JPS6345730Y2 - - Google Patents
Info
- Publication number
- JPS6345730Y2 JPS6345730Y2 JP1981009769U JP976981U JPS6345730Y2 JP S6345730 Y2 JPS6345730 Y2 JP S6345730Y2 JP 1981009769 U JP1981009769 U JP 1981009769U JP 976981 U JP976981 U JP 976981U JP S6345730 Y2 JPS6345730 Y2 JP S6345730Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- plate
- transfer block
- electron beam
- collector electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 17
- 238000010894 electron beam technology Methods 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- 238000005219 brazing Methods 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Microwave Tubes (AREA)
Description
【考案の詳細な説明】
本考案は、進行波管などの電子ビーム管、特に
集電極（コレクター）が接地点から電気的に絶縁
されている進行波管の集電極冷却装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electron beam tube such as a traveling wave tube, and particularly to a collector electrode cooling device for a traveling wave tube in which the collector electrode is electrically insulated from a ground point.
従来、この種の冷却装置は、放熱体が取り付け
られる保持板の反対面に伝熱導路を形成する伝熱
板および電気絶縁板を介して電子ビーム管の円筒
状の集電極収納用嵌合孔を有する伝熱ブロツクを
配置しこの伝熱ブロツクおよび伝熱板の電気絶縁
板への固定はメタライズ加工、メツキ処理および
はんだ付加工等の製造技術を用いて行われてい
た。 Conventionally, this type of cooling device has been designed to fit the cylindrical collector electrode of the electron beam tube through a heat transfer plate and an electrical insulating plate that form a heat transfer path on the opposite side of the holding plate to which the heat dissipation body is attached. A heat transfer block having holes is arranged, and the heat transfer block and heat transfer plate are fixed to an electrically insulating plate using manufacturing techniques such as metallization, plating, and soldering.
この種の冷却装置は放熱特性が良好であり有用
であるが、伝熱ブロツクおよび伝熱板を構成する
銅等の金属とアルミナセラミツク等を使用した電
気絶縁板との熱膨張係数に相異があることから伝
熱ブロツクおよび伝熱板の電気絶縁板との接合面
の表面積が大きくなればなる程はんだ付加工時お
よび動作時の集電極の温度上昇による接合面に掛
かる熱応力が増大する。 This type of cooling device has good heat dissipation characteristics and is useful, but there is a difference in the coefficient of thermal expansion between the metal such as copper that makes up the heat transfer block and heat transfer plate and the electrical insulation board made of alumina ceramic etc. For this reason, as the surface area of the joint surfaces of the heat transfer block and the heat transfer plate with the electrically insulating plate increases, the thermal stress applied to the joint surfaces due to the temperature rise of the collector electrode during soldering and operation increases.
その結果、冷却装置構成部品の中でも機械的強
度の劣る電気絶縁板に微小クラツクが入り、伝熱
ブロツクと伝熱板又は保持板との間の耐圧を低下
させる危険が多分にあり冷却装置の製造はもとよ
り進行波管等の製品歩留の低下を招く怖れがあつ
た。これらの従来構造による欠点を除去する目的
で既に実願昭和54−1866号により、伝熱ブロツク
および伝熱板の電気絶縁板との接合面に一つ又は
複数個の溝を設けたことを特徴とする電子ビーム
管の集電極冷却装置を提供した。 As a result, there is a high risk that minute cracks will occur in the electrical insulating plate, which has poor mechanical strength among the components of the cooling system, reducing the withstand pressure between the heat transfer block and the heat transfer plate or holding plate. In addition, there was a fear that the yield of products such as traveling wave tubes would decrease. In order to eliminate these drawbacks of the conventional structure, Utility Application No. 1866/1973 has provided one or more grooves in the joint surface of the heat transfer block and the heat transfer plate with the electrically insulating plate. We have provided a collector electrode cooling device for an electron beam tube.
本考案の目的は、更に、実質的に接着面積の大
きい放熱体構造において異種材料の熱膨張係数の
相異による熱応力の緩和に有効な放熱体構造を提
供することである。 A further object of the present invention is to provide a heat sink structure that is effective in alleviating thermal stress due to differences in thermal expansion coefficients of different materials in a heat sink structure that has a substantially large adhesive area.
本考案は保持板に伝熱板および電気絶縁板を介
して電子ビーム管の集電極収納用嵌合孔を有する
伝熱ブロツクを接着した電子ビーム管の集電極冷
却装置において、伝熱ブロツクを可撓性を有する
薄板の積層体とし、伝熱ブロツクと電気絶縁板の
接着部分に発生する熱応力を、積層体の薄板を可
撓させる事により緩和し、電気絶縁板に微小クラ
ツクが発生する事を防止する事を特徴とする。 The present invention enables a heat transfer block to be used in an electron beam tube collector electrode cooling device in which a heat transfer block having a fitting hole for housing the electron beam tube collector is adhered to a holding plate through a heat transfer plate and an electrically insulating plate. It is a laminate of flexible thin plates, and the thermal stress that occurs at the bonded area between the heat transfer block and the electrical insulating plate is alleviated by flexing the thin plates of the laminate, which prevents micro-cracks from occurring in the electrical insulating plate. It is characterized by preventing
以下実施例を用いて本考案を説明する。 The present invention will be explained below using examples.
第１図および第２図は本考案による電子ビーム
管の集電極冷却装置の一実施例の部分軸断面図、
およびそのＡ−Ａ断面図を示し、特に電子ビーム
管として進行波管を用いた場合を示している。同
図において進行波管（集電極側部分のみ図示）１
の集電極１１を冷却する冷却装置１２は集電極１
１で発生する熱を一旦伝導させるための伝熱ブロ
ツク１３、伝熱板１４および電気絶縁板１５から
構成されている。伝熱ブロツク１３は薄板の積層
体で、中央付近には集電極１１の外径と同等の内
径を有する円筒状の嵌合孔１６が積層方向と直交
する方向にあけられている。伝熱ブロツク１３の
電気絶縁板１５との接合面には溝３０が伝熱ブロ
ツク１３を２分割するごとく嵌合孔１６の軸方向
に形成されている。伝熱板１４は隙間３１をもつ
て完全に４分割されて電気絶縁板１５を接着され
ている。隙間３１は接合面の表面積が４等分にな
るように設けられている。溝３０は、接合面の表
面積が２等分になる様に設けられている。電気絶
縁板１５は電気的絶縁体でかつ、熱伝導率が良好
なベリリアセラミツク板から成り、両面には各々
伝熱ブロツク１３および伝熱板１４が図示の如く
はんだ付或いはろう付で接着されている。伝熱ブ
ロツク１３と集電極１１は、はんだ付或いはろう
付で接着されている。そして、集電極１１で発生
する熱は伝熱ブロツク１３に低い熱抵抗で良好に
伝導される。伝熱ブロツク１３および伝熱板１４
は熱伝導率の高い銅などを用いるのが良い。遅波
回路２３と集電極１１はその間に介在する絶縁円
筒２４で電気的に絶縁される。この遅波回路２３
の外周囲には電子ビーム集束用の磁気集束装置２
５が配置され、冷却装置１２と合せて金属性の保
持板２６上にねじ止め（図示せず）などの方法で
固定される。 1 and 2 are partial axial sectional views of an embodiment of the collector electrode cooling device for an electron beam tube according to the present invention,
and its AA sectional view, particularly showing the case where a traveling wave tube is used as the electron beam tube. In the same figure, traveling wave tube (only the collecting electrode side part is shown) 1
A cooling device 12 for cooling the collector electrode 11 of the collector electrode 1
It is comprised of a heat transfer block 13, a heat transfer plate 14, and an electrically insulating plate 15 for once conducting the heat generated in the heat exchanger 1. The heat transfer block 13 is a laminated body of thin plates, and a cylindrical fitting hole 16 having an inner diameter equivalent to the outer diameter of the collector electrode 11 is bored near the center in a direction perpendicular to the lamination direction. A groove 30 is formed in the axial direction of the fitting hole 16 on the joint surface of the heat transfer block 13 with the electrically insulating plate 15 so as to divide the heat transfer block 13 into two. The heat exchanger plate 14 is completely divided into four parts with gaps 31, and electrically insulating plates 15 are bonded to each other. The gap 31 is provided so that the surface area of the joint surface is divided into four equal parts. The groove 30 is provided so that the surface area of the joint surface is divided into two equal parts. The electrical insulating board 15 is made of a beryllia ceramic board that is an electrical insulator and has good thermal conductivity, and a heat transfer block 13 and a heat transfer plate 14 are bonded to both sides by soldering or brazing as shown in the figure. ing. The heat transfer block 13 and the collector electrode 11 are bonded together by soldering or brazing. The heat generated in the collector electrode 11 is well conducted to the heat transfer block 13 with low thermal resistance. Heat transfer block 13 and heat transfer plate 14
It is better to use copper, etc., which has high thermal conductivity. The slow wave circuit 23 and the collector electrode 11 are electrically insulated by an insulating cylinder 24 interposed therebetween. This slow wave circuit 23
A magnetic focusing device 2 for focusing the electron beam is installed around the outer periphery of the
5 is arranged and fixed together with the cooling device 12 on a metal holding plate 26 by screwing (not shown) or the like.
このような構造の電子ビーム管の集電極冷却装
置においては、集電極１１で発生する熱は伝熱ブ
ロツク１３、電気絶縁板１５、伝熱板１４、保持
板２６の順に熱伝導路２７のごとく伝達し、保持
板２６の底面に設けられた適当な放熱フイン（図
示せず）により放散される。 In the collector electrode cooling device for an electron beam tube having such a structure, the heat generated in the collector electrode 11 is transferred in the order of the heat transfer block 13, the electric insulating plate 15, the heat transfer plate 14, and the holding plate 26 like a heat conduction path 27. and is dissipated by suitable heat dissipating fins (not shown) provided on the bottom surface of the retaining plate 26.
以上述べたように、本考案の実施例に示す冷却
装置では、伝熱ブロツク１３の電気絶縁板１５と
の接合面に溝３０を設け、接合面を等分割すると
同時に、伝熱板１４に設けられた隙間３１も伝熱
板１４を完全に４分割するごとく電気絶縁板１５
に接合されているおり、伝熱ブロツク１３は、可
撓性のある薄板の積層体であるので、熱膨張係数
の異る異種材料をはんだ付やろう付で接着した際
に発生する接合面の熱応力を緩和すると同時に、
進行波管の集電極１１より伝熱ブロツク１３に与
えられる急熱シヨツクに対しても伝熱ブロツク１
３の熱膨張を伝熱ブロツクの薄板の変形と溝３０
によつて緩和できる。又、伝熱板１４の熱膨張も
隙間３１によつて緩和でき、機械的強度の弱い電
気絶縁板１５に発生し易い微小クラツクを防止で
き耐圧の低下を招くことも無い。また伝熱ブロツ
ク１３は可撓性のある薄板の密な積層体とした
が、適当なスキマをもたせれば、さらに可撓性が
まし、熱応力を緩和できる。 As described above, in the cooling device shown in the embodiment of the present invention, the grooves 30 are provided on the joint surface of the heat transfer block 13 with the electrical insulating plate 15 to divide the joint surface into equal parts. The electrical insulating plate 15 also divides the heat exchanger plate 14 into four parts.
Since the heat transfer block 13 is a laminate of flexible thin plates, the joint surface that occurs when different materials with different coefficients of thermal expansion are bonded by soldering or brazing is At the same time as relieving thermal stress,
The heat transfer block 1 also responds to the rapid heating shock applied to the heat transfer block 13 from the collector electrode 11 of the traveling wave tube.
Deformation of the thin plate of the heat transfer block and groove 30
This can be alleviated by In addition, the thermal expansion of the heat transfer plate 14 can be alleviated by the gap 31, and micro-cracks that are likely to occur in the electrical insulating plate 15, which has weak mechanical strength, can be prevented, and the withstand voltage will not be lowered. Further, although the heat transfer block 13 is made of a dense laminate of flexible thin plates, if an appropriate gap is provided, the flexibility will be further improved and thermal stress can be alleviated.
なお、上記実施例においては、電子ビーム管と
して進行波管を用いた場合について述べたが本考
案はこれに限定されるものでは無く、他の電子ビ
ーム管の集電極冷却装置として適用できることは
勿論である。又、伝熱ブロツクを溝３０より２等
分し、伝熱板の接合面の隙間を十文字とし４分割
したが、電子ビーム管の消費電力や接合面の面積
を考慮し、溝と隙間の数および位置を任意に選定
できることも勿論である。 In the above embodiment, a traveling wave tube is used as the electron beam tube, but the present invention is not limited to this, and can of course be applied as a collector electrode cooling device for other electron beam tubes. It is. In addition, the heat transfer block was divided into two equal parts from the groove 30, and the gap between the joint surfaces of the heat transfer plates was made into a cross and divided into four parts. However, considering the power consumption of the electron beam tube and the area of the joint surface, the number of grooves and gaps was changed. Of course, it is also possible to arbitrarily select the location.
第１図は本考案による電子ビーム管の集電極冷
却装置の一実施例を示す部分軸断面図、第２図は
第１図のＡ−Ａ断面図である。
１……進行波管、１１……集電極、１２……冷
却装置、１３……伝熱ブロツク、１４……伝熱
板、１５……電気絶縁板、１６……嵌合孔、２３
……遅波回路、２４……絶縁円筒、２５……磁気
集束装置、２６……保持板、２７……熱伝導路、
３０……溝、３１……隙間。
FIG. 1 is a partial axial sectional view showing an embodiment of the collector electrode cooling device for an electron beam tube according to the present invention, and FIG. 2 is a sectional view taken along line A-A in FIG. DESCRIPTION OF SYMBOLS 1...Travelling wave tube, 11...Collecting electrode, 12...Cooling device, 13...Heat transfer block, 14...Heat transfer plate, 15...Electrical insulating plate, 16...Fitting hole, 23
... Slow wave circuit, 24 ... Insulating cylinder, 25 ... Magnetic focusing device, 26 ... Holding plate, 27 ... Heat conduction path,
30...Groove, 31...Gap.
Claims (1)
ビーム管の集電極収納用嵌合孔を有する伝熱ブロ
ツクを接着した電子ビーム管の集電極冷却装置に
おいて、前記伝熱ブロツクは可撓性を有する薄板
の積層体とし、かつ前記積層体に積層方向と直交
する方向に前記電子ビーム管の集電極収納用嵌合
孔を設けたことを特徴とする電子ビーム管の集電
極冷却装置。 In an electron beam tube collector electrode cooling device in which a heat transfer block having a fitting hole for housing the electron beam tube collector is adhered to a holding plate through a heat transfer plate and an electrical insulating plate, the heat transfer block is flexible. 1. A collector electrode cooling device for an electron beam tube, characterized in that the laminated body is made of a laminate of thin plates having the following structure, and a fitting hole for accommodating the collector electrode of the electron beam tube is provided in the laminate in a direction perpendicular to the lamination direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981009769U JPS6345730Y2 (en) | 1981-01-27 | 1981-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981009769U JPS6345730Y2 (en) | 1981-01-27 | 1981-01-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57126152U JPS57126152U (en) | 1982-08-06 |
| JPS6345730Y2 true JPS6345730Y2 (en) | 1988-11-28 |
Family
ID=29807882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981009769U Expired JPS6345730Y2 (en) | 1981-01-27 | 1981-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6345730Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5447153A (en) * | 1977-09-21 | 1979-04-13 | Hitachi Ltd | Heat exchanger |
| JPS54164050A (en) * | 1978-06-16 | 1979-12-27 | Intorepurinderea De Radeiatoar | Heat exchanger |
| JPS5631455B2 (en) * | 1971-01-13 | 1981-07-21 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142278Y2 (en) * | 1979-08-17 | 1986-12-01 |
-
1981
- 1981-01-27 JP JP1981009769U patent/JPS6345730Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5631455B2 (en) * | 1971-01-13 | 1981-07-21 | ||
| JPS5447153A (en) * | 1977-09-21 | 1979-04-13 | Hitachi Ltd | Heat exchanger |
| JPS54164050A (en) * | 1978-06-16 | 1979-12-27 | Intorepurinderea De Radeiatoar | Heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57126152U (en) | 1982-08-06 |
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