JPS6425594A - Manufacture of circuit board - Google Patents

Manufacture of circuit board

Info

Publication number
JPS6425594A
JPS6425594A JP18248687A JP18248687A JPS6425594A JP S6425594 A JPS6425594 A JP S6425594A JP 18248687 A JP18248687 A JP 18248687A JP 18248687 A JP18248687 A JP 18248687A JP S6425594 A JPS6425594 A JP S6425594A
Authority
JP
Japan
Prior art keywords
conductive layer
laser
circuit pattern
laser trimming
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18248687A
Other languages
Japanese (ja)
Inventor
Hiroaki Morimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18248687A priority Critical patent/JPS6425594A/en
Publication of JPS6425594A publication Critical patent/JPS6425594A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To allow accurate fine-patterning by forming a circuit pattern by laser trimming after first printing a conductive paste on an insulating substrate and then forming a conductive layer by baking and drying the conductive paste. CONSTITUTION:A paste type conductor such as AgPd and Cu is screen-printed on an insulating substrate 11, and a conductive layer 12 is formed therefrom by baking after the drying process. An unpatterned area of the conductive layer 12 is fine-patterned by laser trimming. An area 13 is a part of the conductive layer 12 which is thermally cut by laser trimming. In the laser trimming process, a laser beam 14 is converged by a lens 15 to irradiate the conductive layer 12 locally, whereby the irradiated area can be thermally cut. The laser beam is irradiated on the conductive layer 12 in accordance with a circuit pattern program stored in a laser trimmer, whereby the circuit pattern can be formed on the conductive layer 12.
JP18248687A 1987-07-22 1987-07-22 Manufacture of circuit board Pending JPS6425594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18248687A JPS6425594A (en) 1987-07-22 1987-07-22 Manufacture of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18248687A JPS6425594A (en) 1987-07-22 1987-07-22 Manufacture of circuit board

Publications (1)

Publication Number Publication Date
JPS6425594A true JPS6425594A (en) 1989-01-27

Family

ID=16119121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18248687A Pending JPS6425594A (en) 1987-07-22 1987-07-22 Manufacture of circuit board

Country Status (1)

Country Link
JP (1) JPS6425594A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938837A (en) * 1985-10-12 1990-07-03 Sumitomo Electric Industries, Ltd. Crucible recovering method and apparatus therefor
US5946946A (en) * 1997-11-04 1999-09-07 Whirlpool Corporation Suspension system for an automatic washing machine
WO2003037049A1 (en) * 2001-10-22 2003-05-01 Invint Limited Circuit formation by laser ablation of ink
US6698072B1 (en) * 1998-11-03 2004-03-02 Robert Bosch Gmbh Method of manufacturing piezoelectric actuators
JP2008028333A (en) * 2006-07-25 2008-02-07 Mitsubishi Electric Corp Printed wiring board and its manufacturing method
CN108282964A (en) * 2018-01-31 2018-07-13 深圳光韵达激光应用技术有限公司 A kind of circuit board machining process forming circuit and figure using laser ablation
CN113068310A (en) * 2021-03-19 2021-07-02 北京梦之墨科技有限公司 Double-sided circuit board and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938837A (en) * 1985-10-12 1990-07-03 Sumitomo Electric Industries, Ltd. Crucible recovering method and apparatus therefor
US5946946A (en) * 1997-11-04 1999-09-07 Whirlpool Corporation Suspension system for an automatic washing machine
US6698072B1 (en) * 1998-11-03 2004-03-02 Robert Bosch Gmbh Method of manufacturing piezoelectric actuators
WO2003037049A1 (en) * 2001-10-22 2003-05-01 Invint Limited Circuit formation by laser ablation of ink
JP2008028333A (en) * 2006-07-25 2008-02-07 Mitsubishi Electric Corp Printed wiring board and its manufacturing method
CN108282964A (en) * 2018-01-31 2018-07-13 深圳光韵达激光应用技术有限公司 A kind of circuit board machining process forming circuit and figure using laser ablation
CN113068310A (en) * 2021-03-19 2021-07-02 北京梦之墨科技有限公司 Double-sided circuit board and manufacturing method thereof

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