들을 포함하고,상기 제 1 및 제 2 전달 장치들은 서로 분리되어 있는, 전송 장치.
- 제 1 항에 있어서,상기 전달 디바이스들은, 적어도 정지 위치에 있을 때, 상기 픽업 위치 및 상기 본딩 영역을 통해 통과하는 라인 주위에서 대칭적으로 배열되는, 전송 장치.
- 제 1 항에 있어서,상기 구동 장치는, 상기 전달 디바이스들에 할당되고 상기 z-축을 따라 상기 전달 디바이스들을 각각 구동시켜 작동시킬 수 있는 각각의 Z 캐리지들을 포함하고, 상기 Z 캐리지들은 정지 위치에 서로 면하도록 장착되는, 전송 장치.
- 제 1 항에 있어서,상기 전달 디바이스들은 각각, 다른 전달 디바이스가 상기 본딩 영역에 컴포넌트를 배치시키는 것과 거의 동시에 상기 픽업 위치로부터 컴포넌트를 픽업하도록 작동하는, 전송 장치.
- 제 1 항에 있어서,상기 장치의 상기 픽업 위치는 고정되는, 전송 장치.
- 제 1 항에 있어서,상기 각각의 전달 디바이스들은 상기 픽업 위치와 상기 본딩 영역을 통해 통과하는 라인 주위에서 서로를 반사하는(mirror) 미리 결정된 이동 경로를 따라서 이동할 수 있는, 전송 장치.
- 제 1 항에 있어서,상기 픽업 위치에 배치된 픽업 광 디바이스 및 상기 본딩 영역에 배치된 배치 광 디바이스를 포함하는, 전송 장치.
- 제 1 항에 있어서,상기 전달 디바이스들의 위치들을 연속으로 모니터링하기 위한 위치 센서들을 포함하는, 전송 장치.
- 제 1 항에 있어서,리셉터와 상기 배치 위치 사이의 위치 오프셋 및 회전 오프셋 중 적어도 하나를 측정하여 임의의 위치 또는 회전 오프셋을 보상할 수 있는 배치 광 디바이스를 포함하는, 전송 장치.
- 제 13 항에 있어서,상기 위치 및 회전 오프셋들은 상기 전달 디바이스들을 조정하여 보상되는, 전송 장치.
- 제 13 항에 있어서,상기 회전 오프셋은 상기 컴포넌트들의 공급부를 회전시켜 보상되는, 전송 장치.
- 제 1 항에 있어서,상기 컴포넌트들은 반도체 다이스를 포함하고, 상기 전달 디바이스들은 각각 다이 본드 헤드들을 포함하는, 전송 장치.
- 제 1 항에 있어서,상기 컴포넌트들은 에폭시의 공급부를 포함하고, 상기 전달 디바이스들은 각각 스탬핑 핀들(stamping pins)을 포함하는 전송 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/454,259 US7179346B2 (en) | 2003-06-03 | 2003-06-03 | Semiconductor apparatus with multiple delivery devices for components |
US10/454,259 | 2003-06-03 |
Publications (2)
Publication Number | Publication Date |
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KR20040104419A KR20040104419A (ko) | 2004-12-10 |
KR100636610B1 true KR100636610B1 (ko) | 2006-10-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020040040042A KR100636610B1 (ko) | 2003-06-03 | 2004-06-02 | 컴포넌트를 위한 다중 전달 디바이스를 갖는 반도체 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7179346B2 (ko) |
JP (1) | JP4150697B2 (ko) |
KR (1) | KR100636610B1 (ko) |
CN (1) | CN100477075C (ko) |
MY (1) | MY137405A (ko) |
SG (1) | SG139737A1 (ko) |
TW (1) | TWI258450B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101242402B1 (ko) | 2010-11-08 | 2013-03-12 | 에이에스엠 어쌤블리 오토메이션 리미티드 | 이중 헤드 분배기를 구비하는 다이 본더 |
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NL1029206C2 (nl) * | 2005-06-07 | 2006-12-08 | Assembleon Nv | Componenttoevoerinrichting alsmede werkwijze. |
US7727800B2 (en) * | 2005-12-12 | 2010-06-01 | Asm Assembly Automation Ltd. | High precision die bonding apparatus |
TWI322476B (en) * | 2006-10-05 | 2010-03-21 | Advanced Semiconductor Eng | Die bonder and die bonding method thereof |
US7677431B2 (en) * | 2006-10-19 | 2010-03-16 | Asm Technology Singapore Pte Ltd. | Electronic device handler for a bonding apparatus |
US7457686B2 (en) * | 2007-03-14 | 2008-11-25 | Ortho—Clinical Diagnostics, Inc. | Robotic arm alignment |
SG147353A1 (en) * | 2007-05-07 | 2008-11-28 | Mfg Integration Technology Ltd | Apparatus for object processing |
KR100929197B1 (ko) * | 2007-12-14 | 2009-12-01 | 세크론 주식회사 | 반도체칩 본딩 장치 및 이를 이용한 반도체칩 본딩 방법 |
KR20110037646A (ko) * | 2009-10-07 | 2011-04-13 | 삼성전자주식회사 | 반도체 다이 본딩 장치 |
US20110248738A1 (en) * | 2010-04-12 | 2011-10-13 | Sze Chak Tong | Testing apparatus for electronic devices |
JP4870857B2 (ja) * | 2010-04-13 | 2012-02-08 | パイオニア株式会社 | 部品移送装置及び方法 |
US8336757B2 (en) * | 2011-01-04 | 2012-12-25 | Asm Assembly Automation Ltd | Apparatus for transporting substrates for bonding |
US8590143B2 (en) * | 2011-05-25 | 2013-11-26 | Asm Technology Singapore Pte. Ltd. | Apparatus for delivering semiconductor components to a substrate |
JP5815345B2 (ja) * | 2011-09-16 | 2015-11-17 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
US8905109B2 (en) * | 2011-12-12 | 2014-12-09 | Asm Technology Singapore Pte. Ltd. | Apparatus for bonding substrates to each other |
JP5957523B2 (ja) * | 2012-05-18 | 2016-07-27 | 富士機械製造株式会社 | 対基板作業システム |
JP2014017313A (ja) * | 2012-07-06 | 2014-01-30 | Panasonic Corp | 部品実装装置 |
US20140341691A1 (en) * | 2013-05-14 | 2014-11-20 | Kui Kam Lam | Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding |
DE102013105660B3 (de) * | 2013-06-03 | 2014-07-24 | Amicra Microtechnologies Gmbh | Bestückungsvorrichtung und Verfahren zum Aufbringen von elektrischen und/oder optoelektrischen Bauteilen auf Substrate |
CN107078087A (zh) * | 2014-04-22 | 2017-08-18 | 美国思睿逻辑有限公司 | 用于承载单个设备封装的***和方法 |
WO2015172383A1 (zh) * | 2014-05-16 | 2015-11-19 | 吉瑞高新科技股份有限公司 | 一种绝缘环拾取手臂、绝缘环装配装置以及装配方法 |
KR101582984B1 (ko) | 2014-09-22 | 2016-01-12 | 에스티에스반도체통신 주식회사 | 반도체 다이 본딩 장치 및 그 방법 |
US10199254B2 (en) * | 2015-05-12 | 2019-02-05 | Nexperia B.V. | Method and system for transferring semiconductor devices from a wafer to a carrier structure |
CN105188273A (zh) * | 2015-07-29 | 2015-12-23 | 王硕 | 一种散装led高速贴片机 |
JP6716969B2 (ja) * | 2016-03-08 | 2020-07-01 | Tdk株式会社 | 実装装置 |
KR200484965Y1 (ko) * | 2016-09-26 | 2017-12-12 | (주)제이티 | 다이본더 및 그에 사용되는 이송툴 |
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2003
- 2003-06-03 US US10/454,259 patent/US7179346B2/en not_active Expired - Lifetime
-
2004
- 2004-06-01 TW TW093115587A patent/TWI258450B/zh active
- 2004-06-01 SG SG200718191-0A patent/SG139737A1/en unknown
- 2004-06-02 MY MYPI20042124A patent/MY137405A/en unknown
- 2004-06-02 KR KR1020040040042A patent/KR100636610B1/ko active IP Right Grant
- 2004-06-02 JP JP2004164998A patent/JP4150697B2/ja not_active Expired - Lifetime
- 2004-06-03 CN CNB2004100460548A patent/CN100477075C/zh not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101242402B1 (ko) | 2010-11-08 | 2013-03-12 | 에이에스엠 어쌤블리 오토메이션 리미티드 | 이중 헤드 분배기를 구비하는 다이 본더 |
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TWI258450B (en) | 2006-07-21 |
CN100477075C (zh) | 2009-04-08 |
JP2004363607A (ja) | 2004-12-24 |
KR20040104419A (ko) | 2004-12-10 |
JP4150697B2 (ja) | 2008-09-17 |
US20040244915A1 (en) | 2004-12-09 |
CN1574204A (zh) | 2005-02-02 |
SG139737A1 (en) | 2008-02-29 |
US7179346B2 (en) | 2007-02-20 |
MY137405A (en) | 2009-01-30 |
TW200505777A (en) | 2005-02-16 |
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