JPS6429826U - - Google Patents
Info
- Publication number
- JPS6429826U JPS6429826U JP12315787U JP12315787U JPS6429826U JP S6429826 U JPS6429826 U JP S6429826U JP 12315787 U JP12315787 U JP 12315787U JP 12315787 U JP12315787 U JP 12315787U JP S6429826 U JPS6429826 U JP S6429826U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- semiconductor chip
- semiconductor device
- void
- impaired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000001771 impaired effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
Description
第1図は本考案の構成を示す図、第2図は本考
案に係る配線パターン構造を適用した半導体装置
の一例を示す図、第3図は第2図における第2層
配線パターンの平面図、第4図は半導体装置とし
ての密着型イメージセンサの製造工程を示す図で
ある。
〔符号の説明〕、1……半導体チツプ、2……
配線パターン、3……空孔、10,20……セラ
ミツクス基板、11a,21a〜21d……第1
層配線パターン、12,22……絶縁層、13,
23……第2層配線パータン、14,24……グ
レースパターン、15,25……コンタクトホー
ル、16a,26……クロム電極パターン、17
,27……光電変換膜、18a,28……透明電
極。
FIG. 1 is a diagram showing the configuration of the present invention, FIG. 2 is a diagram showing an example of a semiconductor device to which the wiring pattern structure according to the present invention is applied, and FIG. 3 is a plan view of the second layer wiring pattern in FIG. 2. , FIG. 4 is a diagram showing the manufacturing process of a contact type image sensor as a semiconductor device. [Explanation of symbols], 1... semiconductor chip, 2...
Wiring pattern, 3...Vacancy, 10, 20...Ceramics substrate, 11a, 21a-21d...First
Layer wiring pattern, 12, 22...Insulating layer, 13,
23... Second layer wiring pattern, 14, 24... Grace pattern, 15, 25... Contact hole, 16a, 26... Chrome electrode pattern, 17
, 27... Photoelectric conversion film, 18a, 28... Transparent electrode.
Claims (1)
ボンデイングされるべき配線パターン2の構造で
あつて、 当該配線パターン2に半導体チツプに対する電
気的特性を損わない範囲で空孔3を形成したこと
を特徴とする半導体装置における配線パターン構
造。[Scope of Claim for Utility Model Registration] A structure of a wiring pattern 2 formed of a conductive metal to which a semiconductor chip 1 is to be bonded, wherein the wiring pattern 2 is provided with a void to the extent that the electrical characteristics for the semiconductor chip are not impaired. A wiring pattern structure in a semiconductor device, characterized in that a hole 3 is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12315787U JPS6429826U (en) | 1987-08-13 | 1987-08-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12315787U JPS6429826U (en) | 1987-08-13 | 1987-08-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6429826U true JPS6429826U (en) | 1989-02-22 |
Family
ID=31371751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12315787U Pending JPS6429826U (en) | 1987-08-13 | 1987-08-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6429826U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63106069U (en) * | 1986-12-27 | 1988-07-08 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153339A (en) * | 1982-03-05 | 1983-09-12 | Mitsubishi Electric Corp | Manufacture of hybrid integrated circuit |
JPS61295656A (en) * | 1985-06-25 | 1986-12-26 | Toshiba Corp | Image sensor |
-
1987
- 1987-08-13 JP JP12315787U patent/JPS6429826U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153339A (en) * | 1982-03-05 | 1983-09-12 | Mitsubishi Electric Corp | Manufacture of hybrid integrated circuit |
JPS61295656A (en) * | 1985-06-25 | 1986-12-26 | Toshiba Corp | Image sensor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63106069U (en) * | 1986-12-27 | 1988-07-08 |
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