JPS6480095A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPS6480095A
JPS6480095A JP23576487A JP23576487A JPS6480095A JP S6480095 A JPS6480095 A JP S6480095A JP 23576487 A JP23576487 A JP 23576487A JP 23576487 A JP23576487 A JP 23576487A JP S6480095 A JPS6480095 A JP S6480095A
Authority
JP
Japan
Prior art keywords
film
conductor
windows
heat dissipating
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23576487A
Other languages
Japanese (ja)
Other versions
JPH0517717B2 (en
Inventor
Shin Kawakami
Satoru Haruyama
Hirotaka Okonogi
Katsutomo Nikaido
Norihito Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
CMK Corp
Original Assignee
Nippon CMK Corp
CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp, CMK Corp filed Critical Nippon CMK Corp
Priority to JP23576487A priority Critical patent/JPS6480095A/en
Priority to US07/194,841 priority patent/US4859805A/en
Priority to DE3850626T priority patent/DE3850626D1/en
Priority to EP88105342A priority patent/EP0308576B1/en
Publication of JPS6480095A publication Critical patent/JPS6480095A/en
Publication of JPH0517717B2 publication Critical patent/JPH0517717B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To protect a circuit conductor of a printed wiring board against heating so as to prevent an erroneous operation of the printed wiring plate due to heating by a method wherein a heat dissipating film is provided to the circuit conductor and an insulating film is provided as plural heat dissipating windows are interspersed in a lengthwise direction on the heat dissipating film. CONSTITUTION:A heat dissipating film 12 is provided to the surface of a circuit conductor 11. An insulating film 14 is formed as plural circular windows 15 are arranged so as to be interspersed along a lengthwise direction on the film 12 formed on the surface of the conductor 11. The windows 15 are circles, ellipses, or triangles in shape. Then, heat generated in operation is actively dissipated through the film 12 formed on the upper side of the conductor 11. The windows 15 enables the decrease of the dissipating effect due to the film 14 to be prevented. By these processes, the conductor 11 is prevented from being heated, and thus the erroneous operation caused by heating can be prevented.
JP23576487A 1987-09-19 1987-09-19 Printed wiring board Granted JPS6480095A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP23576487A JPS6480095A (en) 1987-09-19 1987-09-19 Printed wiring board
US07/194,841 US4859805A (en) 1987-09-19 1988-03-29 Printed wiring board
DE3850626T DE3850626D1 (en) 1987-09-19 1988-04-02 Circuit board.
EP88105342A EP0308576B1 (en) 1987-09-19 1988-04-02 A printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23576487A JPS6480095A (en) 1987-09-19 1987-09-19 Printed wiring board

Publications (2)

Publication Number Publication Date
JPS6480095A true JPS6480095A (en) 1989-03-24
JPH0517717B2 JPH0517717B2 (en) 1993-03-09

Family

ID=16990888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23576487A Granted JPS6480095A (en) 1987-09-19 1987-09-19 Printed wiring board

Country Status (1)

Country Link
JP (1) JPS6480095A (en)

Also Published As

Publication number Publication date
JPH0517717B2 (en) 1993-03-09

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