JPS6459823A - Coating of paste - Google Patents

Coating of paste

Info

Publication number
JPS6459823A
JPS6459823A JP21549587A JP21549587A JPS6459823A JP S6459823 A JPS6459823 A JP S6459823A JP 21549587 A JP21549587 A JP 21549587A JP 21549587 A JP21549587 A JP 21549587A JP S6459823 A JPS6459823 A JP S6459823A
Authority
JP
Japan
Prior art keywords
pressure
paste
residual amount
space part
raising duration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21549587A
Other languages
English (en)
Other versions
JP2562612B2 (ja
Inventor
Katsuyoshi Kawabe
Makoto Arie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP62215495A priority Critical patent/JP2562612B2/ja
Publication of JPS6459823A publication Critical patent/JPS6459823A/ja
Application granted granted Critical
Publication of JP2562612B2 publication Critical patent/JP2562612B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP62215495A 1987-08-31 1987-08-31 ペ−スト塗布方法 Expired - Lifetime JP2562612B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62215495A JP2562612B2 (ja) 1987-08-31 1987-08-31 ペ−スト塗布方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62215495A JP2562612B2 (ja) 1987-08-31 1987-08-31 ペ−スト塗布方法

Publications (2)

Publication Number Publication Date
JPS6459823A true JPS6459823A (en) 1989-03-07
JP2562612B2 JP2562612B2 (ja) 1996-12-11

Family

ID=16673333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62215495A Expired - Lifetime JP2562612B2 (ja) 1987-08-31 1987-08-31 ペ−スト塗布方法

Country Status (1)

Country Link
JP (1) JP2562612B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188887A (ja) * 1990-11-22 1992-07-07 Matsushita Electric Ind Co Ltd 接着剤塗布方法および接着剤塗布装置
US7691432B2 (en) 2002-11-13 2010-04-06 Lg Display Co., Ltd. Dispenser for liquid crystal display panel and method for detecting residual quantity of dispensing material using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6397259A (ja) * 1986-10-14 1988-04-27 Shinkawa Ltd ペ−スト吐出装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6397259A (ja) * 1986-10-14 1988-04-27 Shinkawa Ltd ペ−スト吐出装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188887A (ja) * 1990-11-22 1992-07-07 Matsushita Electric Ind Co Ltd 接着剤塗布方法および接着剤塗布装置
US7691432B2 (en) 2002-11-13 2010-04-06 Lg Display Co., Ltd. Dispenser for liquid crystal display panel and method for detecting residual quantity of dispensing material using the same

Also Published As

Publication number Publication date
JP2562612B2 (ja) 1996-12-11

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