JPS6425594A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPS6425594A JPS6425594A JP18248687A JP18248687A JPS6425594A JP S6425594 A JPS6425594 A JP S6425594A JP 18248687 A JP18248687 A JP 18248687A JP 18248687 A JP18248687 A JP 18248687A JP S6425594 A JPS6425594 A JP S6425594A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- laser
- circuit pattern
- laser trimming
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE:To allow accurate fine-patterning by forming a circuit pattern by laser trimming after first printing a conductive paste on an insulating substrate and then forming a conductive layer by baking and drying the conductive paste. CONSTITUTION:A paste type conductor such as AgPd and Cu is screen-printed on an insulating substrate 11, and a conductive layer 12 is formed therefrom by baking after the drying process. An unpatterned area of the conductive layer 12 is fine-patterned by laser trimming. An area 13 is a part of the conductive layer 12 which is thermally cut by laser trimming. In the laser trimming process, a laser beam 14 is converged by a lens 15 to irradiate the conductive layer 12 locally, whereby the irradiated area can be thermally cut. The laser beam is irradiated on the conductive layer 12 in accordance with a circuit pattern program stored in a laser trimmer, whereby the circuit pattern can be formed on the conductive layer 12.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18248687A JPS6425594A (en) | 1987-07-22 | 1987-07-22 | Manufacture of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18248687A JPS6425594A (en) | 1987-07-22 | 1987-07-22 | Manufacture of circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6425594A true JPS6425594A (en) | 1989-01-27 |
Family
ID=16119121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18248687A Pending JPS6425594A (en) | 1987-07-22 | 1987-07-22 | Manufacture of circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6425594A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938837A (en) * | 1985-10-12 | 1990-07-03 | Sumitomo Electric Industries, Ltd. | Crucible recovering method and apparatus therefor |
US5946946A (en) * | 1997-11-04 | 1999-09-07 | Whirlpool Corporation | Suspension system for an automatic washing machine |
WO2003037049A1 (en) * | 2001-10-22 | 2003-05-01 | Invint Limited | Circuit formation by laser ablation of ink |
US6698072B1 (en) * | 1998-11-03 | 2004-03-02 | Robert Bosch Gmbh | Method of manufacturing piezoelectric actuators |
JP2008028333A (en) * | 2006-07-25 | 2008-02-07 | Mitsubishi Electric Corp | Printed wiring board and its manufacturing method |
CN108282964A (en) * | 2018-01-31 | 2018-07-13 | 深圳光韵达激光应用技术有限公司 | A kind of circuit board machining process forming circuit and figure using laser ablation |
CN113068310A (en) * | 2021-03-19 | 2021-07-02 | 北京梦之墨科技有限公司 | Double-sided circuit board and manufacturing method thereof |
-
1987
- 1987-07-22 JP JP18248687A patent/JPS6425594A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938837A (en) * | 1985-10-12 | 1990-07-03 | Sumitomo Electric Industries, Ltd. | Crucible recovering method and apparatus therefor |
US5946946A (en) * | 1997-11-04 | 1999-09-07 | Whirlpool Corporation | Suspension system for an automatic washing machine |
US6698072B1 (en) * | 1998-11-03 | 2004-03-02 | Robert Bosch Gmbh | Method of manufacturing piezoelectric actuators |
WO2003037049A1 (en) * | 2001-10-22 | 2003-05-01 | Invint Limited | Circuit formation by laser ablation of ink |
JP2008028333A (en) * | 2006-07-25 | 2008-02-07 | Mitsubishi Electric Corp | Printed wiring board and its manufacturing method |
CN108282964A (en) * | 2018-01-31 | 2018-07-13 | 深圳光韵达激光应用技术有限公司 | A kind of circuit board machining process forming circuit and figure using laser ablation |
CN113068310A (en) * | 2021-03-19 | 2021-07-02 | 北京梦之墨科技有限公司 | Double-sided circuit board and manufacturing method thereof |
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