JPS6355997A - Electronic unit - Google Patents
Electronic unitInfo
- Publication number
- JPS6355997A JPS6355997A JP19926286A JP19926286A JPS6355997A JP S6355997 A JPS6355997 A JP S6355997A JP 19926286 A JP19926286 A JP 19926286A JP 19926286 A JP19926286 A JP 19926286A JP S6355997 A JPS6355997 A JP S6355997A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- electronic
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子ユニットに関し、特にリードを介してプ
リント基板に取付けた電子部品を備える電子ユニットに
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic unit, and more particularly to an electronic unit including electronic components attached to a printed circuit board via leads.
この種の電子ユニットは、電子部品本体のプリント基板
側面よりも該プリント基板側に突出するリードを介し、
電子部品本体とプリントノ、（板との間に間隔を持たせ
て取付けた電子部品を備えているものがある。This type of electronic unit uses leads that protrude from the side of the printed circuit board of the electronic component body toward the printed circuit board.
Some have electronic components attached with a gap between the electronic component body and the printed board.
しかしながら、Ｌ記電′ｆ部品は、単にハンダによりリ
ードをプリント基板に取付けるだけで電ｆ−部品本体が
プリント基板から浮いた状態であり、プリント基板との
接着面積が小さいことから、外れ易いという問題点があ
った。However, with the L electric component, simply attaching the leads to the printed circuit board with solder means that the electric component body is floating from the printed circuit board, and because the adhesive area with the printed circuit board is small, it is easy to come off. There was a problem.
本発明は、上記従来技術の問題点に鑑みなされたもので
あり、電子部品本体をプリント基板から間隔を持たせて
取付る電子部品を、容易に外れることなくプリント基板
に固定できる電子ユニットを提供することを目的とする
。The present invention has been made in view of the above-mentioned problems of the prior art, and provides an electronic unit that can fix an electronic component to a printed circuit board without easily coming off, in which the electronic component body is attached with a distance from the printed circuit board. The purpose is to
このため本発明では、電ｆ一部品本体のプリント基板側
面よりも該プリント基板側に突出するリードを介し、上
記電子部品本体とプリント基板との間に間隔を持たせて
取付けた電子部品を備える電子ユニットにおいて、上記
電子部品本体と上記プリント基板との間に他の電子部品
を配し、該電子部品とＬ２電子部品本体及び上記プリン
ト基板とを夫々接着するという構成を採用し、これによ
って上記目的を達成しようとするものである。For this reason, the present invention includes an electronic component mounted with a gap between the electronic component body and the printed circuit board via a lead that protrudes from the side surface of the electronic component body toward the printed circuit board side. In the electronic unit, another electronic component is disposed between the electronic component main body and the printed circuit board, and the electronic component is bonded to the L2 electronic component main body and the printed circuit board, respectively. It is an attempt to achieve a goal.
以ｆ本発明の一実施例を第１図ないし第３図に基づいて
説明する。Hereinafter, one embodiment of the present invention will be described based on FIGS. 1 to 3.
本実施例の電子ユニットは、プリント基板１に電子部品
２を実装して構成したものである。The electronic unit of this embodiment is constructed by mounting electronic components 2 on a printed circuit board 1.
電子部品２は、本実施例ではＩＣが用いてあり、第２図
に示すようにフラットな形状をした電子部品本体２ａと
複数のり一ド２ｂ、２ｂとからなる。このうち、リード
２ｂは、電子部品本体２ａのプリント基板側ｔ（ｒｔ
２ ｃよりもプリント基板■側に突出しており、先端が
内方に屈曲したいわゆるＪリードとなっている。即ち、
電子部品２は、このリード２ｂをプリント基板ｌにハン
ダ付、けすることにより、電子部品本体２ａをプリント
基板ｌから所定の間隔を持たせた状態で固定しである。The electronic component 2 used in this embodiment is an IC, and as shown in FIG. 2, it consists of a flat electronic component main body 2a and a plurality of boards 2b, 2b. Among these, the lead 2b is connected to the printed circuit board side t(rt) of the electronic component main body 2a.
It protrudes more toward the printed circuit board ■ than 2c, and has a so-called J lead with an inwardly bent tip. That is,
The electronic component 2 is fixed with the electronic component body 2a spaced apart from the printed circuit board 1 by a predetermined distance by soldering and gluing the leads 2b to the printed circuit board 1.
プリント基板１と電子部品本体２ａとの間には、他の電
子部品としてのチップ形電子部品３を配しである。この
チップ形電子部品３は、プリント基板ｌと電子部品本体
２ａとの間の間隔と略同じ長さの厚みを有しており、プ
リント基板ｌの上面及び電子部品本体２ａのプリント基
板側面２ｃに夫々接着剤４により接着しである。もっと
も、接着剤４によらず両面テープ等を用いてもよい。A chip-type electronic component 3 as another electronic component is arranged between the printed circuit board 1 and the electronic component main body 2a. This chip-shaped electronic component 3 has a thickness that is approximately the same length as the distance between the printed circuit board l and the electronic component body 2a, and is attached to the top surface of the printed circuit board l and the printed circuit board side surface 2c of the electronic component body 2a. Each is adhered with adhesive 4. However, double-sided tape or the like may be used instead of the adhesive 4.
次に、上記実施例の取付は方法について説明する。Next, the installation method of the above embodiment will be explained.
まずチップ形電子部品３の上面及び下面に接着剤４を塗
布して、プリント基板１に取付ける０次に、電子部品２
を取付けて、リード２ｂをプリント２ｇ板ｌにハンダ付
けする。これにより、電子部品２は、リード２ｂがプリ
ントＡ板１に固定されると共に、電子部品本体２ａがチ
ップ形電子部品３を介してプリント基板ｌに固定される
。First, adhesive 4 is applied to the upper and lower surfaces of the chip-type electronic component 3, and the electronic component 3 is attached to the printed circuit board 1.
, and solder the lead 2b to the printed board 2g. As a result, the leads 2b of the electronic component 2 are fixed to the printed A board 1, and the electronic component main body 2a is fixed to the printed circuit board l via the chip-shaped electronic component 3.
なお、」−２実施例によれば、プリント基板１と電子部
品本体２ａとの間にチップ形電子部品３を１つ配したが
、多数配してもよい。In addition, although one chip-shaped electronic component 3 is disposed between the printed circuit board 1 and the electronic component main body 2a in the "-2 embodiment," a plurality of chip-shaped electronic components 3 may be disposed between the printed circuit board 1 and the electronic component main body 2a.
以りのように未発ＩＪＪは、電子部品本体とプリント基
板との間に他の電子部品を配し、該他の電子部品と上記
電子部品本体及び上記プリント基板とを夫々接着したの
で、電子部品本体が他の電Ｔ一部品を介してプリント基
板に固定されることから。As described above, the undeveloped IJJ is caused by placing another electronic component between the electronic component body and the printed circuit board, and bonding the other electronic component to the electronic component body and the printed circuit board, respectively. This is because the component body is fixed to the printed circuit board via another electrical component.
従来のように電子部品本体がプリント）人板から浮いた
状ｙ！（に比べてプリント基板との接着面積が大きくな
り、この結果、電子部品本体をプリントノ、（板から間
隔を持たせて取付る電子部品を容易に外れることなくプ
リント基板に固定できる効果を奏する。As before, the electronic parts are printed) It looks like it's floating above the board! (The adhesion area with the printed circuit board is larger than that of the printed circuit board.) As a result, the electronic component body can be fixed to the printed circuit board without easily coming off. .
しかも、電子部品本体とプリン１Ｆ＆板とのＩｆｆに他
の電子部品を配したので、プリント基板への電子部品実
装密度を高めることができる。Furthermore, since other electronic components are arranged between the electronic component main body and the printer 1F & board, it is possible to increase the density of electronic component mounting on the printed circuit board.
第１図は本発明の一実施例を示す縦断面図、第２図はＪ
リードを有する電子部品の斜視図、第３図はチップ形電
子部品の斜視図である。
ｌニブリント基板 ２：電子部品
２ａ：電子部品本体 ２ｂ：リード
２Ｃニブリント基板側面FIG. 1 is a vertical cross-sectional view showing one embodiment of the present invention, and FIG. 2 is a J
FIG. 3 is a perspective view of an electronic component having leads, and FIG. 3 is a perspective view of a chip-shaped electronic component. l Niblint board 2: Electronic component 2a: Electronic component body 2b: Lead 2C niblint board side surface
Claims (1)
板側に突出するリードを介し、上記電子部品本体とプリ
ント基板との間に間隔を持たせて取付けた電子部品を備
える電子ユニットにおいて、上記電子部品本体と上記プ
リント基板との間に他の電子部品を配し、該電子部品と
上記電子部品本体及び上記プリント基板とを夫々接着し
たことを特徴とする電子ユニット。In an electronic unit comprising an electronic component mounted with a gap between the electronic component body and the printed circuit board via a lead protruding from the printed circuit board side of the electronic component body to the printed circuit board side, the electronic component body An electronic unit characterized in that another electronic component is disposed between the electronic component and the printed circuit board, and the electronic component is bonded to the electronic component main body and the printed circuit board, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19926286A JPS6355997A (en) | 1986-08-26 | 1986-08-26 | Electronic unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19926286A JPS6355997A (en) | 1986-08-26 | 1986-08-26 | Electronic unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355997A true JPS6355997A (en) | 1988-03-10 |
Family
ID=16404864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19926286A Pending JPS6355997A (en) | 1986-08-26 | 1986-08-26 | Electronic unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355997A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04225590A (en) * | 1990-12-27 | 1992-08-14 | Matsushita Electric Ind Co Ltd | Package structural body |
| US5614102A (en) * | 1990-01-29 | 1997-03-25 | Sakurada; Yasuyuki | Method for purifying sewage |
-
1986
- 1986-08-26 JP JP19926286A patent/JPS6355997A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614102A (en) * | 1990-01-29 | 1997-03-25 | Sakurada; Yasuyuki | Method for purifying sewage |
| JPH04225590A (en) * | 1990-12-27 | 1992-08-14 | Matsushita Electric Ind Co Ltd | Package structural body |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6355997A (en) | Electronic unit | |
| JPS59143047U (en) | circuit parts | |
| JPS5911520U (en) | Piezoelectric resonant components | |
| JPS59140466U (en) | circuit board connection device | |
| JPS61248496A (en) | Flexible substrate device | |
| JPS60107896A (en) | Printed board unit | |
| JPS5897848U (en) | Outer lead bonding structure | |
| JP2000301065A (en) | Piezoelectric vibrator | |
| JPS58150862U (en) | Chip parts mounting device | |
| JPS58135976U (en) | Parts mounting structure | |
| JPS59158179U (en) | liquid crystal display device | |
| JPS5936235U (en) | block electrolytic capacitor | |
| JPS5996869U (en) | Mounting device for chip-shaped circuit components | |
| JPS6083274U (en) | Spacer with adhesive tape | |
| JPS5931269U (en) | Double-sided chip attachment device | |
| JPS59171372U (en) | thin circuit board | |
| JPS5920675U (en) | Laminated structure of printed wiring board | |
| JPS6092828U (en) | Electronic component mounting structure | |
| JPS58144854U (en) | small electronic components | |
| JPS58168169U (en) | Printed board | |
| JPS59185870U (en) | Mounting structure of chip components on printed circuit board | |
| JPS59159975U (en) | hybrid integrated circuit board | |
| JPS6081674U (en) | Ceramic hybrid integrated circuit device | |
| JPS59113683A (en) | Printed board | |
| JPS60180194A (en) | Device for mounting part on circuit board |